CN2872595Y - Stand of light-emitting diode - Google Patents
Stand of light-emitting diode Download PDFInfo
- Publication number
- CN2872595Y CN2872595Y CNU2006201005291U CN200620100529U CN2872595Y CN 2872595 Y CN2872595 Y CN 2872595Y CN U2006201005291 U CNU2006201005291 U CN U2006201005291U CN 200620100529 U CN200620100529 U CN 200620100529U CN 2872595 Y CN2872595 Y CN 2872595Y
- Authority
- CN
- China
- Prior art keywords
- leg
- bracket
- wire connection
- connection pin
- led support
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
A bracket for light emitting diode is disclosed. The bracket comprises multiple connected bracket units continuously punched on a conductive metal sheet and spaced with each other by equal distance, a first wire connection pin provided with a slot on upper end surface for accommodating light emitting wafer, and a second wire connection pin having upper end connected with that of the first wire connection pin to form a connection point. The bracket is characterized in that the first wire connection pin comprises a strip-like block at upper part which has gaps at two sides, and a cam is arranged on side edge of the second wire connection pin at the position correspondent with one gap of the first wire connection pin. In the utility model, epoxy resin envelop is firmly bond with the strip-like block which has large width to reinforce strength of the whole bracket; and volume of the slot is increased by four times to increase volume of original light-emitting wafer to three times so as to improves brightness thereof by three times. The bracket is made from steel-iron alloy and has good heat dissipating effect.
Description
Technical field
The utility model relates to a kind of supporting structure of light-emitting diode.
Background technology
The existing LED support of using is provided with two branch connecting pins in each carrier unit, be respectively extreme pin of P and N end and connect pin, this light-emitting diode is generally in indoor application, and two branch connecting pins P utmost point pin often take place burst apart when connecing out with external force, cause the unnecessary waste of material, cost is improved.The patent No. is that 97243750.9 Chinese utility model patent has proposed a kind of structure for this reason, its architectural feature is that this support is to be made by the tablet punch process, this diode support upper punch is provided with some plate racks unit, these support list branch units include one first extreme pin and one second extreme pin respectively, this first extreme pin and this second termination pin are for being the strip lamellar body, wherein the first extreme pin upper end is provided with a carrier, this carrier is absorbed in and forms circular-arc recess, with the holding semiconductor luminescent wafer therein, and the second extreme pin be located at the first extremely relative position on, this second extreme pin upper end is equipped with a protuberance outward adjacent to the side direction of first pin, and is provided with consistent reach through hole at this protuberance one book office.Though this structure has certain advantage, but its shortcoming is, skeleton as support is too thin, be easy to during use bend or fracture, so fastness is not enough, and this structure is because its support is thinner, the carrier of placing luminescent wafer can't increase again, so the volume of luminescent wafer also is difficult to strengthen, therefore the brightness of the light-emitting diode of making also is difficult to increase, so its structure awaits further to improve.
Summary of the invention
Technical problem to be solved in the utility model is the big LED support of groove volume that a kind of sound construction is provided and can places luminescent wafer at above-mentioned prior art present situation.
The utility model solves the problems of the technologies described above the technical scheme that is adopted: this LED support, include and go out a plurality of equidistant carrier units that link to each other on the conductive metal sheet continuously, each unit includes first leg and second leg of mutual correspondence, be provided with the groove that to place luminescent wafer in the upper surface of first leg, second leg upper end forms contact with first leg upper end, it is characterized in that its top of described first leg is bar blocks, and dual-side has breach on the top of bar blocks, wherein convexes with protuberance on the breach opposite position on one side and be positioned on the second leg side and with first leg.
As improvement, its both sides that are positioned at groove of described first leg are for also can be designed to and second contact of first leg and the extension protuberance of the 3rd contact; And the upper side of described first leg and second leg can be designed to matsurface, and described matsurface may be selected to be the male and fomale(M﹠F) that strip line is formed.
As further improvement, its bar blocks bottom of described first leg also can have the perforate that can save manufacturing materials.
Compared with prior art, advantage of the present utility model is because of adopting the first leg top to be bar blocks, and dual-side has breach on the top of bar blocks, and be positioned on the second leg side and wherein convex with protuberance on the breach opposite position on one side with first leg, and the upper side in first leg and second leg is designed to matsurface, so not only the epoxy resin envelope can combine with bar blocks securely, and bar blocks obviously increases because of width makes the support fastness of support greatly, anti-folding is anti-fracture again, thereby has strengthened the bulk strength of support; Also have because the bar blocks volume is big and solid, can make the volume of groove increase four times, make the volume of former luminescent wafer increase by three times then, thereby make the brightness of luminescent wafer increase to three times; And this support adopts steel and alloy to make, and thermal diffusivity is good.Have the perforate of material-saving in addition in the bottom of bar blocks, thereby can further reduce cost.
Description of drawings
Fig. 1 is the structural representation of the utility model embodiment;
Fig. 2 is the rearview of Fig. 1;
Fig. 3 is an I portion enlarged drawing among Fig. 1;
Fig. 4 is the vertical view of A-A line direction among Fig. 1;
Fig. 5 is the state diagram of single support and wafer and epoxy resin combination among Fig. 1.
Embodiment
Embodiment describes in further detail the utility model below in conjunction with accompanying drawing.
Extremely shown in Figure 5 as Fig. 1, the LED support of present embodiment, include and go out a plurality of equidistant carrier unit H that link to each other on the conductive metal sheet continuously, see shown in Figure 1, each unit H includes first leg 1 and second leg 2 of mutual correspondence, be provided with groove 11, the second leg, 2 upper ends and first leg, 1 upper end that to place luminescent wafer 3 in the upper surface of first leg 1 and form contact.Described first leg 1 its top is bar blocks 1a, see Fig. 1, Fig. 2, Fig. 3 and shown in Figure 5, and dual-side has breach 12 on the top of bar blocks 1a, and be positioned on second leg, 2 sides and wherein convex with protuberance 21 on breach 12 opposite positions on one side with first leg 1, see Fig. 1 and shown in Figure 3, and on described first leg 1 its both sides that are positioned at groove 11 for can form and second contact of first leg 1 and the extension protuberance 15 of the 3rd contact, 16, be designed to the matsurface 13 that strip line 13a forms in the upper side of first leg 1 and second leg 2.Thereby seal when combining more firmly when bar blocks and epoxy resin 4, and have the perforate 14 that to save manufacturing materials in first leg, 1 its bar blocks 1a bottom.
Claims (5)
1, a kind of LED support, include and go out a plurality of equidistant carrier units (H) that link to each other on the conductive metal sheet continuously, each unit (H) includes first leg (1) and second leg (2) of mutual correspondence, be provided with the groove (11) that to place luminescent wafer (3) in the upper surface of first leg (1), second leg (2) upper end forms contact with first leg (1) upper end, it is characterized in that its top of described first leg (1) is bar blocks (1a), and the top dual-side in bar blocks (1a) has breach (12), wherein convexes with protuberance (21) on breach (12) opposite position on one side and be positioned on second leg (2) side and with first leg (1).
2, LED support according to claim 1 is characterized in that its both sides that are positioned at groove (11) of described first leg (1) are for can form and second contact of first leg (1) and the extension protuberance of the 3rd contact (15,16).
3, LED support according to claim 1 and 2, the upper side that it is characterized in that described first leg (1) and second leg (2) is matsurface (13).
4, LED support according to claim 3 is characterized in that the male and fomale(M﹠F) that described matsurface (13) is formed for strip line (13a).
5, LED support according to claim 4 is characterized in that its bar blocks of described first leg (1) (1a) bottom has the perforate (14) that can save manufacturing materials.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNU2006201005291U CN2872595Y (en) | 2006-01-20 | 2006-01-20 | Stand of light-emitting diode |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNU2006201005291U CN2872595Y (en) | 2006-01-20 | 2006-01-20 | Stand of light-emitting diode |
Publications (1)
Publication Number | Publication Date |
---|---|
CN2872595Y true CN2872595Y (en) | 2007-02-21 |
Family
ID=37740935
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNU2006201005291U Expired - Fee Related CN2872595Y (en) | 2006-01-20 | 2006-01-20 | Stand of light-emitting diode |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN2872595Y (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101459212B (en) * | 2007-12-11 | 2011-06-22 | 富士迈半导体精密工业(上海)有限公司 | Solid illuminating element |
CN102332444A (en) * | 2011-06-16 | 2012-01-25 | 沈健 | Semiconductor lead frame of whole matrix surface |
CN102956599A (en) * | 2012-11-20 | 2013-03-06 | 无锡市威海达机械制造有限公司 | Lead frame structure |
-
2006
- 2006-01-20 CN CNU2006201005291U patent/CN2872595Y/en not_active Expired - Fee Related
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101459212B (en) * | 2007-12-11 | 2011-06-22 | 富士迈半导体精密工业(上海)有限公司 | Solid illuminating element |
CN102332444A (en) * | 2011-06-16 | 2012-01-25 | 沈健 | Semiconductor lead frame of whole matrix surface |
CN102956599A (en) * | 2012-11-20 | 2013-03-06 | 无锡市威海达机械制造有限公司 | Lead frame structure |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20070221 Termination date: 20130120 |