CN2838011Y

CN2838011Y - Laminated wafer electronic component with inner poles

Info

Publication number: CN2838011Y
Application number: CN 200420122230
Authority: CN
Inventors: 李坤龙
Original assignee: SFI Electronics Technology Inc
Current assignee: SFI Electronics Technology Inc
Priority date: 2004-12-31
Filing date: 2004-12-31
Publication date: 2006-11-15
Anticipated expiration: 2014-12-31

Abstract

The utility model relates to a laminated wafer type electronic component with inner poles, which comprises a flaky component body, at least a pair of inner poles and a dielectric substance interlayer, wherein the inner poles laminated in the body have superposed parts at intervals and the dielectric substance interlayer is arranged between the pair of inner poles. The utility model is characterized in that the inner poles are respectively extended up and down from both ends of the body to an inner middle part in parallel, and the free ends of the inner poles are formed with at least one flyover crossing superposed part at intervals. Therefore, the longitudinal or / and the transverse contraposition offset errors of the inner poles during printing lamination can be absorbed by a cross part to keep the superposed areas of the inner poles unchanged.

Description

Laminated chip type electronic component with interior electrode

Technical field

The utility model relates to a kind of interior electrode structure laminated chip type electronic component that has, and is the laminated chip type electronic component of the laminar interior electrode of laminated type of interval overlapping part up and down with dielectric in the middle of particularly a kind of element internal is buried underground and had.

Background technology

Laminated chip type electronic component utilizes pouring film and printing laminating method successively to pile up usually and forms, and in this manufacture process, the printing lamination with electrode is layering and does not carry out simultaneously that the contraposition precision during lamination is the problem that makes the dealer have a headache always especially.Particularly the chip type electronic component enters nanometer unit by micron unit in recent years; the size of wafer is therefore more and more little; desired precision is also more and more high, and often atomic error regular meeting causes the inequality of product quality on the production process, causes the product yield to descend.With regard to laminated chip ceramic capacitor (MLCC), the overlapping area of electrode changed in the skew of contraposition just can cause during lamination, and the change of overlapping area promptly causes the variation of capacitance, the laminated capacitor that this is then produced, its capacity distributes and can't concentrate or inequality product percent of pass thereby reduction.In addition, for with regard to the example, interior electrode is the deviation of contraposition up and down, can cause internal electrical capacity distribution problem too with regard to the prominent inhibitor of laminated chip type, therefore, how to control the contraposition precision of laminated chip type electronic component when lamination accurately and become upward important problem of production.

Can cause wafer stack up and down the main cause of contraposition difficulty be interior electrode structure such as Fig. 5 A of general chip type element, shown in Fig. 5 B, element 10 inside have a pair of respectively from two be that the level difference is relatively extended and the end that meeting has an interval overlapping part A same wide with sheet type conductor long and symmetry mutually promptly in electrode 20A, 20B, and the dielectric material interlayer 30 between this two electrode, the electrode structure of this kind design, as long as have vertical in process of production, horizontal (x, y) the contraposition deviation or the error of any direction, just can cause, the change of the overlapping area A of bottom electrode (imaginary line of seeing Fig. 5 A is represented partly) causes the variation of inter-electrode capacitance.Yet, the production of this chip type electronic component, be with the displacement, successively different step such as superimposition printing, oven dry is reached, the lamination owing to repeatedly shift one's position, the generation of mismachining tolerance is unavoidable from belonging to, add the error and the progressive error of facility, instrument etc., it is impossible from belonging to desire to eliminate this equal error fully.Since error can't be avoided, how not upgrade the following of existing equipment and the existing production line of change, can manage this error is absorbed, even the interior error of scope that generation is aborning allowed also can not influence the overlapping area of the electrode of former setting, the most economical effective solution of can yet be regarded as.

Summary of the invention

Main purpose of the present utility model provides a kind of interior electrode structure of laminated chip type electronic component.It goes to upper and lower interlayer every lap with the dielectric medium interlayer, has at least a part to form the decussation shape.

Above-mentioned purpose of the present utility model is to realize like this, a kind of laminated chip type electronic component with interior electrode, comprise: a thin sheet-like element body, at least one pair of is the different levels lamination and has the interruption-like overlapping interior electrode of part in body interior, and is located at the dielectric medium interlayer between this internal electrode;

It is characterized in that this internal electrode goes to upper and lower from the inward at both ends of body middle part respectively and extends in parallel, form the interval overlapping portion that at least one is cross crossings on different level shape at the free end of the interior electrode that meets.

Configuration makes electronic component in process of production by this, though the printing lamination take place vertical or horizontal or its two to corresponding offset error, can absorb by cross part, and it is constant to keep the overlapping area of electrode, thereby can keeps the quality precision of product.

Above-mentioned purpose of the present utility model can also realize like this, the first assembly of a kind of array type laminated chip type electronics, it is characterized in that comprising: the square common body of a lengthy motion picture, two groups comprise respectively that a plurality of two relative edges that come body respectively relatively with number present down parallel correspondence and to the interior electrode group of electrode in being much of and down interior electrode, one be located at above-mentioned in two groups electrode groups the place ahead of one group therewith electrode group become vertical community electrode of extending along common body total length, one be located at above-mentioned in two groups on the same plane, the place ahead of another group of electrode groups and therewith electrode group become vertical another common electrode that extends along common body total length, be located at the common joint at the two ends of these two common electrodes respectively, and be located at the independent contact of the outer end of each interior electrode of electrode group in two respectively; Wherein, the interval overlapping portion of the leading section of electrode and the non-relative common electrode formation cross crossings on different level shape at grade in the place ahead in each.

Constitute by this, the good more high-grade product of energy quality bills of materials can promote the qualification rate of producing efficient and product simultaneously.

Other purposes of the present utility model, effect and characteristics can be from conjunction with the accompanying drawings to becoming clearer the detailed description of the present utility model.

Description of drawings

Fig. 1 has shown first example of the utility model electronic component, and wherein Figure 1A is a vertical view, and Figure 1B is an I-I line cutaway view;

Fig. 2 has shown second example of the utility model electronic component, and wherein Fig. 2 A is a vertical view, and Fig. 2 B is an II-II line cutaway view;

Fig. 3 has shown the 3rd example of the utility model electronic component, and wherein Fig. 3 A is a vertical view, and Fig. 3 B is an III-III line cutaway view;

Fig. 4 has shown the 4th example of the utility model electronic component, and wherein Fig. 4 A is a vertical view, and Fig. 4 B is an IV-IV line cutaway view, and Fig. 4 C and Fig. 4 D have shown the upper and lower stack layer of electrode structure in the tool respectively;

Fig. 5 A and Fig. 5 B are respectively the vertical view and the cutaway views of the laminated chip type electronic component of electrode in the traditional tool.

Description of reference numerals: 1 body; Electrode in 2a, the 2b; The overlapping portion of A, A '; 3,3a, 3b dielectric medium interlayer (dielectric layer); X, X ' array type unit assembly; E1～E4 chip type element; 2C, 2C ' common electrode; 4a, 4b common joint; 5a, 5b independent contact.

Embodiment

At first, please refer to first example of the present utility model shown in Figure 1A, Figure 1B, laminated chip type electronic component E1 in this form comprises: a laminar body 1, a pair of be the level lamination in body 1 inside and have part keep electrode 2a in interval overlapping A upper and lower, 2b, and be located at this internal electrode 2a, the dielectric medium interlayer between the 2b (abbreviation dielectric layer) 3.

Interior electrode

2a, 2b extend in parallel up and down toward interior middle part from the two ends of body 1 respectively, and form overlapping A of crossings on different level shape at this free end that meets.In this example, one of interior electrode, for example 2a forms the L font and is positioned at the top that another forms the electrode 2b of ㄇ font, and overlapping A forms decussation, two the jag overhang x and the y in length and breadth of cross part, be and allow two electrode 2a, the margin of error of contraposition skew during the 2b lamination longitudinal and transverse two all can not influence the area size of overlapping A to skew in this margin of error scope.

Fig. 2 A, Fig. 2 B have shown second example of the present utility model, all use same mark to represent at this all member identical or suitable with first example or part.Press in the present embodiment, except

interior electrode

2a, 2b adopts identical shaped but outside the mutual inverted ㄇ font electrode, other parts are substantially the same.Because two mutual inverted ㄇ font electrode 2a, the terminal part of 2b just with to corresponding electrode 2b, between the 2a in part cross-shaped, and form overlapping A of two decussations, A '.This embodiment, as take place in length and breadth either party to or the contraposition skew of two directions, its side-play amount (margin of error) also can be absorbed by cross part equally.

Fig. 3 A, Fig. 3 B have shown the 3rd example of the present utility model, this form is a plurality of elements (this example is four) A1-A4 of first form shown in Figure 1 side by side one row and constitutes one, and become the assembly X1 of laminar array type laminated chip type, can connect for the electronic component of a plurality of associations and use.

Fig. 4 A, Fig. 4 B have shown the 4th embodiment form of the present utility model, and this is the variation of aforementioned array type unit assembly, have the assembly X2 of laminated chip type unit of interior electrode structure of the double density of the assembly X1 of aforementioned array type unit.Particularly, in the common body 1 of lengthy motion picture type, be provided with a plurality of long limits along body 1 side by side in electrode 2a, along another long limit of body 1 be not with last in electrode 2a with electrode 2b in number following be positioned at the same plane of top electrode 2a on, and in its place ahead along body 1.The common electrode 2c that total length is extended be positioned at the same plane of bottom electrode 2b on, and another common electrode 2c ' that 1 total length is extended in its place ahead along body, the two ends of being located at body 1 connect above-mentioned common electrode 2c respectively, the common joint 4a of each end of 2c ', 4b, and be located at electrode 2a in each, the independent contact 5a of the outer end of 2b, 5b.The assembly X2 of array type unit of this form, can utilize shown in Fig. 4 C, Fig. 4 D, to have and be in symmetric figure upper and lower electrode structure and pile up on mutual and form, between the electrode group dielectric layer must be arranged in two, one as described above, each

electrode

2a, 2b and common electrode 2c, the overlapped part of 2c ' also forms the overlapping portion of decussation.

According to the array type laminated chip type element X1 of the 3rd and the 4th example, X2, because of the A of interval overlapping portion that electrode structure in each all has the identical decussation of overlapping area, the contraposition deviation that is produced during lamination all can be absorbed by cross part.

At the described electronic component of first to fourth example, can be the element that capacitor, surge suppressor, array type capacitor, array type surge suppressor etc. have interior electrode.

The utility model is because of electrode structure in having as constituted above, therefore, in the lamination operation of production process as occur in the contraposition deviation of allowing in the maximum standard deviation scope, also can not have influence on the effective area of the internal electrode of each chip element, the effective area that still can keep each element in this case is identical, and can not be subjected to the restriction of the precision of production equipment, the particularly important is, can utilize existing equipment and production line, just can make more high-grade and high-quality product, not only can significantly reduce the investment amount of equipment, can promote the yield of production efficiency and raising product again.

Below only just be illustrated than the embodiment of basic feasible solution; but those skilled in the art obviously also can do all distortion and modification as can be known under spirit of the present utility model and principle; for example; can form the overlapping subordinate of at least one decussation; formation with interior electrode; size changes, with the quantity of the interior electrode of array type element arrange, combination and variation or the like, all this kind distortion, modify and all should be considered as protection range of the present utility model.

Claims

1. laminated chip type electronic component with interior electrode comprises: a thin sheet-like element body, and at least one pair of is the different levels lamination and has the interruption-like overlapping interior electrode of part in body interior, and is located at the dielectric medium interlayer between this internal electrode;

2. according to the described laminated chip type of claim 1 electronic component, it is characterized in that electronic component is capacitor or surge suppressor.

3. one kind is utilized the described array type laminated chip type electronics unit assembly with laminated chip type electronic component of interior electrode of claim 1-2, and it is characterized in that: a plurality of described chip type electronic components are arranged into a row, and each body forms as one.

4. array type laminated chip type electronics unit assembly, it is characterized in that comprising: the common body of a lengthy motion picture shape, two groups comprise respectively that a plurality of two relative edges that come body respectively relatively with number present down parallel correspondence and to the interior electrode group of electrode in being much of and down interior electrode, one be located at above-mentioned in two groups electrode groups the place ahead of one group therewith electrode group become vertical community electrode of extending along common body total length, one be located at above-mentioned in two groups on the same plane, the place ahead of another group of electrode groups and therewith electrode group become vertical another common electrode that extends along common body total length, be located at the common joint at described two common electrode two ends respectively, and be located at the independent contact of the outer end of each interior electrode of electrode group in two respectively; Wherein, the interval overlapping portion of the leading section of electrode and the non-relative common electrode formation decussation at grade in the place ahead in each.

5. according to claim 2 or 3 described array type laminated chip type electronics unit assemblies, it is characterized in that electronics unit assembly is array type capacitor or array type surge suppressor.