CN2833824Y - Improved chip inductor - Google Patents
Improved chip inductor Download PDFInfo
- Publication number
- CN2833824Y CN2833824Y CN 200520074938 CN200520074938U CN2833824Y CN 2833824 Y CN2833824 Y CN 2833824Y CN 200520074938 CN200520074938 CN 200520074938 CN 200520074938 U CN200520074938 U CN 200520074938U CN 2833824 Y CN2833824 Y CN 2833824Y
- Authority
- CN
- China
- Prior art keywords
- magnetic core
- substrate
- projection
- groove
- overcoat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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Abstract
The utility model discloses an improved adhesive sheet inductor which comprises a coat, a magnetic core in the coat, a coil winding on the magnetic core and a basal plate pasted on the upper end surface of the magnetic core. A bulge is arranged on the basal plate. The end surface of the magnetic core is provided with a groove corresponding to the bulge position. When the basal plate is pasted, the bulge is inserted in the groove. The utility model can enhance the binding force of the magnetic core and the basal plate, prevent the magnetic core from detaching from the basal plate caused by heating and improve the product quality of the adhesive sheet inductor.
Description
Technical field
The utility model relates to a kind of improved SMT Inductor.
Background technology
Along with the develop rapidly of electronics and information industry, paster electron-like element is adopted in a large number.SMT Inductor is exactly one of them, SMT Inductor in the market includes overcoat, be provided with I-shaped magnetic core in the overcoat, be wound with coil windings on the magnetic core, one end of magnetic core is pasted with the substrate of band cross notch, four terminations welding of four pin of substrate and coil windings, because magnetic core is different with the material of substrate, their hot coefficient of dilatation is also different, therefore after the transmission that is subjected to welding heat, magnetic core and substrate are thrown off easily, thereby badly influence the quality of SMT Inductor, production firm's repousse on substrate is also arranged, to increase the contact area of magnetic core and substrate, prevent to be heated and throw off the generation of phenomenon, but produce little effect.
Summary of the invention
The purpose of this utility model is: a kind of improved SMT Inductor is provided, its substrate is provided with projection, the magnetic core end face is provided with groove, projection embeds in the groove, can strengthen the adhesion of magnetic core and substrate, preventing to be heated because of welding throws off magnetic core and substrate, improves the product quality of SMT Inductor.
The technical solution of the utility model is: a kind of improved SMT Inductor, comprise magnetic core, the coil windings on the magnetic core in the overcoat, overcoat, stick on the substrate of magnetic core upper surface, described substrate is provided with projection, the end face of magnetic core is provided with groove on the position corresponding to projection, projection embeds in the groove during stickup.
The further technical scheme of the utility model is: a kind of improved SMT Inductor, comprise magnetic core, the coil windings on the magnetic core in the overcoat, overcoat, stick on the substrate of magnetic core upper surface, described substrate is provided with projection, the end face of magnetic core is provided with groove on the position corresponding to projection, projection embeds in the groove during stickup; Described projection and groove closely cooperate, and projection is formed by the downward bending of the notch on the substrate.
The more detailed technical scheme of the utility model is: a kind of improved SMT Inductor, comprise magnetic core, the coil windings on the magnetic core in the overcoat, overcoat, stick on the substrate of magnetic core upper surface, described substrate is provided with projection, the end face of magnetic core is provided with groove on the position corresponding to projection, projection embeds in the groove during stickup; Described projection and groove closely cooperate, and projection is formed by the downward bending of the notch on the substrate; Described projection is trapezoidal, and an end that inserts groove one end big, that connect substrate is less.
The utility model has the advantages that:
1. substrate of the present utility model is provided with projection, the magnetic core end face is provided with groove, and projection embeds in the groove, can strengthen the adhesion of magnetic core and substrate, prevents to be heated because of welding magnetic core and substrate are thrown off the product quality of raising SMT Inductor.
2. the projection on the substrate is formed by the downward bending in the edge of cross notch, and is trapezoidal shape, and is not only easily manufactured, and strong with the adhesion of groove, can guarantee the stickup of substrate and magnetic core firmly.
Description of drawings
The utility model will be further described below in conjunction with drawings and Examples:
Fig. 1 is a vertical view of the present utility model;
Fig. 2 is the A-A profile of Fig. 1;
Fig. 3 is the B-B profile of Fig. 1.
Wherein: 1 overcoat; 2 magnetic cores; 3 coil windings; 4 substrates; 5 projectioies; 6 grooves; 7 notches.
Embodiment
Embodiment: as Fig. 1, Fig. 2, shown in Figure 3, a kind of improved SMT Inductor, comprise magnetic core 2, the coil windings 3 on the magnetic core 2 in the overcoat 1, overcoat 1, stick on the substrate 4 of magnetic core 2 upper surfaces, the notch 7 of described substrate 4 is bent with projection 5 downwards, the end face of magnetic core 2 is provided with groove 6 on the position corresponding to projection 5, projection 5 embeds in the groove 6 during stickup, and projection 5 closely cooperates with groove 6.
Claims (4)
1. improved SMT Inductor, comprise magnetic core (2), the coil windings (3) on the magnetic core (2) in the overcoat (1), overcoat (1), stick on the substrate (4) of magnetic core (2) upper surface, it is characterized in that: described substrate (4) is provided with projection (5), the end face of magnetic core (2) is provided with groove (6) on the position corresponding to projection (5), projection during stickup (5) embeds in the groove (6).
2. improved SMT Inductor according to claim 1 is characterized in that: described projection (5) closely cooperates with groove (6).
3. improved SMT Inductor according to claim 1 and 2 is characterized in that: described projection (5) is formed by the bending downwards of the notch (7) on the substrate (4).
4. improved SMT Inductor according to claim 1 and 2 is characterized in that: described projection (5) is trapezoidal, and an end that inserts groove (6) one end big, that connect substrate (4) is less.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200520074938 CN2833824Y (en) | 2005-08-25 | 2005-08-25 | Improved chip inductor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200520074938 CN2833824Y (en) | 2005-08-25 | 2005-08-25 | Improved chip inductor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN2833824Y true CN2833824Y (en) | 2006-11-01 |
Family
ID=37198135
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200520074938 Expired - Lifetime CN2833824Y (en) | 2005-08-25 | 2005-08-25 | Improved chip inductor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN2833824Y (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1996517B (en) * | 2006-11-25 | 2011-04-06 | 中山市三礼电子有限公司 | A making method for fully automated small ultra-thin chip inductor |
-
2005
- 2005-08-25 CN CN 200520074938 patent/CN2833824Y/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1996517B (en) * | 2006-11-25 | 2011-04-06 | 中山市三礼电子有限公司 | A making method for fully automated small ultra-thin chip inductor |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| AV01 | Patent right actively abandoned |
Effective date of abandoning: 20090603 |
|
| C25 | Abandonment of patent right or utility model to avoid double patenting |