CN2831426Y - Large power semiconductor water cooling radiator - Google Patents
Large power semiconductor water cooling radiator Download PDFInfo
- Publication number
- CN2831426Y CN2831426Y CN 200520092232 CN200520092232U CN2831426Y CN 2831426 Y CN2831426 Y CN 2831426Y CN 200520092232 CN200520092232 CN 200520092232 CN 200520092232 U CN200520092232 U CN 200520092232U CN 2831426 Y CN2831426 Y CN 2831426Y
- Authority
- CN
- China
- Prior art keywords
- hole
- water
- main body
- radiator
- conductive plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model relates to a large-power semiconductor water-cooling radiator, which belongs to a radiator used in the power electronic industry. The utility model is mainly composed of a body (1), a right water inlet parallel connection hole (3), a left water outlet parallel connection hole (11), a left and a right-screwing cooling water channels (5), (4), a central cavity (12), etc., wherein positioning columns (13) are centrally and symmetrically arranged on lug bosses (6) on pressing plates of two side planes of the body (1); screw threads are fabricated on the connection position of a total water inlet hole (2) and a total water outlet hole (10) with a water faucet; the lower end of the body (1) is provided with a conductive plate (7) provided with a cathode hole (8) and an electrical connection hole. The pressing plate on both side surfaces of the body are protruded, which can prevent the interference of the body and a semiconductor gate leading wire; the center is provided with the positioning columns, and the positioning and the serial connection are easy; the total water inlet and the total water outlet holes are movably connected with the water faucet by screw threads, and the replacement is convenient; the whole radiator forms a rectangular shape and is provided with the conductive plate, the appearance is decent, and the electrical connection is convenient; a cathode leading wire can be conveniently connected through twin cathode holes.
Description
Technical field
The utility model belongs to the radiator that the power electronics industry is used, particularly a kind of high power semi-conductor water-cooling type radiator.
Technical background
Existing water-cooling type radiator adopts spiral stainless steel tube to bury part, this radiator heat-dissipation effect is not fine, thermal resistance, flow resistance performance is poor, bearing static pressure can not meet the demands, the inventor is in application on December 2nd, 2003 a kind of " high voltage direct current power transmission and transformation water-cooling type radiator ", the patent No. is 200320105769.7 patents, the utility model adopts the fine aluminum template to make the heat radiation main body, symmetry is made two pass and around a left side on main body two side planes, the right-hand screw cooling water channel, this radiator integral is good, easy to install and use, the radiating efficiency height, flow resistance loss is little, but exist because shape is a square, do not establish the centralized positioning post, serial connection is difficult for the location, is not with shortcomings such as conductive plate can not be electrically connected.
Summary of the invention
The purpose of this utility model is to overcome above-mentioned technical deficiency, provides a kind of convenient installation, the high power semi-conductor water-cooling type radiator of long service life.
The technical scheme that the utility model technical solution problem adopts is: the high power semi-conductor water-cooling type radiator is mainly intake by main body, the right side and is connected hole, left water outlet and connect hole, left and right spiral cooling water channel, compositions such as center cavity, be characterized in that the center is arranged with reference column on the pressing plate boss of main body two side planes, screw thread is made in total inlet opening and total osculum and water nozzle junction, be provided with conductive plate in the main body lower end, on conductive plate, be provided with cathode aperture and be electrically connected the hole.
The beneficial effects of the utility model are: the utility model main body two sides pressing plate protrudes, can prevent the interference of main body and semiconductor gate pole lead-in wire, the center is established reference column and is easily located serial connection, always advance, osculum and water nozzle with screw thread flexibly connect change convenient, radiator is whole to be that rectangle, outward appearance are generous, be provided with conductive plate, the convenient electrical connection; The twin cathode hole, the convenient cathode leg that connects.
Description of drawings
Specify with embodiment below in conjunction with accompanying drawing.
Fig. 1 shows that the high power semi-conductor water-cooling type radiator master office of looking cuts open figure.
The vertical view of Fig. 2 diagrammatic sketch 1.
The A-A cutaway view of Fig. 3 diagrammatic sketch 1.
Among the figure, the 1-main body; The total inlet opening of 2-; The right water inlet of 3-also connects the hole; 4-right-hand screw cooling water channel; 5-left-hand screw cooling water channel; 6-pressing plate boss; The 7-conductive plate; The 8-cathode aperture; 9-is electrically connected the hole; The total osculum of 10-; 11-left side water outlet also connects the hole; The 12-center cavity; The 13-reference column; The 14-concave station;
Embodiment
With reference to accompanying drawing 1-3, employing high-quality aluminium sheet size is as required made square main body 1, square main body 1 bottom is provided with conductive plate 7, symmetry is made a left side on main body 1 two sides, right-hand screw cooling water channel 5,4, a left side, both sides, right-hand screw cooling water channel 5, a termination, 4 outer ring and a left side, the right side goes out into water and connects hole 11,3 communicate, center of circle end is connected with center cavity 12 on the main body 1, a left side, right-hand screw cooling water channel 5,4 pitch equates, cross dimensions is identical, a left side, right-hand screw cooling water channel 5,4 weld together with main body in high-temperature vacuum furnace with two flat surface pressing plates 6 respectively, guarantee certain pressure and positive confinement, flat surface pressing plate 6 formed boss prevent main body 1 and the interference of semiconductor gate pole lead-in wire.Right water inlet also connects hole 3 and communicates with total inlet opening 2 of main body 1 upper end, and left water outlet also connects hole 11 and communicates with total osculum 10 of main body 1 upper end.Total inlet opening 2 and total osculum 10 are made screwed hole with the water nozzle junction, flexibly connect with water nozzle, are convenient for changing, and are provided with concave station 14 between screw thread and main body 1 upper surface, prevent to leak.
Be provided with two cathode apertures 8 of symmetry in conductive plate 7 tops, below cathode aperture 8, establish two and be electrically connected hole 9.
Center on two sides pressing plate boss 6 is arranged with circular reference column 13, so that the radiator serial connection.
The course of work of the present utility model is achieved in that at first radiator body 1 by centralized positioning post 13, and is with the semiconductor location, by applying static pressure, that radiator and semiconductor serial connection is fixing.Total inlet opening 2, water nozzle by upper end screw thread and cooling water pipe joins, cooling water enters main body 1 through total inlet opening 2, intaking by the right side and connecting hole 3 enters in the main body 1 right-hand screw cooling water channel 4, and cooling water enters into radiator center cavity 12 widdershins along this water channel 4, and cooling water begins to enter left-hand screw cooling water channel 5 by center cavity 12, cooling water deasil flows out, by left water outlet and connect hole 11, total osculum 10, discharge main body 1, heat is taken out of, reach the purpose of heat radiation.
Claims (1)
1, a kind of high power semi-conductor water-cooling type radiator, mainly intake and connect hole (3), left water outlet and connect hole (11), left and right spiral cooling water channel (5), (4) and center cavity (12) etc. and form by main body (1), the right side, it is characterized in that being arranged with reference column (13) at the pressing plate boss (6) of main body (1) the two side plane center of going up, total inlet opening (2) and total osculum (10) are made screw thread with the water nozzle junction, be provided with conductive plate (7) in main body (1) lower end, on conductive plate (7), be provided with cathode aperture (8) and be electrically connected hole (9).
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN 200520092232 CN2831426Y (en) | 2005-08-19 | 2005-08-19 | Large power semiconductor water cooling radiator |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN 200520092232 CN2831426Y (en) | 2005-08-19 | 2005-08-19 | Large power semiconductor water cooling radiator |
Publications (1)
Publication Number | Publication Date |
---|---|
CN2831426Y true CN2831426Y (en) | 2006-10-25 |
Family
ID=37136355
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN 200520092232 Expired - Fee Related CN2831426Y (en) | 2005-08-19 | 2005-08-19 | Large power semiconductor water cooling radiator |
Country Status (1)
Country | Link |
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CN (1) | CN2831426Y (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101984507A (en) * | 2010-08-27 | 2011-03-09 | 中国电力科学研究院 | Novel water-cooled radiator for thyristor |
CN102562513A (en) * | 2010-12-17 | 2012-07-11 | 中国科学院理化技术研究所 | Cyclotron pump for driving conductive fluid to flow |
CN107396600A (en) * | 2017-07-16 | 2017-11-24 | 中车永济电机有限公司 | Bidirectional screw runner water-cooling heat radiating device |
CN107860247A (en) * | 2017-10-10 | 2018-03-30 | 深圳航天东方红海特卫星有限公司 | A kind of expansion hot plate that conduit is spirally distributed that exchanges heat |
-
2005
- 2005-08-19 CN CN 200520092232 patent/CN2831426Y/en not_active Expired - Fee Related
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101984507A (en) * | 2010-08-27 | 2011-03-09 | 中国电力科学研究院 | Novel water-cooled radiator for thyristor |
WO2012024887A1 (en) * | 2010-08-27 | 2012-03-01 | 中国电力科学研究院 | Water-cooling radiator for thyristor |
CN102562513A (en) * | 2010-12-17 | 2012-07-11 | 中国科学院理化技术研究所 | Cyclotron pump for driving conductive fluid to flow |
CN107396600A (en) * | 2017-07-16 | 2017-11-24 | 中车永济电机有限公司 | Bidirectional screw runner water-cooling heat radiating device |
CN107860247A (en) * | 2017-10-10 | 2018-03-30 | 深圳航天东方红海特卫星有限公司 | A kind of expansion hot plate that conduit is spirally distributed that exchanges heat |
CN107860247B (en) * | 2017-10-10 | 2019-12-27 | 深圳航天东方红海特卫星有限公司 | Spiral-distributed heat-expanding plate of heat exchange channel |
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Legal Events
Date | Code | Title | Description |
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C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C19 | Lapse of patent right due to non-payment of the annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |