CN2826459Y - Osa - Google Patents
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- CN2826459Y CN2826459Y CN 200520106630 CN200520106630U CN2826459Y CN 2826459 Y CN2826459 Y CN 2826459Y CN 200520106630 CN200520106630 CN 200520106630 CN 200520106630 U CN200520106630 U CN 200520106630U CN 2826459 Y CN2826459 Y CN 2826459Y
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Abstract
The utility model discloses an optical sub-assembly (OSA) which is composed of a connecting base and a light emitting apparatus, wherein the connecting base is provided with an optical axis and contains a lens structure in the form of a single element, and the lens structure aims at the optical axis; the lens structure can be a single lens or a double lens, and the light emitting apparatus can be a traditional LED or a laser diode or a light emitting element with a to-can framework or a light detecting apparatus. The light which is emitted from the light emitting apparatus passes through an opening at one end of an external package body, and a light emitting crystal of the light emitting apparatus can not be provided with a micro lens; the lens structure can come near to the light emitting crystal by enlarging the radius or extending the lengthso that the OSA has better coupling-light efficiency. The manufacturing process and the assembly process of the elements of the OSA are the same as the existing manufacturing process; in addition, the light emitting crystal is not provided with micro lens, and one end of the package body is provided with an opening but no covering, and thus, the manufacturing cost can be greatly reduced, and the lens structure can come near to the light emitting crystal easily.
Description
Technical field
The utility model relates to a kind of light time module, more particularly, relates to a kind of being sent out by semiconductor and receives the light time module that electro-optical device and plastic cement joint chair combine.Plastic cement joint chair in the light time module combines with optical fiber, and this light time module extensively applies in the optical communication field.
Background technology
Optical-fibre communications becomes light signal with the electrical signal conversion of transmitting terminal, after light signal transmits in optical fiber then, converts light signal to electric signal again at receiving end.More than, emission need use light time module with receiving optical signals.The element of communication product is made into high-quality and it is packaged into closed type again, prevents by this to operate under atmospheric environment and causes damage.
Usually, light time module comprises a diode, lens or lens combination at least on a pedestal, and the mechanical jack in order to accurate butt joint Optical fiber plug.For example light time module generally comprises electrooptical device and joint chair of a light emission/reception, and wherein joint chair is provided with a passage that supplies Optical fiber plug to plug, and the light transmission/reception is in order to generation/received signal.In light communication system, light time module is also referred to as coupling unit (coupling unit), and it plays the part of an important role.Light time module sees through the quality of the transmission signals of optical fiber by optical magnification and light coupling efficient decision.In order to improve the optics light coupling efficient, the assembly of normal light apotype is equipped with or is formed with the optical beam conversion system, lens for example, and perhaps the assembly of light apotype has the light emitting devices of the output power that can provide high.
As shown in Figure 1, traditional light time module 10 comprises a light emitting devices 11 (ball-lens To-can) and a joint chair (receptacle) 12.Light emitting devices 11 can be penetrated diode or light emitting diode constitutes by electricity.Joint chair 12 penetrates one-shot forming by plastic cement and makes, and to definition one optical axis 18 is arranged along the inner shaft of passage 17.Light emitting devices 11 combines with joint chair 12, and an optical fiber ceramic rod 13 (ceramic ferrule is called for short optical fiber subsequently) is plugged in the passage 17 of joint chair 12 ends, and is positioned at the relative position of light emitting devices 11.By the light time module of said structure, after light emitting devices 11 sent light signal, this light signal entered in the optical fiber 13.Yet because the divergence of beam angle of light emitting devices 11 is, so light can not be directly and entered fully in the optical fiber 13.Between this joint chair 12 and light emitting devices 11, be provided with lens 14, the light that is sent by these lens 14 gathered light emitters 11, and import in the optical fiber 13.Lens 14 are upper shield 15 tops that a spherical lens is installed in light emitting devices 11, and alignment light emission wafer 16.
Because spherical lens 14 is installed in the top of upper shield 15, thus between lens 14 and light emission wafer 16, the assembling tolerance is arranged, and when light emitting devices 11 combines with joint chair 12, also have assembly error.So, aforesaid assembly error influences the corresponding of lens 14 and optical axis 18 easily, and causes some light signals not import optical fiber 13 by scioptics 14.Even the light coupling efficient of this spherical lens 14 is low, make the operation of light time module 10 can not reach optimum degree.In addition, if light emitting devices 11 is made of metal, generally be also referred to as metal can (metal can), owing on this upper shield 15 spherical lens 14 is arranged, wherein spherical lens 14 is a glass material, must utilize glass capsulation (glass sealing) to stick on the upper shield 15, and institute is so that cost increases.
Fig. 2 A is the light time module of another kind of structure, and this light time module 20 comprises a joint chair 22 and a light emitting devices 21 (being called flat-window To-can).Joint chair 22 has been defined a passage 27, and this passage 27 has a blind end.Blind end at this passage 27 forms lens 23, and an optical axis 28 is defined in the axial of this passage 27.Light emitting devices 21 comprises a crown cap 24, and its its inside is provided with light emission wafer 25.These crown cap 24 upper surfaces are provided with a glass plate 26.Structure by this, the light that is emitted by light emission wafer 25 can penetrate glass plate 26 then scioptics 23 assemble.
Because glass plate 26 does not have light-focusing function, so no matter whether light emission wafer 25 aims at metal upper shield 24, coupling light action when light emission wafer 25 all further need combine with joint chair 22 by light emitting devices 21, make light emission wafer 25 relative, reach the purpose of aiming at optical axis 28 with the lens 23 of ejection formation.So, non-spherical lens can be improved light coupling efficient.Yet, because light emitting devices 21 has been purchased glass plate 26, so the element cost of this light time module 20 increases.
In addition, when lens 23 are mounted near light emission wafer 25,, still can be transmitted in the scope of lens 23 even the light that light emission wafer 25 is launched has the bigger angle of divergence.Yet because of glass plate 26 being arranged, so limited the distance between lens 23 and the light emission wafer 25 on upper shield 24 tops of light emitting devices 21.Though, can highly make lens 23 approaching by reducing crown cap 24 with the distance of light emission wafer 25, but this light emitting devices 21 has certain specification usually, if it is few to change the quantity of metal upper shield 24 specifications, the cost of this light time module 20 is still increase.On the other hand, can by increase light emission wafer 25 and down the height of load bearing seat but so do and can increase the cost of product with near lens 23.
United States Patent (USP) the 5th, 973 discloses a kind of light time module for No. 862, and its joint chair provides stretches claw in order to grasp a sphere lens more.Yet it can not reduce cost, because this light emitting devices still sets glass plate.In addition, the light coupling efficient of spherical lens is low, and the distance between this spherical lens and the light emission wafer can not reduce.
United States Patent (USP) the 6th, 547 also discloses a light time module for No. 455, and it uses double lens device to increase coupling light.Yet light emitting devices is equipped with glass plate, thus the cost height, and lens can not be near the light emission wafer of light emitting devices.Further, the double-sided glass lens that are installed in this light apotype group seat-joined may cause the situation of skew optical axis, so can misalignment light emission wafer or optical fiber.So, the two-lens structure in joint chair is unfavorable for improving light coupling efficient.
Generally, the operating speed of the light that is made of the LED light emitting diode time module can reach 155Mb/s at least, and it can satisfy the requirement of general user in local-area network.LED light time module has benefit cheaply, yet the angle of divergence of LED is big, only is not enough to effective collected light by lens.In the case, LED light time module should set lens or lens group structure again to improve light coupling efficient.Consult Fig. 2 B, its LED wafer 110 comprises the of heap of stone brilliant portion 112 that is made of the plural layer semiconductor material, and comprising an active layers 114, it produces light by electric current.Brilliant portion 112 of heap of stone grows up on a substrate 116, and this substrate 116 provides a lenticule 118 independently.Because substrate 116 almost is a light-permeable,, and improve light coupling efficient in view of the above so the light that is sent by active layers 114 can pass substrate 116 then by lenticule 118 optically focused.
Yet, go out lenticule 118 at substrate 116 surface etchings, need accurately control the etching uniformity coefficient to whole wafer.In fact, this program also is not easy control, so the cost height of product.Further, if substrate 116 is thick, it will influence spotlight effect because light disperses.In order to increase light gathering efficiency, substrate 116 must be made into suitable thickness.Thin substrate 116 is influenced by external strength easily and fragmentation, and the product fine rate is descended.
In addition, because light penetrates by appearing substrate, that is to say, only penetrated by the wafer back, is difficult so will do full inspection to wafer on wafer, and follow-up processing procedure also is not easy control.To pass wafer 110 be earlier by lenticule 118 optically focused to light again, again by the lens light gathering of joint chair.If the error that the wafer pros and cons gold-tinted stage makes, can cause the situation of optical axis misalignment, for example, if wafer manufacture and the lenticular manufacture process of align substrates in produce error, then light coupling efficient will significantly reduce, like this transfer element of being constituted of this light time module, it comprises LED and joint chair, will lose specification requirement and can not be employed.The combination of the lens of LED and the single lens of encapsulation can provide traditional LED light time enough output powers of module, but still has some problems to need to solve.For example make inconvenient, expensive, descend, examine incompatible or the like problem entirely because of misalignment power with wafer.
Summary of the invention
In view of the foregoing, the purpose of this utility model provide that a kind of light coupling efficient height, light output effect are good, low cost of manufacture, light time module that the product fine rate is high.
For achieving the above object, the utility model by the following technical solutions: a kind of light time module, it includes:
One has the joint chair of optical axis and coupling photo structure, and this coupling photo structure is a two-lens structure, forms single element with this joint chair, and this coupling photo structure is formed in described optical axis direction, more by the emitted light of light emission wafer in order to collect, and improves light coupling efficient;
A kind of light time module, it comprises a light emitting devices and a joint chair; The light emission wafer set of described light emitting devices is located in the outer package body, and an end of this outer package body is open architecture and the relative position that is positioned at light emission wafer, and so structure can significantly reduce the cost of light emitting devices.
A kind of light time module, it comprises a light emitting devices and a joint chair, wherein joint chair provides lens, and the outer package body inside of this light emitting devices is provided with light emission wafer, the lens of joint chair can stretch in the outer package body near light emission wafer, so, the emitted light signal of light emission wafer can manyly be collected by lens.
Other effects of the present utility model are that this light time module does not provide the element of tool glass plate, so do not have the problem of light reflection, and light coupling efficient is improved.
Above-described light emitting devices, with reference to the light emitting devices with Metal Packaging, for example To-can, or the LED with epoxy encapsulation, these light time module element all processing procedure with existing light time module element are identical.
The utility model has the advantages that: have good properties of product, the element framework is simple, product fine rate height, low cost of manufacture.
Description of drawings
Fig. 1 is the diagrammatic cross-section of traditional light time module;
Fig. 2 A is the diagrammatic cross-section of traditional light time module;
Fig. 2 B is traditional light emission wafer partial cutaway schematic;
Fig. 3 A is that the utility model comprises traditional light emitting devices and has the diagrammatic cross-section of the light time module of double lens joint chair;
Fig. 3 B is the diagrammatic cross-section of the utility model light time module;
Fig. 4 is the diagrammatic cross-section of the utility model light time module, and its middle chamber is by the close hard and infertile of stick;
Fig. 5 is the diagrammatic cross-section of the utility model light time module, and wherein lens are launched wafer near light;
The diagrammatic cross-section of Fig. 6 the utility model light time module, wherein light emission wafer is the wall emission diode;
Fig. 7 is the diagrammatic cross-section of the utility model light time module, wherein outer package body sealing;
Fig. 8 is the structural representation of the utility model light emission wafer;
Fig. 9 is the structural representation of another light emission wafer of the utility model;
Figure 10 is the diagrammatic cross-section of the utility model light time module, and wherein outer package body one end is open;
Figure 11 is the diagrammatic cross-section of the utility model light time module, and wherein joint chair has the lens than long radius;
Figure 12 is the diagrammatic cross-section of the utility model light time module, and wherein joint chair tool single lens and outer package body one end are open;
Figure 13 is the diagrammatic cross-section of the utility model light time module, and wherein light emission wafer seals with jelly;
Figure 14 is the diagrammatic cross-section of the utility model light time module, wherein is full of medium between lens and light emission wafer.
Embodiment
Following according to the purpose of this utility model, effect, and the structure configuration, for example, and cooperate graphic detailed description.
As shown in Figure 3A, light time module 30 comprises a smooth transmission/reception 50.This light transmission/reception 50 can be traditional LED, or laser diode, or has that metal covers or the light emitting devices of the To-can framework of glass, or an optical detector.
Consult Fig. 3 B, in the utility model, light time module 30 comprises the joint chair 32 and a light emitting devices 52 of a plastic cement material.Joint chair 32 is combined with light emitting devices 52.
Further, light emitting devices 52 comprises an outer package body 54 and light emission wafer 56.Outer package body 54 can be made and an end 58 is provided with a through hole 62 with metal.Light emission wafer 56 is arranged on outer package body 54 inside and faces toward through hole 56.It should be noted that this through hole 62 is open columnar structure, does not hide with any veil.
Encapsulation procedure is meant that light emitting devices 52 is installed in the chamber 48 of joint chair 32.By by the coupling optical tech, can make light emission wafer 56 aim at through hole 62 and optical axis 46, and light emitting devices 52 is temporarily fixing with stick 72 (UV glue) with joint chair 32, then again with stick 74 permanent fixations.So, the chamber 48 of joint chair 32 forms sealing, and light emission wafer 56 is sealed in the joint chair 32.
Consult Fig. 4, after stick 72 temporary transient fixing, stick 76 is used for being full of the gap between outer package body 54 and chamber 48 inwalls, and light emitting devices 52 and joint chair 32 are sticked together.Under the low viscosity characteristics and surface tension effects thereof of stick 76, stick 76 can flow to the below of stick 72 and be trapped in the periphery of outer package body 54, and its result makes chamber 48 form separate space.The condition in this space during according to viscose glue environment and decide vacuum or charge into nitrogen for example.Lens 44 are launched the pollution that wafer 56 is not subjected to stick 76 with light, and light coupling efficient is also unaffected.
According to above structure, this chamber 48 can be vacuum or filling gas, as nitrogen, therefore can keep light emission wafer 56 not contact with oxygen.In addition, experimental result shows, can reach 100% sealing effectiveness by above sealing means.
If stick 76 is soft, silica gel for example, then stick 74 must be used to improve bond strength.And if the bond strength of stick 76 is enough, then stick 74 can be selected same substance with stick 76, for example UV glue or AB epoxy resin.
The specification of above-described light emitting devices 52 is suitable with traditional light emitting devices, does not dispose glass plate or any veil but difference of the present utility model is the end face of light emitting devices 52.Thus, the high price element in the utility model cancellation light emitting devices 52 is so material cost is minimized.
In addition, the encapsulation procedure of light emitting devices 52 and joint chair 32 is compatible to classic method, and so packaging cost can not increase because of the structural change of light emitting devices 52.
Consult Fig. 5 because the end face of light emitting devices 52 does not have covering structure, so lens 44 can make very near light emission wafer 56.For example lens 44 are extend in the outer package body 54, make lens 44 more approaching with light emission wafer 56.In this example, the light that most light emission wafer 56 is sent can project lens 44, and particularly, the light with big emission angle is also passable.Light collection efficiency can therefore and significantly improve.
Consult Fig. 6, this light time module comprises a joint chair 32 and a light emitting devices 80.The structure of light time module 32 is with previous described identical, and the combination of joint chair 32 and light emitting devices 80 was also with before described identical.The outer package body 82 of this light emitting devices 80 is epoxy resin layers, and light emission wafer 84 is located at outer package body 82 inside.This is a kind of commonly used and have a cost-benefit method for packing in traditional LED.It should be noted that outer package body 82 end faces are provided with a perforate 86, and this perforate 86 is not with any object covering/encapsulation.
With light emitting devices 80 is example, though the dispersion angle of its light is bigger, because the end face of outer package body 82 is open, so the lens 44 of joint chair 32 can be made near light emission wafer 84, thus, most light can project lens 44, and light gathering efficiency is significantly improved.
In addition, because joint chair 32 is provided with two relative lens 42,44, the light that institute's light emitting devices 80 is sent can make light more assemble and be beneficial to aim at optical fiber through twice optically focused effect.
Above embodiment, light emitting devices and joint chair close envelope, yet, if pay no attention to the fiduciary level of light emitting devices, also can blow-by between light emitting devices and the joint chair.For example use stable semiconductor device, then under atmospheric environment, can normal running and do not damage lastingly.
Consult Fig. 7, this light time module comprises a joint chair 32 and a LED 90.Joint chair 32 is formed with a passage 34, one optical axises 36 and is defined in the axial of this passage 34.Passage 34 has an open end 36 and a blind end 38.Two relative lens 42 and 44 are formed on the opposite side of blind end 38, and aim at optical axis 46.End at joint chair 32 is formed with a chamber 48, and lens 44 are located in the chamber 48.
LED 90 is located at and aims at optical axis 46 in the chamber 48.LED 90 comprises an outer package body 92, and portion is provided with light emission wafer 94 within it.This outer package body 92 is made in order to sealing light emission wafer 94 with epoxy resin.Above-described LED 90 can be the LED of traditional form.
Consult Fig. 8, light emission wafer 94 comprises a brilliant portion 95 of heap of stone and a substrate 96.Substrate 96 is arranged on brilliant portion of heap of stone 95 1 sides, and the opposite side of brilliant portion 95 of heap of stone combines with a P-type material layer 97.When using a thick P-type material layer 97 and connecting material bondingly with elargol or AuSn, then in encapsulation process, make light emission wafer 94 produce short circuits easily with brilliant portion of heap of stone 95.Wherein, this P-type material layer 97 can be electroplated metal layer or wafer combination (wafer-bonded) electrically-conductive backing plate.Brilliant portion 95 of heap of stone comprises the epitaxial layer of plural number, and wherein active region 98 can provide light source.
It should be noted that substrate 96 surfaces do not make lenticule especially.So the light by active region 98 emissions can pass transparent surface 99.The light of LED directly passes penetrates light bar led (Back-Side Bottom-Emitting Flat LED) at the bottom of substrate 96 is called as dorsal part.
Consult Fig. 9, comprise the penetration surface 100 on a plane at this shown light emission wafer 94, it is formed in a side of brilliant portion 95 of heap of stone and is positioned at direction away from substrate 96.In this embodiment, the light that is sent by active region 98 will pass the penetration surface 100 that is positioned at brilliant portion of heap of stone 95 1 sides, but not pass substrate 96.LED allows light to be appeared by brilliant portion of heap of stone 95 1 sides, penetrates light bar led (Front-SideTop-Emitting Flat LED) so be called the top, front side.Specifically, on the direction that light penetrates, light emission wafer 94 not system is established lenticule.
No matter be the light emitting diode of above that class, its light emission wafer surface is all made and is established lenticule, so making is easy and cost is low.
Consult Fig. 7, when LED 90 combines with joint chair 32, the light that LED 90 is sent is with scioptics 42 and 44 optically focused twice, so can reduce the coupling light loss.By the way, even the divergence of beam angle of LED 90 is big, also can assembles enough light and enter optical fiber.
In addition, because light emission wafer 94 does not have lenticular design, so light passes behind the penetration surface by lens 42 and 44 optically focused.So, the plate type LED framework more can be avoided the situation of optical registration error than the light-emitting device of globe lens To-can encapsulation.In other words, LED 90 can make optical registration more simple with the combination of joint chair 32.In addition, the encapsulation form of LED 90 is identical with traditional LED.LED 90 is identical with the conventional package processing procedure with the combination processing procedure of joint chair 32 again.Therefore, for a large amount of manufacturings, have that processing procedure is more simple and easy, maturation and the good effect of cost benefit.Because light emission wafer 94 does not have lenticule, so light emission wafer 94 can have the selection of different light emission directions.As a result, the wafer stage of LED before encapsulation just can be examined entirely, and for example light bar led (Front-Side Top-Emitting Flat LED) is penetrated on the top, front side.
Consult Figure 10, the end face of outer package body 92 provides an opening 101, and increases the length of lens 44, then can reduce the spacing of lens 44 and light emission wafer 94.These lens 44 can stretch into opening 101, and lens 44 more reduce with the spacing of light emission wafer 94.According to this structure kenel, even the light angle of divergence of LED 90 is big, still can make most ray cast to lens 44, so can reach good light coupling efficient.
Consult Figure 11, light time module comprises a joint chair 122 and a device 124.Chamber 126 and coupling photo structure 127 are formed in the joint chair 122.Wherein, coupling photo structure 127 has single lens or two-lens structure, and is set in the chamber 126.
This device 124 is a kind of photocell or light receiving element, and it is assembled in the joint chair 122 and aims at optical axis.Device 124 comprises an outer package body 128, and is assembled in the wafer 132 in this outer package body 128.If these device 124 end faces 129 are package surface, then wafer 132 is set at a sealed space.End face 129 has a breakthrough portion, and it can be to penetrate glass or sealing to pass for light.
As shown in figure 11, this coupling photo structure 127 can pass through than long radius or the approaching device 124 of extension.Therefore the light that is sent by this device 124 can be assembled by coupling photo structure 127.Thus, light time module has good light output efficiency.
Consult Figure 12, coupling photo structure 127 can be single lens or two-lens structure, and this coupling photo structure 127 is near light transmission/reception 140.This light transmission/reception 140 comprises an outer package body 142 and a wafer 144.This wafer is located at outer package body 142 inside for 144 groups, and the end face 143 of outer package body 142 has an opening 146.
Consider the fiduciary level requirement of wafer 144, wafer 144 must be installed in a sealed space.Yet this outer package body 142 is non-tights, so must be with stick 148 sealing at the chamber 126 and the space of installing between 140.If but do not consider the fiduciary level of wafer 144, chamber 126 and the space of installing between 140 just need not seal.
Consult Figure 13, protective seam 152 (can be silica gel or other) contacts with air in order to prevent wafer 144.At this embodiment, even outer package body 142 has an opening, and chamber 126 and install 140 between the space unsealing, the fiduciary level of this wafer 144 also meets the requirements.
Consult Figure 14, can be full of viscose glue 154 between wafer 144 and the coupling photo structure 127, for example silica gel or UV glue, or epoxy resin, or with above similar material.Particularly, this viscose glue 154 also can be similar cooperation oil (matching oil), its refractive index is subjected between the refractive index of optical semiconductor and coupling photo structure 127 between sending out, two different interface variations in refractive index like this are less, can reduce the generation of total reflection (total internal reflection), and it is excessive to make light can not disperse.In other words, originally be full of air in the space, the path after then light is sent by wafer 144 is shown in the dotted line; And after filling up viscose glue 154 in the space, the path after light is sent by wafer 144 is shown in the solid line.Shown in figure, this structure obviously can improve spotlight effect.Otherwise utilizing receiving element also is identical reason, because the active light area of following high speed element such as optical diode (photodiode) can be more and more littler, so also will effectively promote light coupling efficient.In addition, stick 154 can be full of the space between wafer 144 and the outer package body 142.
The utlity model has following characteristics:
1, the utility model is provided with a perforate at outer package body one end of light emitting devices, and make this perforate aligning be positioned at the light emission wafer of outer package body, so the lens of joint chair just can be launched wafer near light, make the output power of light time module significantly promote.
2, the outer package body of light emitting devices of the present utility model does not dispose the covering structure of sealing, so can reduce the manufacturing cost of light emitting devices.
3, light of the present utility model time module specification is identical with traditional light time module, and all not changes of the combination processing procedure of joint chair and light emitting devices and equipment, so the utility model can be compatible fully with conventional process.
4, joint chair of the present utility model provides two relative lens, the more effective optical fiber that is imported into of light signal energy, so allow bigger error to produce in the coupling light time, it is more easy therefore to produce.
5, the disclosed LED of the utility model does not have lenticule, and joint chair has two lens, although LED has bigger divergence of beam angle, but still can reach the demand of light coupling efficient.
6, the LED that the utility model disclosed does not have lenticule, so simple in structure and low cost of manufacture.
7, the packing forms of LED of the present utility model is identical with traditional LED, so encapsulation is easily, and compatible with conventional process.And it is also compatible with the combination process of joint chair with conventional process.
8, LED of the present utility model does not make and establishes lenticule, so light emission form has different selections, so can launch wafer at light and be in wafer stage and examine entirely.
Claims (25)
1, a kind of light time module, it is characterized in that: it includes:
One has the joint chair of optical axis and coupling photo structure, and this coupling photo structure refers to two-lens structure, forms single element with this joint chair, and this coupling photo structure is formed in described optical axis direction;
One is combined in the light emitting devices on this joint chair, and this light emitting devices is aimed at described optical axis.
2, light according to claim 1 time module is characterized in that: described light emitting devices comprises that an outer package body inside is provided with light emission wafer, and outer package body one end forms enclosed construction and relative with light emission wafer.
3, light according to claim 1 time module, it is characterized in that: described joint chair combines with light emitting devices, wherein light emitting devices comprises that an outer package body inside is provided with light emission wafer, and this outer package body one end forms non-enclosed construction and relative with light emission wafer.
4, light according to claim 3 time module, it is characterized in that: described outer package body is made with metal, and it is relative with described light emission wafer that the one end is provided with a perforate.
5, light according to claim 1 time module, it is characterized in that: the outer package body of described light emitting devices is an epoxy resin layer, a perforate is formed between epoxy resin layer one end and the light emission wafer, and this perforate is relative with light emission wafer.
6, light according to claim 3 time module, it is characterized in that: described light emitting devices combines hermetically with joint chair, and described light emission wafer is arranged in the sealed space.
7, light according to claim 3 time module, it is characterized in that: described joint chair is provided with lens, and these lens are approaching by the non-closed construction and the described light emission wafer of outer package body one end.
8, light according to claim 3 time module, it is characterized in that: described joint chair is provided with lens, and the non-closed construction of these lens by outer package body one end extends into outer package body and light, and to launch wafer approaching.
9, light according to claim 1 time module, it is characterized in that: described joint chair is provided with a passage, and described optical axis is positioned at the axial of this passage, this passage one end is a blind end, the other end is the open end, respectively is provided with lens in the relative both sides of described blind end, forms the double lens structure.
10, a kind of light time module, it is characterized in that: it includes:
One includes the joint chair of optical axis and coupling photo structure, and described coupling photo structure has two relative lens and position at optical axis direction, and forms single element with joint chair;
One LED group is located on this joint chair and aims at the optical axis place.
11, light according to claim 10 time module, it is characterized in that: described LED comprises an outer package body, be provided with light emission wafer in the outer package body, a penetration surface is arranged on described light emission wafer one side, and this penetration surface is provided with the lenticule of a collected light.
12, light according to claim 10 time module, it is characterized in that: described LED comprises an outer package body, be provided with light emission wafer in this outer package body, one penetration surface is arranged on this light emission wafer one side, and this penetration surface is a planar structure, and light appears this penetration surface under the condition of any lenticule structure by this.
13, light according to claim 10 time module is characterized in that: the light emission wafer of described LED comprises a substrate and a brilliant portion of heap of stone at least, and a penetration surface is formed on this substrate.
14, light according to claim 10 time module is characterized in that: the light emission wafer of described LED comprises a substrate and a brilliant portion of heap of stone at least, and a penetration surface is formed on a side of described brilliant portion of heap of stone.
15, light according to claim 10 time module, it is characterized in that: the outer package body of described LED is an epoxy resin layer, and this outer package body and function coats described light emission wafer with sealing.
16, light according to claim 10 time module, it is characterized in that: the outer package body of described LED is an epoxy resin layer, and this outer package body offers a perforate, and described light emission wafer is aimed in this perforate.
17, light according to claim 10 time module, it is characterized in that: wherein this joint chair is provided with a passage, and this passage one end is a blind end, and the other end is the open end, respectively is provided with lens in the relative both sides of this blind end to form the double lens structure.
18, light according to claim 16 time module, it is characterized in that: described LED combines with described joint chair, and described joint chair is provided with lens, and these lens pass the perforate of outer package body and described light, and to launch wafer approaching.
19, a kind of light time module, it is characterized in that: it includes:
One includes the joint chair of optical axis and coupling photo structure, and this coupling photo structure has at least one lens arrangement, and this coupling photo structure is positioned at optical axis direction, and forms single element with joint chair;
One device group is located at wherein on the joint chair and aims at described optical axis;
This device is a smooth transmission/reception, and described lens arrangement installs near this by the structural form than long radius.
20, light according to claim 19 time module, it is characterized in that: described joint chair has a chamber, described device comprises an outer package body and a wafer, described outer package body has an opening, described wafer set is contained in this outer package body, and the space between this chamber and the outer package body forms seal cavity by stick.
21, light according to claim 19 time module, it is characterized in that: described joint chair has a chamber, and this device comprises an outer package body and a wafer, and the outer package body is a hermetically-sealed construction, and described wafer set is contained in this outer package body.
22, light according to claim 19 time module, it is characterized in that: described joint chair has a chamber, and this device comprises an outer package body and a wafer, and the outer package body has an opening, and described wafer set is contained in the outer package body and with a medium-tight and coats.
23, light according to claim 19 time module, it is characterized in that: described joint chair has a chamber, this device comprises an outer package body and a wafer, this outer package body has an opening, described wafer set is contained in this outer package body, and a medium is filled up in the space between wafer and the chamber, makes this wafer obtain sealing and coats.
24, light according to claim 19 time module, it is characterized in that: described device comprises an outer package body and a wafer, and wafer set is contained in the outer package body, and the space between wafer and the outer package body fills a medium, makes this wafer obtain the sealing coating.
25, light according to claim 19 time module, it is characterized in that: described medium is silica gel or UV glue or epoxy resin or other similar materials.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200520106630 CN2826459Y (en) | 2005-08-29 | 2005-08-29 | Osa |
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2009012672A1 (en) * | 2007-07-26 | 2009-01-29 | Aeco Optoelectronics (Shenzhen) Co. Ltd | Transmitter optical sub-assembly for optical fiber communication |
| US7772608B2 (en) | 2007-04-13 | 2010-08-10 | Amtran Technology Co., Ltd. | Photoelectric element package with temperature compensation |
| CN101102161B (en) * | 2007-07-26 | 2011-05-11 | 智科光光电（深圳）有限公司 | Optical transmission secondary module for optical fiber communication |
| CN102540359A (en) * | 2010-12-27 | 2012-07-04 | 熊大曦 | Highlighted LED (light-emitting diode) optical coupling device |
| CN104115048A (en) * | 2011-12-14 | 2014-10-22 | 菲尼萨公司 | Chip on flex optical subassembly |
| CN106154438A (en) * | 2016-08-19 | 2016-11-23 | 桂林福冈新材料有限公司 | A kind of optical fiber interface component |
| CN106489089A (en) * | 2015-05-28 | 2017-03-08 | 住友电工光电子器件创新株式会社 | The optical plug for relaxing the mechanical stress produced because of welding and the optical module equipped with the optical plug |
-
2005
- 2005-08-29 CN CN 200520106630 patent/CN2826459Y/en not_active Expired - Lifetime
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7772608B2 (en) | 2007-04-13 | 2010-08-10 | Amtran Technology Co., Ltd. | Photoelectric element package with temperature compensation |
| WO2009012672A1 (en) * | 2007-07-26 | 2009-01-29 | Aeco Optoelectronics (Shenzhen) Co. Ltd | Transmitter optical sub-assembly for optical fiber communication |
| CN101102161B (en) * | 2007-07-26 | 2011-05-11 | 智科光光电（深圳）有限公司 | Optical transmission secondary module for optical fiber communication |
| CN102540359A (en) * | 2010-12-27 | 2012-07-04 | 熊大曦 | Highlighted LED (light-emitting diode) optical coupling device |
| CN102540359B (en) * | 2010-12-27 | 2015-02-04 | 熊大曦 | Highlighted LED (light-emitting diode) optical coupling device |
| CN104115048A (en) * | 2011-12-14 | 2014-10-22 | 菲尼萨公司 | Chip on flex optical subassembly |
| US9337932B2 (en) | 2011-12-14 | 2016-05-10 | Finisar Corporation | Chip on flex optical subassembly |
| CN106489089A (en) * | 2015-05-28 | 2017-03-08 | 住友电工光电子器件创新株式会社 | The optical plug for relaxing the mechanical stress produced because of welding and the optical module equipped with the optical plug |
| CN106154438A (en) * | 2016-08-19 | 2016-11-23 | 桂林福冈新材料有限公司 | A kind of optical fiber interface component |
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