CN2821784Y - Hard disc machine heat radiator - Google Patents

Hard disc machine heat radiator Download PDF

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Publication number
CN2821784Y
CN2821784Y CN 200520103405 CN200520103405U CN2821784Y CN 2821784 Y CN2821784 Y CN 2821784Y CN 200520103405 CN200520103405 CN 200520103405 CN 200520103405 U CN200520103405 U CN 200520103405U CN 2821784 Y CN2821784 Y CN 2821784Y
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China
Prior art keywords
heat
disk drive
winchester disk
conducting unit
thermal bonding
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Expired - Fee Related
Application number
CN 200520103405
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Chinese (zh)
Inventor
谢坤祥
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Individual
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Individual
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Priority to CN 200520103405 priority Critical patent/CN2821784Y/en
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Publication of CN2821784Y publication Critical patent/CN2821784Y/en
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Expired - Fee Related legal-status Critical Current

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Abstract

The utility model relates to a heat radiator of a hard disk machine, which comprises a hard disk machine, a first heat conducting unit covered on the upper surface and two side surfaces of the hard disk machine, and a second heat conducting unit thermally connected with the bottom of the hard disk machine by heat-conducting adhesive. Each of main bodies of the two heat conducting units is provided with at least one thermally connected surface and at least one heat radiation wall integrally formed on the surface of the external part of the main bodies to form the heat radiator all thermally connected with and covered on the hard disk machine to cooperate with a fan unit arranged at a computer enclosure to convect to bring the heat energy away from the hard disk machine so as to improve the efficacy of high temperature heat radiation of the hard disk machine.

Description

The Winchester disk drive heat abstractor
Technical field
The utility model refers to a kind of tool high-level efficiency especially about a kind of Winchester disk drive heat abstractor, is applied to Winchester disk drive surface heat joint and is coated with the heat abstractor that heat energy is dispersed in transmission, causes equipment to work as machine to avoid high temperature.
Background technology
Known, in the computer equipment mainly as the Winchester disk drive of electronic bits of data access, all be directly to be disposed at the inner narrow and small non-open type space of computer housing, especially computing machine is for cooperating light, thin, short, the little market orientation in consumption market, computer housing also tends to miniaturization Design, certainly the computer housing inner space after miniaturization Design is more narrow and small, even more important on heat dissipation design relatively.
Again, along with progressing greatly of electronic technology and microelectric technique, but the Winchester disk drive design constantly increases its access capability and access speed, on rotating speed, transmit 7200 (rpm) commentaries on classics of main flow before the exhibition syllabus by per minute 5400 (rpm), even more existing dealer provides the zero access of rotating speed up to 12000 (rpm) commentaries on classics, under the continuous hurricane height of access speed operates like this, the heat energy that also makes Winchester disk drive produce when access operates significantly improves especially, and the temperature of this heat energy rises very quick, non-general energy can be loaded by the usefulness that the air-flow that is produced by the fan disturbance in the computer housing can dispel the heat, and the condition of high temperature will directly influence the normal operation of Winchester disk drive for a long time, comprise when machine etc. influencing computer operating, significantly shortened its serviceable life.
The utility model content
Fundamental purpose of the present utility model, be to solve above-mentioned tradition disappearance, avoid disappearance to exist, the utility model is with simple architecture and make one and can directly use and the Winchester disk drive all surfaces coats thermal bonding, disperse a Winchester disk drive heat abstractor of heat energy by the heat radiation wall of outside encirclement with transferring heat energy, heat energy to Winchester disk drive produces can improve its thermal transpiration efficient, so that the user to be provided easier, the cheap but practical Winchester disk drive heat abstractor of high cooling efficiency.
For reaching above-mentioned purpose, Winchester disk drive heat abstractor of the present utility model includes:
One Winchester disk drive;
One thermal bonding is covered in first heat-conducting unit of above-mentioned Winchester disk drive outer surface, has a body, and the body inboard has most thermal bondings surface, and most heat radiation walls are set in the body exterior surface;
One thermal bonding has a body in second heat-conducting unit of above-mentioned Winchester disk drive bottom, and this body is provided with a thermal bonding surface of a relative Winchester disk drive bottom, and in the heat radiation wall on this body exterior surface;
Above-mentioned this second heat-conducting unit sees through a heat-conducting glue thermal bonding in Winchester disk drive bottom, the perhaps one of processor controls.
In the utility model one preferred embodiment, the thermal bonding surface of this first heat-conducting unit more comprises: be positioned at inboard end face of body and the two side faces between end face and bottom.
In the utility model one preferred embodiment, the thermal bonding surface of this first heat-conducting unit is the plane surface that can engage with Winchester disk drive surface close thermal.
In the utility model one preferred embodiment, the majority of this first heat-conducting unit heat radiation wall comprises that more the end face that is positioned at the body exterior surface reaches the two side faces between end face and bottom.
In the utility model one preferred embodiment, the majority of this first heat-conducting unit heat radiation wall is that aluminium extruded type is shaped in the end face on this body exterior surface and the two side faces between end face and bottom surface.
In the utility model one preferred embodiment, the heat radiation wall of this first heat-conducting unit comprises that more majority extends the radiating fins of arranging by this body by integral forming and forms.
In the utility model one preferred embodiment, the thermal bonding surface of this second heat-conducting unit is to see through the plane surface that heat-conducting glue engages with Winchester disk drive bottom close thermal.
In the utility model one preferred embodiment, the heat radiation wall of this second heat-conducting unit more comprises: most radiating fins of being arranged by its body one surperficial one-body molded extension are formed.
See also the detailed description and the accompanying drawing thereof of following relevant the utility model one preferred embodiment, can further understand technology contents of the present utility model and purpose effect thereof.
Description of drawings
Fig. 1 is the structural upright exploded view of the utility model one embodiment.
Fig. 2 is the decomposing schematic representation of the utility model one embodiment, second heat-conducting unit and Winchester disk drive.
Fig. 3 is the combination synoptic diagram of the utility model one embodiment, second heat-conducting unit and Winchester disk drive.
Fig. 4 is the utility model one example structure combination synoptic diagram.
Fig. 5 is the synoptic diagram of the utility model one example structure and guiding air-flow.
Fig. 6 is the structural upright exploded view of another embodiment of the utility model.
Fig. 7 is the decomposing schematic representation of another embodiment second heat-conducting unit of the utility model and Winchester disk drive.
Fig. 8 is the combination synoptic diagram of another embodiment second heat-conducting unit of the utility model and Winchester disk drive.
Fig. 9 is another example structure combination synoptic diagram of the utility model.
The primary clustering symbol description
Winchester disk drive 1 first heat-conducting unit 2
Second heat-conducting unit, 3 heat-conducting glues 4
Lock arrangement 5 upper surfaces 11
Side surface 12,13 holes 14
Processor controls 15 bodies 20,31
End face 21 sides 22,23
Thermal bonding surface 24,32 heat radiation walls 25,33
Radiating fin 26,34 is dispersed channel 27
Lockhole 28 bodies 31
Composition surface 32 heat radiation walls 33
Radiating fin 34
Embodiment
Relevant technology contents of the present utility model and detailed description, existing conjunction with figs. is described as follows:
Seeing also shown in Fig. 1 to 5, is the decomposition and combination synoptic diagram that the utility model Winchester disk drive heat abstractor is formed structure.As shown in the figure: the utility model Winchester disk drive heat abstractor includes: a Winchester disk drive 1; One is coated on first heat-conducting unit 2 of Winchester disk drive 1 outer surface; Reach one and utilize second heat-conducting unit 3 of heat-conducting glue 4 thermal bondings in Winchester disk drive 1 bottom, with constitute one cheap but all thermal bondings be covered in above-mentioned Winchester disk drive outside, the heat abstractor of tool high cooling efficiency, the fast speed belt of fan unit convection current air that is provided with the coupled computer casing is used the high temperature heat dissipation that improves Winchester disk drive from Winchester disk drive heat energy.
Above-mentioned first heat-conducting unit of carrying 2, has a preferable body 20 of making by the aluminium extruded type material, this body 20 includes an end face 21 and 22,23 formations of two side faces between end face 21 and bottom at least, aforementioned body 20 is shaped to thermal bonding surface 24 at the inner surface that comprises an end face 22 and two side faces 22,23 at least, and its outer surface one-body molded for the heat radiation wall 25.
Aforementioned this thermal bonding surface 24, be preferably a plane surface moulding, can with a Winchester disk drive 1 each the relative outer surface that is covered, be the close thermal joint as its upper surface 11 and two side surfaces 12,13, with form splendid heat transference efficiency with Winchester disk drive 1 thermal energy transfer to the thermal transpiration unit 2 bodies 20, disperse further to see through above-mentioned heat radiation wall 25.
Described heat radiation wall 25, be to be arranged in above-mentioned body 20 and to comprise that at least the radiating fin 26 of an end face 21 and two side faces 22,23 is constituted by majority is one-body molded, and this several dissipation fins 26 arrange form disperse channel 27, be preferably the convection current air conducting direction of fan unit (not shown) generation that is provided with respect to computer housing, as shown in Figure 5, with can be fast by the heat energy of dispersing of 26 of convection current air band discrete heat fins.
Above-mentioned second heat-conducting unit of carrying 3, has a preferable body 31 of making by the aluminium extruded type material, this body 31 forms a thermal bonding surface 32 in the one plane surface, enable to see through a heat-conducting glue 4 and engage transferring heat energy with Winchester disk drive 1 bottom close thermal, at this body 31 another outer surface with respect to thermal bonding surface 32, then be provided with a heat radiation wall 33, this heat radiation wall 33 contains most radiating fins 34 that extended by body 31 1 surperficial one-body molded arrangements.
Above-mentioned this first heat-conducting unit 2, the lockhole 28 that can further offer, the hole 14 lock dress one of utilizing the above-mentioned relatively Winchester disk drive 1 of lock arrangement 5 to be provided with by its body 20 two side faces 22,23.
Because this first heat-conducting unit 2 and second heat-conducting unit 3, its each thermal bonding surface 24 of energy mat, 32 form all and close thermal engages and is covered in Winchester disk drive 1 each surface, can obtain large tracts of land, fast with the body 20 of Winchester disk drive 1 thermal energy transfer to the first heat-conducting unit 2 and second heat-conducting unit 3,31, again by body 20, the majority heat radiation wall 25 of 31 outer surfaces, 33 do and large-arealy disperse fast, the convection current air conducting direction that the fan unit (not shown) that is provided with the coupled computer casing produces can be fast by convection current air band discrete heat fin 26,34 disperse heat energy.
Seeing also shown in Fig. 6 to 9, is that Winchester disk drive heat abstractor of the present utility model is formed another embodiment synoptic diagram of structure.As shown in the figure: present embodiment and above-mentioned Fig. 1 to 5 are roughly the same, institute's difference is in this second heat-conducting unit 3 and is miniaturization Design, its area is preferably and equals the processor controls 15 that Winchester disk drive 1 exposes to the bottom relatively, and utilize heat-conducting glue 4 with the thermal bonding of second heat-conducting unit 3 surface 32 thermal bondings in these processor controls 15 1 surfaces, and with first heat-conducting unit 1 that is covered in Winchester disk drive 1 upper surface 11 and two side surfaces 12,13, with form one cheap but all thermal bondings be covered in that above-mentioned Winchester disk drive is outside to produce position, the heat abstractor of tool high cooling efficiency with thermal source.
Above-listed detailed description is specifying at a possible embodiments of the present utility model, but this embodiment is not in order to limit claim of the present utility model, allly do not break away from the equivalence that the utility model skill spirit done and implement or change, for example: wait the equivalence embodiment of variation, all should be contained in the application's the claim.
In sum, the utility model not only really belongs to innovation on device architecture and running kenel, and can commonly use article and promote above-mentioned multinomial effect, should fully meet novelty and creationary legal utility model patent important document, sincerely file an application in accordance with the law, earnestly ask and check and approve the utility model patent application case, to encourage creation, to feeling moral just.

Claims (11)

1, a kind of Winchester disk drive heat abstractor is characterized in that, this device comprises:
One Winchester disk drive;
One thermal bonding is covered in first heat-conducting unit of above-mentioned Winchester disk drive outer surface, has a body, and the body inboard has most thermal bondings surface, and most heat radiation walls are set in the body exterior surface;
One second heat-conducting unit has a body, and this body is provided with a thermal bonding surface of a relative Winchester disk drive bottom, and in the heat radiation wall on this body exterior surface;
Above-mentioned this second heat-conducting unit sees through a heat-conducting glue thermal bonding in the Winchester disk drive bottom.
2, Winchester disk drive heat abstractor as claimed in claim 1 is characterized in that, the thermal bonding surface of this first heat-conducting unit more comprises and is positioned at inboard end face of body and the two side faces between end face and bottom.
3, Winchester disk drive heat abstractor as claimed in claim 1 is characterized in that, the thermal bonding surface of this first heat-conducting unit is the plane surface that can engage with Winchester disk drive surface close thermal.
4, Winchester disk drive heat abstractor as claimed in claim 1 is characterized in that, the majority heat radiation wall of this first heat-conducting unit comprises that more the end face that is positioned at the body exterior surface reaches the two side faces between end face and bottom.
5, Winchester disk drive heat abstractor as claimed in claim 1 is characterized in that, the majority heat radiation wall of this first heat-conducting unit is that aluminium extruded type is shaped in the end face on this body exterior surface and the two side faces between end face and bottom surface.
6, Winchester disk drive heat abstractor as claimed in claim 1 is characterized in that the heat radiation wall of this first heat-conducting unit more comprises: extend the several dissipation fins of arranging by this body by integral forming and form.
7, Winchester disk drive heat abstractor as claimed in claim 1 is characterized in that, the thermal bonding surface of this second heat-conducting unit is to see through the plane surface that heat-conducting glue engages with Winchester disk drive bottom close thermal.
8, Winchester disk drive heat abstractor as claimed in claim 1 is characterized in that, the heat radiation wall of this second heat-conducting unit more comprises: most radiating fins of being arranged by its body one surperficial one-body molded extension are formed.
9, a kind of Winchester disk drive heat abstractor is characterized in that, this device comprises:
One Winchester disk drive;
One thermal bonding is covered in first heat-conducting unit of above-mentioned Winchester disk drive outer surface, has a body, and the body inboard has most thermal bondings surface, and most heat radiation walls are set in the body exterior surface;
One second heat-conducting unit has a body, and this body is provided with a thermal bonding surface of a relative Winchester disk drive bottom, and in the heat radiation wall on this body exterior surface;
Above-mentioned this second heat-conducting unit sees through processor controls one surface of a heat-conducting glue thermal bonding in the Winchester disk drive bottom.
10, Winchester disk drive heat abstractor as claimed in claim 9 is characterized in that, the area of this second heat-conducting unit is the processor controls area that equals the Winchester disk drive bottom relatively.
11, a kind of Winchester disk drive heat abstractor is characterized in that, this device comprises:
One Winchester disk drive;
One all thermal bonding be covered in first heat-conducting unit of above-mentioned Winchester disk drive outer surface, have a body, the body inboard has most thermal bondings surface, and most heat radiation walls are set in the body exterior surface.
CN 200520103405 2005-08-04 2005-08-04 Hard disc machine heat radiator Expired - Fee Related CN2821784Y (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN 200520103405 CN2821784Y (en) 2005-08-04 2005-08-04 Hard disc machine heat radiator

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN 200520103405 CN2821784Y (en) 2005-08-04 2005-08-04 Hard disc machine heat radiator

Publications (1)

Publication Number Publication Date
CN2821784Y true CN2821784Y (en) 2006-09-27

Family

ID=37018338

Family Applications (1)

Application Number Title Priority Date Filing Date
CN 200520103405 Expired - Fee Related CN2821784Y (en) 2005-08-04 2005-08-04 Hard disc machine heat radiator

Country Status (1)

Country Link
CN (1) CN2821784Y (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104217743A (en) * 2013-05-30 2014-12-17 英业达科技有限公司 Electronic device and frame structure thereof
WO2016026271A1 (en) * 2014-08-19 2016-02-25 华为技术有限公司 Heat dissipation apparatus for hard disk array

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104217743A (en) * 2013-05-30 2014-12-17 英业达科技有限公司 Electronic device and frame structure thereof
WO2016026271A1 (en) * 2014-08-19 2016-02-25 华为技术有限公司 Heat dissipation apparatus for hard disk array
CN105446437A (en) * 2014-08-19 2016-03-30 华为技术有限公司 Disk array cooling device

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C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20060927