CN2807483Y - Special-purpose double-illuminator LED lamp for miner's lamp - Google Patents
Special-purpose double-illuminator LED lamp for miner's lamp Download PDFInfo
- Publication number
- CN2807483Y CN2807483Y CNU2005200788548U CN200520078854U CN2807483Y CN 2807483 Y CN2807483 Y CN 2807483Y CN U2005200788548 U CNU2005200788548 U CN U2005200788548U CN 200520078854 U CN200520078854 U CN 200520078854U CN 2807483 Y CN2807483 Y CN 2807483Y
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- CN
- China
- Prior art keywords
- light source
- led chip
- source led
- main light
- led chips
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/85909—Post-treatment of the connector or wire bonding area
- H01L2224/8592—Applying permanent coating, e.g. protective coating
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Led Device Packages (AREA)
Abstract
The utility model relates to a special double-light source LED lamp used for miners lamps, which is suitable for miner production underground. The utility model is composed of a radiating base plate, LED chips, a sealing cover of a lens, etc. The utility model is characterized in that the number of the groups of LED chips which are sealed in the sealing cover of the lens is two; the two groups of the LED chips comprise a main light source LED chip and auxiliary light source LED chips with the number of oen to four; the voltage difference of the operating voltage among the main light source LED chip and the auxiliary light source LED chips is more than or equal to 0.3 V; an electrode low-voltage converting circuit is arranged in a battery charge and discharge control circuit of the main light source LED chip and the auxiliary light source LED chips. The miners lamp uses the main light source LED for illumination at ordinary times; when the main light source is broken or the battery voltage is too low, the positive electrode of battery is connected with the positive electrode ends of the auxiliary light source LED chips from the positive electrode end of the main light source LED chip in a transferring mode by the electrode low-voltage converting circuit to make the miners lamp changed into the illumination carried out by the auxiliary light source LED chips.
Description
Technical field
The utility model belongs to electrical lighting device technology field, relates to the special-purpose two light source led lamps of mine lamp that a kind of miner's of being suitable for downhole production is used.
Background technology
What installed and used on mine lamp in a large number this area in the past all is traditional incandescent lamp bulb generally, and structure heaviness, poor stability, useful life lack.In recent years, many mines company is for improving mine lamp fail safe and portability, and performance purposes such as increase mine lamp useful life and prolongation mine lamp single lighting hours, Ni-MH battery and lithium battery mine lamp have been used, the company that has has also adopted white LED lamp, though alleviated the weight of mine lamp and prolonged mine lamp single lighting hours, but its shortcoming is not consider the emergency lighting of mine lamp, if mine lamp breaks down in the work production process, will bring unnecessary danger to the workman, especially cross the work that more is difficult to guarantee mine lamp when hanging down at cell voltage.
The utility model content
The purpose of this utility model is to overcome the weak point that prior art exists, and then to provide a kind of can all be the special-purpose pair light source led lamps of mine lamp that mine lamp is given security in safety, economize on electricity, aspect convenient, emergent.
Be used to realize that the technical solution of foregoing invention purpose is such: the heat dissipation metal base plate that the special-purpose two light source led light fixtures of the mine lamp that provided have a pressure welding on it led chip to be arranged and be laid with printed circuit board technology bonding die, in being packaged with, fills the led chip external seal lens sealing cover of transparent silica gel, on the heat dissipation metal base plate, be shaped on the both positive and negative polarity pad contact of the led chip of making of Copper Foil, it is characterized in that: the encapsulated LED chip has two groups in the lens sealing cover, comprise a main light source led chip and 1～4 pair of light source led chip, pressure reduction 〉=the 0.3V of the operating voltage of main light source led chip and pair light source led chip is provided with the low voltage conversion circuit of electrode in the battery charge/discharge control circuit of main light source led chip and pair light source led chip.
No matter the described in the utility model pair of light source led lamp be can both give security for mine lamp at safety, economize on electricity, aspect such as convenient, emergent.In the mine lamp practical application, adopt main light source LED illumination at ordinary times, pay light source led and do not work; When main light source breaks down or cell voltage is crossed when low, the low voltage conversion circuit of the electrode in the battery charge/discharge control circuit is transferred to the positive terminal of paying the light source led chip with anode by the positive terminal of main light source led chip, pays the light source led illumination so mine lamp adopts.Because main light source led chip and pair light source led chip are with being in the package lens, the light source adapter can not change to the source reflection path, the uniformity of illumination and the scope of illumination can not change yet, just the intensity of illumination dies down to some extent, under equal battery condition, the lighting hours of paying light source can prolong more than 4 times.
Description of drawings
Fig. 1 is the structural representation of an embodiment of the utility model.
Fig. 2 is that the A-A of Fig. 1 is to main cutaway view.
Fig. 3 is an encapsulating structure schematic diagram of the present utility model.
Fig. 4 is an another kind of encapsulating structure schematic diagram of the present utility model.
Embodiment
As shown in the figure, the special-purpose two light source led lamps of mine lamp described in the utility model are made up of members such as heat dissipation metal base plate 1, led chip 2, lens sealing covers 4.Heat dissipation metal base plate 1 uses the Metal Substrate copper-clad plate as lead frame, makes bonding die with printing the version circuit technology on it.Led chip 2 pressure weldings are on heat dissipation metal base plate 1, pair light source led chip 22 that comprises a main light source led chip 21 and four ring main light source led chips 21 and establish, wherein main light source led chip 21 is 0.5～1.5W blue light or purple LED chip, each pair light source led chip 22 constitutes by a 0.06W blue light or purple LED chip, utilize blue-light LED chip to excite yellow fluorescent powder during work, make yellow fluorescent powder send sodium yellow, blue light or purple light again with the sodium yellow synthesize white light; The purple light that perhaps utilizes the purple LED chip to send, excitated red fluorescent powder sends ruddiness, and excitated blue fluorescent material sends blue light, excites green emitting phosphor to send green glow, at last by red, blue, green three coloured light synthesize white lights.Pressure reduction 〉=the 0.3V of the operating voltage of main light source led chip 21 and pair light source led chip 22.Lens sealing cover 4 sealed package are filled with transparent silica gel 5 (referring to Fig. 2, Fig. 3 and Fig. 4) in the cover outside led chip 2.Main light source led chip 21 is separate with the positive terminal pad contact of paying light source led chip 22.The both positive and negative polarity pad contact weldering of the led chip of making of Copper Foil 8 is on heat dissipation metal base plate 1, wherein: main light source led chip 21 and the shared pad contact 81 of negative pole (also can be separate) of paying light source led chip 22, main light source led chip 21 is separate with the positive terminal pad contact of paying light source led chip 22, in main light source led chip 21 and the battery charge/discharge control circuit of paying light source led chip 22, be provided with the low voltage conversion circuit of electrode of conventional type, can be when cell voltage is crossed low or main light source discharge loop and broken down the positive pole of battery be transferred to the positive terminal of paying the light source led chip by the positive terminal of main light source led chip by the automatic or manual mode.Label 83 among Fig. 1 is a main light source positive terminal pad contact, and 82 and 84 are a pair light source positive terminal pad contact; Label 3 among Fig. 3 and Fig. 4 is the spun gold pressure welding point, and 6 is fluorescent material, and 7 is heat conductive insulating silica gel, and 9 is the heat conductive insulating layer.
Claims (3)
1, the special-purpose two light source led lamps of a kind of mine lamp, has the heat dissipation metal base plate (1) that a pressure welding on it has led chip (2) and is laid with printed circuit board technology bonding die, in being packaged with, fills led chip (2) external seal the lens sealing cover (4) of transparent silica gel (7), on heat dissipation metal base plate (1), be shaped on the both positive and negative polarity pad contact of the led chip of making of Copper Foil (8), it is characterized in that: flat to being packaged with two groups of led chips in lens sealing cover (4), comprise a main light source led chip (21) and 1～4 pair of light source led chip (22), pressure reduction 〉=the 0.3V of the operating voltage of main light source led chip (21) and pair light source led chip (22) is provided with the low voltage conversion circuit of electrode in the battery charge/discharge control circuit of main light source led chip (21) and pair light source led chip (22).
2, the special-purpose two light source led lamps of mine lamp as claimed in claim 1, it is characterized in that: main light source led chip (21) is 0.5～1.5W blue light or purple LED chip, paying light source led chip (22) is a 0.06W blue light or purple LED chip.
3, the special-purpose two light source led lamps of mine lamp as claimed in claim 1, it is characterized in that: main light source led chip (21) and the shared pad contact of negative pole (81) of paying light source led chip (22), main light source led chip (21) is separate with the positive terminal pad contact of paying light source led chip (22).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2005200788548U CN2807483Y (en) | 2005-06-02 | 2005-06-02 | Special-purpose double-illuminator LED lamp for miner's lamp |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2005200788548U CN2807483Y (en) | 2005-06-02 | 2005-06-02 | Special-purpose double-illuminator LED lamp for miner's lamp |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN2807483Y true CN2807483Y (en) | 2006-08-16 |
Family
ID=36921780
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNU2005200788548U Expired - Fee Related CN2807483Y (en) | 2005-06-02 | 2005-06-02 | Special-purpose double-illuminator LED lamp for miner's lamp |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN2807483Y (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103234164A (en) * | 2013-05-02 | 2013-08-07 | 桂林海威科技有限公司 | Double-seal waterproof guardrail LED (light emitting diode) streetlamp structure |
-
2005
- 2005-06-02 CN CNU2005200788548U patent/CN2807483Y/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103234164A (en) * | 2013-05-02 | 2013-08-07 | 桂林海威科技有限公司 | Double-seal waterproof guardrail LED (light emitting diode) streetlamp structure |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C19 | Lapse of patent right due to non-payment of the annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |