CN2807472Y - Pressure spiral arms structure - Google Patents

Pressure spiral arms structure Download PDF

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Publication number
CN2807472Y
CN2807472Y CNU2005200920363U CN200520092036U CN2807472Y CN 2807472 Y CN2807472 Y CN 2807472Y CN U2005200920363 U CNU2005200920363 U CN U2005200920363U CN 200520092036 U CN200520092036 U CN 200520092036U CN 2807472 Y CN2807472 Y CN 2807472Y
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CN
China
Prior art keywords
grinding machine
wafer grinding
wafer
spiral arm
arm body
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CNU2005200920363U
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Chinese (zh)
Inventor
童德黉
童德观
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Individual
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Individual
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Publication date
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Priority to CNU2005200920363U priority Critical patent/CN2807472Y/en
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Publication of CN2807472Y publication Critical patent/CN2807472Y/en
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Expired - Fee Related legal-status Critical Current

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Abstract

The utility model provides a pressure spiral arm structure, which comprises a spiral arm body and an induction body, wherein both ends of the spiral arm body are respectively provided with a pivoting part and a holding and fixing part which are used for a wafer grinding machine to sheath. The induction body is arranged on the lower end of the spiral arm body and is a single block body having high stress and high strain intensity, the side surface is provided with a through hole and the upper and the lower end surfaces of the block body along the middle line of the thin wall of the through hole are provided with strain components. The structure can be used for holding and fixing a wafer grinding machine to be arranged in the holding and fixing part, and a wafer is sucked to grind by the telescopic action of the wafer grinding machine. The utility model can prevent the self damage of a wafer grinding machine and the damage of a ground wafer, and the damages are caused by excess pushing and extension of a wafer grinding machine; accordingly, the good manufacture rate of products can be improved, the abrasion of a wafer grinding machine can be avoided and the maintenance cost can be greatly reduced.

Description

The pressure arm structure
Technical field
The utility model relates to a kind of pressure arm structure, particularly about a kind of change by this body weight of spiral arm, test and know whether the wafer grinding machine pushes away and extend the location, and can provide the operating side to react, prevent that the wafer grinding machine from causing the wafer that damages wafer grinding machine itself and ground because of pushing away to extend through more.
Background technology
Wafer grinding workflow commonly used, be to utilize an arm structure to drive the wafer grinding machine to rotate to the work location, draw wafer by the wafer grinding machine with expanding-contracting action again, then wafer is rotated action, add diamond dust spin finishing in the lump simultaneously, to be ground finishing still placed wafer with expanding-contracting action, driven by arm structure the wafer grinding machine is recessed the work location, so promptly finishes the grinding of wafer.
Yet, as above-mentioned common structure, see the shortcoming that its structure but is implied with many manufacturings and uses:
1. because the wafer grinding machine pushes away downwards when stretching, the operator often only can extend the work location with feeling to judge whether to push away by rule of thumb, therefore usually causes to push away and stretches deficiency, and can't carry out grinding really; Or push away the wafer that extends through as many as conflict grinding, and cause damage, have a strong impact on the yield of making.
2. the cost that uses easily because of long-term use easily causes wearing and tearing, is keeped in repair and increase in wafer grinding machine bottom.
This case inventor is because predicament and the shortcoming that above-mentioned wafer grinding workflow commonly used is produced, and accumulation individual is engaged on the related industry exploitation practice experience for many years, study intensively,, develop a kind of pressure arm structure finally according to existing spiral arm improvement.
The utility model content
Main purpose of the present utility model is to provide a kind of pressure arm structure, and change that can be by this body weight of spiral arm is tested and known whether the wafer grinding machine pushes away and extend the location, thus improve production yield, and reduce the cost that maintenance is used.
For achieving the above object, the technical solution adopted in the utility model is: it includes a spiral arm body, and two ends are respectively equipped with an articulated section and and hold solid portion, for the wafer grinding mantle establish into; One inductor is located at above-mentioned spiral arm body lower end, the single block of, high strain intensity heavily stressed for tool, and its place, side has an open-work, is provided with the strain assembly along the upper and lower end face of the block place of open-work thin-walled center line.
As above-mentioned structure, when the wafer grinding machine pushes away downwards when extending location conflict object, can make the inductor on the spiral arm body produce micro-deformation, become corresponding weight to show this deflection conversion of signals by the strain assembly, and then inform the operating side, make the wafer grinding machine stop to push away and stretch, begin to carry out grinding work.
The utlity model has following advantage:
1. the utility model can be by the change of this body weight of spiral arm, test and know whether the wafer grinding machine pushes away and extend the location, to provide the operating side to react, prevent that the wafer grinding machine from causing the wafer that damages wafer grinding machine itself and ground because of pushing away to extend through more, and then improve the yield of production;
2. the utility model can be avoided the wearing and tearing of wafer grinding machine, and significantly reduce the cost of safeguarding by the induction of strain assembly.
Description of drawings
See also the detailed description and the accompanying drawing thereof of following relevant the utility model one preferred embodiment, can further understand technology contents of the present utility model and purpose effect thereof; The accompanying drawing of relevant this embodiment is:
Fig. 1 is one of stereoscopic figure of the present utility model;
Fig. 2 is two of stereoscopic figure of the present utility model;
Fig. 3 is the decomposing schematic representation of the utility model user mode;
Fig. 4 is the combination schematic diagram of the utility model user mode.
Embodiment
Your juror can further to structure of the present utility model, use and feature thereof clear and definite, full and accurate understanding of darker one deck and understanding be arranged for ease of, the inventor enumerates preferred embodiment, and conjunction with figs. is described in detail as follows:
As shown in Figure 1, 2, the utility model comprises: a spiral arm body 1, an inductor 2 etc., wherein:
These spiral arm body 1 two ends are respectively equipped with an articulated section 11 and and hold solid portion 12, and this articulated section 11 extends an annular external member in these spiral arm body 1 one ends, and this is held solid portion 12 and extends an annular external member in these spiral arm body 1 one ends, and the upper end is provided with plural lockhole 121;
This inductor 2 is located at above-mentioned spiral arm body 1 lower end, the single block of, high strain intensity heavily stressed for tool, and its place, side has an open-work 21 that is the H type, is provided with strain assembly 3 respectively along the upper and lower end face of the block place of these open-work 21 thin-walled center lines.
Above-mentioned structure is shown in Fig. 3,4, and this articulated section 11 can be arranged in the rotating shaft of board, and this is held solid portion 12 and can go into for a wafer grinding machine 4 is sheathed, and certainly should plural number lockhole 121 with these wafer grinding machine 4 locking location; During enforcement, can drive 4 turns of wafer grinding machine to production line, draw wafer by this wafer grinding machine 4 with expanding-contracting action, carry out attrition process, when wafer grinding machine 4 pushes away when extending location conflict object, because of reaction force produces micro-deformations to the inductor on the spiral arm body 12 downwards, become corresponding weight to show this deflection conversion of signals by strain assembly 3, and then inform the operating side, and make wafer grinding machine 4 stop to push away and stretch, begin to carry out grinding work.
Above-listed detailed description is specifying at a possible embodiments of the present utility model, only this embodiment is not in order to limit claim of the present utility model, allly do not break away from the equivalence that the utility model skill spirit does and implement or change, for example wait the equivalence embodiment that changes, all should be contained in the claim of this case.

Claims (4)

1. a pressure arm structure can be drawn wafer by this wafer grinding machine with expanding-contracting action for holding a solid wafer grinding machine turn to production line, carries out attrition process, it is characterized in that comprising:
One spiral arm body, two ends be respectively equipped with an articulated section and one for the wafer grinding mantle establish into hold solid portion;
One inductor is located at above-mentioned spiral arm body lower end, the single block of, high strain intensity heavily stressed for tool, and its place, side has an open-work, is provided with the strain assembly along the upper and lower end face of the block place of open-work thin-walled center line;
When the wafer grinding machine pushes away downwards when extending location conflict object, can make inductor generation micro-deformation on the spiral arm body, become corresponding weight to show this deflection conversion of signals by the strain assembly, and then inform the operating side, make the wafer grinding machine stop to push away and stretch, begin to carry out grinding work.
2. by the described pressure arm structure of claim 1, it is characterized in that: wherein this articulated section is extended an annular external member in this spiral arm body one end and is formed.
3. by the described pressure arm structure of claim 1, it is characterized in that: wherein this is held solid portion and extends an annular external member in this spiral arm body one end, the upper end be provided with can for the wafer grinding mantle establish into and the plural lockhole of locking location.
4. by the described pressure arm structure of claim 1, it is characterized in that: wherein this open-work is the H type.
CNU2005200920363U 2005-08-02 2005-08-02 Pressure spiral arms structure Expired - Fee Related CN2807472Y (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CNU2005200920363U CN2807472Y (en) 2005-08-02 2005-08-02 Pressure spiral arms structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CNU2005200920363U CN2807472Y (en) 2005-08-02 2005-08-02 Pressure spiral arms structure

Publications (1)

Publication Number Publication Date
CN2807472Y true CN2807472Y (en) 2006-08-16

Family

ID=36921769

Family Applications (1)

Application Number Title Priority Date Filing Date
CNU2005200920363U Expired - Fee Related CN2807472Y (en) 2005-08-02 2005-08-02 Pressure spiral arms structure

Country Status (1)

Country Link
CN (1) CN2807472Y (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110497307A (en) * 2018-05-18 2019-11-26 株式会社荏原制作所 The method and grinding device detected using abradant surface of the grinding head to grinding pad

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110497307A (en) * 2018-05-18 2019-11-26 株式会社荏原制作所 The method and grinding device detected using abradant surface of the grinding head to grinding pad

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C19 Lapse of patent right due to non-payment of the annual fee
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