CN2806035Y - Apparatus for machining liquid storage tank of microfluidic chip and chip cutting by utilizing laser - Google Patents
Apparatus for machining liquid storage tank of microfluidic chip and chip cutting by utilizing laser Download PDFInfo
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- CN2806035Y CN2806035Y CN 200520114854 CN200520114854U CN2806035Y CN 2806035 Y CN2806035 Y CN 2806035Y CN 200520114854 CN200520114854 CN 200520114854 CN 200520114854 U CN200520114854 U CN 200520114854U CN 2806035 Y CN2806035 Y CN 2806035Y
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Abstract
The utility model relates to an apparatus for machining a liquid storage tank of a micro-fluidic chip and chip cutting by utilizing laser, which belongs to the technical field of laser. The utility model adopts a light-power machining and comprises a laser (10), an outer light path system (3) and a machining platform (4). The utility model is characterized in that the laser is a carbon dioxide laser, and the laser emitted by the laser is vertically emitted into the surfaces of materials arranged on the machining platform through the outer light path system; the machining platform comprises an outer frame (8) and horizontal grates (17), wherein space between the horizontal grates is larger than the size of a chip, and the upper parts of the horizontal grates are inclination-angle inclined planes capable of reflecting the transmitted laser to the lower part of a horizontal plane, an automatic recovering device (5) for making the space between the horizontal grates drop to the chip to carry over a laser machining circuit is also arranged just under the machining platform. The apparatus of the utility model can effectively protect the surface of the chip form being damaged in the whole machining process, enhance the machining efficiency and effectively utilize materials, and finished products to be machined are easily recovered or easily transferred to next one station.
Description
Technical field
The utility model relates to a kind of laser processing device, especially to using the laser processing device of high polymer material in the biochip, belongs to laser technology field.
Background technology
Traditional machining adopts modes such as card, folder, pressure that material is fixed on the processing platform more, understands heavy wear like this and destroys biochip surface; Because the existence of standing part can not make material be able to effective utilization; The efficient of machining is low, is not suitable for being applied to producing in batches.
Compare Laser Processing with traditional machining and have a lot of outstanding advantages, but still processing to biochip can not be satisfied in some place, mainly is presented as:
The processing platform of existing laser processing device is used for the processing of metal material more, platform makes intensive cross grid by metal material and makes up supporting object, be easy to like this reflect after the dump energy behind the laser penetration material runs into platform in the process of processing, to the processed finished products secondary operations.Because the fusing point height of metal material, dump energy can not impact finished product, and the high polymer material fusing point is low, and the reflection of dump energy can have a strong impact on the result of processing.
Existing processing mode generally adopts processing platform motion and light dynamic formula to combine, cost is than higher so on the one hand, on the other hand because the high polymer material quality is light, in with the process of platform motion easily and platform relatively move, if material is fixed, can wear and tear equally and destroy material surface.
Laser Processing now mostly is single-piece work, manual recovery after the process finishing, and protection processed finished products that like this can be artificial, but such efficient is too low, is not suitable for producing.
The utility model content
The purpose of this utility model is to propose a kind of laser that adopts and carries out the processing unit (plant) that micro-fluidic chip liquid storage tank and chip are cut apart, adopt light dynamic formula processing mode, improve processing platform, make process chips surface injury-free, and can reclaim automatically, improve working (machining) efficiency.
For achieving the above object, adopt light dynamic formula processing mode, comprise laser instrument 10, outside optical system 3 and processing platform 4, be characterised in that: described laser instrument 10 is carbon dioxide laser, and the laser that laser instrument 10 sends impinges perpendicularly on the material surface that is placed on processing platform 4 through outside optical system 3; Described processing platform 4 comprises outside framework 8, horizontal grate 17, and wherein, the spacing of horizontal grate 17 is greater than the size of chip, and horizontal grate 17 tops are the inclined-plane, inclination angle that the laser of transmission can be reflected to the horizontal plane below, and the inclination angle is θ, 0 °＜θ＜45 °; Between also being provided with under the processing platform 4, drop to chip and take the automatic recycling device 5 of Laser Processing circuit out of horizontal grate 17.Horizontal grate 17 can be narrow strip rectangle sheet metal, and the laser penetration material is reflected below horizontal plane on the inclined-plane on sheet metal top, material secondary is processed preventing.
Described outside optical system 3 by be fixed on first speculum 11 on the horizontal lathe 15, be fixed on second speculum 12 on vertical lathe 16, the focus lamp 13 under second speculum is formed, and makes laser vertical in the material surface incident that is placed on processing platform 4; First speculum 11 and horizontal plane angle in the outside optical system 3 are α, second speculum 12 and horizontal plane angle are β, alpha+beta=180 °, focus lamp 13 be placed horizontally at second speculum 12 under, make incident laser vertical level outgoing behind outside optical system 3.Two speculums are respectively with machine tool motion that it was fixed in.
Described automatic recycling device comprises motor 9, base 18, driving wheel 19, driven pulley 20, conveyer belt 14; Wherein, driving wheel 19, driven pulley 20, on base 18, driving wheel 19 links to each other with motor 9 by power transmission shaft by bearing fixing, and driving wheel 19 has conveyer belt 14 to connect between the driven pulley 20.
The centre position that is parallel to processing platform at the both sides of body outer wall is provided with suction opeing 2, makes whole process that suction opeing 2 exhausting all be arranged, and processes the circulation of air of object surface and processing environment with maintenance, thereby has guaranteed the cleaning on processed finished products surface.
Also be provided with horizontal adjustment knob 6 and horizon rule 7 on the described processing platform 4; Horizon rule 7 is fixed on the centre position of orthogonal two frame outer walls, upper surface is parallel with the upper surface of outside framework 8, four horizontal adjustment knob 6 are placed on four interior bases of outside framework, regulate the height of processing platform 4 and keep making the processing platform level by adjusting knob 6.
After adopting the utility model,, make that the efficient of processing is higher, speed is faster owing to adopted Laser Processing; Because workpiece is placed directly on the processing platform, so avoided deformation and wearing and tearing because of fixedly bringing; Because the two-dimemsional number controlled machine drives the laser Machining head motion, but not the processing platform motion, process is faster like this, locatees more accurate; Because automatic recycling device can effectively be protected chip surface in the process that reclaims, and is easy to processed finished products is sent to next station, is adapted to the batch process of streamline; Owing in the two sides of processing platform bleeding point is arranged all, remains less with the cleaning of maintenance processing environment and the residue of material surface.Thereby make whole process simple, quick, clean, have protection.
Description of drawings
Fig. 1 is a device front view of the present utility model;
Fig. 2 is a device vertical view of the present utility model;
Wherein the outer direction of arrow of frame is: two directions of arrow in the laser incident direction, frame are respectively the direction of motion of two-dimemsional number controlled machine;
Fig. 3 is the outside optical system vertical view;
The direction of arrow wherein is the laser propagation direction;
Fig. 4 is the processing platform vertical view;
Fig. 5 is the automatic recycling device vertical view;
Among Fig. 1-5,1-equipment body, 2-suction opeing, 3-outside optical system, the 4-processing platform, 5-automatic recycling device, 6-horizontal adjustment knob, 7-horizon rule, the 8-outside framework, 9-motor, 10-laser instrument, 11-first speculum, 12-second speculum, 13-focus lamp, 14-conveyer belt, 15-transverse movement lathe, 16-lengthwise movement lathe, 17-horizontal grate, the 18-base, 19-driving wheel, 20-driven pulley.
The specific embodiment
Below in conjunction with accompanying drawing 1-5, specify an embodiment of the present utility model.
The utility model is adding man-hour, at first with reference to regulating horizontal adjustment knob 6 with the horizon rule 7 of two vertical direction of processing platform 4 in same plane, with processing platform 4 adjusting levels, rapidoprint is placed directly on the horizontal machine table 4, because acting under the situation that does not have external interference of gravity can not moved, adopt the processing of light dynamic formula.
Laser from laser instrument 10 outgoing after outside optical system 3 vertical material surface incidents, first speculum 11 and the horizontal plane angle of outside optical system 3 is 135 degree, second speculum 12 is 45 degree with the angle of horizontal plane, focus lamp 13 under second speculum 12, and and its be fixed on vertical Digit Control Machine Tool.
Make the figure that chip liquid storage tank or chip are cut apart as required by software, and set process velocity.Process velocity is adjustable from 10～200mm/s, and laser power is adjustable continuously from 0～100W, and the adjusting of speed should combine with power adjusting.It is too fast that the principle that should follow is that speed is difficult for, and excessive velocities causes cutting surface roughness easily and increases; Power is difficult for excessive, and the excessive biochip cut surface that causes easily of power is ablated seriously, and the heat affected area increases.The adjusting of power and speed should cooperatively interact.For the cutting of high polymer material, the best adjustable range of Laser Processing speed is: 10～30mm/s, the best adjustable range of laser power is: 20～50W.
Because it is very little that the strip lattice are deleted 15 self thickness, two parallel lattice are deleted 15 the spacing size greater than biochip in the same horizontal plane, each chip that processes all can be owing to the effect of gravity is fallen on the following conveyer belt 14, the distance of conveyer belt 14 and processing platform 4 is set according to the focal length of focus lamp 13, focal length is big more, and conveyer belt 14 is big more apart from the spacing of processing platform 4.Do not influence on the conveyer belt in the Laser Processing dump energy under the situation of 14 chip, conveyer belt 14 dwindles as much as possible with the distance of processing platform 4, and is injury-free in the process of contact conveyer belt 14 with protection processed finished product chip surface.Open motor 9 in the time of the processing beginning, motor 9 drive driving wheels 19 rotate, thereby drive conveyer belt 14 runnings, each chip that processes is in time shifted out laser processing zone and recovery, or send into next station, for next step processing is got ready.
Laser power can be regulated by the laser instrument control panel, and process velocity can be by the software setting.
By the suction opeing exhausting of both sides, remain less when opening laser instrument with the cleaning of maintenance processing environment and the residue of material surface.
Claims (5)
1. adopt laser to carry out the processing unit (plant) that micro-fluidic chip liquid storage tank and chip are cut apart, adopt the processing of light dynamic formula, comprise laser instrument (10), outside optical system (3) and processing platform (4), it is characterized in that: described laser instrument (10) is a carbon dioxide laser, and the laser that laser instrument (10) sends impinges perpendicularly on the material surface that is placed on processing platform (4) through outside optical system (3); Described processing platform (4) comprises outside framework (8) and is arranged on the interior horizontal grate (17) of outside framework (8), wherein, the spacing of horizontal grate (17) is greater than the size of chip, horizontal grate (17) top is the inclined-plane, inclination angle that the laser of transmission can be reflected to the horizontal plane below, the inclination angle is θ, 0 °＜θ＜45 °; Between also being provided with under the processing platform (4), drop to chip and take the automatic recycling device of Laser Processing circuit (5) out of horizontal grate (17).
2. employing laser according to claim 1 carries out the processing unit (plant) that micro-fluidic chip liquid storage tank and chip are cut apart, and it is characterized in that: described outside optical system (3) by be fixed on first speculum (11) on the horizontal lathe (15), be fixed on second speculum (12) on vertical lathe (16), the focus lamp (13) under second speculum is formed; Wherein first speculum (11) and horizontal plane angle are α, and second speculum (12) and horizontal plane angle are β, alpha+beta=180 °, focus lamp (13) be placed horizontally at second speculum (12) under.
3. employing laser according to claim 1 carries out the processing unit (plant) that micro-fluidic chip liquid storage tank and chip are cut apart, and it is characterized in that: described automatic recycling device comprises motor (9), base (18), driving wheel (19), driven pulley (20), conveyer belt (14); Wherein, driving wheel (19), driven pulley (20), on base (18), driving wheel (19) links to each other with motor (9) by power transmission shaft by bearing fixing, and driving wheel (19) has conveyer belt (14) to connect between the driven pulley (20).
4. employing laser according to claim 1 carries out the processing unit (plant) that micro-fluidic chip liquid storage tank and chip are cut apart, and it is characterized in that: the centre position that is parallel to processing platform at the both sides of body outer wall is provided with suction opeing (2).
5. employing laser according to claim 1 carries out the processing unit (plant) that micro-fluidic chip liquid storage tank and chip are cut apart, and it is characterized in that: also be provided with horizontal adjustment knob (6) and horizon rule (7) on the described processing platform (4); Horizon rule (7) is fixed on the centre position of orthogonal two frame outer walls, upper surface is parallel with the upper surface of outside framework (8), four horizontal adjustment knob (6) are placed on four interior bases of outside framework, regulate the height of processing platform (4) and keep making the processing platform level by adjusting knob (6).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200520114854 CN2806035Y (en) | 2005-07-27 | 2005-07-27 | Apparatus for machining liquid storage tank of microfluidic chip and chip cutting by utilizing laser |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200520114854 CN2806035Y (en) | 2005-07-27 | 2005-07-27 | Apparatus for machining liquid storage tank of microfluidic chip and chip cutting by utilizing laser |
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| Publication Number | Publication Date |
|---|---|
| CN2806035Y true CN2806035Y (en) | 2006-08-16 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200520114854 Expired - Fee Related CN2806035Y (en) | 2005-07-27 | 2005-07-27 | Apparatus for machining liquid storage tank of microfluidic chip and chip cutting by utilizing laser |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102218595A (en) * | 2011-01-14 | 2011-10-19 | 哈尔滨工业大学（威海） | Method for preparing micro-fluidic chip |
| CN102649198A (en) * | 2012-05-14 | 2012-08-29 | 广东大族粤铭激光科技股份有限公司 | Laser machining equipment |
| CN102649197A (en) * | 2012-05-14 | 2012-08-29 | 广东大族粤铭激光科技股份有限公司 | Laser machining platform and adjusting method of planeness of laser machining platform |
| CN111730218A (en) * | 2020-06-23 | 2020-10-02 | 深圳市合川医疗科技有限公司 | Laser cutting method for microfluidic chip |
-
2005
- 2005-07-27 CN CN 200520114854 patent/CN2806035Y/en not_active Expired - Fee Related
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102218595A (en) * | 2011-01-14 | 2011-10-19 | 哈尔滨工业大学（威海） | Method for preparing micro-fluidic chip |
| CN102218595B (en) * | 2011-01-14 | 2013-09-11 | 哈尔滨工业大学（威海） | Method for preparing micro-fluidic chip |
| CN102649198A (en) * | 2012-05-14 | 2012-08-29 | 广东大族粤铭激光科技股份有限公司 | Laser machining equipment |
| CN102649197A (en) * | 2012-05-14 | 2012-08-29 | 广东大族粤铭激光科技股份有限公司 | Laser machining platform and adjusting method of planeness of laser machining platform |
| CN102649197B (en) * | 2012-05-14 | 2014-09-10 | 广东大族粤铭激光科技股份有限公司 | Laser machining platform and adjusting method of planeness of laser machining platform |
| CN102649198B (en) * | 2012-05-14 | 2014-12-03 | 广东大族粤铭激光科技股份有限公司 | Laser machining equipment |
| CN111730218A (en) * | 2020-06-23 | 2020-10-02 | 深圳市合川医疗科技有限公司 | Laser cutting method for microfluidic chip |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C19 | Lapse of patent right due to non-payment of the annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |