CN2791973Y - Chip laser - Google Patents
Chip laser Download PDFInfo
- Publication number
- CN2791973Y CN2791973Y CN 200520070672 CN200520070672U CN2791973Y CN 2791973 Y CN2791973 Y CN 2791973Y CN 200520070672 CN200520070672 CN 200520070672 CN 200520070672 U CN200520070672 U CN 200520070672U CN 2791973 Y CN2791973 Y CN 2791973Y
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Abstract
The utility model discloses a microchip laser device which is composed of a semiconductor laser device, a coupled lens group, a laser crystal body, a frequency doubling crystal body, etc., wherein the frequency doubling crystal body is combined with the laser crystal body; in light-through direction, the front end face of the frequency doubling crystal body is coated with a medium film for the anti-reflection of the pumping light and high reflection of base-frequency light and frequency doubling light. In the light-through direction, the rear end face of the laser crystal body is coated with a medium film for the highly reflection of the base-frequency light and the anti-reflection of the frequency doubling light. A resonance cavity is formed between two medium films. The utility model has the advantages of compact structure, small size, low energy consumption, long service life, high stability and low manufacturing cost, and can realize mass production.
Description
Affiliated technical field
The utility model relates to all solid state micro-slice laser of semiconductor laser pumping field, especially a kind of thermally-stabilised micro-slice laser.
Background technology
Micro-slice laser, simple in structure because of it, volume is little, cover wide waveband, good beam quality, be with a wide range of applications in fields such as laser display, optical storage, laser printing, remote sensing communications.
Micro-slice laser forms the vibration chamber by the laser crystal end face coating, produces thermal lensing effect in the crystal and helps the stable of chamber type.But the laser of end pumping is because local heat absorption is more intense, and temperature and stress distribution are very inhomogeneous, and very complicated.Simultaneously, the heat of incidence surface is very big, often causes the damage of rete.Or in the micro-slice laser frequency-doubling crystal is positioned over back cavity, the return reverse frequency doubled light that produces on the frequency-doubling crystal that incides of fundamental frequency light, through a series of elements, during once more by frequency-doubling crystal and the fundamental frequency light phase be difficult to control, then power output is minimum as if the phase place phase difference of pi, and because the thermo-optic effect of optical element, this phase place can change with temperature, causes power output with temperature fluctuation.
Goal of the invention
The purpose of this utility model be to provide a kind of heat distribution evenly, stable performance and the high micro-slice laser of power output.
For achieving the above object, the utility model adopts following technical scheme: a kind of micro-slice laser, form by semiconductor laser, coupled lens group, laser crystal and frequency-doubling crystal etc., frequency-doubling crystal combines with laser crystal, that the front end face of wherein said frequency-doubling crystal on optical direction is coated with is anti-reflection to pump light, to fundamental frequency light and the high anti-deielectric-coating of frequency doubled light, the rear end face of laser crystal on optical direction is coated with the deielectric-coating that fundamental frequency light is high instead, frequency doubled light is anti-reflection, forms resonant cavity between two deielectric-coating.
Described laser crystal is Nd:YAG or Nd:YVO
4, frequency-doubling crystal is KTP.
Can be provided with crystal microchip between frequency-doubling crystal and laser crystal.
The laser crystal both sides can also be provided with crystal microchip, and crystal microchip combines with laser crystal by optical cement
Adopt the utility model not only compact conformation, volume is little, energy consumption is low, the life-span is long, good stability, and cost of manufacture is low, can realize production in enormous quantities.
Description of drawings
Fig. 1 is existing structural representation.
Fig. 2 is the utility model structural representation.
Fig. 3 is the another kind of cavity resonator structure schematic diagram of the utility model.
Embodiment
Consult accompanying drawing, the utility model is a kind of micro-slice laser, form by semiconductor laser 1, coupled lens group 3, frequency-doubling crystal 4 and laser crystal 5 etc., frequency-doubling crystal 4 is bonding with laser crystal 5, that the front end face 4A of wherein said frequency-doubling crystal 4 on optical direction is coated with is anti-reflection to pump light, to fundamental frequency light and the high anti-deielectric-coating of frequency doubled light, the rear end face 5B of laser crystal 5 on optical direction is coated with the deielectric-coating that fundamental frequency light is high instead, frequency doubled light is anti-reflection, forms resonant cavity between two deielectric-coating.
As shown in Figure 2, in the laser crystal 5 of the laser beam 2 that semiconductor laser 1 sends after coupled lens group 3 focuses on frequency-doubling crystal 4, the front end face 4A of frequency-doubling crystal 4 and the rear end face 5B of laser crystal are coated with deielectric-coating respectively, wherein, end face 4A is coated with pump light anti-reflection, the high anti-rete of fundamental frequency light and frequency doubled light, end face 5B is coated with fundamental frequency light high anti-, the rete that frequency doubled light is anti-reflection, the fundamental frequency light that laser produces is at two plated film face 4A, form vibration in the resonant cavity between 5B, fundamental frequency light converts frequency doubled light to by frequency-doubling crystal 4 time, frequency doubled light and fundamental frequency light keep phase place always in frequency-doubling crystal 4, frequency doubled light is directly exported from Effect of Back-Cavity Mirror by laser medium after front cavity mirror 4A reflection.Although fundamental frequency light is different with frequency doubled light phase delay in laser crystal 5, but only be equivalent to the one way frequency multiplication here, eliminated general laser medium add in the frequency multiplication crystal structure the long mutually or cancellation effect that forms of intrinsic return frequency doubled light and frequency doubled light that fundamental frequency light produces by frequency-doubling crystal once more.Here, the microplate combining structure of employing is for II class phase matched, as Nd:YVO
4And KTP, Nd:YVO
4Along a axle or the cutting of b axle, optical axis direction is parallel to end face, and KTP is with the cutting of II class phase matched direction, and optical axis direction also is parallel to end face and and Nd:YVO
4Optical axis is 45 degree angles.Because Nd:YVO
4The anisotropy of pump absorption be to increase the temperature variant stability of pumping efficiency, and the pump light polarization direction is along parallel or perpendicular to the KTP optical axis.
Because the variation of ambient temperature, laser crystal in the variations in refractive index difference of different directions, can make pump light by the time polarization state change, thereby cause the variation of pumping efficiency.If laser crystal is an isotropic medium, as Nd:YAG, then without limits to the pump light polarization direction.Pump light should focus on certain depth in the laser crystal, weakens the stress deformation of optical cement face.The heat that produces in the laser crystal not only dispels the heat by gain medium, but also by dispelling the heat with contacting from frequency-doubling crystal of frequency-doubling crystal, more helps the stable of chamber type.
As shown in Figure 3, at micro-slice laser, thermal effects limit the further raising of its power, can also add the good crystal 51,52 of heat conductivity of plated film on laser crystal 5 both sides, can improve its temperature performance, particularly side cooling situation.Crystal 5,51,52 combines by optical cement.This micro-slice laser can be used for high power and transfers the Q occasion.
In addition, other crystal can also be inserted, as pure YVO between frequency-doubling crystal and laser crystal
4Crystal can improve thermal stability like this, prolongs the microplate working life.
Claims (4)
1. micro-slice laser, form by semiconductor laser, coupled lens group, laser crystal and frequency-doubling crystal etc., frequency-doubling crystal combines with laser crystal, it is characterized in that: the front end face of described frequency-doubling crystal on optical direction be coated with anti-reflection to pump light, to the high anti-deielectric-coating of fundamental frequency light and frequency doubled light, the rear end face of laser crystal on optical direction is coated with the deielectric-coating that fundamental frequency light is high instead, frequency doubled light is anti-reflection, forms resonant cavity between two deielectric-coating.
2. a kind of micro-slice laser according to claim 1 is characterized in that: described laser crystal is Nd:YAG or Nd:YVO
4, frequency-doubling crystal is KTP.
3. a kind of micro-slice laser according to claim 1 is characterized in that: can be provided with crystal microchip between described frequency-doubling crystal and laser crystal.
4. a kind of micro-slice laser according to claim 1 is characterized in that: described laser crystal both sides can be provided with crystal microchip, and crystal microchip combines with laser crystal by optical cement.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200520070672 CN2791973Y (en) | 2005-04-08 | 2005-04-08 | Chip laser |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200520070672 CN2791973Y (en) | 2005-04-08 | 2005-04-08 | Chip laser |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN2791973Y true CN2791973Y (en) | 2006-06-28 |
Family
ID=36808018
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200520070672 Expired - Lifetime CN2791973Y (en) | 2005-04-08 | 2005-04-08 | Chip laser |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN2791973Y (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102237630A (en) * | 2010-04-28 | 2011-11-09 | 北京中视中科光电技术有限公司 | Laser resonant cavity, solid laser and manufacturing method of laser resonant cavity |
-
2005
- 2005-04-08 CN CN 200520070672 patent/CN2791973Y/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102237630A (en) * | 2010-04-28 | 2011-11-09 | 北京中视中科光电技术有限公司 | Laser resonant cavity, solid laser and manufacturing method of laser resonant cavity |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CX01 | Expiry of patent term |
Expiration termination date: 20150408 Granted publication date: 20060628 |