CN2786830Y - 40 lines flat package combination IC aging examination socket - Google Patents
40 lines flat package combination IC aging examination socket Download PDFInfo
- Publication number
- CN2786830Y CN2786830Y CN 200520015468 CN200520015468U CN2786830Y CN 2786830 Y CN2786830 Y CN 2786830Y CN 200520015468 CN200520015468 CN 200520015468 CN 200520015468 U CN200520015468 U CN 200520015468U CN 2786830 Y CN2786830 Y CN 2786830Y
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- China
- Prior art keywords
- socket
- contact
- locking device
- component
- socket body
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Testing Of Individual Semiconductor Devices (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
The utility model relates to a microelectronic component ageing testing device, particularly a testing socket capably of carrying out high temperature ageing test on double-surface leading wire flatly sealed microelectronic components, which is composed of a socket body, a contact component and a locking device, wherein the socket body is used for the positioning installation of a tested component; the contact component is formed from the arrangement of two rows of centrally symmetrical gold plated arc-shaped contact components of 40 pairs of leading wires of dense pitches of 1.27 mm, inlaid in the socket body and corresponding to the led out wire of the tested component; the positioning plate of the locking device is composed of a hook and a handle and the locking device is arranged at one side of the socket body through a positioning pin. When turning over 90 DEG, the locking device can cause the tested component to turn to correct positioning and locking and cause the contact component to generate the needed normal force. The utility model completes the test in the condition of high temperature.
Description
Affiliated technical field
The utility model relates to a kind of microelectronic component ageing tester, especially can carry out the testing socket of high-temperature circulation test and test to the two sides flat packaging microelectronic component reliability that goes between.
Background technology
At present, what known aging test socket bulk material adopted is non-high-temperature resistant unskilled labor engineering plastics, when measured device is tested, aging working temperature only is-25 ℃～85 ℃, and the aging operating time is of short duration, the socket contact surfaces is silver-plated, exist and measured device between form the significant deficiency that contact resistance is big, consistency is not high and useful life is long.In China microelectronic component reliability field, novel high-end technology two sides lead-in wire flat packaging microelectronic component can not satisfy the test request to the device performance index because of the special arrangement of no high temperature ageing reliability testing, causes accident resulting from poor quality of projects easily.
Summary of the invention
For overcoming existing aging test socket in the deficiency aspect heatproof, contact resistance and consistency and useful life, the utility model provides a kind of high-temperature circulation test socket.This socket can not only expand the operating temperature range that wears out to-65 ℃～150 ℃, once aging stream time reaches 250 hours, and when tested device and the use of socket coupling, have that contact resistance is little, consistency is high, make things convenient for use, the advantage of surface abrasion resistance, zero plug power, prolonged useful life of socket greatly.
The technical scheme that the utility model technical solution problem is adopted is: according to 40 pairs of lead-out wire structures, 1.27mm contact spacing and overall dimension requirement, jack design is become three big part, i.e. socket, contact and locking devices.The socket bulk material is selected the extraordinary high temperature engineering material of the PPS high temperature resistant type of import for use, adopts the high-temperature injection molding technology thereof to make jack body; With beryllium-bronze (Qbe
2) do contact and locking device material through drawing, under 300 ℃ of high temperature, be stained with fire, after polishing, annealing, Quenching Treatment, adopt the hard gold layer of plating technical face gold-plated, reach the effect that reduces contact resistance, consistency height, surface abrasion resistance and increase the service life.
The beneficial effects of the utility model are: can satisfy similar two sides lead-in wire flat packaging microelectronic component high-temperature circulation test and performance test, reduce the contact resistance that tested components and parts and socket coupling is used, improve its consistency, and convenient the use, life-span prolongs, and can obtain bigger economic benefit and social benefit.
Description of drawings
The utility model is described in further detail below in conjunction with drawings and Examples.
Fig. 1, Fig. 3 are appearance structure of the present utility model vertical section structural maps
Fig. 2 is a vertical view of the present utility model
Among Fig. 1: 5. 8. hook of 6. torsion springs (1) 7 torsion spring (2)
Among Fig. 3: 1. 2. 3. 4. lids of reed (2) of reed (1)
Specific embodiments
In Fig. 1, alternately insert reed (1) and reed (2) in the groove of seat (3) the right and left respectively earlier, make reed (1), (2) draw seat (3), then torsion spring (7), axle (5) and hook (8) are packed into together in the lid (4), will cover (4), torsion spring (6) and spool (5) at last and pack in (3).
Fig. 2 is used for socket is fixed on the wiring board of tested components and parts.
In this scheme, socket is used for tested device mounting location, contact divides two groups to rearrange by the gold-plated arc contact of two rows of 40 pairs of lead-in wires of center symmetry 1.27mm pitch, is embedded on the socket, and is corresponding with tested device lead-out wire, locking device by hook, form the locking positioning plate, be installed on socket one side by alignment pin, with 90 ° of upsets, can make tested device turn to correct location and locking, and make contact produce necessary normal force.This push-pull structure is designed to self-locking to contact, and zero plug power structure to avoid contact plug wearing and tearing electrogilding layer, influences contact performance.
Claims (3)
1. aging test socket that is applicable to flat packaging hybrid integrated circuit microelectronic component.It is characterized in that: it is by three of socket, contact and locking devices part conjuncted composition.
2. according to right 1 described flat packaging hybrid integrated circuit aging test socket, it is characterized in that: socket, contact and locking device are a unified integral body, contact is rearranged by the gold-plated arc contact of two rows of 40 pairs of lead-in wires of centrosymmetric 1.27mm pitch, insert in the right and left groove of seat respectively, and draw base.
3. according to right 1 described flat packaging hybrid integrated circuit aging test socket, it is characterized in that: the locking device of socket by hook, alignment pin, form, with push-pull structure contact is designed to self-locking, zero plug power structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200520015468 CN2786830Y (en) | 2005-10-11 | 2005-10-11 | 40 lines flat package combination IC aging examination socket |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200520015468 CN2786830Y (en) | 2005-10-11 | 2005-10-11 | 40 lines flat package combination IC aging examination socket |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN2786830Y true CN2786830Y (en) | 2006-06-07 |
Family
ID=36775392
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200520015468 Expired - Fee Related CN2786830Y (en) | 2005-10-11 | 2005-10-11 | 40 lines flat package combination IC aging examination socket |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN2786830Y (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108802526A (en) * | 2018-06-07 | 2018-11-13 | 中国电子科技集团公司第五十四研究所 | A kind of modeling method of coaxial connector electrical contact impedance operator deterioration law |
-
2005
- 2005-10-11 CN CN 200520015468 patent/CN2786830Y/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108802526A (en) * | 2018-06-07 | 2018-11-13 | 中国电子科技集团公司第五十四研究所 | A kind of modeling method of coaxial connector electrical contact impedance operator deterioration law |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C19 | Lapse of patent right due to non-payment of the annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |