CN2773074Y - Vacuum ion copper-plating porcelain - Google Patents
Vacuum ion copper-plating porcelain Download PDFInfo
- Publication number
- CN2773074Y CN2773074Y CN 200520038737 CN200520038737U CN2773074Y CN 2773074 Y CN2773074 Y CN 2773074Y CN 200520038737 CN200520038737 CN 200520038737 CN 200520038737 U CN200520038737 U CN 200520038737U CN 2773074 Y CN2773074 Y CN 2773074Y
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- copper
- layer
- vacuum ion
- vacuum
- ceramic body
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Abstract
The utility model relates to a vacuum ion copper plating ceramics which comprises a ceramic body and a copper layer covered on the ceramic body. The utility model is characterized in that a vacuum ion titanium plating layer and a vacuum ion titanium nitride plating layer are respectively arranged between the ceramic body and the copper layer, and the copper layer is a vacuum ion copper planting layer. The utility model solves the technical problems that the combination of copper and the ceramics is firm and can not strip or drop, and copper material consumption is little.
Description
Technical field:
The utility model is about ceramic ware, and the ceramic ware of metallic copper is especially arranged about coating surface.
Background technology:
Still time-honored great invention of China of pottery, device with ceramic making applies in the every field of daily life widely, for example the brick that uses of building, watt, the bowl that uses on the dining table, dish, dish, spoon, spoon, the basin that storage is used, jar, Ping, Portland, cylinder, broad-mouthed receptacle for holding liquid, and various personage, animal-shaped artwork etc.At present anyway ceramic ware is decorated, and people see that its appearance can discern the essence that it is made by potter's clay or china clay.Copper on the other hand, particularly the use of bronze work has also been made historical contribution to the development of Social Culture, technology, so far bronze, brass or copper ware is still given a kind of long allusion of people, steady simple and unadorned sensation but to so far, ceramic ware and bronze, brass or copper ware still belong to two mutual incoherent fields, the occasion of each have their own use.And compare with potter's clay, the china clay of wide material sources, the resource-constrained of copper, also China is the country of a poor copper.The long like this allusion of bronze, brass or copper ware, steady simple and unadorned metal-like can be combined with traditional ceramic ware, avoid the luxus consumption of copper again, be still the problem that industry need be researched and solved.
Summary of the invention:
The utility model purpose is to provide a kind of vacuum ionic copper facing ceramic ware, solves copper and combines firm can not peeling off with ceramic ware and come off and technical problem that the copper material consumption is few.
A kind of vacuum ionic copper facing ceramic ware comprises ceramic body and the copper layer that covers on the ceramic body, it is characterized in that: be disposed with vacuum ion plating titanium layer and vacuum ion plating titanium nitride layer between this ceramic body and copper layer; This copper layer is a vacuum ionic copper facing layer.
The utlity model has following advantage:
1, product surface is the fine copper look, and is graceful luxurious, makes nonmetallic ceramic member outward appearance have copper metallized texture.
2, because titanium, titanium nitride and copper are to be deposited on the base substrate with ionic forms, institute can not come off in conjunction with very firm, and is wear-resistant again, fast in colour.
3, enlarge the material scope of plating matrix, not only used the china clay blank that extensively adopts now, also can use wide material sources and low-cost potter's clay etc.
4, the ion copper plate can be fine copper (red copper), brass or bronze, can select plating according to user's actual needs.
5, adopt the vacuum ionic depositing process not have waste liquid, also pollution-free.
6, make nonmetallic finishing material metalized after, the copper product of conserve expensive in a large number reduces trimming cost.
Description of drawings:
Fig. 1 is the utility model structure cross-sectional schematic.
Among the figure: the 1-ceramic body
2-vacuum ion plating titanium layer
3-vacuum ion plating titanium nitride layer
4-vacuum ionic copper facing layer
Embodiment:
Please join shown in Figure 1.The utility model comprises ceramic body 1 and copper layer 4.This ceramic body 1 is made as the ceramic ware of blank by potter's clay or china clay, this ceramic ware can be brick and tile for building, also can be tablewares such as the bowl that uses on the dining table, dish, dish, spoon, spoon, or storage basin, jar, Ping, Portland, cylinder, the broad-mouthed receptacle for holding liquid used, and various personage, animal-shaped artwork etc.This copper layer 4 is vacuum ionic copper facing layers.This ceramic body 1 is put into vaccum ion coater plate one deck vacuum ion plating titanium layer 2 earlier, plate plating titanium nitride layer 3 at these vacuum ion plating titanium layer 2 external application vaccum ion coaters again, because titanium nitride is golden yellow, for good color basis has been laid in copper facing, and has good consistency with one deck vacuum ion plating titanium layer 2, plating vacuum ionic copper facing layer 4 outside plating titanium nitride layer 3 at last.Vacuum ion plating titanium nitride layer 3 has good binding ability with vacuum ionic copper facing layer 4 again, and because its coatings surface microscopic is the hills are undulating shape, the hard peak point of its projection is in use resisted wearing and tearing, overcome and be positioned at the soft easily deficiency of mill of its surperficial copper, then be full of the copper that plates in its recessed peak valley of face, thereby more guaranteed the durable of coppery effect.Above-mentioned copper can be clean steel (claiming red copper again), brass or bronze.
Vacuum ion plating titanium layer 2, the thickness of vacuum ion plating titanium nitride layer 3 and vacuum ionic copper facing layer 4 is generally 〉=0.3 μ m, but also can determine suitable thickness by the concrete service requirements of this ceramic ware.
From as seen above-mentioned, all once shapeds after changing different anode materials, carrying out repeatedly plated film in same vaccum ion coater of the utility model, so easily manufactured, and do not have environmental pollutions such as waste gas, waste liquid, formed rete does not have any stimulation to human body skin yet.
Claims (1)
1, a kind of vacuum ionic copper facing ceramic ware comprises ceramic body and the copper layer that covers on the ceramic body, it is characterized in that: be disposed with vacuum ion plating titanium layer and vacuum ion plating titanium nitride layer between this ceramic body and copper layer; This copper layer is a vacuum ionic copper facing layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200520038737 CN2773074Y (en) | 2005-01-05 | 2005-01-05 | Vacuum ion copper-plating porcelain |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200520038737 CN2773074Y (en) | 2005-01-05 | 2005-01-05 | Vacuum ion copper-plating porcelain |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN2773074Y true CN2773074Y (en) | 2006-04-19 |
Family
ID=36708331
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200520038737 Expired - Fee Related CN2773074Y (en) | 2005-01-05 | 2005-01-05 | Vacuum ion copper-plating porcelain |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN2773074Y (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108456858A (en) * | 2018-03-08 | 2018-08-28 | 合肥开泰机电科技有限公司 | Circuit board drilling dry method method for metallising |
-
2005
- 2005-01-05 CN CN 200520038737 patent/CN2773074Y/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108456858A (en) * | 2018-03-08 | 2018-08-28 | 合肥开泰机电科技有限公司 | Circuit board drilling dry method method for metallising |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C19 | Lapse of patent right due to non-payment of the annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |