CN2731446Y - Measurer for thermal-conductivity coefficient - Google Patents
Measurer for thermal-conductivity coefficient Download PDFInfo
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- CN2731446Y CN2731446Y CN 200420083518 CN200420083518U CN2731446Y CN 2731446 Y CN2731446 Y CN 2731446Y CN 200420083518 CN200420083518 CN 200420083518 CN 200420083518 U CN200420083518 U CN 200420083518U CN 2731446 Y CN2731446 Y CN 2731446Y
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- heat
- conduction coefficient
- measurement mechanism
- insulating block
- coefficient measurement
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Abstract
The utility model relates to a heat conduction coefficient measuring device, which comprises a load bearing part and a buckling part. The load bearing part comprises a first heat insulating block. The inner part of the heat insulating block comprises a heater and a first heat conducting block which is tightly and thermally connected with the heater, and a part of the first heat conducting block extends out of the first heat insulating block to form a load bearing plane. The buckling part comprises a second heat insulating block. The inner part of the second heat insulating block comprises a plurality of heat conduction channels and a second heat conducting block which is tightly and thermally connected with the heat conduction channels, and a part of the second heat insulating block extends out of the second heat insulating block to form a buckling plane corresponding to the load bearing plane. At least one elastic element is arranged between the load bearing part and the buckling part to balance out the gravity of the buckling part.
Description
[technical field]
The utility model relates to a kind of heat-conduction coefficient measurement mechanism, relates in particular to a kind of heat-conduction coefficient measurement mechanism of thermal interface material.
[background technology]
Along with SIC (semiconductor integrated circuit) is constantly being improved, developed, the circuit degree of integration is more and more higher, and (Thermal Interface Material, application TIM) also more and more widely for thermal interface material.Yet the basic parameter of decision thermal interface material performance is a heat-conduction coefficient, and the heat-conduction coefficient that how could measure thermal interface material has exactly played important effect to the development of thermal interface material.
Thermal interface material is when doing the heat-conduction coefficient measurement, and its heat-conduction coefficient is the function that heat passes distance, and its relational expression is as follows:
Wherein, K is a heat-conduction coefficient; Q is heat flux (Heat Flow Rate); A is the cross-sectional area of heat conduction direction; L is the heat conduction distance, i.e. the thickness of thermal interface material; T1, T2 are respectively the temperature of two interfaces of thermal interface material.
The basic structure of the heat-conduction coefficient test mode of traditional hot dielectric surface material as shown in Figure 1, it utilizes a thermoflux generator (Dummy Heater) 5 to produce heat, good conductor (as the fine copper piece) 4a with heat is delivered to the test plane again, on the test plane, evenly coat tested thermal interface material 3, push down with the identical fine copper piece 4b of area size again, allow heat penetration cross thermal interface material 3 and be delivered to another piece copper billet 4b, and design cooling device 2 is walked the torrid zone, total system system is by heat-insulating block 6a, other adiabatic method such as 6b prevents heat dissipation, thereby guarantees the accuracy that heat-conduction coefficient is measured.
Yet when measuring the heat-conduction coefficient of thermal interface material, fastening power size is a very important parameters.So-called fastening power is the suffered summation that adds thrust of two copper billets among Fig. 1 because the big young pathbreaker of fastening power directly has influence on the thickness of thermal interface material, and with the thermocontact area of two heat conduction copper billets.Therefore its value size meeting remote effect must accurately be controlled when test to test result.
The influence that the present test platform of measuring the thermal interface material heat-conduction coefficient is made a concerted effort according to the mode make-up of two copper billets ornaments can be divided into vertical test platform and horizontal type test platform.Vertical test platform as shown in Figure 1, its advantage is the influence that fastening power is not subjected to friction force, shortcoming is that the gravity of system itself can have influence on fastening power size.The advantage of horizontal type platform is that gravity can not influence fastening power, and shortcoming can be subjected to the influence of friction force for fastening power.
Therefore, provide a kind of influence that can overcome above friction force and gravity, the heat-conduction coefficient measurement mechanism that can accurately control fastening power size is very necessary.
[utility model content]
Be to solve the technical matters of prior art, the purpose of this utility model provides a kind ofly can accurately control fastening power size, accurately measures the heat-conduction coefficient measurement mechanism of heat-conduction coefficient.
For realizing the purpose of this utility model, the utility model provides a kind of heat-conduction coefficient measurement mechanism, it comprises: a supporting part, this supporting part comprises one first heat-insulating block, this first heat-insulating block inside comprises that a well heater reaches and tight hot linked one first heat-conducting block of this well heater, and this first heat-conducting block partly extends this first heat-insulating block and forms a load plane; One buckling parts, this buckling parts comprises one second heat-insulating block, this second heat-insulating block inside comprises that plural heat conduction channel reaches and hot linked one second heat-conducting block of this heat conduction channel, and this second heat-conducting block partly extends this second heat-insulating block and form a fastening plane corresponding with above-mentioned load plane; And a flexible member is arranged between supporting part and the buckling parts, to offset the gravity of buckling parts.
Compared with prior art, heat-conduction coefficient measurement mechanism of the present utility model has following advantage: one, and heat-conduction coefficient measurement mechanism of the present utility model is vertical platform, thereby need not the influence of considering that friction force causes test; Its two, the dynamic balance analysis according to the utility model heat-conduction coefficient measurement mechanism can calculate the relational expression between fastening power size and spring force, helps the control of fastening power size, solves the congenital shortcoming that vertical platform is subjected to gravity effect; Its three, the utility model heat-conduction coefficient measurement mechanism is simple in structure, institute's materials used cost is low, and need not complex control apparatus, more can use the spring of different elasticity coefficient according to different fastening power scopes, has good practicability.
[description of drawings]
Fig. 1 is the synoptic diagram of the heat-conduction coefficient measurement mechanism of prior art.
Fig. 2 is the synoptic diagram of the utility model heat-conduction coefficient measurement mechanism.
Fig. 3 is the synoptic diagram of the dynamic balance of the utility model heat-conduction coefficient measurement mechanism.
[embodiment]
Below in conjunction with the accompanying drawings and the specific embodiments the utility model is elaborated.
See also Fig. 2, the utility model provides a kind of heat-conduction coefficient measurement mechanism 10, and it comprises: a supporting part 11, one buckling parts 12 and a plurality of spring 13 are between supporting part 11 and buckling parts 12.Supporting part 11 further comprises one first heat-insulating block 111, and these first heat-insulating block, 111 inside comprise a well heater 112 and and these well heater 112 tight hot linked one first heat-conducting blocks 113.The section of this first heat-conducting block 113 is " protruding " shape, and projection extends this first heat-insulating block 111 and forms a load plane 1131.This first heat-conducting block 113 contacts with well heater 112 by one first heat diffusing surface 1132, and the area of first heat diffusing surface 1132 is used for transmitting better the heat of well heater 112 greater than load plane 1131.This buckling parts 12 comprises one second heat-insulating block 121, and these second heat-insulating block, 121 inside comprise at least one passage of heat 15 and and these passage of heat 15 hot linked one second heat-conducting blocks 123.The section of this second heat-conducting block is " protruding " shape, and projection extends this second heat-insulating block 121 and form one that to fasten plane 1231 corresponding with above-mentioned load plane 1131.This second heat-conducting block 123 is by one second heat diffusing surface 1232 and passage of heat 15 hot tie-ins, and the area of this second heat diffusing surface 1232 is greater than fastening plane 1231, is used for better heat transferred enlarging area of dissipation and effect to passage of heat 15.This passage of heat 15 is hot tie-in external connection radiating device (figure does not show) further, is used for the emanation system heat, and external connection radiating device of the present utility model comprises heating radiator or water-cooling heat radiating device.Wherein, above-mentioned load plane 1131 with fasten that plane 1231 is parallel to each other and area equates.In addition, present embodiment adopts two identical springs of elasticity coefficient to place between supporting part 11 and the buckling parts 12, makes that leaving a gap between load plane 1131 and the fastening plane 1231 is used to place thermal interface material.Certainly also can adopt a plurality of springs to place between supporting part 11 and the buckling parts 12 as required.When measuring, thermal interface material to be measured 14 can be placed on the load plane 1131, fastening plane 1231 with buckling parts 12 fastens, make thermal interface material 14 contact with load plane 1131 and fastening plane 1231 close thermal respectively, guarantee the accuracy that heat-conduction coefficient is measured.
Seeing also Fig. 3, is the dynamic balance synoptic diagram of the utility model heat-conduction coefficient measurement mechanism, and as can be seen from Figure, the dynamic balance relational expression of the utility model heat-conduction coefficient measurement mechanism is:
F+f1＝f2+f3+f4；
Wherein, F is outside applied pressure, and f1 is the weight of button and portion, and f2, f3 are spring force, and f4 is a fastening power.The size that can obtain this fastening power according to this relational expression is:
f4＝F+f1-f2-f3。
Thus relational expression as can be seen, the size and spring force f2, the f3 that fasten power f4 have direct relation, can control the size of fastening power f4 by the spring of selecting different elasticity coefficient.
Please consult Fig. 2 again, heat-conduction coefficient measurement mechanism 10 of the present utility model is that thermal interface material to be measured 14 is placed on the load plane 1131 when using, and fastens to fasten plane 1231 again.Because use spring 13 to place between supporting part 11 and the buckling parts 12, elastic force will be offset the gravity of total system.Be appreciated that also spring also can replace with other flexible members, as long as the gravity of its elastic force energy bucking-out system.During measurement, not only can make thermal interface material 14 closely contact with load plane 1131 and fastening plane 1231 respectively, simultaneously the influence that the gravity make-up is made a concerted effort can be got rid of, by controlling outside applied pressure, thereby the size of actual fastening power can be accurately controlled.
Heat conduction coefficient measuring device of the present utility model has following advantage: one, and of the present utility model Heat conduction coefficient measuring device is vertical platform, thereby need not the impact of considering that frictional force causes test; Its two, according to the Equilibrium Analysis of the utility model heat conduction coefficient measuring device, can calculate fastening Relational expression between power size and spring force is conducive to the control of fastening power size, solves vertical platform and is subjected to The congenital shortcoming of gravity effect; Its three, the utility model heat conduction coefficient measuring device is simple in structure, institute Use that the cost of material is low, and need not complicated control device, more can be according to different fastening power scopes, Use the spring of different coefficient of elasticity, have good practicality.
Claims (8)
1. heat-conduction coefficient measurement mechanism, it comprises: a supporting part, this supporting part comprises one first heat-insulating block, this first heat-insulating block inside comprises that a well heater reaches and tight hot linked one first heat-conducting block of this well heater, and this first heat-conducting block partly extends this first heat-insulating block and forms a load plane; An and buckling parts, this buckling parts comprises one second heat-insulating block, this second heat-insulating block inside comprises that a plurality of heat conduction channels reach and hot linked one second heat-conducting block of this heat conduction channel, and this second heat-conducting block partly extends this second heat-insulating block and form a fastening plane corresponding with above-mentioned load plane; It is characterized in that this heat-conduction coefficient measurement mechanism comprises that further at least one flexible member is arranged between supporting part and the buckling parts.
2. heat-conduction coefficient measurement mechanism as claimed in claim 1 is characterized in that this flexible member is a spring.
3. heat-conduction coefficient measurement mechanism as claimed in claim 1 is characterized in that this first heat-conducting block and second heat-conducting block are " protruding " shape, and projection extends first heat-insulating block respectively and second heat-insulating block forms load plane and fastens the plane.
4. heat-conduction coefficient measurement mechanism as claimed in claim 1 is characterized in that this fastening plane and load plane are parallel to each other, and area equates.
5. heat-conduction coefficient measurement mechanism as claimed in claim 1 is characterized in that the further hot tie-in external connection radiating device of this passage of heat.
6. heat-conduction coefficient measurement mechanism as claimed in claim 5 is characterized in that this external connection radiating device comprises heating radiator or water-cooling heat radiating device.
7. heat-conduction coefficient measurement mechanism as claimed in claim 1 is characterized in that this first heat-conducting block and second heat-conducting block are the derby of high heat-conduction coefficient.
8. heat-conduction coefficient measurement mechanism as claimed in claim 7 is characterized in that this derby is a copper billet.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200420083518 CN2731446Y (en) | 2004-08-27 | 2004-08-27 | Measurer for thermal-conductivity coefficient |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200420083518 CN2731446Y (en) | 2004-08-27 | 2004-08-27 | Measurer for thermal-conductivity coefficient |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN2731446Y true CN2731446Y (en) | 2005-10-05 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200420083518 Expired - Lifetime CN2731446Y (en) | 2004-08-27 | 2004-08-27 | Measurer for thermal-conductivity coefficient |
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| CN (1) | CN2731446Y (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111413242A (en) * | 2020-05-21 | 2020-07-14 | 中认南信(江苏)检测技术有限公司 | Plate glass temperature difference test device and test method |
| CN111982962A (en) * | 2020-08-25 | 2020-11-24 | 苏州鸿凌达电子科技有限公司 | Heat conduction effect detection device of heat conduction material |
-
2004
- 2004-08-27 CN CN 200420083518 patent/CN2731446Y/en not_active Expired - Lifetime
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111413242A (en) * | 2020-05-21 | 2020-07-14 | 中认南信(江苏)检测技术有限公司 | Plate glass temperature difference test device and test method |
| CN111982962A (en) * | 2020-08-25 | 2020-11-24 | 苏州鸿凌达电子科技有限公司 | Heat conduction effect detection device of heat conduction material |
| CN111982962B (en) * | 2020-08-25 | 2021-03-23 | 苏州鸿凌达电子科技有限公司 | Heat conduction effect detection device of heat conduction material |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CX01 | Expiry of patent term |
Expiration termination date: 20140827 Granted publication date: 20051005 |