CN2710160Y - Circuit substrate - Google Patents
Circuit substrate Download PDFInfo
- Publication number
- CN2710160Y CN2710160Y CNU2004200593899U CN200420059389U CN2710160Y CN 2710160 Y CN2710160 Y CN 2710160Y CN U2004200593899 U CNU2004200593899 U CN U2004200593899U CN 200420059389 U CN200420059389 U CN 200420059389U CN 2710160 Y CN2710160 Y CN 2710160Y
- Authority
- CN
- China
- Prior art keywords
- layer
- contact pad
- slotted eye
- conductive
- circuitry substrate
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/1515—Shape
- H01L2924/15151—Shape the die mounting substrate comprising an aperture, e.g. for underfilling, outgassing, window type wire connections
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- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
The utility model relates to a circuit substrate, which is provided with a linear slot hole, and a slot-shaped electrical conduction through hole with multiple transmission channels can be formed in the linear slot hole for transferring a plurality of signals simultaneously. The circuit substrate is of help to enhance the integration degree of circuit, the length of wire winding for the arrangement of the whole circuit is shortened, the production efficiency is increased and the cost is reduced.
Description
Technical field
The utility model relates to a kind of circuitry substrate (circuit substrate), and is particularly related to a kind of circuitry substrate with groove shape conductive through hole.
Background technology
Because the progress and the demand of electronics technology, various electronic correlation products develop towards the direction of miniaturization and multifunction invariably, and drive related semiconductor technology strides forward towards higher integrated level.Chip volume after the encapsulation is littler, complexity is higher in order to make, such as flip-chip (Flip Chip, FC) encapsulation, ball grid array (Ball Grid Array, BGA) encapsulation and chip size packages (Chip ScalePackage, CSP) etc. encapsulation technology more widely industrial circle utilize.In addition, with regard to circuit board (PCB), in order to improve current densities, also used the circuit board that Layer increasing method (Build-Up) for example or laminated method formation such as (Lamination) have multilayer circuit, and above-mentioned BGA encapsulates employed base plate for packaging also in this range of application.Yet, no matter be base plate for packaging or multilayer circuit board, (Plating Through Hole PTH), to connect different patterned circuit layer, is used as the signal access path between the different circuit layers all to have a plurality of conductive through holes that run through multilager base plate.
Please refer to Fig. 1, it illustrates the generalized section of a kind of circuitry substrate of prior art.As shown in Figure 1, circuitry substrate 100 is a layer multilayer packaging substrate, and wherein dielectric sandwich layer (dielectric core) 102 has a upper surface 102a, corresponding a lower surface 102b and a perforation 102c who runs through dielectric sandwich layer 102.Conductive through hole 104 is positioned at perforation 102c in addition, it comprises the upper contact pad 104a that is disposed at upper surface 102a and lower surface 102b respectively and contact pad 104b once, an and conductive layer 104c who covers the inwall of perforation 102c, wherein conductive layer 104c connects upper contact pad 104a and following contact pad 104b, so that the signal of the upper strata circuit of dielectric sandwich layer 102 can see through the lower circuit that conductive layer 104c is passed to dielectric sandwich layer 102.
Above-mentioned conductive through hole can be applicable to the single or multiple lift circuit board, and wherein the different patterned circuit layer more than two can interconnect by conductive through hole, to reach the purpose that signal transmits.What deserves to be mentioned is, when prior art forms conductive through hole on the dielectric sandwich layer, all need the connected up area of the dielectric core laminar surface of sacrificial section, forming the other opening connection pad (via land) of perforation and perforation, and the design that also need wind the line of the circuit around conductive through hole.Therefore, under the situation of a large amount of use conductive through holes, will make the circuit layout on the dielectric sandwich layer be restricted, and also can't effectively improve the integrated level of circuit.
Therefore, the conductive through hole that existing in recent years people's proposition has multiple transmission channel, it utilizes process technology to form a plurality of independently transmission channels in same perforation, to connect different levels circuit.Thus, single conductive through hole just can transmit a plurality of different signals simultaneously, therefore not only can remove the puzzlement of coiling from, and the number of the conductive through hole in the circuitry substrate also can be reduced significantly.
Yet, what deserves to be mentioned is that no matter for the conductive through hole of above-mentioned single or multiple transmission circuit, prior art all forms the perforation of circle on the dielectric sandwich layer in modes such as machine drilling or laser drill on making.Unfortunately, the spacing of required reservation between the profile of these circular perforations and the circular perforation all will cause the restriction of certain degree to the circuit layout of integral body.For example, there is the restriction on its minimum dimension in the aperture of perforation, for example the design live width of general high-density circuit substrate is about 30 microns, the aperture of conductive through hole is about 300 microns, if when adding the opening connection pad around the perforation, the diameter of whole conductive through hole will arrive about 450 microns, that is during every increase by one conductive through hole, will take the about 450 microns border circular areas of diameter relatively on the dielectric sandwich layer.Therefore, how structure and the configuration to the conductive through hole of circuitry substrate provides a preferably design, is to increase circuit level, and then improves the important key of product competitiveness.
The utility model content
Therefore, the purpose of this utility model provides a kind of circuitry substrate, and it has the conductive through hole of groove shape, in order to the conductive through hole of the circle that replaces prior art, in the hope of increasing the connected up area of circuitry substrate, and shortens the winding length of integrated circuit layout.
Based on above-mentioned purpose, the utility model proposes a kind of circuitry substrate, it for example comprises an at least one layer and conductive through hole of coinciding, the layer that wherein coincides has a upper surface and corresponding a lower surface, the layer that wherein coincides has a linear slotted eye, it runs through the layer that coincides, and conductive through hole for example comprises one first transmission channel and at least one second transmission channel.In addition, first transmission channel can be divided into one first upper contact pad, one first time contact pad and one first transfer wire, wherein the first upper contact pad and first time contact pad are disposed at the upper surface and the lower surface of the layer that coincides respectively, and first transfer wire system is disposed at the inwall of linear slotted eye, and first transfer wire connects the first upper contact pad and first time contact pad.In addition, second transmission channel can be divided into one second upper contact pad, one second time contact pad and one second transfer wire, wherein the second upper contact pad and second time contact pad are disposed at the upper surface and the lower surface of the layer that coincides respectively, and second transfer wire is disposed at the inwall of linear slotted eye, and second transfer wire connects the second upper contact pad and second time contact pad.
For this reason, the utility model provides a kind of circuitry substrate, comprising: at least one layer that coincides, have a upper surface and corresponding a lower surface, and the wherein said layer that coincides has a linear slotted eye, and it runs through the described layer that coincides; One first transmission channel comprises: one first upper contact pad, be disposed at described coincide the layer described upper surface; One first time contact pad, be disposed at described coincide the layer described lower surface; One first transfer wire be disposed at the inwall of described linear slotted eye, and described first transfer wire connects the described first upper contact pad and described first time contact pad; At least one second transmission channel comprises: one second upper contact pad, be disposed at described coincide the layer described upper surface; One second time contact pad, be disposed at this coincide the layer this lower surface; And one second transfer wire, be disposed at the inwall of described linear slotted eye, and described second transfer wire connects the described second upper contact pad and described second time contact pad.
Based on above-mentioned, the utility model proposes a kind of circuitry substrate with conductive through hole of groove shape, and a plurality of transmission channels in the conductive through hole of this groove shape can form by bore mode, see through these transmission channels and can transmit a plurality of signals simultaneously, therefore can increase the elasticity of layout designs and the integrated level of circuit.In addition, by linear slotted eye design of the present utility model, also can improve the situation that prior art is used circular conductive through hole in a large number, thereby can increase the connected up area of circuitry substrate, and shorten the winding length of integrated circuit layout.
Description of drawings
Fig. 1 illustrates the generalized section of a kind of circuitry substrate of prior art.
Fig. 2 illustrates the partial cutaway schematic of a kind of circuitry substrate of preferred embodiment of the present utility model.
Fig. 3 illustrates on a kind of part of circuitry substrate of preferred embodiment of the present utility model and looks schematic diagram.
Fig. 4 A～4C illustrates respectively on the part of circuitry substrate of the linear slotted eye with different kenels and looks schematic diagram.
Fig. 5 A and 5B illustrate respectively second embodiment of the present utility model a kind of circuitry substrate on look schematic diagram and A-A ' generalized section thereof.
Fig. 6 A～6E illustrate in regular turn preferred embodiment of the present utility model a kind of conductive through hole manufacture method on look schematic diagram.
Fig. 7 A～7E illustrates the B-B ' generalized section of Fig. 6 A～6E in regular turn.
Fig. 8 and 9 illustrates respectively in the manufacture method of conductive through hole of the present utility model, with circular drill bit remove conductive layer in the slotted eye on look schematic diagram.
Description of reference numerals:
100: circuitry substrate
102: the dielectric sandwich layer
102a: upper surface
102b: lower surface
102c: perforation
104: conductive through hole
104a: upper contact pad
104b: following contact pad
104c: conductive layer
200: circuitry substrate
202: layer coincides
202a: upper surface
202b: lower surface
202c: linear slotted eye
204: conductive through hole
206: transmission channel
206a: upper contact pad
206b: following contact pad
206c: transfer wire
302: layer coincides
302a: upper surface
302c: linear slotted eye
306a: upper contact pad
306c: transfer wire
308: extend center line
The linear slotted eye of 410:L shape
410a: extend center line
The linear slotted eye of 420:S shape
420a: extend center line
The linear slotted eye of 430:U shape
430a: extend center line
500: circuitry substrate
502: layer coincides
502a: upper surface
502b: lower surface
502c: linear slotted eye
506: the first transmission channels
506a: go up power plane
506b: the first slotted eye conductive wall
506c: go up power plane
507a: the first upper contact pad
507c: first time contact pad
508: the second transmission channels
508a: go up ground plane
508b: the second slotted eye conductive wall
508c: following ground plane
509a: the second upper contact pad
509b: second time contact pad
602: layer coincides
602a: upper surface
602b: lower surface
602c: linear slotted eye
604a upper strata conductive layer:
604b: lower floor's conductive layer
604c: slotted eye conductive layer
606: transmission channel
606a: upper contact pad
606b: following contact pad
606c: transfer wire
608a: upper strata line segment
608b: lower floor's line segment
608c: slotted eye line segment
802a: linear slotted eye
806: signal channel
902a: linear slotted eye
912: signal channel
914: the power delivery passage
916: the ground connection transmission channel
D: external diameter
M: width
Embodiment
For above-mentioned and other purpose of the present utility model, feature and advantage can be become apparent, preferred embodiment cited below particularly, and conjunction with figs. are described in detail below.
Please refer to Fig. 2, it illustrates the partial cutaway schematic of a kind of circuitry substrate of preferred embodiment of the present utility model.Circuitry substrate 200 for example is the base plate for packaging of a multilayer, and wherein a conductive through hole 204 for example is disposed at one of circuitry substrate 200 and coincides on the layer 202, and this layer that coincides 202 for example can be dielectric sandwich layer shown in Figure 2.Certainly, conductive through hole 204 is any two circuit layers in the circuit connectable substrate 200 also, in other words, coincide layer except that can being made of single dielectric layer, also can comprise a plurality of dielectric layers and at least one conductive layer, and conductive layer are between wantonly two adjacent dielectric layers.Yet, be simplified illustration, hereinafter the situation that will only be positioned on the dielectric sandwich layer with regard to conductive through hole 204 describes.
Refer again to Fig. 2, the layer 202 that coincides for example has a upper surface 202a and corresponding a lower surface 202b, and the layer 202 linear slotted eye 202c (linear slot) with I shape that coincide, and it runs through the layer 202 that coincides.Just can form groove shape conductive through hole 204 by this linear slotted eye 202c, and groove shape conductive through hole 204 of the present utility model for example can have a plurality of transmission channels 206, in order to the multiple signal transmission path to be provided.Each transmission channel 206 for example can comprise a upper contact pad 206a, once a contact pad 206b and a transfer wire 206c, and wherein transfer wire 206c extends surperficial 202b under the inwall of the upper surface 202a, the linear slotted eye 202c that are disposed at the layer 202 that coincides and the layer 202 that coincides.In addition, upper contact pad 206a and following contact pad 206b are disposed at the upper surface 202a and the lower surface 202b of the layer 202 that coincides respectively, in order to as weld pad (bonding pad) or opening connection pad (via land), and the two ends of transfer wire 206c are extended connection upper contact pad 206a and following contact pad 206b respectively, to transmit the signal of levels circuit.
The design of the groove shape conductive through hole by the foregoing description, circuitry substrate of the present utility model can provide the multiple signal transmission path.Please refer to Fig. 3, it illustrates on a kind of part of circuitry substrate of preferred embodiment of the present utility model and looks schematic diagram, wherein is simplicity of illustration, and Fig. 3 only illustrates the coincide layer and the conductive through hole of circuitry substrate.As shown in Figure 3, the upper surface 302a of the layer 302 that coincides disposes a plurality of upper contact pad 306a, and the corresponding transfer wire 306c that connects the part of upper contact pad 306a.Different signals can be entered by different upper contact pad 306a simultaneously, and sees through the transmission of transfer wire 306c, and arrives the circuit of layer 302 below that coincide.In addition, by the linear slotted eye 302c on the layer 302 that coincides,, therefore can reduce the number of perforation on the circuitry substrate, and then significantly increase the connected up area of circuitry substrate when holding more transmission channel than the circular perforation of prior art.
Refer again to Fig. 3, wherein according to feature of the present utility model, the extension center line 308 of linear slotted eye 302c of the present utility model is open line segments, therefore the external form of linear slotted eye 302c its be not defined as the linear slotted eye of the I shape shown in Fig. 2 and 3.Please refer to Fig. 4 A～4C, it illustrates respectively on the part of circuitry substrate of the linear slotted eye with different shape and looks schematic diagram, wherein is simplicity of illustration, and Fig. 4 A～4C only illustrates the coincide layer and the conductive through hole of circuitry substrate.The shown person of Fig. 4 A is a L shaped linear slotted eye 410, it extends, and center line 410a is L-shaped, and the shown person of Fig. 4 B is the linear slotted eye 420 of a S shape, and it is S-shaped that it extends center line 420a, and the shown person of Fig. 4 C is the linear slotted eye 430 of a U-shaped, and it extends center line 430a and takes the shape of the letter U.
Except that the foregoing description, conductive through hole of the present utility model also can be used for a power plane and a ground plane of connecting circuit substrate.
Please also refer to Fig. 5 A and 5B, its illustrate respectively second embodiment of the present utility model a kind of circuitry substrate on look schematic diagram and A-A ' generalized section thereof, it wherein is simplicity of illustration, Fig. 5 A only illustrates coincide layer, power plane and the conductive through hole of circuitry substrate, and Fig. 5 B only illustrates coincide layer, power plane, ground plane and the conductive through hole of circuitry substrate.One of circuitry substrate 500 layer 502 the upper surface 502a that coincide for example disposes on one ground plane 508a on the power plane 506a and, wherein go up the periphery of ground plane 508a around last power plane 506a, for example have a plurality of first upper contact pad 507a and go up power plane 506a, and upward ground plane 508a for example have a plurality of second upper contact pad 509a.In addition, layer 502 the lower surface 502a that coincide for example disposes power plane 506c and ground plane 508c once, wherein descend the periphery of ground plane 508c around following power plane 506c, and power plane 506c for example has a plurality of first time contact pad 507c down, and ground plane 508c for example has a plurality of second time contact pad 509c down.In addition, the layer that coincides 502 for example has a linear slotted eye 502c of I shape, and for example disposes one first slotted eye conductive wall 506b and one second slotted eye conductive wall 506b independently mutually in the linear slotted eye 502c.Wherein, the first slotted eye conductive wall 506b Connects Power plane, source 506a and following power plane 506c and constitutes one first transmission channel 506 (hatched example areas), in order to usefulness as supply power, and ground plane 508a constitutes one second transmission channel 508 (hatched example areas) with following ground plane 508c in the second slotted eye conductive wall 508b connection, in order to the usefulness as ground connection.
At above-mentioned circuitry substrate with groove shape conductive through hole of the present utility model, the utility model also proposes a kind of manufacture method of conductive through hole at this.Please in regular turn with reference to figure 6A～6E and 7A～7E, its illustrate in regular turn respectively preferred embodiment of the present utility model a kind of conductive through hole manufacture method on look schematic diagram and B-B ' generalized section thereof.
At first, shown in Fig. 6 A and 7A, provide coincide layer 602, one upper strata conductive layer 604a and the conductive layer 604b of lower floor, conductive layer 604a and the conductive layer 604b of lower floor lay respectively at coincide layers 602 upper surface 602a and corresponding lower surface 602b at the middle and upper levels for they.In this step, for example can directly provide the upper and lower surface of a dielectric layer to be pasted with a lamina of Copper Foil respectively, or on a base material, form above-mentioned upper strata conductive layer 604a and the conductive layer 604b of lower floor in the mode of electroplating.
Then, shown in Fig. 6 B and 7B, form a linear slotted eye 602c on coincide layer 602, upper strata conductive layer 604a and the conductive layer 604b of lower floor, and linear slotted eye 602c is run through coincide layer 602, upper strata conductive layer 604a and the conductive layer 604b of lower floor.The method that forms this linear slotted eye 602c for example can be carried out milling (milling) along a cutting path by a cutter, and wherein cutting path is an open line segment, for example can be the mentioned I shape of the foregoing description, L shaped, S shape or U-shaped etc.In addition, also can directly form linear slotted eye 602c for example by the mode of mechanical punching (punching).
Then, shown in Fig. 6 C and 7C, form a slotted eye conductive layer 604c in the inwall of linear slotted eye 602c, when wherein forming this slotted eye conductive layer 604c, after for example can forming thin plating inculating crystal layer (not shown) prior to the inwall of linear slotted eye 602c, electroplate a metal level (not shown) on the inculating crystal layer (not shown) in electroplating again, so that electroplate inculating crystal layer and metal level formation slotted eye conductive layer 604c.
Subsequently, shown in Fig. 6 D and 7D, remove slotted eye conductive layer 604c partly, so that the slotted eye conductive layer 604c of remainder forms a plurality of slotted eye line segment 608c independent of each other.In this step, can remove slotted eye conductive layer 604c partly by for example mode such as machine drilling or laser drill.
What deserves to be mentioned is, the manufacture method of conductive through hole of the present utility model also can be after forming the plating inculating crystal layer, remove the plating inculating crystal layer of part earlier, on the remainder of electroplating inculating crystal layer, electroplate a metal level afterwards again, form a plurality of slotted eye line segments so that electroplate the remainder and the metal level of inculating crystal layer.In addition, in a preferred embodiment of the present utility model, wherein after forming above-mentioned slotted eye line segment, also can fill a dielectric material in linear slotted eye, and make dielectric material cover the slotted eye line segment, and this dielectric material for example can be a consent printing ink.In addition, after the filled dielectric material, also can come thinning upper strata conductive layer and lower floor's conductive layer by for example grinding modes such as (grinding).
At last, shown in Fig. 6 E and 7E, patterning upper strata conductive layer 604a and the conductive layer 604b of lower floor are with a plurality of upper strata line segment 608a that form separate a plurality of upper contact pad 606a and be connected with upper contact pad 606a in layer 602 the upper surface 602a that coincide.And, a plurality of line segment 608b of lower floor that form a plurality of contact pad 606b down and be connected in layer 602 the lower surface 602b that coincide with following contact pad 606b.Thus, each corresponding upper line segment 608a, slotted eye line segment 608c and the line segment 608b of lower floor constitute a transfer wire 606c, and also corresponding with it the upper contact pad 606a of each transfer wire 606c constitutes a transmission channel 606 with following contact pad 606b.
From the above, the manufacture method of conductive through hole of the present utility model can provide the conductive through hole of a groove shape, and can form a plurality of separate transmission channels in conductive through hole, so that the multiple signal transmission path to be provided.In addition, the manufacture method of conductive through hole of the present utility model for example can remove conductive layer in the slotted eye in order to the drill bit that forms circular perforation by prior art.Please refer to Fig. 8 and 9, it illustrates respectively in the manufacture method of conductive through hole of the present utility model, with circular drill bit remove conductive layer in the slotted eye on look schematic diagram.As shown in Figure 8, linear direction along linear slotted eye 802a forms a plurality of interconnective borings in regular turn, wherein Zuan Kong outside diameter d is slightly larger than or equals the width m of linear slotted eye 802a, therefore the action of whenever once holing, just can form corresponding signal channel 806 in the both sides of linear slotted eye 802a, so will help to accelerate process speed.
In addition, refer again to above-mentioned Fig. 5 A and the shown circuitry substrate of 5B, the utility model also can be in the action of once boring, only remove the slotted eye conductive layer (not shown) of one-sided part, to separate out different slotted eye line segments (slotted eye conductive wall 506b, 508b), and when patterning upper strata conductive layer and lower floor's conductive layer, upper and lower surface in the layer that coincides forms power plane 506a respectively, last ground plane 508a, following power plane 506c and following many conductive planes of ground plane 508c are to constitute in order to first transmission channel 506 of supply power and in order to second transmission channel 508 of ground connection.Certainly, except that above-mentioned power delivery channel and ground connection transmission channel, the utility model also can form the transmission channel of plural difference in functionality in same conductive through hole.Conductive through hole as shown in Figure 9 promptly has signal channel 912, power delivery channel 914 and ground connection transmission channel 916 simultaneously.
In sum, the utility model proposes a kind of circuitry substrate with conductive through hole of groove shape.Wherein, the linear slotted eye on the circuitry substrate for example can form by the mode of milling or punching, and a plurality of transmission channels in the linear slotted eye can form by bore mode.Circuitry substrate of the present utility model has following feature and advantage at least:
(1) each conductive through hole can provide multiple transmission channel, to transmit a plurality of signals simultaneously, therefore helps to improve the integrated level of circuit.
(2) each conductive through hole can provide multiple transmission channel, thereby can decrease in the number of times of boring a hole on the circuitry substrate relatively, significantly increases the connected up area of circuitry substrate, and shortens the winding length of integrated circuit layout.
(3) replace circular in the past perforation design with linear slotted eye design, and can in linear slotted eye, form multiple circuit, therefore can reach high efficiency and low production cost target by the action of boring.
Though the utility model with preferred embodiment openly as above; yet; it is not in order to limit the utility model; those skilled in the art; under the prerequisite that does not break away from spirit and scope of the present utility model; certainly can do some and change and retouching, therefore protection range of the present utility model should comprise above-described change and retouching.
Claims (8)
1. circuitry substrate is characterized in that described circuitry substrate comprises:
At least one layer that coincides has a upper surface and corresponding a lower surface, and the wherein said layer that coincides has a linear slotted eye, and it runs through the described layer that coincides;
One first transmission channel comprises: one first upper contact pad, be disposed at described coincide the layer described upper surface; One first time contact pad, be disposed at described coincide the layer described lower surface; One first transfer wire be disposed at the inwall of described linear slotted eye, and described first transfer wire connects the described first upper contact pad and described first time contact pad;
At least one second transmission channel comprises: one second upper contact pad, be disposed at described coincide the layer described upper surface; One second time contact pad, be disposed at described coincide the layer described lower surface; And
One second transfer wire be disposed at the inwall of described linear slotted eye, and described second transfer wire connects the described second upper contact pad and described second time contact pad.
2. circuitry substrate as claimed in claim 1 is characterized in that the part of described first transfer wire also is disposed at the described upper surface and the described lower surface of the described layer that coincides.
3. circuitry substrate as claimed in claim 1 is characterized in that the part of described second transfer wire also is disposed at the described upper surface and the described lower surface of the described layer that coincides.
4. circuitry substrate as claimed in claim 1 is characterized in that the described layer that coincides is made of single dielectric layer.
5. circuitry substrate as claimed in claim 1 it is characterized in that the described layer that coincides comprises a plurality of dielectric layers and at least one conductive layer, and described conductive layer is between wantonly two adjacent described dielectric layers.
6. circuitry substrate as claimed in claim 1 is characterized in that it is an open line segment that one of described linear slotted eye extends center line.
7. circuitry substrate as claimed in claim 6, it is characterized in that described extension center line be I shape, L shaped, S shape and U-shaped one of them.
8. circuitry substrate as claimed in claim 1 is characterized in that also comprising a dielectric material, and described dielectric material is filled in the described linear slotted eye, and covers described first transfer wire and described second transfer wire.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2004200593899U CN2710160Y (en) | 2004-05-21 | 2004-05-21 | Circuit substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2004200593899U CN2710160Y (en) | 2004-05-21 | 2004-05-21 | Circuit substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN2710160Y true CN2710160Y (en) | 2005-07-13 |
Family
ID=34851855
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNU2004200593899U Expired - Lifetime CN2710160Y (en) | 2004-05-21 | 2004-05-21 | Circuit substrate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN2710160Y (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100449556C (en) * | 2007-02-05 | 2009-01-07 | 智原科技股份有限公司 | Circuit unit of integrated circuit and related technology and method |
| US8455994B2 (en) | 2002-01-31 | 2013-06-04 | Imbera Electronics Oy | Electronic module with feed through conductor between wiring patterns |
| CN109757037A (en) * | 2017-11-07 | 2019-05-14 | 宏启胜精密电子(秦皇岛)有限公司 | High density circuit board and preparation method thereof |
-
2004
- 2004-05-21 CN CNU2004200593899U patent/CN2710160Y/en not_active Expired - Lifetime
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8455994B2 (en) | 2002-01-31 | 2013-06-04 | Imbera Electronics Oy | Electronic module with feed through conductor between wiring patterns |
| CN100449556C (en) * | 2007-02-05 | 2009-01-07 | 智原科技股份有限公司 | Circuit unit of integrated circuit and related technology and method |
| CN109757037A (en) * | 2017-11-07 | 2019-05-14 | 宏启胜精密电子(秦皇岛)有限公司 | High density circuit board and preparation method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CX01 | Expiry of patent term |
Expiration termination date: 20140521 Granted publication date: 20050713 |