CN2692844Y

CN2692844Y - LED chip crimping mechanism

Info

Publication number: CN2692844Y
Application number: CNU2004200282917U
Authority: CN
Inventors: 温大明; 温大同
Original assignee: Individual
Current assignee: Individual
Priority date: 2004-01-19
Filing date: 2004-01-19
Publication date: 2005-04-13
Anticipated expiration: 2014-01-19

Abstract

The utility model relates to an LED chip crimping mechanism. An upper press mould and a lower press mould capable of lifting are vertically and correspondingly arranged in a machine body sealing chamber with movable opening and closure, mould bodies of the upper press mould and the lower press mould present a corresponding structure shape and are respectively formed by fixing a face plate, a heating plate, a heat insulating plate and a bearing plate locking bolt into a whole, wherein one side of the plate bodies of the heating plates is provided with a plurality of spacing tube holes in which a plurality of electric heating tubes with the corresponding number are sheathed so as to provide a heating source for each face plate, one side of plate bodies of the face plates is provided with more than one hole passage in which a temperature sensor is sheathed so as to provide the reference data of the heating temperature of the electric heating tubes, the heat insulating plates avoid the heating temperature conducting and diffusing oppositely to the ends of the face plates, and the bearing plates are positioned between the mould bodies, are connected with and the mould bodies and support the mould bodies; the upper press mould is hung on the inner top surface of the machine body sealing chamber, the face plate of the upper press mould faces downwards and is connected to the inner top surface of the machine body sealing chamber through the ends of the bearing plates, the face plate of the lower press mould faces upwards, and the ends of the bearing plates are connected and supported on the corresponding position of the bottom end of the upper press mould through an air cylinder arranged at the bottom or the end of a hydraulic cylinder piston rod. The utility model saves chip crimping operation time, ensures the even pressure application and the heating effect of a chip set to be crimped and enhances the crimping quality of the chips.

Description

The laminating mechanism of light-emitting diode chip for backlight unit

One, technical field

The utility model chip pressing mechanism relates in particular to a kind of project organization of exerting pressure synchronously, heating that uses upper and lower pressing mold, saves the pressing activity duration of chip, and improves the laminating mechanism of the light-emitting diode chip for backlight unit of chip pressing quality simultaneously.

Two, background technology

The chip pressing that the utility model is alleged is meant luminescent layer chip and circuit layer chip chamber folder is established a glued membrane, utilizes heating, the mode of exerting pressure to make luminescent layer and the tight pressing bonding of circuit layer two chips one, in order to the processing operation of subsequent preparation process.

Existing light-emitting diode (Light Emitting DiOde, LED) technological means that chip pressing preparation process is adopted, as shown in Figure 1, be to carry out mostly with manual type, the luminescent layer chip 31 that the folder that is near completion is established glued membrane 33 operations and circuit layer chip 32 are as one group, and it is not easily broken to have, heat-resisting and graphite bolster plate that conductibility is good 4 piles one folded for the chipset alignment of will counting that separates material, with this folded chipset be placed on a compressing tablet frame 5 on, bottom deck 51,52, utilize again and be located at, the locking pressurization steps of the adjusting bolt 53 of angle end around the bottom deck and fixing should folded chipset, then clamping there is the compressing tablet of chipset to mount, makes the luminescent layer chip 31 and circuit layer chip 32 bonding one of each chipset with the thermosol glued membrane into an oven heat.

The pressing means of above-mentioned existing light-emitting diode chip for backlight unit, though can reach the effect of pressing, yet this process relies on manpower, causes efficient to improve, and it is in the mode of the fixing chipset to be laminated of compressing tablet frame, be difficult for balance and respectively regulate the locking degree of bolt, therefore cause pressing quality instability easily, even when the locking bolt tension, can change because of the coefficient of expansion of upper and lower board in the heating process, cause the excessive and problems such as breakage of chip pressure, demand improved necessity in fact urgently.

Three, utility model content

Main purpose of the present utility model is to overcome the above-mentioned shortcoming that existing product exists, and provide a kind of laminating mechanism of light-emitting diode chip for backlight unit, in the confined chamber of the movable switch of a body, dip mold with upright correspondence setting one top die and a may command lifting activity, on, dip mold has heating and temperature sense ability respectively, in view of the above, can make the chipset to be laminated that is placed on the dip mold end face obtain suitably heating, evenly exert pressure back and the tight bond one, reach and save the chip pressing activity duration, improve the implementation benefit of chip pressing quality stability, effectively solve existing light-emitting diode chip for backlight unit pressing means inconvenience and have the clear and quality problem of unstable of efficient.

An of the present utility model purpose is to provide a kind of laminating mechanism of light-emitting diode chip for backlight unit, on it, the die body of dip mold becomes counter structure, mainly by panel, heating plate, the thermal insulation board board is close to locking bolt in regular turn and is fixed as one and forms, this heating plate plate body one side is provided with number pore at interval, electrothermal tube for respective amount is inserted in the heating source as panel, this panel plate body one side is provided with more than one Kong Zhu and is inserted in for temperature inductor, so that electrothermal tube heating-up temperature reference data to be provided, thermal insulation board can avoid heating-up temperature to different what panel end conduction diffusion, and board provides the binding between die body to support; This top die board end face center is provided with a block body with arc surface top, this block body becomes apical margin to be tight against the top wall and has supporting with a bearing buckle of deflection activity space, the outstanding carrier aircraft body confined chamber inner top surface place that establishes that makes top die have the deflection activity ability guarantees evenly the exerting pressure of chipset to be laminated, heats.

The purpose of this utility model is realized by following technical scheme.

The laminating mechanism of the utility model light-emitting diode chip for backlight unit, it is characterized in that, in the confined chamber of the movable switch of a body, dip mold with upright correspondence setting one top die and a control lifting activity, on being somebody's turn to do, the die body of dip mold becomes corresponding planform, and respectively by panel, heating plate, thermal insulation board and board are close to the locking bolt formation that is fixed as one in regular turn, plate body one side of this heating plate is provided with number pore at interval, electrothermal tube for respective amount is inserted in, so that the heating source of panel separately to be provided, plate body one side of this panel is provided with more than one duct and is inserted in for temperature inductor, so that the reference data of electrothermal tube heating-up temperature to be provided, this thermal insulation board avoids heating-up temperature to differing from panel end conduction diffusion, this board is positioned between die body and links and supports die body, and link suspention by its board end is arranged on body confined chamber inner top surface to the top die panel down, dip mold become panel up and the board end tailpiece of the piston rod of putting air cylinder or hydraulic cylinder by an end link and be supported on corresponding position, top die bottom.

The laminating mechanism of aforementioned light-emitting diode chip for backlight unit, wherein top die board end face center is provided with a block body with arc surface top, the bearing buckle that pass through that the block body apical margin is tight against the top wall and has a deflection activity space supports, and what make that top die one-tenth has a deflection activity ability is hung on body confined chamber inner top surface.

Four, description of drawings

Fig. 1 is existing chip pressing mode schematic diagram.

Fig. 2 is the utility model laminating mechanism schematic perspective view.

Fig. 3 is the utility model laminating mechanism initial condition forward sight generalized section.

Fig. 3 A is a position shown in Figure 3 structure enlarged diagram.

Fig. 4 is the utility model laminating mechanism operate condition schematic side view.

Fig. 5 is the utility model top die structural representation.

Number in the figure explanation: 1 top die, 11 panels, 111 ducts, 112 temperature inductors, 12 heating plates, 121 pores, 122 electrothermal tubes, 13 thermal insulation boards, 14 boards, 15 block bodies, the 15a arc surface, 16 bearings, 2 dip molds, 21 panels, 211 ducts, 212 temperature inductors, 22 heating plates, 221 pores, 222 electrothermal tubes, 23 thermal insulation boards, 24 boards, 25 air cylinders, 26 piston rods, 3 chipsets, 31 luminescent layer chips, 32 circuit layer chips, 33 glued membranes, 4 Graphite pads, 5 compressing tablet framves, hold sheet on 51, hold sheet 52 times, 53 regulate bolt.

Five, embodiment

The laminating mechanism of the utility model light-emitting diode chip for backlight unit, be to use for the heat pressure adhesive preparation process operation of luminescent layer chip and circuit layer chip, see also Fig. 2 to shown in Figure 4, it mainly is in the confined chamber of a body, there is a top die 1 and can carry out 2 liang of main partly formations of dip mold of lifting activity with upright correspondence setting, wherein: the die body of top die 1 comprises panel 11, heating plate 12, thermal insulation board 13, board 14 members such as grade, become the sealed from bottom to top in regular turn one of movable mounting or dismounting to form, and become panel 11 down be hung on body confined chamber inner top surface, this panel 11 plate bodys one side is provided with duct 111, and in the duct sheathed temperature inductor 112, reference as the panel heating-up temperature, heating plate 12 plate bodys one side is provided with number pore 121 at interval, and be arranged with an electric heater 122 in the pore respectively, be used to provide panel required thermal source, in addition, this thermal insulation board 13 is made for Nai Gaore material (as asbestos etc.), temperature with the reduction heating plate runs off towards different what panel end conduction diffusion, and this board 14 mainly provides the binding support that reaches between die body between die body and body; In addition, these dip mold 20 die bodys become corresponding planform with top die, comprise members such as panel 21, heating plate 22, thermal insulation board 23, board 24, become the sealed from top to bottom in regular turn one of movable mounting or dismounting to form, and become panel 21 up be erected at corresponding position, top die 1 below, this panel 21 plate bodys one side is provided with pore 211, be arranged with temperature inductor 212 in the pore, be used as the reference of panel heating-up temperature, this heating plate 22 plate bodys one side is provided with number pore 221 at interval, and be respectively equipped with an electrothermal tube 222 in the pore 2, be used to provide panel required thermal source; This thermal insulation board 23 is made for Nai Gaore material (as asbestos etc.), runs off towards different what panel end conduction diffusion with the temperature that reduces heating plate; Board 24 mainly is to support for the binding between die body, and the binding that end piston rod 26 pivots of putting air cylinder 25 go out end fixes, and raises, draws the reciprocating motion ability of falling so that dip mold 2 has control.Hold the laminating mechanism of above-mentioned light-emitting diode chip for backlight unit, as Fig. 3, Fig. 3 A, shown in Figure 4, with the graphite plate 4 with planarization serves as to pile stacked several chipsets 3 at interval, directly be placed on the panel 21 of dip mold, can be by the motion that raises of dip mold bottom air cylinder piston rod 26, by last, the panel 11 of dip mold, 21 carry out synchronous pressurized, heated operation, make the luminescent layer chip 31 and circuit layer chip 32 of each chipset, can establish glued membrane 33 thermosol phenomenons therebetween and continue suitable compression strength by folder, and the close adhesion one is embodiment of the present utility model.

The laminating mechanism of above-mentioned light-emitting diode chip for backlight unit, what 1 one-tenth of this top die had a deflection activity ability is hung on body confined chamber inner top surface place, main establish one in the board 11 end face centers of top die and have the block body 15 on arc surface 15a top, and make 15 one-tenths apical margins of this block body be tight against above wall and have supporting of deflection activity space with a bearing 16 buckles; The overhung construction shape of aforementioned top die, please cooperate Fig. 4, shown in Figure 5, when the level of putting several laminated chips groups 3 end of when raises angle and produces the skew situation, top die 1 can be by the arc surface 15a rolling characteristics of block body, and from reason pushing loading angle panel 11 is adjusted to deflect to the angle of exerting pressure of fitting fully with the topsheet surface of laminated chips group 3, make the top, bottom surface of chipset to be laminated obtain to exert pressure synchronously uniformly, heats, thereby improve the pressing quality of stability.

The above, it only is preferred embodiment of the present utility model, be not that the utility model is done any pro forma restriction, every foundation technical spirit of the present utility model all still belongs in the scope of technical solutions of the utility model any simple modification, equivalent variations and modification that above embodiment did.

To sum up, the laminating mechanism of the utility model light-emitting diode chip for backlight unit, what it utilized upper and lower pressing mold in the body confined chamber exerts pressure, heats project organization synchronously, can have more the activity duration of saving the chip pressing processing procedure than the prior art manufacturing process, and the implementation result that improves chip pressing quality stability, in addition, the technical characterstic of the utility model creation, also not seen has the like product public use or sees publication before application, be with the utility model of novelty and progressive, file an application in accordance with the law.

Claims

1, a kind of laminating mechanism of light-emitting diode chip for backlight unit, it is characterized in that, in the confined chamber of the movable switch of one body, dip mold with upright correspondence setting one top die and a control lifting, on being somebody's turn to do, the die body of dip mold becomes corresponding planform, and respectively by panel, heating plate, thermal insulation board and board are close to the locking bolt formation that is fixed as one in regular turn, plate body one side of this heating plate is provided with number pore at interval, electrothermal tube for respective amount is inserted in, plate body one side of this panel is provided with more than one duct and is inserted in for temperature inductor, this board is positioned between die body and links and supports die body, link suspention by its board end is arranged on body confined chamber inner top surface to the top die panel down, dip mold become panel up and the board end tailpiece of the piston rod of putting air cylinder by an end link and be supported on corresponding position, top die bottom.

2, the laminating mechanism of light-emitting diode chip for backlight unit according to claim 1, it is characterized in that, the board end face center of described top die is provided with a block body with arc surface top, the bearing buckle that pass through that this block body apical margin is tight against the top wall and has a deflection activity space supports, and what make that top die one-tenth has a deflection activity ability is hung on body confined chamber inner top surface.