CN2679737Y - Radiating structure of computer - Google Patents
Radiating structure of computer Download PDFInfo
- Publication number
- CN2679737Y CN2679737Y CN 200320113701 CN200320113701U CN2679737Y CN 2679737 Y CN2679737 Y CN 2679737Y CN 200320113701 CN200320113701 CN 200320113701 CN 200320113701 U CN200320113701 U CN 200320113701U CN 2679737 Y CN2679737 Y CN 2679737Y
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- China
- Prior art keywords
- heat
- computer
- housing
- heat sink
- radiating fin
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- Expired - Lifetime
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model relates to a radiating structure of the computer, comprising a casing, a radiating fin set, a radiating board and a heat conductive pipe. The casing is provided with containing space for placing a printed circuit board provided with a heating component. The radiating fin set is arranged on the top side of the heating component; the heat conductive pipe is connected with the radiating fin set. The radiating board is contacted with the casing and is tightly jointed between the heat conductive pipe and the radiating fin set, so that the produced heat energy during the working of the heating component can be conducted to the heat conductive pipe and the radiating board through the radiating fin set; the heat energy is conveyed to the casing to greatly expand the radiating area to obviously raising the radiating effect.
Description
Technical field
The utility model relates to a kind of radiator structure, is applied to computer equipment, particularly a kind of computer to dissipate heat structure that good heat radiating function is provided.
Background technology
The prosperity of Information technology industry in recent years, expensive in the past computer equipment early to become the indispensable instrument of society, wherein has different types according to user's different demands.Have the supercomputer (Super Computer) of quick arithmetic capability, notebook (Notebook) individual easy to carry etc. as large units such as desktop PC (Desktop PC), the industry of individual's use server (Server) commonly used, research institutions, it is powerful, price is but cheap day by day, be subjected to deeply society certainly be widely used in industry work and personal daily is lived.
This type of computer equipment has generally included a printed circuit board (PCB), the motherboard that just is commonly called as (MainBoard), in order to the required north bridge chipset of supply work (North Bridge), South Bridge chip group (SouthBridge), central processing unit (Central Process Unit, CPU), and can supply various expansion boards such as sound card, presentation card and network card to plant with the assembling of random access memory electronic packages such as (RandomAccess Memory).Sub-component the time tends to distribute high heat in work yet these computer equipments can be powered, so prior art provides the method for multiple heat radiation, as No. the 504021st, Taiwan patent, and a kind of buckling device of central processing unit (CPU) heat radiator "; And No. 516666, a kind of fin improvement structure of computer CPU heat sink promptly discloses relevant technology.The former major technique is characterised in that on each main heat sink of fin to have several flanging, and the trend of this flanging is corresponding with the device flow path direction, and the air-guiding structure that forms by flanging promotes ventilation effect and heat sinking function.The latter is improved at the engaging support mechanism of heat radiator, mainly is made up of butting section, first buckling parts and second buckling parts, so that the user dismantles, installs heat radiator in central processing unit (CPU).
The major technique means of prior art as mentioned above, in fact prior art or commercially available prod roughly do not break away from this two big class of improvement of above-mentioned heat radiator and fastener.
Summary of the invention
The purpose of this utility model is to disclose a kind of computer to dissipate heat structure, is applied to computer equipment, and a kind of radiator structure that is different from prior art is provided, and the integral heat sink enlarged areas effectively can be promoted heat dissipation.
According to computer to dissipate heat structure provided by the utility model, mainly constituted by housing, radiating fin group, heat sink and heat pipe.Its middle shell has accommodation space, can put for printed circuit board (PCB)s such as motherboards, and the both sides of housing is formed with several heat radiator.The radiating fin group has several radiating fins, can produce the top side of the heat generating component of high heat when being disposed at work, as central processing unit etc.Heat pipe extends towards the top side of heat generating component direction, and is connected in a side of radiating fin group.In addition, be equipped with heat sink between heat pipe and the radiating fin group, and the heat sink overlap joint is resisted against the inwall of housing.
Can produce the heat generating component of high heat during the work of one class such as central processing unit, heat energy can be led to heat pipe and heat sink, and be passed to housing by the radiating fin group, causes whole area of dissipation to be expanded to whole housing; In other words, radiating subassembly has comprised heat pipe, heat sink and housing, because of its area of dissipation increases, airflow through the time can take away more thermal energy to reach thermal equilibrium, many in order to do heat dissipation is also promoted thereupon.
The server that computer equipment, particularly industrial community are commonly used and the supercomputer of research unit now, the requirement that has for the degree of stability of computer system is harshness day by day; Computer to dissipate heat structure disclosed in the utility model, the radiating mode by heat radiator and fan different from the past arrives heat pipe, heat sink and casing with the integral heat sink enlarged areas, and effectively promotes heat dissipation.And via researching and analysing and related experiment, even need not assemble fan good heat sinking function can be provided, more avoid the noise phenomenon that produces because of fan running.
For above-mentioned and other purpose, feature and advantage of the present utility model can be become apparent, several preferred embodiments cited below particularly, and conjunction with figs. are described in detail below.
Description of drawings
Fig. 1 is the decomposing schematic representation of the utility model computer to dissipate heat structure;
Fig. 2 is the first assembly synoptic diagram of the utility model computer to dissipate heat structure;
Fig. 3 is the second preferred embodiment synoptic diagram of the utility model computer to dissipate heat structure;
Fig. 4 is the 3rd a preferred embodiment synoptic diagram of the utility model computer to dissipate heat structure;
Fig. 5 is the 4th a preferred embodiment synoptic diagram of the utility model computer to dissipate heat structure.
Description of reference numerals
13 pairs of chutes of 10 housing 11 accommodation spaces, 12 heat radiator
20 heat sinks, 21 thermal troughs, 22 openings, 30 heat pipes
40 radiating fin groups, 50 printed circuit board (PCB)s, 60 heat generating components
70 heat sinks, 71 thermal troughs, 72 openings
73 alar parts, 80 heat pipes
Embodiment
According to a kind of computer to dissipate heat structure disclosed in the utility model, please refer to Fig. 1 and Fig. 2, mainly to be formed with heat pipe 30 by housing 10, heat sink 20, its middle shell 10 has accommodation space 11, puts for printed circuit board (PCB)s such as motherboard 50.Printed circuit board (PCB) 50 can distribute the heat generating component 60 of high heat during as central processing unit (Central Process Unit), north bridge chipset (North Bridge) and the work such as (South Bridge) of South Bridge chip group for the required electronic package assembling of several work.The relative both sides of housing 10 are formed with several heat radiator 12 respectively, and offer several to chute 13, for the circulation of air turnover housing 10 in the external world, to promote heat dissipation.
Radiating fin group 40 is made of several radiating fins, is disposed at the top side of heat generating component 60.Heat sink 20 offers several openings 22, for air in the accommodation space 11 and extraneous circulation, and promotes radiating effect.Heat sink 20 closely abuts against the side in radiating fin group 40, and optionally is coated with heat-conducting cream to strengthen the thermal energy transfer effect; Heat sink 20 more overlaps conflict mutually with the inwall of housing 10 in addition, and the material of heat sink 20 is made of the aldary of high heat-conduction coefficient.Heat sink 20 is formed with thermal trough 21 and closely is installed with for heat pipe 30 corresponding to the opposite side of radiating fin group 40, and in the same manner, heat pipe 30 selectively is coated with heat-conducting cream with heat sink 20 joints, to promote the thermal energy transfer effect.Heat pipe 30 is connected in radiating fin group 40, and extends towards the top side direction of heat generating component 60.In other words, heat pipe 30 cooperates radiating fin group 40, and with heat sink 20 tight clampings therebetween.
When heat generating component 60 is high when hot because of work produces, heat energy can dispel the heat by radiating fin 40 basically; Simultaneously, can be by heat pipe 30 with heat sink 20 with thermal energy transfer to housing 10.Area of dissipation is except having comprised radiating fin group 40 and heat sink 20, more be expanded to housing 10 and significantly increase, and housing 10 have heat radiator 12 with to chute 13, so that extraneous air frees in and out circulation, the heat sink 20 of inner installing also has opening 22 and has increased the cross-ventilation of housing 10 inner accommodation spaces 11, in order to do making the integral heat sink performance tangible lifting is arranged.
Lift second preferred embodiment in addition at this, please refer to Fig. 3, wherein a side of heat sink 20 and radiating fin group 40 are joined, opposite side abuts against the inwall that is attached at housing 10, and the heat pipe (not shown) closely is folded between heat sink 20 and the housing 10, the heat energy that is produced when therefore heat generating component 60 is worked can directly be conducted to housing 10, and effectively be promoted heat dissipation.
Heat sink and heat pipe also can be done variation slightly in addition, as Fig. 4, shown in Figure 5, the the 3rd, the 4th preferred embodiment for the utility model computer to dissipate heat structure, wherein heat pipe 80 is different from previous embodiment, side from radiating fin group 40 is extended continuously with the U type, heat sink 70 has the thermal trough 71 of corresponding heat pipe 80 external forms, and with ccontaining heat pipe 80, heat sink 70 also has the air free flow of opening 72 for accommodation space 11 inside.Specifically, for asking more contact area is arranged with housing 10, side in heat sink 70 is extended with alar part 73, subsides are butted on the inwall of housing 10, make heat sink 20 and effective contact area of housing 10 increase many, and the heat energy that makes heat generating component 60 is passed to housing 10 more efficiently, to promote heat dispersion.Among Fig. 4, the alar part 73 of a side of heat sink 70 and the alar part 73 of opposite side are identical bearing of trend.Among Fig. 5, the alar part 73 of a side of heat sink 70 and the alar part 73 of opposite side are opposite bearing of trend.
The above only is the utility model preferred embodiment wherein, is not to be used for limiting practical range of the present utility model; Be that all equivalences of being done according to the utility model claim change and modification, all contained by the utility model claim.
Claims (7)
1. a computer to dissipate heat structure is dispelled the heat in order to the heat generating component to a printed circuit board (PCB), includes:
One housing has an accommodation space, and this printed circuit board (PCB) is put wherein, and a side of this housing is provided with several heat radiator;
One radiating fin group is disposed at the top side of this heat generating component;
One heat sink is assemblied in a side of this radiating fin group, and is overlapped in a side of this housing; And
One heat pipe is arranged at the opposite side of this heat sink with respect to this radiating fin group, and an end of this heat pipe is engaged in this radiating fin group.
2. computer to dissipate heat structure as claimed in claim 1 is characterized in that, this housing forms a side of this heat radiator, offers several to chute.
3. computer to dissipate heat structure as claimed in claim 1 is characterized in that, this heat sink is provided with a thermal trough according to the external form of this heat pipe, and this heat pipe is installed with wherein and adhere well to this heat sink.
4. computer to dissipate heat structure as claimed in claim 1 is characterized in that this heat sink has several openings.
5. computer to dissipate heat structure as claimed in claim 1 is characterized in that, the side that this heat sink and this housing join is formed with an alar part and pastes the inwall that is butted on this housing.
6. computer to dissipate heat structure as claimed in claim 1 is characterized in that, this heat sink is a copper alloy plate.
7. computer to dissipate heat structure as claimed in claim 1 is characterized in that, the side that this heat sink and this heat pipe join abuts against the inwall that is attached at this housing together.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200320113701 CN2679737Y (en) | 2003-12-29 | 2003-12-29 | Radiating structure of computer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200320113701 CN2679737Y (en) | 2003-12-29 | 2003-12-29 | Radiating structure of computer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN2679737Y true CN2679737Y (en) | 2005-02-16 |
Family
ID=34580871
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200320113701 Expired - Lifetime CN2679737Y (en) | 2003-12-29 | 2003-12-29 | Radiating structure of computer |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN2679737Y (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102279641A (en) * | 2011-09-08 | 2011-12-14 | 童泽奇 | Notebook computer radiator |
| CN104460910A (en) * | 2014-12-18 | 2015-03-25 | 山东超越数控电子有限公司 | Board-level radiating method for board cards |
-
2003
- 2003-12-29 CN CN 200320113701 patent/CN2679737Y/en not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102279641A (en) * | 2011-09-08 | 2011-12-14 | 童泽奇 | Notebook computer radiator |
| CN104460910A (en) * | 2014-12-18 | 2015-03-25 | 山东超越数控电子有限公司 | Board-level radiating method for board cards |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CX01 | Expiry of patent term |
Expiration termination date: 20131229 Granted publication date: 20050216 |