CN2660683Y - Special mounting assembly for radiator - Google Patents
Special mounting assembly for radiator Download PDFInfo
- Publication number
- CN2660683Y CN2660683Y CN 200320102734 CN200320102734U CN2660683Y CN 2660683 Y CN2660683 Y CN 2660683Y CN 200320102734 CN200320102734 CN 200320102734 CN 200320102734 U CN200320102734 U CN 200320102734U CN 2660683 Y CN2660683 Y CN 2660683Y
- Authority
- CN
- China
- Prior art keywords
- heat abstractor
- backboard
- special
- fixed lever
- installation component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model discloses a mounting component specially designed for radiating devices. The mounting component is used to fix the radiating device onto the motherboard of a computer, comprising a backboard and a plurality of holding rods. The backboard is arranged under the motherboard; a plurality of holes are prepared on the backboard, and these holes correspond to various specifications of preformed holes on the motherboard, and the holding rods can run through these holes; the embedded parts of the holding rods are arranged in the holes on the backboard to prevent the holding rods from rotating relatively to the backboard. As a result, the radiating device can be installed easily, rapidly and firmly.
Description
Technical field
The utility model relates to the special-purpose installation component of a kind of heat abstractor, relates in particular to a kind of motherboard preformed hole applicable to various different sizes, with easy, rapidly, firmly assemble the special-purpose installation component of heat abstractor of heat abstractor.
Background technology
Along with Information technology is flourish rapidly, the design of personal computer association area and assembly are along with making rapid progress, relevant product such as hard disk, adapter, central processing unit (CPU) etc., it is more and more big to relate to multimedia logical operation deal with data, processing speed is more and more faster, make the operating temperature of personal computer internal unit and integrated circuit package too high, for reducing the high heat that is produced when these high-performance computer processors (as the P4 processor of Intel or the K8 processor of AMD) are worked, industry generally adopts the heat abstractor that adds large volume, thereby relatively increased considerably overall weight, higher to the installation requirement of these heat abstractors.
The special-purpose installation component of known heat abstractor, " improvement of CPU radiating fin mounting structure " shown in No. the 90211070th, the novel patent application of TaiWan, China, be connected and fixed motherboard and central processing unit closely though utilize, have and avoid accidentally dropping accidentally that electronic building brick is hit the effect that shatters and damage when dropping, but still following problem is arranged: because supporting bracket and screw rod are the fixed designs that strikes up partnership, only can be applicable to the motherboard of single central processing unit manufacturing firm, for the central processing unit of different manufacturers, then must make the supporting bracket of other model in addition.Thereby manufacturing cost is significantly improved.
So the special-purpose installation component of above-mentioned known heat abstractor has awkward shortcoming in actual use, should be improved.
Designer of the present utility model, concentrates on studies in conjunction with the experience of being engaged in the sector for many years at above-mentioned defective, in line with excelsior spirit, has designed the utility model.
Content of the present utility model
Main purpose of the present utility model provides the special-purpose installation component of a kind of heat abstractor, on backboard, be provided with a plurality of holes, these holes are corresponding with the motherboard preformed hole of various different sizes, being applicable to various motherboard, thereby can reduce manufacturing cost significantly.
Another purpose of the present utility model provides the special-purpose installation component of a kind of heat abstractor, be arranged on by Embedded Division in the hole of backboard fixed lever, make this fixed lever and backboard relative fixed, do not produce relative rotation, with easy, rapidly, firmly heat abstractor is installed.
To achieve these goals, the utility model provides a kind of heat abstractor special-purpose installation component, is used for heat abstractor is fixedly mounted on the computer main frame panel, comprises a backboard and a plurality of fixed lever.Wherein, described backboard is arranged on the motherboard below, on backboard, be provided with a plurality of holes, these holes are corresponding to the motherboard preformed hole of various different sizes, and can pass setting for a fixed lever, described fixed lever one end has Embedded Division, and the shape of described Embedded Division is corresponding with the hole of backboard, thereby realizes above-mentioned purpose.
Use the special-purpose installation component of heat abstractor of the present utility model, can reduce manufacturing cost, easy, rapidly, firmly heat abstractor is installed.
Brief description of drawings
Fig. 1 is the exploded perspective view of the special-purpose installation component of heat abstractor of an embodiment of the present utility model;
Fig. 2 is the combination schematic diagram of the special-purpose installation component of heat abstractor of an embodiment of the present utility model;
Fig. 3 is the exploded perspective view that the utility model has an embodiment of heat abstractor;
Fig. 4 is the combination schematic diagram that the utility model has an embodiment of heat abstractor;
Fig. 5 is the assembled sectional view that the utility model has an embodiment of heat abstractor;
Fig. 6 is the schematic isometric of the fixed lever of the special-purpose installation component of the heat abstractor of second embodiment of the present utility model;
Fig. 7 is the schematic isometric of the fixed lever of the special-purpose installation component of the heat abstractor of the 3rd embodiment of the present utility model.
The assembly conventional letter is listed as follows in the accompanying drawing:
Fixed lever 20
Embedded Division 21 grooves 22
Bottom 25 top covers 26
Heat abstractor 30
Breach 312 heat-conducting blocks 32
Shock-absorbing assembly 35 elastic partss 36
Bolt 37
Motherboard 40
Embodiment
Below in conjunction with accompanying drawing feature of the present utility model and technology contents are elaborated.Only for reference and the explanation usefulness of accompanying drawing is not to restriction of the present utility model.
Fig. 1, Fig. 2 are respectively exploded perspective view and the combination schematic diagrames of an embodiment of the present utility model.As shown in Figure 1 and Figure 2, the utility model provides a kind of heat abstractor special-purpose installation component, comprises a backboard 10 and a plurality of fixed lever 20.Wherein:
Described fixed lever 20 can be made by metal material, and an end is provided with an Embedded Division 21, and the hole 12 of the shape of Embedded Division 21 and backboard 10 is corresponding, also can be regular hexagon, rectangle or other geometry.Above this Embedded Division 21, be provided with a groove 22, an elastomeric pad 23 can be set in the groove 22.Be provided with a junction 24 at the center of fixed lever 20, this connecting portion 24 can be a screw or straight hole.At present embodiment is a screw, can be connected with the assembly that bolt etc. plays fixation.
Fig. 3, Fig. 4, Fig. 5 are respectively exploded perspective view, combination schematic diagram and the assembled sectional views that has an embodiment of the present utility model of heat abstractor.As Fig. 3, Fig. 4 and shown in Figure 5, the utility model further comprises a heat abstractor 30.Heat abstractor 30 is fixedly installed on the motherboard 40, and fixedlys connected with fixed lever 20, and motherboard 40 is fixed between heat abstractor 30 and the backboard 10.Wherein, these motherboard 40 end faces are provided with central processing unit 41 and other electronic building brick, are provided with preformed hole 42 at the front and back ends of central processing unit 41.Illustrated embodiment is one to be used for the motherboard 40 of the K8 processor specification of AMD.Heat abstractor 30 comprises a framework 31, a heat-conducting block 32, a pressing plate 33 and a radiating fin 34.Wherein, this framework 31 is flat hollow frameworks, is respectively equipped with a plurality of through holes 311 in the middle of Qi Gejiao end and forward and backward plate, the hole 12 corresponding settings of these through holes 311 and backboard 10.Be respectively equipped with a breach 312 in the bottom of these framework 31 forward and backward plates.The center of this framework 31 can be provided with a heat-conducting block 32, and this heat-conducting block 32 is trapezoidal, is made by copper, aluminium or other material with thermal conductive resin, and its end face is to having a conduit 321.Can hold in this conduit 321 pressing plate 33 is set.This pressing plate 33 is approximate " ㄇ " font, and each openend extends laterally a lug 331 is set in the bottom.This lug 331 can hold in the breach 312 that is arranged on framework 31.In addition, these heat-conducting block 32 tops can be provided with a radiating fin 34.
Can be during assembling at the end face of this backboard 10 shock-absorbing assembly 35 of fitting, this shock-absorbing assembly 35 can be the assembly that sponge etc. has the shock-absorbing protective effect.Earlier fixed lever 20 is passed from the preformed hole 42 of motherboard 40, the bottom surface with heat-conducting block 32 is flattened on central processing unit 41 end faces again.This pressing plate 33 is put into the conduit 321 of heat-conducting block 32, and this framework 31 is placed on the motherboard 40, the through hole 311 that makes framework 31 aligns with the preformed hole 42 of motherboard 40, and the breach 312 of framework 31 is placed on lug 331 tops of pressing plate 33.Be arranged on the bolt 37 with an elastic parts 36, this bolt 37 is penetrated the through hole 311 of framework 31 and be connected with the connecting portion 24 of fixed lever 20.
Fig. 6, Fig. 7 are respectively the schematic isometric of the fixed lever of the fixed lever schematic isometric of second embodiment of the present utility model and the 3rd embodiment of the present utility model.Wherein, fixed lever 20 shown in Figure 6 is provided with a bottom 25 that protrudes below Embedded Division 21, and the external diameter of this bottom 25 plays a part to stop much larger than hole 12 diameters of backboard 10.In like manner, as shown in Figure 7, a top cover 26 that protrudes is set above the Embedded Division 21 of this fixed lever 20, the external diameter of this top cover 26 is much larger than hole 12 diameters of backboard 10.Like this, can make the manufacture simplification of the groove 22 of fixed lever 20, and reduce assembly cost.
As mentioned above, according to the special-purpose installation component of a kind of heat abstractor of the utility model, have the following advantages at least:
1. the utility model backboard offers a plurality of holes, and these holes are corresponding with the motherboard preformed hole of various different sizes, applicable to different motherboards, thereby reduces manufacturing cost significantly.
2. the Embedded Division of the utility model fixed lever can be arranged in the hole of backboard, and this fixed lever and backboard are not produced relative rotation, and heat abstractor can easy, rapidly, firmly be installed.
3. backboard of the present utility model and heat abstractor can be protected motherboard, and under the situation such as drop of accidentally dropping accidentally, motherboard and central processing unit can not broken by damage yet.
In sum, the special-purpose installation component of heat abstractor of the present utility model has had practicality, novelty and creativeness, also is not disclosed use, meets the utility application important document fully, now files an application according to Patent Law.
The above is a preferred embodiment of the present utility model, is not to restriction of the present utility model.The equivalence done of with good grounds specification of the present utility model and accompanying drawing change, directly or indirectly be used in other relevant technical field, all be encompassed in the Patent right requirement scope of the present utility model.
Claims (10)
1. the special-purpose installation component of a heat abstractor, be used for heat abstractor is fixedly installed on the computer main frame panel, comprise a backboard and a plurality of fixed lever, it is characterized in that, described backboard is located at the motherboard below, the body of described backboard is provided with a plurality of holes, these holes are corresponding to the motherboard preformed hole of various different sizes, described fixed lever can therefrom pass, described fixed lever one end has Embedded Division, the shape of described Embedded Division is corresponding with the hole of backboard, makes described fixed lever and described backboard relative fixed.
2. the special-purpose installation component of heat abstractor according to claim 1 is characterized in that the hole of described backboard is regular hexagon hole or rectangle hole.
3. the special-purpose installation component of heat abstractor according to claim 1 is characterized in that the left and right side of described backboard body is respectively equipped with the strip groove, and the front and back ends of described backboard body is respectively equipped with " T " font groove.
4. the special-purpose installation component of heat abstractor according to claim 1 is characterized in that the Embedded Division of described fixed lever is regular hexagon or rectangle.
5. the special-purpose installation component of heat abstractor according to claim 1 is characterized in that the Embedded Division of described fixed lever is provided with a groove, in the described groove elastomeric pad can be set.
6. the special-purpose installation component of heat abstractor according to claim 1 is characterized in that, the Embedded Division bottom of described fixed lever is provided with a bottom, and the external diameter of described bottom plays a part to stop much larger than the hole diameter of described backboard.
7. the special-purpose installation component of heat abstractor according to claim 1 is characterized in that the top of the Embedded Division of described fixed lever is provided with a top cover, and the external diameter of described top cover plays a part to stop much larger than the hole diameter of described backboard.
8. the special-purpose installation component of heat abstractor according to claim 1 is characterized in that described fixed lever center is provided with a junction, and described connecting portion can be connected with fixation kit, and described fixation kit comprises bolt.
9. the special-purpose installation component of heat abstractor according to claim 1, it is characterized in that further comprise a heat abstractor, described heat abstractor is fixedly mounted on the motherboard, and fixedly connected with described fixed lever, described motherboard is between described heat abstractor and the described backboard.
10. the special-purpose installation component of heat abstractor according to claim 9, it is characterized in that, described heat abstractor comprises framework, heat-conducting block, pressing plate and radiating fin, described pressing plate is placed on the heat-conducting block, described framework is arranged on the two ends of pressing plate, described heat-conducting block and described pressing plate are arranged in the described framework, and described radiating fin is arranged on the described heat-conducting block.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200320102734 CN2660683Y (en) | 2003-10-31 | 2003-10-31 | Special mounting assembly for radiator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200320102734 CN2660683Y (en) | 2003-10-31 | 2003-10-31 | Special mounting assembly for radiator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN2660683Y true CN2660683Y (en) | 2004-12-01 |
Family
ID=34340242
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200320102734 Expired - Fee Related CN2660683Y (en) | 2003-10-31 | 2003-10-31 | Special mounting assembly for radiator |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN2660683Y (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107479644A (en) * | 2016-06-08 | 2017-12-15 | 恩斯迈电子(深圳)有限公司 | Main board assembly and supporting board |
-
2003
- 2003-10-31 CN CN 200320102734 patent/CN2660683Y/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107479644A (en) * | 2016-06-08 | 2017-12-15 | 恩斯迈电子(深圳)有限公司 | Main board assembly and supporting board |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN201465020U (en) | Conduction and heat dissipation device of CPCI module | |
| CN2660683Y (en) | Special mounting assembly for radiator | |
| CN2886654Y (en) | Heat radiating device for display card | |
| CN2681336Y (en) | Heat sink | |
| CN100345289C (en) | Hot-piping radiator | |
| CN2777705Y (en) | Heat conducting racliator for computer hard disk apparatus | |
| CN2755781Y (en) | Integrated radiator | |
| CN2672874Y (en) | Stair type radiator | |
| CN2544327Y (en) | Water cooling type heat sink | |
| CN2860013Y (en) | Fixing apparatus for heat conducting plate | |
| CN1790690A (en) | Heat radiator | |
| CN1681113A (en) | Hot-piping radiator | |
| CN2682473Y (en) | Radiating fin fixing structure combined with computer cabinet | |
| CN2708372Y (en) | Heat sink | |
| CN2657197Y (en) | Radiator assembly | |
| CN2874614Y (en) | CPU radiator fixing structure | |
| CN2694356Y (en) | Heat sink | |
| CN2696125Y (en) | Plate heat sink | |
| CN2636306Y (en) | Heat sink for extended card | |
| CN2667664Y (en) | Radiator | |
| CN2875006Y (en) | Improved heat radiator structure | |
| CN2548395Y (en) | Radiating fin structure improvement | |
| CN2909365Y (en) | Heat sink structure | |
| CN2710320Y (en) | Power supply device without fan | |
| CN2667661Y (en) | Integrated radiating device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C19 | Lapse of patent right due to non-payment of the annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |