CN2643479Y

CN2643479Y - Wafer polishing cramp ring

Info

Publication number: CN2643479Y
Application number: CNU032053789U
Authority: CN
Inventors: 彭朋益
Original assignee: CaliTech Co Ltd
Current assignee: CaliTech Co Ltd
Priority date: 2003-08-22
Filing date: 2003-08-22
Publication date: 2004-09-22
Anticipated expiration: 2013-08-22

Abstract

A wafer polishing retaining ring that is used to make the semiconductor comprises a polishing ring and a base ring that is folded and fixed to the polishing ring. The utility model is characterized in that the polishing ring comprises a plurality of polishing pills that are arranged and assembled in a ring shape. A groove is positioned between the adjacent polishing pills in order to make the polishing solution exhaust more rapidly. The rove can incline clockwise from interior to exterior in the direction that the head of polishing and the polishing pad rotate in order to comply with the flow direction of the polishing solution. A plurality of screw holes can be positioned on the upper surface of the base ring thus being fixed to one head of polishing. A punch hole can be arranged in the radial direction of the base ring to drain or exhaust. The wafer polishing retaining ring of the utility model can save the material, reduce the cost as well as make the partial replacement more convenient.

Description

The polishing wafer clasp

[technical field]

The utility model is about a kind of polishing wafer clasp (retaining ring), particularly about a kind of knockdown polishing wafer clasp.

[background technology]

In the present semiconductor fabrication process, burnt phenomenon takes place to lose, indispensable step when the planarization program has become the wafer manufacturing for avoiding the gold-tinted fabrication schedule when focusing.In the epoch of deep-sub-micrometer even nanometer, chemico-mechanical polishing (Chemical Mechanical Polishing, CMP) technology replaces traditional eat-backing (etching back) or spin-on glasses (Spin-On Glass gradually, SOG) coating, and become the main flow that semiconductor planarization is made.

Chemical mechanical polishing operation platform now is to utilize a rubbing head (polishinghead) to seize a wafer on both sides by the arms to polish mostly, each rubbing head has a clasp that is surrounded on this wafer periphery, be used to limit this wafer, damage to avoid this wafer when polishing, to skid off this rubbing head.

Clasp adopts polymeric material more, is the pole that a polymer is made is cut out a disk according to its section direction, this disk is processed again.Must cooperate the diameter of wafer to hollow out in the middle of this disk to hold this wafer, its upper surface then bores the system screw, is assembled in rubbing head so that cooperate, afterwards, this clasp is polished at the lower surface that polishing the time will contact polishing pad, undermine this polishing pad when avoiding polishing.

According to the above-mentioned practice, because of this clasp must pick up from whole polymer pole, and must hollow out in the middle of it and abandon, can cause the waste of material undoubtedly, thereby increase the cost expenditure.In addition, just in case this clasp produces local scratch, necessary whole replacing does not meet economic benefit very much.

[utility model content]

The purpose of this utility model is to provide a kind of polishing wafer clasp, can save material and reduce production costs, and conveniently carry out local replacing.

In order to achieve the above object, the utility model provides a kind of polishing wafer clasp, it comprises a buffing ring and and fixedly is stacked at basic ring on this buffing ring, it is characterized in that: described buffing ring comprises a plurality of polished silicon wafer of permutation and combination in the form of a ring, has a groove between adjacent polished silicon wafer, in order to the rapid discharging of polishing fluid.

Described polishing wafer clasp can also have following additional technical feature:

Described groove can be to be clockwise direction from inside to outside, to comply with the flow direction of polishing fluid.

Described a plurality of polished silicon wafer is glue-bondable to be fixed on this basic ring.

A plurality of perforation be can be provided with on the described basic ring, draining or exhaust are used for.

Described perforation can be towards this basic ring radially.

Described a plurality of polished silicon wafer is to be the equal angles annular arrangement.

Also can be provided with a plurality of screws on the described basic ring, to be fixed in a rubbing head.

Described polished silicon wafer both sides can be respectively equipped with one first groove and one second groove that is clockwise inclination from inside to outside.

Described a plurality of polished silicon wafer has two kinds of different hardness or rigidity at least.

Described polished silicon wafer is to be selected from a kind of among polyphenylene sulfide, polyether-ether-ketone and the hemicrystalline thermoplastic polymer.

If this polishing wafer clasp is the environment that is applied to use mobile relatively poor polishing fluid (slurry), or based on the needs of fabrication schedule, can make it form groove via design between this two adjacent polished silicon wafer, in order to the rapid discharging of polishing fluid.According to the direction of rubbing head and polishing pad rotation, this groove or can be clockwise inclination from inside to outside is to comply with the flow direction of polishing fluid.

Because of buffing ring of the present utility model by separately independently polished silicon wafer form, so its combination has diversity, for example hardness or the different polished silicon wafer of rigidity can be spaced combination, need for particular application.In addition, when one, two polishing pad wears of minority only, only need to change an impaired polished silicon wafer and get final product, and do not need integral body to change, so can effectively reduce maintenance cost.

[description of drawings]

The utility model will be illustrated according to accompanying drawing shown below, wherein:

Fig. 1 is the stereogram of polishing wafer clasp of the present utility model;

Fig. 2 (a) is the vertical view of polishing wafer clasp of the present utility model;

Fig. 2 (b) is the upward view of polishing wafer clasp of the present utility model;

Fig. 2 (c) is the profile along 1-1 hatching among Fig. 2 (a);

Fig. 3 is the stereogram of the polished silicon wafer of polishing wafer clasp of the present utility model;

Fig. 4 (a) is the vertical view of the polished silicon wafer of polishing wafer clasp of the present utility model;

Fig. 4 (b) is the front view of the polished silicon wafer of polishing wafer clasp of the present utility model;

Fig. 4 (c) is the profile along 2-2 hatching among Fig. 4 (a).

[embodiment]

Please be simultaneously with reference to Fig. 1 and Fig. 2 (a) to Fig. 2 (c), polishing wafer clasp 10 of the present utility model comprises a basic ring 11 and a buffing ring 16, this basic ring 11 is fixedly to be stacked on this buffing ring 16.This basic ring 11 can be made by stainless steel or aluminium alloy, to increase whole rigidity and toughness.The upper surface of this basic ring 11 is provided with the screw 13 of 18 equal angles annular arrangements, so that utilize screw that this polishing wafer clasp 10 is fixed in a rubbing head (not shown).This basic ring 11 is provided with six equiangularly arranged and symmetrical perforation 14 in its radial direction, is used to get rid of redundant moisture or air.This buffing ring 16 is made up of with the equal angles annular arrangement 18 polished silicon wafer 12, and gummed is attached at the lower surface of this basic ring 11.12 of each two adjacent polished silicon wafer form a groove 15, and it is clockwise direction from inside to outside, are used to get rid of polishing fluid when polishing.In fact, the inclination of this groove 15 might not be clockwise direction, and it is to cooperate the direction of rotation of this rubbing head and polishing pad and decide, to comply with the flow direction of polishing fluid.

Fig. 3 shows the thin portion stereochemical structure of this polished silicon wafer 12, and Fig. 4 (a) and 4 (b) show the vertical view and the front view of this polished silicon wafer 12 respectively, and Fig. 4 (c) then is the profile along 2-2 hatching among Fig. 4 (a).This polished silicon wafer 12 comprises a burnishing surface 121, a faying face 122, and these polished silicon wafer 12 both sides are established one first groove 123, one second groove 124 respectively, and polished silicon wafer 12 sides are also established an inclined-plane 125.This burnishing surface 121 can polish on demand, so that polishing the time contacts polishing pad smoothly.This faying face 122 is positioned at the opposite side of this burnishing surface 121, is used to be incorporated into this basic ring 11.This first groove 123 and second groove 124 are to be clockwise direction from inside to outside.First groove 123 of one polished silicon wafer 12 promptly forms groove 15 in conjunction with second groove 124 of its another adjacent polished silicon wafer 12.

The polished silicon wafer 12 of present embodiment is except the mode that can utilize gummed is incorporated into the lower surface of this basic ring 11, and it can also chimeric mode or fixes with screw.This polished silicon wafer 12 can be selected from polyphenylene sulfide (the Polyphenylene Sulfide of the wear-resisting and corrosion resistance characteristic of tool, PPS), polyether-ether-ketone (Polyether-etherketon, PEEK) or hemicrystalline thermoplastic polymer polymeric materials such as (Semi-crystaline Thermoplastic polyester).

Buffing ring 16 of the present utility model by separately independently polished silicon wafer 12 form, so its combination can have diversity, for example different or diverse polished silicon wafer 12 is spaced combination with hardness or rigidity, and is required for particular application.In addition, when only one, two polished silicon wafer of minority 12 are worn and torn, only need change impaired polished silicon wafer 12 and get final product, and not need integral replacing, so can effectively reduce maintenance cost.In addition, this polished silicon wafer 12 can be selected from less materials and parts and process, and need not pick up from huge polymer pole, and does not hollow out the discarded object that is produced, thus can increase the elasticity of material selection, and can reduce material cost effectively.

Technology contents of the present utility model and technical characterstic disclose as above, yet those skilled in the art still may be based on teaching of the present utility model and announcement and done all replacements and modification.Therefore, protection range of the present utility model should be not limited to the content that embodiment discloses.

Claims

1, a kind of polishing wafer clasp, it comprises a buffing ring and and fixedly is stacked at basic ring on this buffing ring, and it is characterized in that: described buffing ring comprises a plurality of polished silicon wafer of permutation and combination in the form of a ring, has a groove between adjacent polished silicon wafer.

2, polishing wafer clasp as claimed in claim 1 is characterized in that: described groove is to be clockwise direction from inside to outside.

3, polishing wafer clasp as claimed in claim 1 is characterized in that: described a plurality of polished silicon wafer are that gummed is fixed on this basic ring.

4, polishing wafer clasp as claimed in claim 1, it is characterized in that: described basic ring is provided with a plurality of perforation.

5, polishing wafer clasp as claimed in claim 4 is characterized in that: described perforation is towards this basic ring radially.

6, polishing wafer clasp as claimed in claim 1 is characterized in that: described a plurality of polished silicon wafer are to be the equal angles annular arrangement.

7, polishing wafer clasp as claimed in claim 1, it is characterized in that: described basic ring is provided with a plurality of screws.

8, polishing wafer clasp as claimed in claim 1 is characterized in that: described polished silicon wafer both sides are respectively equipped with one first groove and one second groove that is clockwise inclination from inside to outside.

9, polishing wafer clasp as claimed in claim 1 is characterized in that: described a plurality of polished silicon wafer have two kinds of different hardness or rigidity at least.

10, polishing wafer clasp as claimed in claim 1 is characterized in that: described polished silicon wafer is to be selected from a kind of among polyphenylene sulfide, polyether-ether-ketone and the hemicrystalline thermoplastic polymer.