CN2636307Y - High core heat sink for CPU - Google Patents

High core heat sink for CPU Download PDF

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Publication number
CN2636307Y
CN2636307Y CN 03264610 CN03264610U CN2636307Y CN 2636307 Y CN2636307 Y CN 2636307Y CN 03264610 CN03264610 CN 03264610 CN 03264610 U CN03264610 U CN 03264610U CN 2636307 Y CN2636307 Y CN 2636307Y
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CN
China
Prior art keywords
heat
cpu
fan
high core
heat conductor
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Expired - Fee Related
Application number
CN 03264610
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Chinese (zh)
Inventor
朱远东
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Individual
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Individual
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Priority to CN 03264610 priority Critical patent/CN2636307Y/en
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Publication of CN2636307Y publication Critical patent/CN2636307Y/en
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  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

A CPU high-index-core cooler is provided, which is a CUP fan cooler device which can cool from the center of metal cooling plate. The center of the metal cooling plate is a high-index-core heat conductor, a baffle or an inclined-arranged/a side-arranged cooling fan is arranged between the fan and the cooling plate. As a result, the airflow of part convection air is compelled to blow to the high-index-core heat conductor with the highest temperature in the cooling plate; the cooling process starts from the heat conductor in the center and ambient cooling position at the same time, which improves the temperature drop effect of the cooler.

Description

The high core heating radiator of CPU
Affiliated technical field
The utility model relates to a kind of microcomputer fan heat sink, and special CPU is the fan heating radiator.
Background technology
At present, known main flow cpu heat mainly is made up of fan and metal fin, heat radiator is mainly made with aluminium alloy, CPU conducts to radiating fin with the heat of its generation in service by the thicker bottom of heat radiator, force cross-ventilation by fan, take away the heat on the fin, thereby reduce the temperature of CPU, the thermal source of CPU is in the center of metal fin bottom, its corresponding tip position is that radiator fan motor is not the flabellum part that produces air-flow partly, is the relative blind area of radiating airflow.Because the development of CPU technology, its travelling speed is more and more faster, thermal value constantly increases, for improving the general measure of cooling-down effect is the specification of accelerating rotation speed of the fan, strengthening fan diameter and increasing metal fin, and problems such as consequent weight, volume and noise all cause adverse effect to CPU and even microcomputer allomeric function.The part heating radiator has adopted the scheme at the bottom of the heat radiator bottom installs copper additional, and this scheme has just been strengthened the bottom heat-conduction coefficient, mainly is still heat is conducted to the fin heat radiation, and is limited to the raising of integral heat sink efficient.
Summary of the invention
The purpose of this utility model provides a kind of cpu fan heating radiator of new structure, can be from core heat conduction simultaneously, the heat radiation of heat radiator bottom and thermal source, thus the whole cooling-down effect of raising cpu heat.
Install the high core heat conductor of the column type metal with excellent heat conductivity performance above the central part CPU thermal source that the utility model is achieved in that at traditional metal fin additional, fast Absorption and the heat of deriving the center high-temperature portion; With cowling panel between fan and the heat radiator or mode oblique, side dress fan, the adjustment member airflow direction makes it directly act on the high core heat conductor of central part.When fan produced air communication and crosses fin and take away heat, the part air-flow had directly been taken away the temperature of high core heat conductor, dispelled the heat simultaneously from fin and centre, thereby had improved the radiating effect of air-flow.
The utility model can make the CPU of the higher running frequency of heating radiator support of same size, or is reaching the volume that dwindles heating radiator under the condition of same radiating effect.
Description of drawings
Figure one is the high core heat spreader structures of a CPU synoptic diagram
Figure two is the high core heat conductor of the high core heating radiator of CPU synoptic diagram
Figure three is that the high core of CPU is oblique, side dress fan synoptic diagram
Drawing reference numeral explanation 1-----fan 2-----heat radiator 3-----heat conductive rod 4-----rectiblock
Embodiment
The CPU crosswind center heating radiator that the utility model provides is shown in figure one, partly be embedded with in the central heat source of traditional heat radiator and be higher than the bottom, the high core heat conductor of metal with excellent heat conductivity performance, this heat conductor is column or multicolumn shape, the surface has fin or is carved with radiating groove to strengthen radiating effect, having only derives heat could dispel the heat, and this heat conductor is positioned at directly over the thermal source, a large amount of heats that produce in the time of can directly absorbing and derive the CPU operation; By installing cowling panel additional or changing the position of fan and the mode that angle is promptly used side, angle mount fan, it is distinguished and admirable that the part air-flow that forces fan to produce forms the side, directly blows to this heat conductor.Its operational process is such, when CPU is in operation a large amount of heat of generation, because high core heat conductor is located immediately at the thermal source top, constantly absorb and the derivation heat, it is the highest part of temperature in the heat radiator, and the heat that the high more place of air communication excess temperature is taken away is just big more, just because of having increased this heat conductor, just can be from central division and bottom heat conduction simultaneously, crosswind directly blows in addition, make air-flow play from central division the effect of dispelling the heat simultaneously, and the high core heat conductor of band fin or multicolumn shape has further improved heat dissipation, has therefore increased substantially radiating effect than the single traditional heat-dissipating sheet by the heat radiation of bottom heat conduction fin with fin portion.It is one of pacing items of the present utility model that the part radiating airflow directly blows high core heat conductor, because thermal-arrest, the conductive force of high core heat conductor, directly blows as airless cpu temperature is raise.According to the installation situation of fan and cowling panel, high core heat conductor shape can be column or hemispherical, also can make band fin-type or multicolumn build.This heat conductor can adopt the setting-in mode, also can with the machine-shaping of heat radiator one.
Preliminary contrast experiment's effect: on same microcomputer that uses the higher CPU of caloric value, closed case, Under identical test environment and condition, move identical software, use and press the utility model repacking, in heat radiation The radiator of the finned high core heat carrier of sheet center setting-in fine copper is than the same model radiator temperature of not reequiping Low 3-4 degree, the heat conduction of fine copper heat carrier, radiating effect are higher than the fine aluminium heat carrier.

Claims (3)

1, the high core heating radiator of CPU, primary structure is high core heat conductor, metal fin and fan, it is characterized in that, the central heat source portion of metal fin is the high core heat conductor that is higher than the bottom, between fan and the heat radiator cowling panel is housed.
2, the high core heating radiator of CPU according to claim 1, the high core heating radiator of CPU according to claim 1 is characterized in that, fan is oblique, side is loaded on the heat radiator top.
3, the high core heating radiator of CPU according to claim 1 is characterized in that, high core heat conductor is the multicolumn body.
CN 03264610 2002-10-14 2003-06-19 High core heat sink for CPU Expired - Fee Related CN2636307Y (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN 03264610 CN2636307Y (en) 2002-10-14 2003-06-19 High core heat sink for CPU

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
CN02257299.6 2002-10-14
CN02257299 2002-10-14
CN 03264610 CN2636307Y (en) 2002-10-14 2003-06-19 High core heat sink for CPU

Publications (1)

Publication Number Publication Date
CN2636307Y true CN2636307Y (en) 2004-08-25

Family

ID=34314679

Family Applications (1)

Application Number Title Priority Date Filing Date
CN 03264610 Expired - Fee Related CN2636307Y (en) 2002-10-14 2003-06-19 High core heat sink for CPU

Country Status (1)

Country Link
CN (1) CN2636307Y (en)

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C14 Grant of patent or utility model
GR01 Patent grant
C19 Lapse of patent right due to non-payment of the annual fee
CF01 Termination of patent right due to non-payment of annual fee