CN2619363Y - Pre key binder for producing vacuum micro chamber on silicon wafer - Google Patents
Pre key binder for producing vacuum micro chamber on silicon wafer Download PDFInfo
- Publication number
- CN2619363Y CN2619363Y CN 03234160 CN03234160U CN2619363Y CN 2619363 Y CN2619363 Y CN 2619363Y CN 03234160 CN03234160 CN 03234160 CN 03234160 U CN03234160 U CN 03234160U CN 2619363 Y CN2619363 Y CN 2619363Y
- Authority
- CN
- China
- Prior art keywords
- vacuum
- vacuum chamber
- main body
- silicon chip
- silicon wafer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Pressure Sensors (AREA)
- Measuring Fluid Pressure (AREA)
Abstract
The utility model relates to a pre-bonding device which can make vacuum micro chambers on the silicon wafer. The utility model is realized in that a pre-bonding device which can make vacuum micro chambers on the silicon wafer is provided. The pre-bonding device comprises a vacuum chamber main body, a vacuum chamber upper cover, a vacuum valve, a nitrogen valve, a bearing frame, a moveable bar and a silicon wafer apposition table. Therein, the bearing frame and the silicon wafer apposition table are fixed on the base inside the vacuum chamber main body. The moveable bar is arranged on the side wall of the vacuum chamber main body. A seal ring is attached to the joint between the moveable bar and the vacuum chamber main body. The vacuum valve is provided with a vacuum gauge. The utility model has the advantages that the vacuum degree in the micro chamber made on the silicon wafer can meet the design request and is simple and convenient to operate.
Description
Technical field
The utility model relates to a kind of bonding apparatus that gives, and especially relates to a kind of bonding apparatus that gives of making vacuum micro chamber on silicon chip.
Background technology
Some vacuum micro mechanical sensor adopts the manufacturing technology of semiconductor device to add man-hour, needs two silicon wafers to be bonded together, and make the microcavity of certain depth and width on one of them silicon chip, and the microcavity that requires to make reaches certain vacuum degree.The method of existing wafer bonding is to vacuumize processing after silicon chip is posted, thereby can not guarantee the vacuum degree in the microcavity.
Summary of the invention
The purpose of this utility model provides a kind of simple in structure, bonding apparatus that gives that can guarantee making vacuum micro chamber that the vacuum degree in the vacuum micro chamber meets design requirement.
The utility model is achieved in that a kind of bonding apparatus that gives of making vacuum micro chamber on silicon chip, and it includes vacuum chamber main body, vacuum chamber loam cake, vacuum valve, nitrogen valve, holds horse, motion bar and silicon chip contraposition platform; Wherein, hold horse and silicon chip contraposition platform is fixed on the vacuum chamber body interior base, the sidewall of vacuum chamber main body is provided with motion bar, is bonded with sealing ring in the junction of motion bar and vacuum chamber main body; Vacuum valve is provided with vacuum gauge.
At the place of covering of vacuum chamber main body or/and the place of covering of vacuum chamber loam cake is bonded with seal washer; The vacuum chamber loam cake is provided with the transparent observing window.
The utility model has the advantages that: the vacuum degree in the microcavity of making on silicon chip can meet design requirement, and is easy and simple to handle.
Description of drawings
Fig. 1 is an internal structure vertical view of the present utility model;
Fig. 2 is a profile of the present utility model;
Fig. 3 is a schematic diagram of making vacuum micro chamber.
Embodiment
The utility model is described in further detail below in conjunction with accompanying drawing.
Referring to Fig. 1-Fig. 2, a kind of bonding apparatus that gives of on silicon chip, making vacuum micro chamber, it includes vacuum chamber main body 1, vacuum chamber loam cake 2, vacuum valve 3, nitrogen valve 4, holds horse 5, motion bar 6 and silicon chip contraposition platform 8; Wherein, hold horse 5 and silicon chip contraposition platform 8 is fixed on vacuum chamber main body 1 internal base, the sidewall of vacuum chamber main body 1 is provided with motion bar 6, is bonded with sealing ring 7 in the junction of motion bar 6 and vacuum chamber main body 1; Vacuum valve 3 is provided with vacuum gauge 9.
At the place of covering of vacuum chamber main body 1 or/and the place of covering of vacuum chamber loam cake 2 is bonded with seal washer 10; Vacuum chamber loam cake 2 is provided with transparent observing window 11.
Referring to Fig. 3, when making vacuum micro chamber, a slice there is the silicon slice placed of microcavity holding on horse 5 and the contraposition platform 8, motion bar 6 is stretched into about the 2mm of silicon chip top, second silicon chip put down gently, this silicon chip part edge contacts with first silicon chip again, and a part of edge rides on the motion bar, support by motion bar, form a fixed gap between two silicon chips; After being evacuated down to the vacuum degree that needs by vacuum valve 3 again, outwards spur motion bar 6, second silicon chip can be fallen and first silicon chip applying naturally by self gravitation, vacuum is given bonding and is finished like this; At last, by nitrogen valve 4 inflated with nitrogen in vacuum chamber, silicon chip is taken out.
Claims (3)
1, a kind of bonding apparatus that gives of on silicon chip, making vacuum micro chamber, it is characterized in that: it includes vacuum chamber main body (1), vacuum chamber loam cake (2), vacuum valve (3), nitrogen valve (4), holds horse (5), motion bar (6) and silicon chip contraposition platform (8); Wherein, hold horse (5) and silicon chip contraposition platform (8) and be fixed on vacuum chamber main body (1) internal base, the sidewall of vacuum chamber main body (1) is provided with motion bar (6), is bonded with sealing ring (7) in the junction of motion bar (6) and vacuum chamber main body (1); Vacuum valve (3) is provided with vacuum gauge (9).
2, the bonding apparatus that gives of making straight empty microcavity on silicon chip according to claim 1 is characterized in that: at the place of covering of vacuum chamber main body (1) or/and the place of covering of vacuum chamber loam cake (2) is bonded with seal washer (10).
3, the bonding apparatus that gives of making straight empty microcavity on silicon chip according to claim 1, it is characterized in that: vacuum chamber loam cake (2) is provided with transparent observing window (11).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 03234160 CN2619363Y (en) | 2003-04-25 | 2003-04-25 | Pre key binder for producing vacuum micro chamber on silicon wafer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 03234160 CN2619363Y (en) | 2003-04-25 | 2003-04-25 | Pre key binder for producing vacuum micro chamber on silicon wafer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN2619363Y true CN2619363Y (en) | 2004-06-02 |
Family
ID=34249032
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 03234160 Expired - Fee Related CN2619363Y (en) | 2003-04-25 | 2003-04-25 | Pre key binder for producing vacuum micro chamber on silicon wafer |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN2619363Y (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103900700A (en) * | 2014-03-28 | 2014-07-02 | 中国科学院上海技术物理研究所 | Test Dewar flask capable of achieving vacuum detection |
| WO2019001311A1 (en) * | 2017-06-30 | 2019-01-03 | 上海微电子装备（集团）股份有限公司 | Vacuumizing device and vacuumizing method |
-
2003
- 2003-04-25 CN CN 03234160 patent/CN2619363Y/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103900700A (en) * | 2014-03-28 | 2014-07-02 | 中国科学院上海技术物理研究所 | Test Dewar flask capable of achieving vacuum detection |
| WO2019001311A1 (en) * | 2017-06-30 | 2019-01-03 | 上海微电子装备（集团）股份有限公司 | Vacuumizing device and vacuumizing method |
| US11664228B2 (en) | 2017-06-30 | 2023-05-30 | Shanghai Micro Electronics Equipment (Group) Co., Ltd. | Vacuumizing device and vacuumizing method for bonding substrate |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C19 | Lapse of patent right due to non-payment of the annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |