CN2547456Y - Low-smelting-point metal welding ball and electronic component - Google Patents
Low-smelting-point metal welding ball and electronic component Download PDFInfo
- Publication number
- CN2547456Y CN2547456Y CN 01271556 CN01271556U CN2547456Y CN 2547456 Y CN2547456 Y CN 2547456Y CN 01271556 CN01271556 CN 01271556 CN 01271556 U CN01271556 U CN 01271556U CN 2547456 Y CN2547456 Y CN 2547456Y
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- point
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- smelting
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Abstract
The utility model discloses a low-smelting-point metal welding ball and an electronic component, wherein a connection low-smelting-point welding ball comprises low-smelting-point metal welding ball particles, a metallic film layer with relatively high melting point which is coated outside the low-smelting-point welding ball and a low-smelting-poit welding ball welding layer, etc., the outer surface of low-smelting-point welding ball is provided with the metallic film layer of which the melting point is higher than that of the low-smelting-point welding ball; the outer surface of the metallic film layer with relatively high melting point is provided with the low-smelting-point welding ball welding layer of which the melting point is the same as that of the low-smelting-point welding ball. The metallic film layer with relatively high melting point and the low-smelting-point welding ball welding layer can be coated on the outer surface of the low-smelting-point welding ball layer by the electroplating or other coating methods. When the solder reflow connection is made between the electronic parts and a PC plate, the low-smelting-point welding ball particles are only deformed, but do not generate the siphon empty solder and the solder collapsed effects, thereby the utility model is convenient in manufacture and can improve the product quality.
Description
Technical field:
The utility model relates to a kind of low-melting-point metal solder sphere and electronic component, is meant a kind of tin ball and electronic component especially.
Background technology:
Existing electronic component employing tin ball or other low-melting-point metal solder sphere are used as electronic component and connect thing with the PC plate, tin ball or other low-melting-point metal solder sphere are simple tin ball or other low-melting-point metal solder sphere, the reason of the pressure that welding tin ball or other low-melting-point metal solder sphere produce owing to temperature or electronic component gravity in reflow, very easily produce empty weldering of siphon or tin and collapse, cause not conducting or short circuit between electronic component and the PC plate.As depicted in figs. 1 and 2.
Summary of the invention:
As shown in Figure 3, the purpose of this utility model is to provide a kind of low-melting-point metal solder sphere and electronic component, and the empty weldering of low-melting-point metal solder sphere siphon can not take place in the time of can not making welding between electronic component and the PC plate when reflow this low-melting-point metal solder sphere and tin collapses defective.
Another purpose of the present utility model provides a kind of tin ball and electronic component, and the defective that the empty weldering of tin ball siphon and tin collapse can not take place in the time of can not making welding between electronic component and the PC plate when the Huis welds this tin ball.
The low-melting-point metal solder sphere that realizes the utility model purpose by the low melting point particle, cover higher melt thin metal layer, low-melting-point metal welding layer etc. outward and constitute, the skin of low melting point particle is provided with than the higher thin metal layer of low melting point particle fusing point, is provided with metal welding layer identical with low melting point particle fusing point or that be close at the skin of higher melt thin metal layer.Higher metal thin layer and metal welding layer can be adopt to electroplate or arbitrarily other lining mode cover low melting point stratum granulosum skin.Adopt low-melting-point metal solder sphere of the present utility model, because the low-melting-point metal welding layer of outside is identical or approaching with the fusing point of low melting point stratum granulosum, and the fusing point of the metal level of higher melt is to be higher than low melting point stratum granulosum and low-melting-point metal welding layer, when reflow, the fusing distortion takes place in low melting point stratum granulosum and low-melting-point metal welding layer, and the higher melt metal level is can not melt, only can be out of shape, can not make the low melting point particle take place to destroy and generation tin collapses phenomenon because of suffered pressure.Equally, because the fusing point of higher metal thin layer is higher than low melting point particle welding layer, the fusing point that is lower than the higher melt metal during reflow as long as the temperature of reflow is higher than the fusing point of low-melting-point metal welding layer just can make the low-melting-point metal ball the empty weldering of siphon neither can occur, tin also do not occur and collapses phenomenon.
As improvement, can be provided with the thin layer of multilayer at low melting point particle skin.
As improvement of the present utility model, described low melting point particle can be low-melting metallic particles.
As further improvement of the utility model, described low-melting-point metal particle is the tin ball.Described low-melting-point metal welding layer is a tin bead layer.
The weld metal ball of electronic component of the present utility model adopt the low-melting-point metal solder sphere by the low melting point particle, cover higher melt thin metal layer, low-melting-point metal welding layer etc. outward and constitute, the skin of low melting point particle is provided with than the higher thin metal layer of low melting point particle fusing point, is provided with metal welding layer identical with low melting point particle fusing point or that be close at the skin of higher melt thin metal layer.Higher metal thin layer and metal welding layer can be adopt to electroplate or arbitrarily other lining mode cover low melting point stratum granulosum skin.Adopt electronic component of the present utility model,, carrying out electronic component and PC plate when carrying out reflow and being connected, be difficult for producing that siphon is empty welds and tin collapses phenomenon, be convenient to production, improve the quality of products because the temperature of reflow is convenient to determine.
As improvement of the present utility model, the low melting point particle of the weld metal ball of described electronic component can be low-melting metallic particles.
As further improvement of the utility model, the low-melting-point metal particle of the weld metal ball of described electronic component is the tin ball.Described low-melting-point metal welding layer is a tin bead layer.
Adopt weld metal ball of the present utility model and electronic component, when reflow, be convenient to control the temperature of reflow stove when producing, empty weldering of low-melting-point metal solder sphere siphon and tin can not take place when having guaranteed the welding between electronic component and the PC plate collapse defective, be convenient to provide product quality.
The empty weldering of siphon phenomenon schematic diagram appears in description of drawings: Fig. 1 after the reflow.Fig. 2 tin occurs to collapse the phenomenon schematic diagram after the reflow.Fig. 3 is a perfect condition schematic diagram after the reflow.Fig. 4 is the utility model tin ball structure schematic diagram.Fig. 5 is electronic component tin ball of the present utility model normal temperature view before reflow.Fig. 6 is electronic component tin ball of the present utility model view after reflow.
Specific embodiment:
As shown in Figure 4, welding tin ball by tin ball particle 1, cover higher melt thin metal layer 2, tin ball welding layer 3 etc. outward and constitute, the skin of tin ball 1 is provided with the thin metal layer 2 more higher than tin ball 1 fusing point, is provided with the tin ball welding layer 3 identical with tin ball 1 fusing point at the skin of higher melt thin metal layer 2.Higher metal thin layer 2 and tin ball welding layer 3 can be adopt to electroplate or arbitrarily other lining mode cover 1 layer of skin of tin ball.Because the tin ball welding layer 3 of outside is identical with the fusing point of tin ball 1, and the fusing point of the thin metal layer 2 of higher melt is to be higher than tin ball 1 and tin ball welding layer 3, when reflow, the fusing distortion takes place with tin ball welding layer 3 in tin ball 1, and higher melt thin metal layer 2 is can not melt, only can be out of shape, can not make tin ball 1 take place to destroy and generation tin collapses phenomenon because of suffered pressure.Equally, because the fusing point of higher metal thin layer 2 is higher than tin ball 1 welding layer, the fusing point that is lower than the higher melt metal during reflow as long as the temperature of reflow is higher than the fusing point of tin ball welding layer 3 just can make welding tin ball the empty weldering of siphon neither can occur, tin also do not occur and collapses phenomenon.
As shown in Figure 5 and Figure 6, the weld metal ball of electronic component 4 of the present utility model adopts the low-melting-point metal solder sphere to be made of tin ball 1, higher melt thin metal layer 2, low melting point tin ball welding layer 3 etc., because the temperature of reflow is convenient to determine, carrying out electronic component 4 and PC plate 5 when carrying out reflow and being connected, the tin ball particle only can deform, be difficult for producing empty weldering of siphon and tin and collapse phenomenon, be convenient to produce, improve the quality of products.
Claims (9)
1, a kind of low-melting-point metal solder sphere is characterized in that covering higher melt thin metal layer, low-melting-point metal welding layer etc. by the low melting point particle, outward and constitutes, the skin of low melting point particle is provided with than the higher thin metal layer of low melting point particle fusing point, is provided with metal welding layer identical with low melting point particle fusing point or that be close at the skin of higher melt thin metal layer.
2, a kind of low-melting-point metal solder sphere as claimed in claim 1 is characterized in that can being provided with at low melting point particle skin the thin metal layer of multilayer.
3, a kind of low-melting-point metal solder sphere as claimed in claim 1 is characterized in that described low melting point particle can be low-melting metallic particles.
4, a kind of low-melting-point metal solder sphere as claimed in claim 3 is characterized in that described low-melting-point metal particle is the tin ball.
5, a kind of low-melting-point metal solder sphere as claimed in claim 3 is characterized in that described low-melting-point metal welding layer is a tin bead layer.
6, a kind of electronic component, the weld metal ball that it is characterized in that described electronic component is a kind of low-melting-point metal solder sphere, by the low melting point particle, cover higher melt thin metal layer, low-melting-point metal welding layer etc. outward and constitute, the skin of low melting point particle is provided with than the higher thin metal layer of low melting point particle fusing point, is provided with metal welding layer identical with low melting point particle fusing point or that be close at the skin of higher melt thin metal layer.
7, electronic component as claimed in claim 6, the low melting point particle that it is characterized in that described weld metal ball can be low-melting metallic particles.
8, electronic component as claimed in claim 7, the low-melting-point metal particle that it is characterized in that the weld metal ball of described electronic component is the tin ball.
9, electronic component as claimed in claim 7 is characterized in that described described low-melting-point metal welding layer is a tin bead layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 01271556 CN2547456Y (en) | 2001-12-31 | 2001-12-31 | Low-smelting-point metal welding ball and electronic component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 01271556 CN2547456Y (en) | 2001-12-31 | 2001-12-31 | Low-smelting-point metal welding ball and electronic component |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN2547456Y true CN2547456Y (en) | 2003-04-30 |
Family
ID=33676973
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 01271556 Expired - Fee Related CN2547456Y (en) | 2001-12-31 | 2001-12-31 | Low-smelting-point metal welding ball and electronic component |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN2547456Y (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101323056B (en) * | 2007-06-13 | 2012-11-28 | 富士康(昆山)电脑接插件有限公司 | Solder ball and electric connector using the solder ball |
| CN103619529A (en) * | 2011-09-02 | 2014-03-05 | 三菱综合材料株式会社 | Solder powder, and solder paste using solder powder |
-
2001
- 2001-12-31 CN CN 01271556 patent/CN2547456Y/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101323056B (en) * | 2007-06-13 | 2012-11-28 | 富士康(昆山)电脑接插件有限公司 | Solder ball and electric connector using the solder ball |
| CN103619529A (en) * | 2011-09-02 | 2014-03-05 | 三菱综合材料株式会社 | Solder powder, and solder paste using solder powder |
| US8882934B2 (en) | 2011-09-02 | 2014-11-11 | Mitsubishi Materials Corporation | Solder powder, and solder paste using solder powder |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C19 | Lapse of patent right due to non-payment of the annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |