CN2472443Y - Semiconductor heater - Google Patents
Semiconductor heater Download PDFInfo
- Publication number
- CN2472443Y CN2472443Y CN 01209364 CN01209364U CN2472443Y CN 2472443 Y CN2472443 Y CN 2472443Y CN 01209364 CN01209364 CN 01209364 CN 01209364 U CN01209364 U CN 01209364U CN 2472443 Y CN2472443 Y CN 2472443Y
- Authority
- CN
- China
- Prior art keywords
- radiator
- semiconductor
- metal
- heat sink
- heating element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 26
- 238000010438 heat treatment Methods 0.000 claims abstract description 39
- 239000002184 metal Substances 0.000 claims abstract description 32
- 238000004080 punching Methods 0.000 claims description 14
- 239000011810 insulating material Substances 0.000 claims description 5
- 238000007789 sealing Methods 0.000 claims description 4
- 229910000679 solder Inorganic materials 0.000 claims description 3
- 230000000694 effects Effects 0.000 abstract description 3
- 239000012774 insulation material Substances 0.000 abstract description 2
- 239000012530 fluid Substances 0.000 abstract 2
- 230000007613 environmental effect Effects 0.000 abstract 1
- 239000007788 liquid Substances 0.000 description 11
- 238000006243 chemical reaction Methods 0.000 description 5
- 239000000463 material Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000000567 combustion gas Substances 0.000 description 1
- 238000009841 combustion method Methods 0.000 description 1
- 239000000306 component Substances 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 239000007772 electrode material Substances 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000004134 energy conservation Methods 0.000 description 1
- 239000002360 explosive Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 230000000505 pernicious effect Effects 0.000 description 1
- 239000000741 silica gel Substances 0.000 description 1
- 229910002027 silica gel Inorganic materials 0.000 description 1
- 239000002912 waste gas Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
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- Resistance Heating (AREA)
Abstract
The utility model relates to a semiconductor heater used for heating the fluid, which comprises a metal radiator 1, a semiconductor heat generating component 2 arranged in the cavity 11 of the metal radiator, a metal electrode 3 arranged at both sides of the heating component, a power cord 5 connected with the electrode; the metal electrode is separated from the radiator by insulation material. The utility model is characterized in that the heater can be used directly in the fluid. The utility model has the advantages of safe and credible usage, increased heating area, improved heat exchange rate; therefore, the effects of energy saving and environmental protection are achieved.
Description
The utility model relates to a kind of heating element that is used for heating liquid, particularly relates to a kind of semiconductor heating element that can directly be placed in the liquid.
At present, heater mainly contains following two big classes: a class is that combustion gas is Instant heating type, and this class heater thermal conversion rate is lower, can produce pernicious gas in the use, contaminated environment, and normal owing to gas leakage causes inflammable, explosive and human casualty accident; Another kind of is Electrothermic wire and heating tubular type, such heating element is owing to use traditional exothermic material, and in use, heating temp is very high, area of dissipation is little, and the temperature difference between the liquid is big, and radiator is prone to corrosion, produces incrustation scale, easily electric leakage, coefficient of safety is not high, and useful life is not long, and thermal conversion rate is low.Since the semiconductor exothermic material comes out, multiple semiconductor liquid heater has also appearred, and mostly be liquid greatly and pass through in the heat dump the inside, reach the purpose of heating, the semiconductor heating element that is placed directly in the liquid does not then occur as yet.
The purpose of this utility model is to provide a kind of and can directly be placed in the liquid and safe and reliable semiconductor heating element, so that increase the heating surface area of liquid, improves heat exchanger effectiveness, and reaches energy-conservation and environment protecting.
For achieving the above object, the utility model provides a kind of semiconductor heating element, this heating element has a metal heat sink 1, in the cavity 11 of metal heat sink, semiconductor heat generating component 2 is housed, metal electrode 3 is equipped with in the both sides of this heat generating component, be connected with power line 5 on the electrode, separate by insulating material 4 between metal electrode and the radiator.
Described semiconductor heat generating component 2 is made of multi-disc semiconductor heating sheet 21, and they are arranged at intervals in the cavity of metal heat sink 1 vertically.
Described metal heat sink 1 in a tubular form, the outer heat-dissipating fin 15 that is provided with of its pipe, the one end passes through solder up, other end ferrule, radiator cavity inner wall and its interior member of adorning fit tightly by punching press, and punching press retraction slot 12 and outer punching press retraction slot 13 in being respectively equipped with on its inside and outside wall, the radiator two ends and outside an opening 14 is respectively arranged on the close flank sheet of punching press retraction slot.
The sealed end of metal heat sink 1 and flange 6 are affixed, and also are provided with temperature sensor mounting pipe 7 and sealing ring 8 on the flange.
Good effect of the present utility model is, owing to adopted current state-of-the-art exothermic material---and semiconductor heating sheet, and metal heat sink is close on the heating sheet, thereby make thermal conversion efficiency significantly improve; Because the outside of metal heat sink is provided with the heat dissipation metal fin, not only increased the endotherm area of liquid, reduced the temperature difference between liquid and the radiator, also increased intensity of radiator, reduced the thickness of metal material, the plane that makes radiator and heater be close to is more flat, so thermal conversion rate is higher, reaches purpose of energy saving.During the work of this heating element, not so the flames of anger burns, and does not have waste gas to discharge, and pollution-free, noiseless is the environment-friendly type heating element.This heating element has adopted novel heater element, its metal electrode and radiator separate fully, the power supply terminal exit passes through encapsulation process, keep dry, temperature is not high during again because of the work of its exothermic material, and radiating surface is big again, so, its security performance is very high, long service life, and thermal conversion rate can remain unchanged.This heating element manufacture craft is simple, and cost is low, and the practicality height can directly replace traditional electrical heating wire or heat-generating pipe, and can dry combustion method.
The utility model is described in further detail below in conjunction with drawings and Examples.
Fig. 1 is an overall structure longitudinal profile schematic diagram of the present utility model.
Fig. 2 is a cross-sectional structure schematic diagram of the present utility model.
Fig. 3 is the not preceding cross sectional representation of punching press of metal heat sink.
At first consult Fig. 1, Fig. 2, semiconductor heating element of the present utility model has a metal heat sink 1, this metal heat sink in a tubular form, its pipe internal cavity cross section can be square, rectangle, in this example, the radiator internal cavity is a rectangle.Radiator tube outer axially-aligned has circular heat-dissipating fin 15, to increase the area of dissipation of heating element.Use because of this heating element directly inserts in the liquid, so radiator must good seal.It inserts, and an end passes through solder up in the water.In the cavity 11 of metal heat sink, semiconductor heat generating component 2 is housed, this heat generating component 2 constitutes (referring to Fig. 1) by multi-disc semiconductor heating sheet 21, at interval suitably apart from being arranged in the cavity of metal heat sink 1, semiconductor heating sheet adopts commercially available PTC ceramic heating plate vertically for they.Metal electrode 3 is equipped with in the both sides of heat generating component, and electrode one end margin is fixed with the binding post with used for electric power connection, is connected with high temperature resistant power line 5 on it, and draws from radiator.Heating sheet and metal electrode can be adhesively fixed.For metal electrode and radiator are insulated fully, separate by insulating material 4 between the two, insulating material can adopt the good high-temperature insulation material of heat conductivility, as silica gel sheet, mica sheet etc.For semiconductor heat generating component and radiator are combined closely, be beneficial to heat conduction, after heat generating component, electrode and insulating material are packed radiator into, with stamping machine with the radiator cavity inner wall and in it member of adorning fit tightly by punching press.Punching press retraction slot 12 in being provided with on radiator inwall, punching press retraction slot 13, two retraction slots can inwardly shrink in punching course outside being provided with on outer wall, to reduce internal stress, avoid damaging radiator.The radiator two ends with outside an opening 14 is respectively arranged on the fin of the close side of punching press retraction slot, also play same effect.Power line exit at radiator is used ferrule.This end is also fixing with flange 6 welding, and flange then is used for being connected with heating container, also is provided with temperature sensor mounting pipe 7 on the flange, transducer can be fixed in the metal tube, and metal tube is then fixing with the flange welding.The sealing ring 8 with heating container sealing usefulness also is equipped with at flange proximal edge place.
Claims (4)
1, a kind of semiconductor heating element, it is characterized in that, it has a metal heat sink (1), in the cavity (11) of metal heat sink, semiconductor heat generating component (2) is housed, metal electrode (3) is equipped with in the both sides of this heat generating component, be connected with power line (5) on the electrode, separate by insulating material (4) between metal electrode and the radiator.
2, semiconductor heating element according to claim 1 is characterized in that, described semiconductor heat generating component (2) is made of multi-disc semiconductor heating sheet (21), and they are arranged at intervals in the cavity of metal heat sink (1) vertically.
3, semiconductor heating element according to claim 1, it is characterized in that, described metal heat sink (1) in a tubular form, the outer heat-dissipating fin (15) that is provided with of its pipe, the one end passes through solder up, other end ferrule, and radiator cavity inner wall and its interior member of adorning fit tightly by punching press, and punching press retraction slot (12) and outer punching press retraction slot (13) in being respectively equipped with on its inside and outside wall, the radiator two ends and outside an opening (14) is respectively arranged on the close flank sheet of punching press retraction slot.
4, semiconductor heating element according to claim 1 is characterized in that, the sealed end of metal heat sink (1) and flange (6) are affixed, and also is provided with temperature sensor mounting pipe (7) and sealing ring (8) on the flange.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 01209364 CN2472443Y (en) | 2001-03-16 | 2001-03-16 | Semiconductor heater |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 01209364 CN2472443Y (en) | 2001-03-16 | 2001-03-16 | Semiconductor heater |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN2472443Y true CN2472443Y (en) | 2002-01-16 |
Family
ID=33629196
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 01209364 Expired - Fee Related CN2472443Y (en) | 2001-03-16 | 2001-03-16 | Semiconductor heater |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN2472443Y (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102387615A (en) * | 2010-09-06 | 2012-03-21 | 黑龙江捷迅自动化设备有限公司 | Semiconductor high-power cabin heating device |
| CN104748387A (en) * | 2015-03-23 | 2015-07-01 | 马根昌 | Fast hot water heater |
-
2001
- 2001-03-16 CN CN 01209364 patent/CN2472443Y/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102387615A (en) * | 2010-09-06 | 2012-03-21 | 黑龙江捷迅自动化设备有限公司 | Semiconductor high-power cabin heating device |
| CN104748387A (en) * | 2015-03-23 | 2015-07-01 | 马根昌 | Fast hot water heater |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| ASS | Succession or assignment of patent right |
Owner name: SHENZHEN CITY PUWEI SCIENCE CO., LTD. Free format text: FORMER OWNER: ZHANG JIANWEN Effective date: 20041210 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20041210 Address after: 518052 second incubator center, Nanshan District science and technology innovation service center, Shenzhen, Guangdong 1302, China Patentee after: Shenzhen Universal Technology Co., Ltd. Address before: 518053 Guangdong city of Shenzhen province Nanshan District Shahe overseas Chinese Town Road exchange Nga Court 3 building 202 room Patentee before: Zhang Jianwen |
|
| C19 | Lapse of patent right due to non-payment of the annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |