CN2472342Y

CN2472342Y - Tray for carrying spherical grating arrays

Info

Publication number: CN2472342Y
Application number: CN 01208965
Authority: CN
Inventors: 吴忠儒; 林蔚峰; 蔡进文
Original assignee: Silicon Integrated Systems Corp
Current assignee: Silicon Integrated Systems Corp
Priority date: 2001-04-02
Filing date: 2001-04-02
Publication date: 2002-01-16
Anticipated expiration: 2011-04-02

Abstract

The utility model relates to a laying plate used in ball grid array production. A plurality of laying grids which has a crossing protective stripe under the grid and is arrayed relatively are arranged on a basic plate; wherein, two hollow laying grids are arranged on the top of the basic plate. When the ball grid array IC is arranged in the grid, the fingers of the porter can avoid touching the IC in the grid by the protective stripe outside the laying grid so that the physical character and accuracy of the IC can be kept. Besides, when the basic plate is stacked, the IC type of the next layer can be identified clearly through the hollow laying grid so that the required type of basic plate can be taken out conveniently.

Description

Be used in the storing dish of spherical palisade array product

The utility model relates to a kind of storing dish that is used in spherical palisade array product, particularly relates to a kind ofly when piling up basal disc, can know the IC model that picks out down on one deck basal disc, conveniently fetches the basal disc of the required IC model of tool.

In recent years since the science and technology flourish, especially computer product more makes it of a great variety along with universal demand, function is kept on improving especially; The CPU of general computer is inserted on the runners of the certain specification that is mated, but, along with computer information industry is day by day prosperous, the packing of central processing unit (CPU) slowly is transformed into spherical grid array (being commonly called as BGA, i.e. Ball Grid Array) mode from early stage PGA (Pin Grid Array) mode now.Yet, the general CPU that packs in the BGA mode, for installing by surface mount technology, for example: the runners on the circuit board, except meeting is produced because of different label, and make outside the specification difference can't generally be suitable for, whether keep original physical characteristics and accuracy for the contact feet of CPU, then be as and the be connected key of relation of substrate of being installed or runners.

In other words, on up-to-date circuit design, provide a kind of new integrated circuit (IC) encapsulation technology, (be commonly called as BGA IC to form a kind of spherical palisade array integrated circuit; Ball Grid Array IC), it mainly is by being installed in the array contact feet on the bottom surface, as electrical pickoff, be welded on the printed circuit board (PCB) so as to increase, or the socket that is complementary that on printed circuit board (PCB), is welded in advance, make the contact terminal on contact feet and the socket bottom surface, keep good electrical contact, and become the center power heart of a computer; Therefore integrated circuit is a kind of electronic product that requires superprecision, and whether it has the physical characteristic and the accurate quality of excellent electric contact, is epochmaking problem.

Yet on the practice, be not installed on printed circuit board (PCB) and go forward for integrated circuit (BGA IC) is soldered, normally temporarily be placed on the storing dish earlier, the design of storing dish in the past, it is the holding hole that on disk body, separates out many hollow outs, but because of the operating personnel in when carrying, regular meeting has hand to touch the IC that is positioned at peripheral holding hole because of carelessness, passes the contact feet outside the hole bottom it; When if this problem takes place, because can't be at once in a plurality of holding holes of storing dish, all IC surfaces find out which becomes defective products, must up to whole dish IC be carried to workbench and be removed install and use after, cause ESD (for example: physical change, the accurate quality of influence etc.) problem, and then significantly reduce the actual using character of the CPU that packs in the BGA mode.Like this, certainly will dismantle again and defective products is separated the change non-defective unit, increase multiple tracks manufacturing process and cost on the finished product manufacturing operation.

Make the relevant BGA mode of computer at present and pack the manufacturer of CPU for improving above-mentioned shortcoming; as shown in Figure 1; can adopt that a kind of all are put and have additional protection portion 11 in lattice 10 and make and put lattice and be the concave shape design haply on storing dish 1; to borrow protection portion 11 that the contact feet 20 of BGA IC2 bottom is protected in it; though can improve and above-mentionedly be handled upside down easily in early days that the workman touches and produce the ESD problem; but produce again other one can't identification sublevel storing dish on IC product specification (being Top Side Mark) problem, its reason mainly is:

Integrated circuit (IC) be not used be installed on the printed circuit board before, normally same rule

The lattice model is placed on the storing lattice of same existing storing dish, is protected and conveniently gets

Take,

2. because each IC volume is minimum, so put every being provided with up to a hundred at least on each storing dish

The hole,

3. light and handy and meticulous owing to IC weight, thus should be comparatively careful in carrying, and the operating personnel is logical

Often be that whole hand, finger all extend the place, periphery of grabbing by to the storing dish, and remove for convenience

Fortune and save the space, usually in right amount storing dish stacked in multi-layers together,

4. owing to all IC on each not necessarily whole storing dish of the needed IC quantity of installation exercise

All taken, that is to say, only needed several IC or dozens of IC sometimes; As

This one, the storing dish after piling up when the superiors' storing dish does not use up as yet, is basic nothing

Method recognizes product specification, the model that BGA IC is gone up in next stratification sale at reduced prices, causes not easy thing

The specification and the model of time dish product of difference earlier, the BGA of be unfavorable for taking required model and quantity

IC。

The purpose of this utility model is to provide a kind of storing dish that is used in spherical palisade array product, after the storing dish piles up, has the specification and the model that can pick out BGA IC on time storing dish.

A time purpose of the present utility model is to provide a kind of to be had finger in the time of can preventing to carry personnel operation simultaneously and touches BGA IC on the storing dish, avoids causing the storing dish of the spherical palisade array product of being used in of ESD problem.

Another purpose of the present utility model is to provide a kind of storing dish that is used in spherical palisade array product, has when piling up the storing dish and can save the characteristics that take up space.

A purpose more of the present utility model is to provide a kind of storing dish that is used in spherical palisade array product, changes structure not significantly, can save the cost of storing dish cost, and improves utilization elasticity.

For achieving the above object, the technical solution of the utility model is as follows:

A kind of storing dish that is used in spherical palisade array product, it is provided with a basal disc, and dish is provided with a plurality of storing lattice of arranging in length and breadth and is positioned at the storing space of enclosing the place that these put lattice; These put the lattice top is the space; close on lower position and convex with cross-shaped ceiling; these are put the space and then design for Openworks shape; after spherical grid array IC is installed on the storing lattice and puts in the space; when the ceiling of putting lattice by the periphery can avoid the staff to carry basal disc; finger touches puts spherical grid array IC contact feet in the lattice, and after piling up these basal discs, can know the IC specifications and models that pick out down on one deck basal disc by this saturating empty storing space.

Above-mentioned storing space be preferably located on this basal disc put lattice in enclose the center.

According to storing dish of the present utility model, can either avoid when carrying, touching the IC contact feet, again can not need move the model that upper strata IC just sees the IC of lower floor.

Below in conjunction with drawings and Examples the storing dish that is used in spherical palisade array product of the present utility model is elaborated, in the accompanying drawing:

Fig. 1 is used in spherical palisade array product storing dish schematic diagram for having now;

Fig. 2 is for looking schematic diagram on the storing dish preferred embodiment of the utility model is used in spherical palisade array product;

Fig. 3 has the BGAIC front elevational schematic for Fig. 2 of the utility model preferred embodiment; And

The storing dish of Fig. 4 spherical palisade array product for the utility model is used in is piling up back preferred embodiment schematic diagram.

For convenience of description, following embodiment, components identical is represented with identical label.

At first, see also Fig. 1, shown in Figure 2, the disclosed storing dish of the utility model is to use in temporary Place shape grid array product.The utility model uses to embodiment simultaneously and illustrates to carry spherical grid array integrated circuit 2 (hereinafter to be referred as BGA IC).Wherein, this BGA IC2 is to be example so that explanation with existing spherical palisade array integrated circuit, and its bottom surface convexes with a plurality of array contact feets 20, and each contact feet 20 is one to protrude cambered surface.Wherein, storing dish 3 is provided with a basal disc 30, and convex being provided with of its outer peripheral edges set up wall 301, covers the accommodation space 90 that forms a upper limb indent and enclose, as shown in Figure 3.Be concaved with and set recess 302 setting up wall 301 with respect to the outside of trying to get to the heart of a matter, borrow and set recess 302 and be embedded at this and set up wall 301, coil 3 stacked on top together to make things convenient for storing, as shown in Figure 4.In addition, this basal disc 30 by card be equipped with to trying to get to the heart of a matter a plurality of be in length and breadth the storing lattice of arranging 31 and be positioned at these put the storing space 32 that lattice 31 enclose the place, in the present embodiment, what these accompanying drawings were represented is for illustrative purposes, because should storing dish 3 be not limit the area size and put lattice 31 and the structural designs such as quantity of putting space 32.These put lattice 31 is to go up two big, little down different bores to design, and is formed with a peristoma 311 and a hypostome 312 on one, and has the antelabium 313 of a drop between two bores.And peristoma 311 is the space on this, then convexes with in its hypostome 312 cross-shapedly to be connected in the ceiling 33 of this hypostome 312.Above-mentioned storing space 32 is main to be hollow out (saturating empty) shaped design, and be positioned at the center of enclosing that these put lattice 31, its aperture shape is similar to this storing lattice 31, for last two big, little down different bores design, and be formed with a peristoma 321 and a storing space hypostome 322 on the storing space, and has the storing space antelabium 323 of a drop between two bores.

Above-mentioned basal disc 30, corresponding these are put lattice 31 and are put peristoma 311 on each of space 32 on its card, 321 outsides convex with the protruding wall 34 of placing restrictions on that omits than high slightly of card, each is placed restrictions on protruding wall 34 and also is arranged with a concane gap 341 at the place, centre, when spherical grid array IC2 temporarily be carried on this basal disc 3 these put lattice 31 and put 32 places, space and be subjected to around the protruding wall 34 of placing restrictions on its limitation is positioned each and puts lattice or put in the space, prevent these spherical grid array IC2 displacements when rocking in 3 generations of carrying storing dish, avoid the problem of damage, and pick up spherical grid array IC2 with finger smoothly from concane gap 341 by these concane gaps 341 persons of being easy to use.

Above-mentioned storing space 32 illustrates two as an illustration in the present embodiment, and is to be positioned to put the center that lattice 31 enclose on this basal disc 30, makes it really away from these basal disc 30 peripheries.

As shown in Figure 3; when spherical grid array IC2 temporarily is carried on this basal disc 3 after these put lattice 31 and put in the space 32; BGA IC2 is positioned at the last peristoma 311 in these storing lattice and storing space and is placed on the antelabium 313; make its bottom surface contact feet 20 be positioned at hypostome 312 just and above ceiling 33; at this moment; even if the operating personnel is when carrying storing dish; whole hand; finger all extends basal disc 30 peripheral disposal of grabbing by to storing dish 3 puts lattice 31 places (convenient firmly carrying); put ceiling 33 screening effects of lattice 31 lower edges by the periphery and can avoid the staff to carry this basal disc 30 time, finger touches and is positioned at these and puts contact feet 20 bottom lattice 31 BGAIC2.

And for example shown in Figure 4, be embedded at this and set up wall 301 by setting recess 302, can make things convenient for storing dish stacked on top together, when piling up these storing dishes 3,3 ', ... after, during BGA IC2 on using the superiors' storing dish 3, as desire to understand in advance next dish storing dish 3 ' go up specifications and models of BGA IC2 ', the operating personnel plans that the manufacturing step of next model carries out on the production line to make things convenient for, then can take after BGA IC2 leave in the storing space 32 of the superiors' storing dish 3, can by these saturating empty storing spaces 32 clear pick out next stratification sale at reduced prices 3 ' on the specifications and models of BGAIC2 ' end face.

Claims

1. storing dish that is used in spherical palisade array product; comprise a basal disc; this basal disc is provided with a plurality of storing lattice and is positioned at the storing space that these storing lattice respectively enclose; it is characterized in that: respectively the last peristoma of these storing lattice is the space; hypostome convexes with ceiling; respectively should put the space then is hollow hole; after spherical grid array IC is carried on respectively these storing lattice and puts the space; protected of the contact feet in this IC bottom is protected in respectively in these lattice; again after piling up this storing dish, borrow saturating empty storing space can pick out down IC specifications and models on one deck basal disc.

2. the storing dish that is used in spherical palisade array product as claimed in claim 1; it is characterized in that: these storing lattice are to design for last two big, little down different bores; wherein; the antelabium that has a drop between the bore of described upward peristoma and described hypostome; should go up peristoma again is the space, and this ceiling then is positioned at hypostome.

3. the storing dish that is used in spherical palisade array product as claimed in claim 1 or 2 is characterized in that: this storing space is positioned at the center that these storing lattice enclose on this basal disc.

4. the storing dish that is used in spherical palisade array product as claimed in claim 1 or 2, it is characterized in that: corresponding each storing lattice and storing outside, space convex with the protruding wall of placing restrictions on that omits than high slightly of card on this basal disc card, each is placed restrictions on the protruding wall and is arranged with a concane gap, can limit to each and be positioned at the spherical grid array IC that puts lattice and put the space, and make things convenient for the user to pick up spherical grid array IC by the concane gap place.

5. the storing dish that is used in spherical palisade array product as claimed in claim 3, it is characterized in that: described storing space has one and puts a peristoma and a storing space hypostome on the space, and be that last two big, little down different bores design, have the storing space antelabium of a drop on the storing space between the bore of peristoma and storing space hypostome.