CN2472266Y - Improved structure of radiator - Google Patents
Improved structure of radiator Download PDFInfo
- Publication number
- CN2472266Y CN2472266Y CN 01204397 CN01204397U CN2472266Y CN 2472266 Y CN2472266 Y CN 2472266Y CN 01204397 CN01204397 CN 01204397 CN 01204397 U CN01204397 U CN 01204397U CN 2472266 Y CN2472266 Y CN 2472266Y
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- heating column
- heat
- heat abstractor
- fan
- improvement structure
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model relates to an improved structure of a heat dissipation device, which comprises a fan and a radiator; wherein, a heat conducting base plate, a heat conducting column and a plurality of radiating fins are arranged on the radiator; the lower surface of the heat conducting base plate contacts with the heat source; the heat conducting column is positioned in the middle of the upper surface of the heat conducting base plate, and arranged below the wheel hub of the fan; the heat radiating fins are arranged on the upper surface of the heat conducting base plate and around the heat conducting column. The heat of the heat source is transmitted to the heat conducting base plate, the heat conducting column and the radiating fins in a conduction manner; the air sucked by the fan cools the heat conducting base plate, the heat conducting column and the radiating fins.
Description
The utility model relates to a kind of heat abstractor, refers to a kind of heat abstractor that is applied to chip cooling especially.
Current chip (Integrated circuit devices) is widely used in the computer system; with CPU (CPU (central processing unit)) is example; can produce a large amount of heat under normal operation, if the overheated shutdown that just is easy to cause system, it is unstable to make operation go up.Take place for fear of overheated situation, these chips need to remove excessive heat with cooling device.Cooling device commonly used is a kind of auxiliary heating radiator cooling device (fan assisted heat sink cooling device) of fan that is called, in this kind cooling device, the common employing of heating radiator (heat sink) such as aluminium etc. has the high heat transfer coefficient material and makes, can comprise several radiating fins (fin) to improve the surface area of heating radiator, heating radiator is seated in the chip top and contacts with chip surface, conducts to heating radiator so as to the heat with chip.The heating radiator top further is provided with one by the driven by power fan, and this fan sucks surrounding air (ambient air) and contacts with radiating fin, is moved in the surrounding air by radiating fin with forced convertion mode accelerated heat, to promote the cooling effect of heating radiator.
In recent years, the power of chip improves a lot of, so produce a large amount of heat, therefore, adopts the cooling device of higher cooling capacity more urgent.Method commonly used comprises more large-area heating radiator of employing or more powerful fan, yet, size is crossed heating radiator or the fan problem that but causes other too, space constraint for example, influence the storing and the running of other assembly, and must have suitable space can make air enter fan between casing and fan, and hot blast is discharged.Therefore, adopting the mode of the bigger fan of larger sized heating radiator or size is not the good method of good solution chip cooling problem.
Figure 1A is the assembly drawing of conventional chip heat abstractor, the material of this heating radiator 12 is the aluminum metal with high thermal conductivity, and it is made of a conductive sole plate 121 and several radiating fins 122, radiating fin 122 is positioned at this conductive sole plate 121 tops, its shape is generally parallel channel form (channel-shaped) or fin shape (fin-shaped), 121 tops that place cpu chip 11 of this conductive sole plate.In order to promote heat transferred, above this heating radiator 12, place a fan 13 usually, fan 13 mainly is made up of motor (not shown), wheel hub 131, blade 132, and is fastened in the radiating fin 122 of this heating radiator 12 with screw 16.
Figure 1B shows the cpu chip heat transferred situation of using in the operation, arrow is represented the direction of heat transferred, because heating radiator 12 bottom surfaces contact with chip, so the chip 11 most heats in the operation are passed to radiating fin 122 (heat transfer direction such as arrow A) in conduction (conduction) mode along conductive sole plate 121, the outside air that fan 13 is attracted then enters in the heating radiator 12, contact with radiating fin 122, and utilize convection current (convection) mode (as arrow B) that the heat that conductive sole plate 121 transmits is brought in the surrounding air.
Fig. 1 C shows the air speed distribution scenario of conventional chip heat abstractor, be broadly divided into I, II, III and IV four districts, found that fan after tested and attracted the air speed of air on radiating fin 122 surfaces distribute, in minimum (I district, fan hub (hub) 131 belows, about 0.05 meter/second of mean speed), II district mean speed is 1.0 meter/second, and the III district is 2.5 meter/second, flabellum 132 below air speeds the highest (IV district, about 4.0 meter/second of mean speed).Result by Fig. 1 C can understand cold air significant convection effects of difficult generation below wheel hub 131 that fan attracts, so the heat that part is transmitted by conductive sole plate 121 is accumulated in the radiating fin 122 of wheel hub below then, so will cause this regional temperature to increase, the conduction of the heat of unfavorable chip 11 is used between long-term and may be caused failure of chip.
Therefore, how not change heating radiator and fan dimension, and effectively removing the heat of radiating fin 122 accumulation below wheel hub,, solving the existing problem of known technology, be fundamental purpose of the present utility model to guarantee electronic package normal operation such as chip.
In order to solve the shortcoming of above-mentioned known technology, the purpose of this utility model is to propose a kind of improvement structure of heat abstractor, in order to remove the part heat from a thermal source.
The improvement structure of heat abstractor provided by the utility model, it comprises:
One heating radiator reaches
One fan; Wherein said
Heating radiator, it has a conductive sole plate, a heating column and several radiating fins, the lower surface of this conductive sole plate contacts with this thermal source, this heating column is positioned at the upper face center of this conductive sole plate, and be positioned at the wheel hub below of this fan, these several radiating fins are positioned on the upper surface of this conductive sole plate, and are positioned at around this heating column.
So as to, the heat of this thermal source is passed to this conductive sole plate, this heating column and this several radiating fins with conduction pattern, and this fan is taken out the air that draws and cooled off this conductive sole plate, this heating column and this several radiating fins.
The improvement structure of described heat abstractor, wherein this thermal source is the heat of the generation of the electronic package in the operation.
The improvement structure of described heat abstractor, wherein this electronic package is a cpu chip.
The improvement structure of described heat abstractor, wherein this heating column to the diameter ratio of the vertical range of this fan hub and this fan hub is 0.1 to 1.0.
The improvement structure of described heat abstractor, wherein this heating column is a right cylinder.
The improvement structure of described heat abstractor, wherein the diameter of this heating column is 0.1 to 1.2 with the diameter ratio of this fan hub.
The improvement structure of described heat abstractor, wherein this heating column is a rectangular parallelepiped.
The improvement structure of described heat abstractor, wherein the diagonal angle length of this heating column is 0.1 to 1.2 with the diameter ratio of this fan hub.
The improvement structure of described heat abstractor, wherein this heating column is a cone.
The improvement structure of described heat abstractor, wherein 0.6 to 1.2 of the diameter ratio of the bottom surface diameter of this heating column and this fan hub, and the upper bottom surface diameter of this heating column is 0.1 to 0.9 of a bottom surface diameter.
The improvement structure of described heat abstractor, wherein this radiating fin be selected from parallel channel form (channel-shaped) and radial one of them.
The improvement structure of described heat abstractor, wherein this heating column is solid.
The improvement structure of described heat abstractor, wherein this heating column is a hollow, the material of the easy heat conduction of inner filling.
Describe preferred embodiment of the present utility model in detail below in conjunction with accompanying drawing, so that more understand the utility model in depth.Wherein:
Figure 1A is the assembly drawing of conventional chip heat abstractor;
Figure 1B is the heat transferred synoptic diagram of conventional chip;
Fig. 1 C is the air speed synoptic diagram of conventional chip heat abstractor;
Fig. 2 is the assembly drawing of the heat abstractor of the utility model first preferred embodiment;
Fig. 3 is the assembly drawing of the heat abstractor of the utility model second preferred embodiment.
Fig. 2 is the assembly drawing of the heat abstractor of the utility model first preferred embodiment, and this heat abstractor mainly is made of a heating radiator 22 and a fan 23.This heating radiator 22 is made for having high thermal conductivity material (for example aluminium), and it comprises a conductive sole plate 221, a heating column 222 and several are the radiating fin 223 of parallel groove shape (channel-shaped).This fan then utilizes screw 26 to be fastened in 223 of radiating fins.The lower surface of this conductive sole plate 221 with one the operation in cpu chip 21 contact, this heating column 222 is positioned at the upper face center of this conductive sole plate 221, and be positioned at wheel hub (hub) 231 belows of this fan 23, these several radiating fins 223 then are positioned on the upper surface of this conductive sole plate 221, and are positioned at around this heating column 222.Emit the cpu chip 21 of high heat in the operation, can contact by lower surface with conductive sole plate 221, with conduction pattern major part heat is passed to this heating column 222 and this several radiating fins 223 along conductive sole plate 221, then this fan 23 air that draws of taking out is taken away the heat of this conductive sole plate 221, this heating column 222 and these several radiating fins 223 to surrounding air in the forced convertion mode.
In the present embodiment, heating column 222 is a right cylinder, the equal diameters of its diameter and this fan 23 wheel hubs 231, and also keep suitable distance between this heating column 222 and this fan hub 231, in order to avoid the heat of chip 21 reaches fan 23, draw the problem that fan life reduces on the contrary, in present embodiment, this heating column 222 to the vertical range of this fan hub 231 is 0.1 times of this fan hub 231.This moment, the heat of heating column 222 of fan hub 231 belows was passed to around the cylinder with conduction pattern, then the heat of this heating column 222 was taken away to surrounding air in the forced convertion mode by this fan 23 air from top to bottom that draws of taking out.
Find after deliberation, the diameter of heating column 222 and the diameter of this fan hub than be 0.1 to 1.2 and heating column to the diameter ratio of the vertical range of this fan hub and this fan hub be 0.1 to 1.0 o'clock, can reach the radiating effect better than known technology.
Certainly, this heating column 222 also can be rectangular parallelepiped or cone except that being right cylinder.If this heating column is a rectangular parallelepiped, then the diagonal angle length of this heating column is 0.1 to 1.2 with the diameter ratio of this fan hub; If this heating column is cone, then the bottom surface diameter of this heating column is and 0.6 to 1.2 of the diameter ratio of this fan hub, and the upper bottom surface diameter of this heating column is 0.1 to 0.9 of a bottom surface diameter.
Certainly, this heating column 222 is except that for also can be hollow solid, but the material of inside other easy heat conduction of filling.
Fig. 3 is the assembly drawing of the heat abstractor of the utility model second preferred embodiment, and this heat abstractor mainly is made of a heating radiator 32 and a fan 33.This heating radiator 32 is made for having high thermal conductivity material (for example aluminium), and it comprises a conductive sole plate 321, and is cylindrical heating column 322 and several radial radiating fins 323.This fan then utilizes screw 36 to be fastened in 323 of radiating fins.The principle of work that the heat abstractor of use present embodiment removes the cpu chip 31 in the operation is identical with first embodiment, and radial radiating fin 323 helps the cold air of fan attraction and contacting of radiating fin 323, so convection effects is better.
In sum, the main difference and the progressive of construction for heat radiating device of the present utility model and known technology are:
1, the utility model heating radiator central authorities design of establishing a heating column with respect to the fan hub lower position can be avoided a large amount of heat history below wheel hub, and then improve fan life.
2, the utility model only need change heat spreader structures, and need not change heating radiator and fan dimension, just can effectively remove the heat of radiating fin 122 accumulation below wheel hub, to guarantee electronic package normal operation such as chip, so can reduce cost and easy to operate.
In sum, heat abstractor provided by the utility model has good, the easy to operate and saving cost of radiating effect, can overcome the shortcoming that exists in the known technology.
Be noted that any those of ordinary skill in the art, improvement or the modification done in not breaking away from spirit and scope of the present utility model all are regarded as belonging to claim protection domain of the present utility model.
Claims (9)
1. the improvement structure of a heat abstractor, in order to remove the part heat from a thermal source, this heat abstractor comprises: a heating radiator and a fan; It is characterized in that said heating radiator, it has a conductive sole plate, a heating column and several radiating fins, the lower surface of this conductive sole plate contacts with this thermal source, this heating column is positioned at the upper face center of this conductive sole plate, and be positioned at the wheel hub below of this fan, these several radiating fins are positioned on the upper surface of this conductive sole plate, and are positioned at around this heating column.
2. the improvement structure of heat abstractor as claimed in claim 1 is characterized in that described thermal source for producing the electronic package of heat in the operation, and described electronic package is a cpu chip.
3. the improvement structure of heat abstractor as claimed in claim 1 is characterized in that this heating column to the diameter ratio of the vertical range of this fan hub and this fan hub is 0.1 to 1.0.
4. the improvement structure of heat abstractor as claimed in claim 1 is characterized in that this heating column is a right cylinder, and the diameter ratio of the diameter of this heating column and this fan hub is 0.1 to 1.2.
5. the improvement structure of heat abstractor as claimed in claim 1 is characterized in that this heating column is a rectangular parallelepiped, and the diameter ratio of the diagonal angle length of this heating column rectangular parallelepiped and this fan hub is 0.1 to 1.2.
6. the improvement structure of heat abstractor as claimed in claim 1, it is characterized in that this heating column is a cone, and the diameter ratio of the bottom surface diameter of this heating column cone and this fan hub is 0.6 to 1.2, and the upper bottom surface diameter of this heating column cone is 0.1 to 0.9 of a bottom surface diameter.
7. the improvement structure of heat abstractor as claimed in claim 1, it is characterized in that this radiating fin be selected from parallel channel form and radial one of them, and this heating column is solid.
8. the improvement structure of heat abstractor as claimed in claim 1 is characterized in that described heating column is solid.
9. the improvement structure of heat abstractor as claimed in claim 1 is characterized in that this heating column is a hollow, the material of the easy heat conduction of inner filling.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 01204397 CN2472266Y (en) | 2001-03-14 | 2001-03-14 | Improved structure of radiator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 01204397 CN2472266Y (en) | 2001-03-14 | 2001-03-14 | Improved structure of radiator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN2472266Y true CN2472266Y (en) | 2002-01-16 |
Family
ID=33625632
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 01204397 Expired - Lifetime CN2472266Y (en) | 2001-03-14 | 2001-03-14 | Improved structure of radiator |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN2472266Y (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100398775C (en) * | 2003-02-12 | 2008-07-02 | K.A.施梅尔索尔公司 | Safety lock |
| CN102262427A (en) * | 2010-05-28 | 2011-11-30 | 昆山广兴电子有限公司 | Radiating module |
-
2001
- 2001-03-14 CN CN 01204397 patent/CN2472266Y/en not_active Expired - Lifetime
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100398775C (en) * | 2003-02-12 | 2008-07-02 | K.A.施梅尔索尔公司 | Safety lock |
| CN102262427A (en) * | 2010-05-28 | 2011-11-30 | 昆山广兴电子有限公司 | Radiating module |
| CN102262427B (en) * | 2010-05-28 | 2013-02-06 | 昆山广兴电子有限公司 | Radiating module |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CX01 | Expiry of patent term |
Expiration termination date: 20110314 Granted publication date: 20020116 |