CN2465323Y - Heat sink for integrated circuits - Google Patents

Abstract

The utility model relates to a heat dissipation device for integrated circuits, which comprises a heat sink and a fan. The heat sink is composed of a metal base and a plurality of heat sinks punched from metal sheets. The heat sink is arranged on the base and is fixed by positioning columns. The heat sinks are isolated by flanges relative to the edges of the middle holes of the positioning columns, so that a certain ventilation gap is maintained between the heat sinks. In this way, the heat generated in the center of the integrated circuit can be effectively and quickly transferred to each heat sink by using the positioning columns, so that the airflow generated by the fan arranged on the side of the heat sink group when rotating can cool and dissipate the heat generated when the integrated circuit components are working.

Description

Heat sink for integrated circuits

The utility model relates to a cooling device for integrated circuits.

Since integrated circuit components will generate high temperature during operation, in order to avoid the high temperature of integrated circuit components affecting the stability of their work, integrated circuit components usually need to use a heat sink to reduce their operating temperature, which is usually used on integrated circuit components The structure of the radiator is shown in Figure 4. It includes a heat sink 40 and a fan 50. The heat sink 40 is a metal plate body 41 with several fins 42 protruding from one surface. The fan 50 includes fan blades 51 and a fan 50. A stator set disposed in a fan base 52 is disposed on the heat dissipation plate 40 to form a heat dissipation device.

When the heat dissipation device is in use, the plate body of the heat dissipation plate 40 leans against the integrated circuit assembly. The metal heat dissipation plate 40 has good thermal conductivity and several fins 42 increase the heat dissipation surface area, thereby making the integrated circuit assembly The high heat generated during operation can be quickly dissipated to the surface of the cooling plate 40 , and then the integrated circuit components are cooled and discharged by the airflow generated by the rotation of the fan 50 installed on the cooling plate 40 .

In the structure of the above existing heat dissipation device, the heat dissipation plate is made of aluminum alloy material through extrusion and reprocessing. When manufacturing, first extrude a long strip, and then cut the long strip to the required length block, and then cut out a strip of fins on the block, so the processing is cumbersome, the manufacturing speed is very slow, so the processing cost is high, and because the strength of the aluminum alloy material is limited, the length and thickness of the fins The ratio has a certain limit. If the fins are too thin or the preset fins are too long, the fins are easy to bend or break during cutting. Therefore, the heat dissipation surface area of the heat sink is limited to a certain extent, and the heat sink after cutting is finished. The configuration is fixed and thus cannot be adjusted, so that the heat dissipation effect of the radiator cannot reach an optimal state.

In addition, since the heat generated by the integrated circuit is mainly concentrated in the central part of the heat sink, it is almost impossible to transfer to parts other than the central part of the heat sink. In this way, the effective heat dissipation surface area of the heat sink is greatly reduced. Effectively provide heat dissipation for integrated circuits.

The main purpose of the utility model is to provide a cooling device for integrated circuits that can effectively and quickly transfer the heat generated in the center of the integrated circuit components to each heat sink.

Another object of the present invention is to provide a heat sink that can control the size of the ventilation gap and the number of fins used by using the extended length of the heat sink flange, so as to optimize the heat dissipation effect.

In order to achieve the above object, the heat dissipation device for integrated circuits of the present utility model includes a heat sink and a fan, and the heat sink is composed of a metal base and a metal heat sink group. It is characterized in that the The base of the base is composed of a seat plate and a positioning column arranged in the center of the seat plate. The heat sink group includes several heat sinks punched from metal sheets, and a center hole corresponding to the positioning column is formed in the center. There is a flange protruding from the edge of the hole, and each heat sink is stacked on the seat plate up and down and fixed for the positioning column. With the help of the flange isolation, a certain ventilation gap is maintained between the heat sinks: the fan assembled in the fan seat The fan composed of the leaves and the stator is arranged on the sides of the plurality of cooling fins to face the end of the cooling fins.

The utility model has the following advantages:

1. The heat sink group in the utility model is composed of several sheet-like heat sinks, and each heat sink is punched directly from a metal sheet, so the processing and manufacturing are very simple, which can effectively reduce the manufacturing cost.

2. The heat sink group of the utility model is composed of several heat sinks stacked and combined, and are separated from each other by the flange extending from the hole edge of the middle hole to form a ventilation gap, and can be used as a heat conduction medium, and can be integrated according to The size of the heat dissipated by the circuit components, the length of the flange extension of the modular heat sink is used to control the size of the ventilation gap and the appropriate number of heat sinks assembled. When the density between the heat sinks is high, the fan can be used to discharge the hot air between the heat sinks. And when the density between the heat sinks is low, a fan can be used to blow cold air into the heat sink to optimize the heat dissipation effect.

3. The positioning column of the utility model is correspondingly located at the center of the integrated circuit assembly, so the heat generated on the integrated circuit assembly can be effectively transferred to each heat sink through the flange of the heat sink, so as to increase the effective performance of the radiator. The heat dissipation surface area greatly improves the heat dissipation effect.

In order to further understand the purpose, features and advantages of the utility model, a preferred embodiment of the utility model will be described in detail below with reference to the accompanying drawings.

Fig. 1 is a three-dimensional exploded schematic diagram of a preferred embodiment of the utility model;

Fig. 2 is a combined sectional view of a preferred embodiment of the utility model;

Fig. 3 is a three-dimensional appearance schematic diagram of a preferred embodiment of the present invention after combination

Fig. 4 is a schematic diagram of a conventional radiator.

First please refer to shown in Figures 1 to 3, the radiator of a preferred embodiment of the present invention includes a radiator 1 and a fan 2, wherein the radiator 1 includes a metal base 10 and a heat sink group 13, the base 10 It is composed of a seat plate 11 and a positioning column 12 arranged in the center thereof. The seat plate 11 and the positioning column 12 can be integrally formed or separately arranged; the heat sink group 13 is composed of several heat sinks 130, and each heat sink 130 is punched by sheet metal, and they can be of any shape. A middle hole 131 corresponding to the positioning column 12 is formed in the center thereof, and a flange 132 protrudes upwards or downwards along the edge of the middle hole 131. For each cooling fin 130 , a certain ventilation gap 133 is maintained between the upper and lower cooling fins 130 through the flange 132 abutting against the lower cooling fin 130 .

The fan 2 includes components such as a fan blade 20 and a stator group installed in a fan base 21. The fan 2 is installed on the side of the plurality of heat sinks 130 to face the end of the heat sink 130, so that the fan blades The airflow generated by the rotation of 20 can pass through the ventilation gap 133 between the cooling fins 130 to realize cooling and heat dissipation.

In addition, the fan 2 is assembled on the heat sink 1 with a frame 3. The frame 3 is a -shaped body, which can cover the outside of the heat sink 130, and its bottom end is fixed on the base 10 for positioning. The frame 3 Protruding pieces 311 are provided on the inner sides of the two side plates 31 , and the fan 2 can be assembled in the frame 3 to face the side edges of the plurality of cooling fins 130 by cooperating with the fastening components. The center of the frame 3 top plate 30 forms a perforation 301 relative to the positioning column 12, and the frame 3 is fixed above the base 10 by means of the positioning column 12 and the perforation 301. The positioning slots 111 allow the bottom ends of the side plates 31 of the frame 3 to be inserted into the positioning slots 111 of the seat plate 11 for positioning.

When in use, as shown in Figures 2 and 3, the seat plate 11 of the base 10 of the heat sink 1 leans against the integrated circuit assembly, and utilizes the good thermal conductivity of several metal heat sinks 130 to concentrate the integrated circuit assembly on the The heat generated at the center is dissipated and conducted to each heat sink 130 through the seat plate 11 , the positioning column 12 and the flange 132 of the heat sink 130 , and the airflow generated by the rotation of the fan 2 discharges the heat on the heat sink 130 to the air.

Claims (6)

1. A heat dissipation device for integrated circuits, which includes a heat sink and a fan. The heat sink is composed of a metal base and a metal heat sink group. It is characterized in that the base is composed of a plate It is composed of a positioning column arranged in the center of the seat plate. The heat sink group includes several heat sinks punched from metal sheets. A center hole corresponding to the positioning column is formed in the center of the heat sink group. There is a flange, each heat sink is stacked up and down on the seat plate and fixed for the positioning column, and a certain ventilation gap is maintained between each heat sink by means of flange isolation; it is composed of fan blades and stators assembled in the fan seat The fans are arranged at the sides of the plurality of heat sinks to face the end edges of the heat sinks. 2. The heat dissipation device for integrated circuits according to claim 1, wherein the seat plate of the base and the positioning column are integrally formed. 3. The heat dissipation device for integrated circuits according to claim 1, wherein the seat plate of the base and the positioning column are separately arranged. 4. The heat dissipation device for integrated circuits according to claim 1, wherein the fan is arranged on the heat sink in conjunction with a -shaped frame, and the frame is covered on the outside of the heat sink, and the bottom end It is fixed on the seat plate, and the inner sides of the two sides of the frame are provided with lugs, and the fan is assembled in the frame with the fixed assembly. 5. The cooling device for integrated circuits according to claim 4, characterized in that, the seat plate of the base is provided with positioning grooves opposite to the two side plates of the frame, and the frame is inserted through the bottom ends of the two side plates Locate in the positioning groove of the seat plate. 6. The heat dissipation device for integrated circuits according to claim 4, wherein a perforation is formed in the center of the top plate of the frame relative to the positioning column of the base, and the frame is assembled on the base through the cooperation of the positioning column and the perforation.

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