CN2465323Y

CN2465323Y - Heat sink for IC

Info

Publication number: CN2465323Y
Application number: CN 01203065
Authority: CN
Inventors: 赵裕丰
Original assignee: AIBIFU HEAT TRANSFER Co Ltd; SHUOQI ENTERPRISE CO Ltd; Min Long Enterprise Co Ltd
Current assignee: AIBIFU HEAT TRANSFER Co Ltd; SHUOQI ENTERPRISE CO Ltd; Min Long Enterprise Co Ltd
Priority date: 2001-02-02
Filing date: 2001-02-02
Publication date: 2001-12-12
Anticipated expiration: 2011-02-02

Abstract

The utility model relates to a radiation device for integrated circuits, which comprises a radiator and a fan, wherein the radiator is assembled by a metal base and a plurality of radiation fins which are punched and made by foils. The radiation fins are assembled on the base and are fixed by positioning columns. Every two radiation fins are isolated by a flange of a mesopore peritreme of the corresponding positioning column so that a certain draught clearance can be kept between every two radiation fins. Therefore, by using the positioning columns, the heat generated in the centre of the integrated circuit can be transferred to every radiation fin effectively, and thus when the fan assembled on the side of the group of the radiation fins rotates, the generated air current can chill down and expel the heat generated by the operation of the assembly of the integrated circuit.

Description

The heat abstractor that is used for integrated circuit

The utility model relates to a kind of heat abstractor that is used for integrated circuit.

Because integrated circuit package can produce high temperature when work, for avoiding integrated circuit package Yin Gaowen to influence the stability of its work, so integrated circuit package need use a heat abstractor to reduce its working temperature usually, usually the structure that is applied to the radiator on the integrated circuit package as shown in Figure 4, it comprises a heating panel 40 and a fan 50, heating panel 40 is for being convexly equipped with the metal plate 41 of several fins 42 on a surface, fan 50 comprises flabellum 51 and is installed in stator pack in the fan base 52 that it is arranged on the described heating panel 40 to form a heat abstractor.

Described heat abstractor is when using, be that plate body by heating panel 40 is resisted against on the integrated circuit package, metallic heat radiating plate 40 has good heat conductivity and several fins 42 have increased cooling surface area, thereby make high heat that integrated circuit package work the time generated can rapid evacuation to the surface of heating panel 40, the air-flow that utilizes fan 50 rotations that are installed on the heating panel 40 to be produced again cools off heat extraction to integrated circuit package.

In above-mentioned existing construction for heat radiating device, its heating panel is to make moulding with aluminum alloy materials by squeezing type reprocessing mode, when making, at first extrude out an elongate body, again elongate body is cut into the block of Len req, then on described block, cut out a rule fin, so processing is loaded down with trivial details, manufacturing speed is very slow, therefore processing cost is higher, simultaneously because the intensity of aluminum alloy materials is limited, and the ratio between fin length and thickness has certain limitation, if fin is crossed thin or default fin when long, flexible or the fracture of fin in cutting, therefore the cooling surface area of described radiator is subjected to certain limitation, and the configuration of the radiator of cutting after finishing be fix thereby can not adjust, make the radiating effect of radiator can't reach best state.

In addition, because the heat that integrated circuit produced mainly concentrates on the centre of described heating panel, and almost can't be delivered to the part beyond the fin centre, like this, the efficiently radiates heat surface area of described heating panel reduces widely, and the heat radiation of integrated circuit can't be provided effectively.

Main purpose of the present utility model is to provide a kind of heat abstractor that is used for integrated circuit that can effectively the heat that results from integrated circuit package central authorities be delivered to fast on each sheet fin.

Another purpose of the present utility model is the fin count that a kind of length control ventilation gap that utilizes described fin flange to extend is big or small and use is provided, so that the optimized radiator of its radiating effect.

For achieving the above object, the heat abstractor that is used for integrated circuit of the present utility model, it comprises a radiator and a fan, described radiator is made up of a metab and a metal fin group, be characterized in, described base is made up of a seat board and a reference column that is arranged on seat board central authorities, described groups of fins comprises the fin that several are formed by the sheet metal punching out, its central authorities form the mesopore of a corresponding described reference column, convex with a flange along the mesopore peritreme, each fin is stacked and placed on up and down on the seat board and for reference column provides fixingly, isolates to make the certain ventilation gap of maintenance between each fin by flange: be arranged at described several fin side edge to face fin end limit by being assembled in the fan that flabellum in the fan base and stator form.

The utlity model has following advantage:

1, the groups of fins in the utility model is to use several laminar fin combinations to form, and each fin forms with the direct punching out of sheet metal, so processing and manufacturing is very simple, thereby can effectively reduce manufacturing cost.

2, groups of fins of the present utility model is to be formed by several fin stacked combination, and the flange isolation formation ventilation gap that is extended by the mesopore peritreme to each other, and can be used as heat conducting media, can be according to the size of integrated circuit package distribute heat, utilize the length of the flange extension of modularization fin to control the ventilation gap size and assemble an amount of fin count, when the density between fin is high, can utilize fan that the hot gas between fin is discharged, and when the density between fin is low, can utilize fan that cold air is blown into fin, thereby make its radiating effect optimization.

3, reference column correspondence of the present utility model is positioned at the centre of integrated circuit package, so can be effectively with the heat that results from the integrated circuit package, flange by fin is delivered on each sheet fin, to increase the efficiently radiates heat surface area of radiator, radiating effect is promoted significantly.

For further understanding the purpose of this utility model, characteristics and advantage, a preferred embodiment of the present utility model is elaborated below in conjunction with accompanying drawing.

Fig. 1 is the perspective exploded view of the utility model one preferred embodiment;

Fig. 2 is the assembled sectional view of the utility model one preferred embodiment;

Fig. 3 is the three-dimensional appearance schematic diagram after the utility model one preferred embodiment combination

Fig. 4 is the schematic diagram of existing radiator.

At first see also shown in Fig. 1 to 3, the radiator of the utility model one preferred embodiment comprises a radiator 1 and a fan 2, wherein radiator 1 comprises a metab 10 and a groups of fins 13, its base 10 is made of a seat board 11 and the reference column 12 that is provided with in the central, and described seat board 11 and reference column 12 can one-body molded or separate type settings; Groups of fins 13 is made up of several fin 130, each fin 130 is formed by the sheet metal punching out, they can be arbitrary shape, its central authorities form the mesopore 131 of a corresponding described reference column 12, be convexly equipped with a flange 132 up or down along mesopore 131 peritremes, when group is established each fin 130, make 130 certain ventilation gaps 133 of maintenance of fin up and down on the fin 130 of below to terminating in by flange 132.

Fan 2 comprises assemblies such as the flabellum 20 that is installed in the fan base 21 and stator pack, described fan 2 is installed on described several fin 130 side edge to face fin 130 end limits, can be so as to the air-flow that flabellum 20 rotations are produced by the ventilation gap 133 of 130 of fin, to realize cooling heat dissipation.

In addition, described fan 2 cooperates a framework 3 to be mounted on the radiator 1, described framework 3 is a  body, can cover in the outside of fin 130, location on the base 10 is fixed in its bottom, biside plate 31 inboards of framework 3 are provided with lug 311, can cooperate affixed assembly that fan 2 is mounted in the framework 3, with the side end edge in the face of several fin 130.The 30 central perforation 301 that form a relative positioning post 12 of described framework 3 top boards, be fixed in base 10 tops by reference column 12 with the framework 3 that cooperates of perforation 301, the location notch 111 of relative framework 3 biside plates 31 is set on the seat board 11 of base 10, makes biside plate 31 bottoms of framework 3 be inserted in location in the location notch 111 of seat board 11.

When using, shown in Fig. 2 and 3, the seat board 11 of the base 10 of radiator 1 is resisted against on the integrated circuit package, utilize the good heat conductivity of several metal fins 130, make integrated circuit package work the time concentrate on heat that central place generates and disperse to conduct on each fin 130 through the flange 132 of seat board 11, reference column 12 and fin 130, and the air-flow that fan 2 rotations are produced with the heat discharge on the fin 130 to air.

Claims

1, a kind of heat abstractor that is used for integrated circuit, it comprises a radiator and a fan, described radiator is made up of a metab and a metal fin group, it is characterized in that, described base is made up of a seat board and a reference column that is arranged on seat board central authorities, described groups of fins comprises the fin that several are formed by the sheet metal punching out, its central authorities form the mesopore of a corresponding described reference column, convex with a flange along the mesopore peritreme, each fin is stacked and placed on up and down on the seat board and for reference column provides fixingly, isolation makes the certain ventilation gap of maintenance between each fin by flange; Be arranged at described several fin side edge with in the face of fin end limit by being assembled in fan that flabellum in the fan base and stator form.

2, the heat abstractor that is used for integrated circuit as claimed in claim 1 is characterized in that, the seat board and the reference column of described base are one-body molded.

3, the heat abstractor that is used for integrated circuit as claimed in claim 1 is characterized in that, the seat board of described base and reference column separate type are provided with.

4, the heat abstractor that is used for integrated circuit as claimed in claim 1, it is characterized in that, described fan cooperates a  shape frame set to be located on the radiator, described framework covers in the fin outside, the bottom is fixed on the seat board, two lateral plate inboards of framework are provided with lug, and fan cooperates affixed component groups to be located in the framework.

5, the heat abstractor that is used for integrated circuit as claimed in claim 4 is characterized in that, the location notch of relative framework biside plate is set on the seat board of described base, and described framework is inserted in by the biside plate bottom in the location notch of seat board and locatees.

6, the heat abstractor that is used for integrated circuit as claimed in claim 4 is characterized in that, the central perforation that forms a relative base reference column of described frame head plate, and framework was mounted on the base by reference column and cooperating of perforation.