CN2458659Y - CPU phase converting radiator for desk computer - Google Patents
CPU phase converting radiator for desk computer Download PDFInfo
- Publication number
- CN2458659Y CN2458659Y CN 00261903 CN00261903U CN2458659Y CN 2458659 Y CN2458659 Y CN 2458659Y CN 00261903 CN00261903 CN 00261903 CN 00261903 U CN00261903 U CN 00261903U CN 2458659 Y CN2458659 Y CN 2458659Y
- Authority
- CN
- China
- Prior art keywords
- copper pipe
- box body
- heat transfer
- lower box
- desk
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Images
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model relates to a CPU phase converting heat transferring radiator for a desk computer, which comprises a radiator fan, a condensing copper pipe and heat transferring fins. The utility model also comprises an upper box body and a lower box body. The condensing copper pipe is a set of copper pipe bundles; the upper end and the lower end of the condensing copper pipe are respectively communicated with the upper box body and the lower box body. The bottom of the lower box body is provided with a small amount of working liquid; the upper box body is empty. The exterior of the condensing copper pipe is provided with heat transferring fins for enhancing heat transfer. The radiator fan is arranged on both sides of the copper pipe bundles. The upper box body can also be not used. The upper end of the condensing copper pipe is enclosed; the upper part of the enclosed condensing copper pipe is provided with a spacing board. The vapor has very small resistance in the course of movement, and as a result, compared with solid aluminum conducting sheets, the utility model has very strong heat transferring capability which can be scores of times even a hundred times of the aluminum sheets.
Description
The utility model relates to a kind of heat abstractor of desktop cpu, is in particular a kind of desk-top computer CPU phase-change heat sink.
Along with the continuous lifting of CPU processing speed, its heat radiation more and more becomes distinct issues.Present method is the heat radiator that the heat of CPU generation is directly delivered to aluminum, and the heat of heat radiator being accumulated by the fan of quick rotation is taken away again.Although the capacity of heat transmission of aluminum thermal fin is very strong, to compare with phase-change heat sink, their thermal resistance still exceeds tens of to hundreds of times than the latter.Although the CPU cooling system constantly improves at present, mainly be to consider how to improve on the cooling effectiveness, and less to the thermal resistance aspect that how to reduce aluminum thermal fin.Thereby its heat-sinking capability is subjected to the constraint of heat radiator thermal resistance always.
The purpose of this utility model is exactly to provide a kind of heating radiator that is used for cooling computer (computer) CPU (central processing unit) for the above-mentioned defective that solves prior art, is specially adapted to a kind of desk-top computer CPU phase-change heat sink of the CPU of desk-top computer and server.
The purpose of this utility model realizes by following technical solution:
A kind of desk-top computer CPU phase-change heat transfer heating radiator, it includes radiator fan, condensation copper pipe, thermofin, it also includes upper and lower box body, and condensation copper pipe is one group of copper pipe bundle, and the condensation copper pipe upper and lower end is connected with upper and lower box body respectively, a little amount of work liquid is arranged at the bottom in the lower box body, upper cartridge body is empty, in the condensation copper pipe outer setting thermofin of augmentation of heat transfer is arranged, and radiator fan is arranged in the both sides of copper pipe bundle.
A kind of desk-top computer CPU phase-change heat transfer heating radiator, it includes radiator fan, condensation copper pipe, thermofin, it also includes lower box body, and condensation copper pipe is one group of copper pipe bundle, the condensation copper pipe upper end is sealed, top at the sealing condensation copper pipe is provided with a limiting plate, and the lower end of condensation copper pipe is connected with lower box body, and a little amount of work liquid is arranged at the bottom in the lower box body, in the condensation copper pipe outer setting thermofin of augmentation of heat transfer is arranged, radiator fan is arranged in the both sides of copper pipe bundle.
The purpose of this utility model can also be opened further realization by following technology solution:
Aforesaid a kind of desk-top computer CPU phase-change heat transfer heating radiator, wherein said diffusing bottom cartridge outer surface is sticked mutually with the upper surface of CPU and puts.
Aforesaid a kind of desk-top computer CPU phase-change heat transfer heating radiator, wherein said upper and lower box body, cooling copper tube are formed a negative pressure of vacuum structure.
Aforesaid a kind of desk-top computer CPU phase-change heat transfer heating radiator, wherein said lower box body, cooling copper tube are formed a negative pressure of vacuum structure.
Aforesaid a kind of desk-top computer CPU phase-change heat transfer heating radiator, the hydraulic fluid of wherein said lower box body bottom can be any in water, acetone, alcohol or other low-boiling-point organic compound matter.
Aforesaid a kind of desk-top computer CPU phase-change heat transfer heating radiator, wherein said each steam condensation copper pipe can be in-line arrangement or wrong row.
Aforesaid a kind of desk-top computer CPU phase-change heat transfer heating radiator, wherein said is the augmentation of heat transfer thermofin that copper or aluminium matter all are housed outside every condenser pipe, the augmentation of heat transfer thermofin can connect in the soldering of full wafer suit, also can be single being intertwined and connected.
Aforementioned a kind of desk-top computer CPU phase-change heat transfer heating radiator, wherein said in the inboard of lower box body base plate, be to strengthen the surface structure of boiling, it is the thin ball of sintering, or filamentary webs, burr body, pearl particle.
Advantage of the present utility model is that the heat-transfer capability of comparing it with solid aluminium conducting strip is also quite big, can be tens times even hundreds of times of aluminium flake because the resistance that steam is subjected to is minimum in motion process.
Below in conjunction with accompanying drawing the utility model is further described:
Fig. 1 is the utility model structural representation.
Fig. 2 is the A-A sectional view of Fig. 1.
Fig. 3 is the another synoptic diagram of the utility model structure.
As shown in Figure 1, 2, it includes radiator fan 1 the utility model, condensation copper pipe 2 (φ 3-4mm),, thermofin 3, it also includes 4, lower box body 6, condensation copper pipe 2 is one group of copper pipe bundle, each steam condensation copper pipe 2 can be in-line arrangement or wrong row.Condensation copper pipe 2 upper and lower ends are connected with upper and lower box body 4,6 respectively, condensation pipe 2 all is welded on up and down on upper cartridge body 4 and the lower box body 6, a little amount of work liquid 7 is arranged at the bottom in the lower box body 6, upper cartridge body 4 is empty, effect is the working steam 11 that a nearly step condensation comes from lower box body 6 risings, and can store the thin liquid layer of one deck.When liquid layer was higher than the tube head of copper pipe, liquid film 12 was dirty along tube wall.In condensation copper pipe 2 outer setting the thermofin 3 of augmentation of heat transfer is arranged, the enhanced heat transfer fin 3 of copper or aluminium matter promptly all is housed outside every condenser pipe 2, enhanced heat transfer fin 3 can connect in the soldering of full wafer suit, also can be single being intertwined and connected.Being attached to condensation copper pipe 2 outer thermofins 3 is in order to increase the heat transfer area of condensation copper pipe 2.Radiator fan 1 is arranged in the both sides of copper pipe bundle, and radiator fan 1 is fixed on the fan bracket 5, and carriage is connected with the side plate 10 of 5 lower box bodies 6.Described upper and lower box body 4,6, condensation copper pipe 2 is formed a negative pressure of vacuum structure.Its course of work is as follows, because many condensation pipes and heat transfer thermofin have constituted the steam cooling duct.Fit upper surface with bottom cartridge outer surface and CPU of the outer bottom of lower box body and CPU is sticked mutually and puts.The heat that CPU8 produces passes to the lower shoe of lower box body 6, at the hydraulic fluid on the lower shoe inside surface 7 owing to be in the vaporization of very easily being heated under the vacuum negative pressure condition.The hydraulic fluid 7 of lower box body bottom can be any in water, acetone, alcohol or other low-boiling-point organic compound matter, and it constantly absorbs heat that CPU transmits as the latent heat of vaporization.Inboard at lower box body 6 base plates, for strengthening the surface structure of boiling, being laid on lip-deep activation boiling material 9 is in order to produce more nucleus of boiling, it is the thin ball of sintering, or filamentary webs, burr body, pearl particle, to produce more steam bubble, after the steam bubble change was broken greatly, steam 11 upwards flowed and enters into respectively in the condensation copper pipe 2.The cooling of cold wind outside steam is subjected to managing in condensation copper pipe 2, steam are condensed into liquid and form condensate film 12 along tube wall and flow downward and fall back to and continue the vaporization of being heated in the lower box body.Fan 1 is located at the cold wind that enough cooling steams are supplied with in both sides, it can be sleeved on the method for full wafer compacting on the copper pipe 2 also can be on individual tubes rolling forming.The effect of upper cartridge body 4 is the upper ends that connect condensation copper pipe 2, stores excessive condensed fluid, and plays the connection effect between each condensation copper pipe 2.
Above-mentioned the utility model also can be without upper cartridge body 2, as shown in Figure 3, it includes radiator fan, condensation copper pipe, heat transfer thermofin, it also includes lower box body, condensation copper pipe is one group of copper pipe bundle, the condensation copper pipe upper end is sealed, top at the sealing condensation copper pipe is provided with a limiting plate, the lower end of condensation copper pipe is connected with lower box body, a little amount of work liquid is arranged at the bottom in the lower box body, in the condensation copper pipe outer setting thermofin of augmentation of heat transfer is arranged, and radiator fan is arranged in the both sides of copper pipe bundle.The top that is every condensation copper pipe 2 is sealed, and all the other are all identical with Fig. 1.This moment, the top of every condenser pipe no longer was communicated with.Have only a upper mounted plate 13 to play and be connected and fixed the welding job that this structure of effect can be saved upper cartridge body and upper cartridge body 4 and condensation copper pipe 2.Described lower box body, cooling copper tube are formed a negative pressure of vacuum structure.Its principle of work is with aforementioned.
Claims (9)
1. desk-top computer CPU phase-change heat transfer heating radiator, it includes radiator fan, condensation copper pipe, heat transfer thermofin, it is characterized in that it also includes upper and lower box body, condensation copper pipe is one group of copper pipe bundle, and the condensation copper pipe upper and lower end is connected with upper and lower box body respectively, a little amount of work liquid is arranged at the bottom in the lower box body, upper cartridge body is empty, in the condensation copper pipe outer setting thermofin of augmentation of heat transfer is arranged, and radiator fan is arranged in the both sides of copper pipe bundle.
2. desk-top computer CPU phase-change heat transfer heating radiator, it includes radiator fan, condensation copper pipe, thermofin, it is characterized in that it also includes lower box body, condensation copper pipe is one group of copper pipe bundle, the condensation copper pipe upper end is sealed, top at the sealing condensation copper pipe is provided with a limiting plate, the lower end of condensation copper pipe is connected with lower box body, a little amount of work liquid is arranged at the bottom in the lower box body, in the condensation copper pipe outer setting thermofin of augmentation of heat transfer is arranged, radiator fan is arranged in the both sides of copper pipe bundle.
3. according to right 1 or 2 described a kind of desk-top computer CPU phase-change heat transfer heating radiators, the bottom cartridge outer surface that it is characterized in that heating radiator is sticked mutually with the upper surface of CPU and puts.
4. according to right 1 described a kind of desk-top computer CPU phase-change heat transfer heating radiator, it is characterized in that upper and lower box body, negative pressure of vacuum structure of cooling copper tube composition.
5. according to right 2 described a kind of desk-top computer CPU phase-change heat transfer heating radiators, it is characterized in that lower box body, negative pressure of vacuum structure of cooling copper tube composition.
6. according to right 1 or 2 described a kind of desk-top computer CPU phase-change heat transfer heating radiators, it is characterized in that hydraulic fluid in the lower box body bottom can be any in water, acetone, alcohol or other low-boiling-point organic compound matter.
7. according to right 1 or 2 described a kind of desk-top computer CPU phase-change heat transfer heating radiators, it is characterized in that described each steam condensation copper pipe, can be in-line arrangement or wrong row.
8. according to right 1 or 2 described a kind of desk-top computer CPU phase-change heat transfer heating radiators, it is characterized in that outside every condenser pipe, all being equipped with the augmentation of heat transfer thermofin of copper or aluminium matter, the augmentation of heat transfer thermofin can connect in the soldering of full wafer suit, also can be single being intertwined and connected.
9. according to right 1 or 2 described a kind of desk-top computer CPU phase-change heat transfer heating radiators, it is characterized in that be to strengthen the surface structure of boiling, it is the thin ball of sintering in the inboard of lower box body base plate, or filamentary webs, burr body, pearl particle.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 00261903 CN2458659Y (en) | 2000-12-14 | 2000-12-14 | CPU phase converting radiator for desk computer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 00261903 CN2458659Y (en) | 2000-12-14 | 2000-12-14 | CPU phase converting radiator for desk computer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN2458659Y true CN2458659Y (en) | 2001-11-07 |
Family
ID=33617298
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 00261903 Expired - Lifetime CN2458659Y (en) | 2000-12-14 | 2000-12-14 | CPU phase converting radiator for desk computer |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN2458659Y (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107527428A (en) * | 2017-10-16 | 2017-12-29 | 成都易住信息技术有限公司 | A kind of self-service smart shopper machine |
| CN109825253A (en) * | 2019-01-30 | 2019-05-31 | 深装总建设集团股份有限公司 | Phase-change energy-storage units module and its preparation method and application |
| CN110842202A (en) * | 2019-11-28 | 2020-02-28 | 内蒙古科技大学 | Free particle/porous medium composite reinforced boiling structure and preparation method thereof |
| CN111414063A (en) * | 2020-03-31 | 2020-07-14 | 盐城工业职业技术学院 | Temperature compensation cooling system of computer network equipment |
-
2000
- 2000-12-14 CN CN 00261903 patent/CN2458659Y/en not_active Expired - Lifetime
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107527428A (en) * | 2017-10-16 | 2017-12-29 | 成都易住信息技术有限公司 | A kind of self-service smart shopper machine |
| CN109825253A (en) * | 2019-01-30 | 2019-05-31 | 深装总建设集团股份有限公司 | Phase-change energy-storage units module and its preparation method and application |
| CN110842202A (en) * | 2019-11-28 | 2020-02-28 | 内蒙古科技大学 | Free particle/porous medium composite reinforced boiling structure and preparation method thereof |
| CN110842202B (en) * | 2019-11-28 | 2021-11-02 | 内蒙古科技大学 | Free particle/porous medium composite reinforced boiling structure and preparation method thereof |
| CN111414063A (en) * | 2020-03-31 | 2020-07-14 | 盐城工业职业技术学院 | Temperature compensation cooling system of computer network equipment |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101261058B (en) | Evaporation condenser applying harmonica-shaped tube | |
| CN101256043B (en) | Plate shell-type nonsaturated evaporation condensing plant | |
| CN201503231U (en) | Compact separation type heat pipe exchanger | |
| WO2008138216A1 (en) | Uniform temperature loop heat pipe device | |
| CN2606877Y (en) | Double effect phase changing heat storage type heat pipe heat exchanger | |
| CN201093904Y (en) | Inorganic heat tube spraying condenser | |
| CN105737631A (en) | Heat tube type water-saving device used for cross-flow cooling tower | |
| CN101782345A (en) | Lamella heat exchanger and manufacturing method thereof and lamella evaporative condensing equipment | |
| CN102661670A (en) | Superconducting nano heat transfer plate type heat exchanger and manufacturing method thereof | |
| CN111099678B (en) | Fresh water collection method for seawater desalination | |
| CN2458659Y (en) | CPU phase converting radiator for desk computer | |
| CN101059323A (en) | Plate type integral structure heat-irradiation method and device suitable for large power high efficiency heat pipe heat-radiator | |
| CN110038314A (en) | A kind of design method and its seawater desalination system of steam pipe constant-current stabilizer | |
| CN107062963B (en) | A kind of alternating expression micro-channel condenser for hair cell regeneration | |
| DE202007014238U1 (en) | Device for heat transfer of a heatpipe condenser | |
| CN207074024U (en) | The phase transformation heat collector cavity heat pipe heat to increase the service life | |
| CN201093905Y (en) | Inorganic heat tube spraying type evaporator | |
| CN2329925Y (en) | Plane-type heat pipe radiator | |
| JP2002071090A (en) | Oil tank equipped with cooler for minimum flow | |
| CN213208710U (en) | Precooling type air cooling device | |
| CN2593364Y (en) | Evaporative heat-transfer tube type radiator | |
| CN212299553U (en) | Vertical micro-channel evaporative condenser | |
| CN214470282U (en) | Integral heat pipe exchanger for recovering flue gas waste heat of mail steamer | |
| CN108253819A (en) | A kind of coal changes electric heat exchanging body and heat-exchange system | |
| CN1884953A (en) | Multi-phase flow unsaturated in-tube evaporation direct cooling device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CX01 | Expiry of patent term |
Expiration termination date: 20101214 Granted publication date: 20011107 |