CN2456214Y - CPU radiator - Google Patents
CPU radiator Download PDFInfo
- Publication number
- CN2456214Y CN2456214Y CN 00263779 CN00263779U CN2456214Y CN 2456214 Y CN2456214 Y CN 2456214Y CN 00263779 CN00263779 CN 00263779 CN 00263779 U CN00263779 U CN 00263779U CN 2456214 Y CN2456214 Y CN 2456214Y
- Authority
- CN
- China
- Prior art keywords
- cpu
- cylindrical shell
- processing unit
- central processing
- heating radiator
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model relates to a radiator for a central processing unit, which is proposed to provide a computer radiating device which has the advantages of simple structure, good radiating effect and high radiating efficiency. The utility model comprises a cooling fan, a barrel body which is assembled between the cooling fan and the central processing unit, a fastener and a cooling medium which is arranged in the barrel body which is pumped into a vacuum state; the outer wall of the barrel body is provided with a plurality of fins; one end of the barrel body is connected with the central processing unit CPU, and the cooling fan is arranged on the other end of the barrel body.
Description
The utility model belongs to computer heat radiating device, particularly a kind of CPU (central processing unit) heating radiator.
The cooling of known computing machine CPU (central processing unit) (CPU) generally is connected with it with aluminium radiating device, to dispel the heat.Heat abstractor is provided with many fins, and blows by cooling fan and to drive cold wind to the heat abstractor fin, the heat that produces with cooling CPU.The known CPU heat abstractor of this kind only can produce CPU the sensible heat (sensible heat) of heat usually and take away, and exists radiating effect limited, the defective that radiating efficiency is not good.If when absorbing the heat of CPU with the heat exchanger of current through being close to CPU, though can loose except that some heats, there is the defective of complex structure, heavy inconvenience in this kind heat exchanger.
The purpose of this utility model provides a kind of simple in structure, good heat dissipation effect, CPU (central processing unit) heating radiator that radiating efficiency is high.
The utility model comprises cooling fan, is mounted on cylindrical shell, the fastener between cooling fan and the CPU (central processing unit) and is placed in the interior refrigerant of shape cylindrical shell that is evacuated; Cylinder body outer wall is connected with plurality of fins; Cylindrical shell one end connects CPU through fastener, and cooling fan is installed in the cylindrical shell other end.
Wherein:
The cylindrical shell content is provided with conducting structure; The contiguous fastener that connects cylindrical shell and CPU of one end of conducting structure, and cohere heat-conducting glue or other heat conduction connection medium and CPU gluing.
Be connected with the paddle blade of tool keyhole between the adjacent fin of cylindrical shell and the barrel; Fastener has the mid-game portion that is connected and is provided with mesopore with cylindrical shell one end, be provided with most keyholes corresponding and sealed in mid-game portion with keyhole on the paddle blade, mid-game portion spaced around circular row is provided with most protuberances and recess, embeds in the recess between the two adjacent protuberances to make plurality of fins on the barrel; The fastener outer rim is prominent establish offer with the CPU substrate on the prominent trip of the establishing prominent button of the mortise of buckle mutually, spread out to side from a prominent button and to establish as fine setting, move and draw or the lug of the handle of assembling and dismantling.
Conducting structure comprises by the high material of heat conductivity makes heat conduction end plate, heat transfer plate and refrigerant guide plate; The heat conduction end plate is affixed and seal up an end of cylindrical shell connection fastener, constituting the cylindrical shell end plate, and through fastener mesopore and CPU gluing; Heat transfer plate be close to or be connected with in the cylindrical shell barrel and with heat conduction end plate quadrature; The refrigerant guide plate is connected with heat transfer plate and heat conduction end plate.
The heat conduction end plate of conducting structure, heat transfer plate and refrigerant guide plate are one-body molded.
The refrigerant guide plate of conducting structure comprises from oblique two flipper guides that extend of heat transfer plate ora terminalis and is connected in the centering guide of two flipper guide ora terminalis with base portion; Centering guide is gradually pointed to cylinder inboard wall, and its tapered ends offers most end orifices; Centering guide base portion and two flipper guide intersections offer most base portion apertures.
The liquid level that is placed in refrigerant in the cylindrical shell is vertical with CPU.
The liquid level that is placed in refrigerant in the cylindrical shell is parallel with CPU.
Refrigerant is a water.
Cylindrical shell is stamped circular arch arc end cap away from the CPU end shield.
The heat conduction end plate of conducting structure is established and the protuberance of CPU Elastic Contact with the generation buffer action.
At interval circular row is arranged at the outside angle of slightly-inclined upwards of protuberance tool around the fastener mid-game portion.
Because the utility model comprises cooling fan, is mounted on cylindrical shell, the fastener between cooling fan and the CPU (central processing unit) and is placed in the interior refrigerant of shape cylindrical shell that is evacuated; Cylinder body outer wall is connected with plurality of fins; Cylindrical shell one end connects CPU through fastener, and cooling fan is installed in the cylindrical shell other end.During running, the heat that CPU produces conducts in the cylindrical shell, and forms steam by refrigerant absorption heat of evaporation, and condensation discharged the heat of condensation after steam touched barrel, made the heat of condensation distribute through the fin of barrel and outer wall thereof, removes the heat that CPU produces to loose quickly and efficiently.Not only simple in structure, and good heat dissipation effect, radiating efficiency height, thereby reach the purpose of this utility model.
Fig. 1, be the utility model structural representation cut-open view (rectilinear).
Fig. 2, be A-A cut-open view among Fig. 1.
Fig. 3, be B portion partial enlarged drawing among Fig. 1.
Fig. 4, be C-C cut-open view among Fig. 2.
Fig. 5, be the utility model structural representation cut-open view (horizontal).
Fig. 6, be D-D cut-open view among Fig. 5.
Below in conjunction with accompanying drawing the utility model is further elaborated.
As Fig. 1, Fig. 2, Fig. 3, shown in Figure 4, the utility model comprises cylindrical shell 1, fastener 3, cooling fan 4, is placed in refrigerant 5 and conducting structure 6 (transfermeans) for water or other media in the cylindrical shell 1.The axis of cylindrical shell 1 and cooling fan 4 is a horizontal axis.
Fastener 3 is connected with in cylindrical shell 1 left end and rabbets or be fixed on the substrate 1B of CPU, and cooling fan 4 is mounted on cylindrical shell 1 right-hand member, and in the cylindrical shell 1 after refrigerant 5 is placed in and is evacuated, conducting structure 6 is connected with in cylindrical shell 1.
As shown in Figure 1, cylindrical shell 1 can be the cylindrical shell of cylinder or other shapes, and it has with aluminium and closes many or left end that the high material of other pyroconductivities the is made barrel 11 in abutting connection with CPU 1C, the contiguous cooling fan 4 of right-hand member, and one-body molded on it have a plurality of fins 2.Also can be as shown in Figure 2, plurality of fins 2 also can be from radially projection and going out of the barrel 11 that is cylindric cylindrical shell 1, can also other shapes, structure is formed into.Between adjacent fin 2 and cylindrical shell 1, be connected with the paddle blade 21 of tool keyhole 22.Cylindrical shell 1 right-hand member seals with arched (dome) arc end cap 14 covers, and is provided with and will vacuumizes the valve 15 of usefulness in the cylindrical shell 1, and after vacuumizing, recharges refrigerant 5 and promptly sealed.
As shown in Figure 3, fastener 3 has the mid-game portion 31 that is connected and is provided with mesopore 32 with cylindrical shell 1 left end, be provided with the corresponding and sealed keyhole 33 of keyhole on most and the paddle blade 21 22 in mid-game portion 31, mid-game portion 31 spaced around circular rows are provided with most tools outwards upwards protuberance 34 and the recess 35 of micro-tilted angle, to make in the recess 35 that plurality of fins 2 embeds between the two adjacent protuberances 34 on the barrel 11; And in fastener 3 outer rims prominent establish to offer with CPU substrate 1B go up the prominent trip 1B1 that the establishes prominent button 36 of the mortise 37 of buckle mutually, spread out to side from a prominent button 36 and establish lug 38, so that be made for fine setting during fastener for installing 3, move and draw or the handle of assembling and dismantling.Prominent button 36 can be made into has the elasticity angle of being convenient to be clipped on the CPU substrate 1B.
Conducting structure 6 is made of such as copper by the high material of heat conductivity, and it comprises heat conduction end plate 61, heat transfer plate 62 and refrigerant guide plate 63.
Heat conduction end plate 61 is affixed and seal up cylindrical shell 1 left end, constituting cylindrical shell 1 end plate (end plate), and coheres heat-conducting glue, but or the connection medium 1A of other heat conduction through fastener 3 mesopores 32 and CPU1C gluings.Heat conduction end plate 61 also can be established the protuberance 611 with the CPU1C Elastic Contact, producing buffer action, unlikelyly tightly squeezes, weighs wounded CPU1C.
As Fig. 1, shown in Figure 2, CPU 1C system is perpendicular to the liquid level of institute's can refrigerant 5 in the cylindrical shell 1, after CPU1C uses living heat, the heat of CPU 1C conducts heat by heat conduction end plate 61, the heat transfer plate 62 heating depositions refrigerant on the heat transfer plate 62 5 in barrel 11 that is connected through heat conduction end plate 61, make refrigerant 5 absorb heat of evaporation (heat of vaporization), cooperate in the cylindrical shell 1 and vacuumize, evaporation produces steam very easily at low temperatures, along centering guide 631 upwards ease rise, spray to barrel 11 until end 632 by aperture 633, cylindrical shell 1 follows protuberance 34 on the fastener 3 because of its periphery fin 2 is subjected to cooling fan 4 axially to blow the cold wind that drives, slightly-inclined is upwards outwards the guiding of the air-flow after the heat absorption, take away the unlikely CPU of blowing to 1C, thereby energy efficiently radiates heat, cause cooling surface in barrel 11, make refrigerant 5 steam condensations, discharge the heat of condensation (heat ofcondensation), be that its numerical value of a kind of latent heat (latent heat) is much larger than sensible heat (sensibleheat), the heat of condensation dissipates by cylindrical shell 1 barrel 11 and fin 2 immediately, and refrigerant 5 drops that condense descend by gravity along barrel 11, drip on oblique two flipper guides 634 that extend, and in base portion aperture 635 passes back into cylindrical shell 1 heat transfer plate 62 places of lower curtate, in this way, in case CPU 1C gives birth to heat, refrigerant 5 evaporations are formed steam, through condensing reflux, so, liquid, the vapour phase Automatic Cycle is distributed rapidly and effectively with the heat with CPU 1C, thereby is much better than the heating radiator of commonly using.
As Fig. 5, shown in Figure 6, CPU 1C system flatly is parallel to cylindrical shell 1 bottom refrigerant 5 liquid levels, it is heat conduction end plate 61, at this moment, heat conduction end plate 61 direct heat transfers give refrigerant 5 liquid that are deposited on heat conduction end plate 61 places, and make refrigerant 5 absorb heat of evaporation and form steam, and through 63 guidings of refrigerant guide plate, when its diffusion, when touching the cold wall of cylindrical shell 1, promptly be condensed, emit the heat of condensation, by fin 2 heat radiations of cylindrical shell 1 and periphery thereof, refrigerant 5 becomes liquid phase by vapour phase, go on the heat conduction end plate 61 of bottom by gravity drippage or drip, in this way, go round and begin again, circulate endlessly, effectively and apace the heat of CPU 1C is distributed.And make CPU 1C running operation smooth, it is overheated to avoid causing.As shown in Figure 5, when cylindrical shell 1 is vertical type, it is dirty that 14 of the dome-shaped arc end caps of cylindrical shell 1 help to guide the steam condensation to be cooled through barrel 11 downwards, and the outside also can reduce windage for fairshaped arc moulding, help cooling fan 4 cold wind circles to drive or aspirate along blowing.
Conducting structure 6 also can be one-body molded with cylindrical shell 1 in the utility model, and in the microprocessor for small-size computer, when little as if cooling heat, also can omit conducting structure 6.
Claims (12)
1, a kind of CPU (central processing unit) heating radiator, it comprises cooling fan; It is characterized in that group is provided with cylindrical shell, fastener and is placed in the interior refrigerant of shape cylindrical shell that is evacuated between cooling fan and the CPU (central processing unit); Cylinder body outer wall is connected with plurality of fins; Cylindrical shell one end connects CPU through fastener, and cooling fan is installed in the cylindrical shell other end.
2, CPU (central processing unit) heating radiator according to claim 1 is characterized in that described cylindrical shell content is provided with conducting structure; The contiguous fastener that connects cylindrical shell and CPU of one end of conducting structure, and cohere heat-conducting glue or other heat conduction connection medium and CPU gluing.
3, CPU (central processing unit) heating radiator according to claim 1 and 2 is characterized in that being connected with between the adjacent fin of described cylindrical shell and the barrel paddle blade of tool keyhole; Fastener has the mid-game portion that is connected and is provided with mesopore with cylindrical shell one end, be provided with most keyholes corresponding and sealed in mid-game portion with keyhole on the paddle blade, mid-game portion spaced around circular row is provided with most protuberances and recess, embeds in the recess between the two adjacent protuberances to make plurality of fins on the barrel; The fastener outer rim is prominent establish offer with the CPU substrate on the prominent trip of the establishing prominent button of the mortise of buckle mutually, spread out to side from a prominent button and to establish as fine setting, move and draw or the lug of the handle of assembling and dismantling.
4, CPU (central processing unit) heating radiator according to claim 2 is characterized in that described conducting structure comprises by the high material of heat conductivity to make heat conduction end plate, heat transfer plate and refrigerant guide plate; The heat conduction end plate is affixed and seal up an end of cylindrical shell connection fastener, constituting the cylindrical shell end plate, and through fastener mesopore and CPU gluing; Heat transfer plate be close to or be connected with in the cylindrical shell barrel and with heat conduction end plate quadrature; The refrigerant guide plate is connected with heat transfer plate and heat conduction end plate.
5, CPU (central processing unit) heating radiator according to claim 4 is characterized in that heat conduction end plate, heat transfer plate and the refrigerant guide plate of described conducting structure is one-body molded.
6, CPU (central processing unit) heating radiator according to claim 4, the refrigerant guide plate that it is characterized in that described conducting structure comprise from oblique two flipper guides that extend of heat transfer plate ora terminalis and are connected in the centering guide of two flipper guide ora terminalis with base portion; Centering guide is gradually pointed to cylinder inboard wall, and its tapered ends offers most end orifices; Centering guide base portion and two flipper guide intersections offer most base portion apertures.
7, CPU (central processing unit) heating radiator according to claim 1 is characterized in that the described liquid level of refrigerant that is placed in the cylindrical shell is vertical with CPU.
8, CPU (central processing unit) heating radiator according to claim 1 is characterized in that the described liquid level of refrigerant that is placed in the cylindrical shell is parallel with CPU.
9, CPU (central processing unit) heating radiator according to claim 1 is characterized in that described refrigerant is a water.
10, CPU (central processing unit) heating radiator according to claim 1 is characterized in that described cylindrical shell is stamped circular arch arc end cap away from the CPU end shield.
11, CPU (central processing unit) heating radiator according to claim 4 is characterized in that the heat conduction end plate of described conducting structure is established and the protuberance of CPU Elastic Contact with the generation buffer action.
12, CPU (central processing unit) heating radiator according to claim 3 is characterized in that described interval circular row is arranged at the outside angle of slightly-inclined upwards of protuberance tool around the fastener mid-game portion.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN 00263779 CN2456214Y (en) | 2000-12-06 | 2000-12-06 | CPU radiator |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN 00263779 CN2456214Y (en) | 2000-12-06 | 2000-12-06 | CPU radiator |
Publications (1)
Publication Number | Publication Date |
---|---|
CN2456214Y true CN2456214Y (en) | 2001-10-24 |
Family
ID=33618670
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN 00263779 Expired - Fee Related CN2456214Y (en) | 2000-12-06 | 2000-12-06 | CPU radiator |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN2456214Y (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN100410841C (en) * | 2001-11-21 | 2008-08-13 | 联想(北京)有限公司 | Heat sink of computer system |
CN109841363A (en) * | 2019-01-31 | 2019-06-04 | 中国人民解放军海军工程大学 | A kind of high-power vapor-cooling resistor and cooling means |
-
2000
- 2000-12-06 CN CN 00263779 patent/CN2456214Y/en not_active Expired - Fee Related
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN100410841C (en) * | 2001-11-21 | 2008-08-13 | 联想(北京)有限公司 | Heat sink of computer system |
CN109841363A (en) * | 2019-01-31 | 2019-06-04 | 中国人民解放军海军工程大学 | A kind of high-power vapor-cooling resistor and cooling means |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN111106411B (en) | Power battery module based on loop heat pipe and phase-change material coupling cooling | |
CN107846813B (en) | Heat dissipation device and heat dissipation method of charging pile and charging pile | |
CN101730449A (en) | Liquid cooling heat abstractor | |
CN2456214Y (en) | CPU radiator | |
CN1588267A (en) | Water cooling type CPU radiator | |
CN104990426A (en) | High-efficiency energy-saving evaporative condenser | |
CN2713641Y (en) | Heat sink | |
CN214841812U (en) | High-efficient heat dissipation condenser | |
CN2834122Y (en) | Remote wind-cooled micro-grooves phase change heat radiation system | |
CN2483756Y (en) | Biphase current conducting radiator for CPU | |
CN116242165A (en) | Efficient water-saving white-eliminating counter-current cooling tower | |
CN115164176A (en) | Heat dissipation type LED energy-saving mining lamp | |
CN111508915A (en) | Circulating evaporation heat dissipation chip cooling device | |
CN208187175U (en) | A kind of tumbler structure filler overflow cooling tower | |
CN219481602U (en) | Air-cooled tail condenser of evaporative crystallization equipment | |
CN2473668Y (en) | Two-way guide flow type radiator of central processing unit | |
CN105840495A (en) | Gear pump with heat tube | |
CN206582805U (en) | A kind of heat radiating type lamp driving | |
CN217430826U (en) | Evaporation separator | |
CN2872281Y (en) | Plastic air chamber of medium cooler | |
CN212676737U (en) | Heat dissipation mechanism of outdoor cabinet | |
CN219328337U (en) | Condenser | |
CN2629221Y (en) | Radiating device with plate type thermal tube | |
CN2627561Y (en) | Heat sink | |
CN216863680U (en) | Novel air cooling structure equipment |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C19 | Lapse of patent right due to non-payment of the annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |