CN2417470Y - Universal micro tunnel plate sensor for space detecting - Google Patents
Universal micro tunnel plate sensor for space detecting Download PDFInfo
- Publication number
- CN2417470Y CN2417470Y CN 00231959 CN00231959U CN2417470Y CN 2417470 Y CN2417470 Y CN 2417470Y CN 00231959 CN00231959 CN 00231959 CN 00231959 U CN00231959 U CN 00231959U CN 2417470 Y CN2417470 Y CN 2417470Y
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- microchannel
- inner sleeve
- space
- detecting
- sensor
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Abstract
The utility model discloses a universal microchannel plate sensor for space detecting, relating a universal sensor which is used in the field of space detecting. The utility model uses a microchannel plate as a detecting element can be used in different application aspects in the field of space directing, such as detecting low-energy charged particles, imaging ultraviolet in the space, imaging and detecting neutral atoms, etc. The utility model adopts an integrative structure design. The adoption of an inner sleeve material, an isolating encapsulation mode and a copper collar improves the characteristics of mechanical vibration and high voltage resistance of the sensor, ensures electrical contact evenness and prevents fire from being lighted under the condition of high voltage. An inner sleeve and an outer sleeve are provided with air holes, so the defect of vacuum-exhaust is overcome and the applied requirements of space detecting are more sufficiently satisfied.
Description
The utility model relates to the general a kind of sensor in space exploration field, it as detecting element, can be widely used in the different application direction in space exploration fields such as space low energy charged particle detection, space ultraviolet imaging, space neutral atom imaging and detection with microchannel plate.
As detecting element--microchannel plate to detected object sensitivities such as low energy charged particle, X ray, ultraviolet rays, be a kind of through high-temperature oxydation, reduction, the glass of the coated plumbous material of inside surface, generally be plate shaped, hundreds of millions of microchannels is arranged on it, and after the upper and lower surface of microchannel plate applied certain bias voltage, microchannel plate just had the function that the detected object of input is converted to electric impulse signal, and can amplify, double, form the manageable output signal of electronic system.Output signal is by positive plate, and perhaps the CCD device is gathered, and offers follow-up electronic system.In order to improve gain, microchannel plate needs two and stacks.As shown in Figure 1, A and B are two microchannel plates, and C is a positive plate, and such space exploration field that is combined in is employed, but can run into such as problems such as: drag vibration, High-Voltage Insulation, position shape change, vacuum exhaust are bad.
For addressing these problems, general way is: adopt little screw multi-point support between two microchannel plates, the way of ceramic bonding encapsulation fixes two microchannel plates, form the microchannel plate parts, positive plate parts and microchannel plate parts are again by the fixed coupling separately of mechanical way.Ceramic bonding encapsulation can improve the characteristic of detector drag vibration, also can guarantee High-Voltage Insulation, and still, the little screw between two microchannel plate glass is a multi-point support, discharges easily; And the relative position between two plates can reduce the accuracy of measuring because thereby vibration changes; Residual gas between two plates is difficult for discharging in the space, may cause infrabar vacuum discharge, also makes microchannel plate damaged easily; In addition, whole sensor is not integrated design, makes the distance of positive plate parts and microchannel plate parts coupling produce deviation, even can't reach requirement.These possible problems make the reliability of sensor reduce greatly, and very big difficulty takes place in the realization of space exploration.
The purpose of this utility model is to provide a kind of for the general integrally-built microchannel plate sensor of space exploration, it can solve problems such as mechanics vibration, High-Voltage Insulation, a position shape are fixed, vacuum exhaust effectively, satisfies the requirement of space exploration applications more fully.
The utility model is made up of circumferential butt, outer sleeve, inner sleeve, copper ring, two microchannel plates, positive plate, pore, lead-in wires.The utility model method for making is; At first positive plate is installed in the lower grooves of inner sleeve, fixes with screw, blended rubber seals admittedly, and lead-in wire is drawn; Two microchannel plates are installed in the upper grooves of inner sleeve in proper order, between two microchannel plates, copper ring are installed, seal admittedly, draw lead-in wire with silicon rubber; Inner sleeve is installed in the outer sleeve, is screwed; Upper cover plate is installed on the upper surface of inner and outer sleeves, between upper cover plate and two microchannel plates, copper ring is housed; On inner and outer sleeves, have pore; The material of outer sleeve is an aluminium, and inner sleeve is made by polyimide, for microchannel plate parts and positive plate parts provide installed surface;
Specify structure of the present utility model below in conjunction with Fig. 2; 1 circumferential butt, 2 outer sleeves, 3 inner sleeves, 4 copper rings, 5 and 6 microchannel plates, 7 positive plates, 8 pores, 9 lead-in wires, the inner sleeve above and below is provided with the installation groove, for microchannel plate parts and positive plate parts provide installed surface; Installation of the present utility model at first is installed on positive plate 7 in the lower grooves of inner sleeve 3, fixes with screw, and seals admittedly with silicon rubber, will go between 9 to draw; Two microchannel plates are installed in the upper grooves of inner sleeve in proper order, between two microchannel plates, copper ring are installed, seal admittedly, draw lead-in wire with glue; Inner sleeve is installed in the outer sleeve, is screwed; Upper cover plate is installed on the upper surface of inner and outer sleeves, between upper cover plate and two microchannel plates, copper ring is housed; On inner and outer sleeves, have pore; The material of outer sleeve is an aluminium, and inner sleeve is made by polyimide,
The utility model has adopted the use with insulation package and copper ring of selecting for use of integrated structure design, inner sleeve material, makes sensor mechanics vibration characteristics, the high pressure resistant property to strengthen greatly; Assurance electrically contacts evenly, prevents high voltage arc; And play the effect of support, the possibility of closely installing is provided; On inner and outer sleeves, have pore, overcome the deficiency of vacuum exhaust, satisfy the requirement of space exploration applications more fully.
Most preferred embodiment of the present utility model is: be made up of circumferential butt 1, outer sleeve 2, inner sleeve 3, copper ring 4 microchannel plates 5 and 6, positive plate 7, pore 8, lead-in wire 9.Installation of the present utility model describes in detail in conjunction with figure (2): at first positive plate is installed in the lower grooves of inner sleeve 3, fixes with screw, blended rubber seals admittedly, will go between 9 to draw; Two microchannel plates are installed in the upper grooves of inner sleeve in proper order, between two microchannel plates, note copper ring is installed, seal admittedly, draw lead-in wire with glue; Inner sleeve is installed in the outer sleeve, is screwed; Upper cover plate is installed on the upper surface of inner and outer sleeves, between upper cover plate and two microchannel plates, copper ring is housed; On outer sleeve, have pore; The material of outer sleeve is an aluminium, and inner sleeve is made by polyimide, for microchannel plate parts and positive plate parts provide installed surface; In thickness the best of copper ring between the microchannel plate and between microchannel plate and the upper cover plate is 0.1mm, all is equipped with pore on the inner and outer sleeves, to guarantee the requirement of vacuum degassing.
Claims (3)
1, the general microchannel plate sensor of a kind of space exploration, it is characterized in that forming by circumferential butt, outer sleeve, inner sleeve, copper ring, two microchannel plates, positive plate, pore, lead-in wires, positive plate is installed in the lower grooves of inner sleeve, fix with screw, blended rubber seals admittedly, and lead-in wire is drawn; Two microchannel plates are installed in the upper grooves of inner sleeve in proper order, between two microchannel plates, copper ring are installed, seal admittedly, draw lead-in wire with silicon rubber; Inner sleeve is installed in the outer sleeve, is screwed; Upper cover plate is installed on the upper surface of inner and outer sleeves, between upper cover plate and two microchannel plates, copper ring is housed; On inner and outer sleeves, have pore.
2, by the general microchannel plate sensor of the described space exploration of claim 1, it is characterized in that copper ring thickness is 0.1mm.
3, by the general microchannel plate sensor of the described space exploration of claim 1, it is characterized in that the material of outer sleeve is an aluminium, inner sleeve is made by polyimide, and provides installed surface for microchannel plate parts and positive plate parts.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN 00231959 CN2417470Y (en) | 2000-03-21 | 2000-03-21 | Universal micro tunnel plate sensor for space detecting |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN 00231959 CN2417470Y (en) | 2000-03-21 | 2000-03-21 | Universal micro tunnel plate sensor for space detecting |
Publications (1)
Publication Number | Publication Date |
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CN2417470Y true CN2417470Y (en) | 2001-01-31 |
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN 00231959 Expired - Fee Related CN2417470Y (en) | 2000-03-21 | 2000-03-21 | Universal micro tunnel plate sensor for space detecting |
Country Status (1)
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CN (1) | CN2417470Y (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102478660A (en) * | 2010-11-26 | 2012-05-30 | 中国科学院大连化学物理研究所 | Modular charged particle two-dimensional imaging detector |
CN103698800A (en) * | 2013-11-29 | 2014-04-02 | 兰州空间技术物理研究所 | Modularized space charged particle detector |
CN104567946A (en) * | 2015-01-22 | 2015-04-29 | 清华大学 | Micro-channel plate detector and photon, electron and ion imaging detector |
CN106610501A (en) * | 2015-10-26 | 2017-05-03 | 中国科学院国家空间科学中心 | Compact push-broom geospace neutral atom observation device |
-
2000
- 2000-03-21 CN CN 00231959 patent/CN2417470Y/en not_active Expired - Fee Related
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102478660A (en) * | 2010-11-26 | 2012-05-30 | 中国科学院大连化学物理研究所 | Modular charged particle two-dimensional imaging detector |
CN102478660B (en) * | 2010-11-26 | 2013-07-24 | 中国科学院大连化学物理研究所 | Modular charged particle two-dimensional imaging detector |
CN103698800A (en) * | 2013-11-29 | 2014-04-02 | 兰州空间技术物理研究所 | Modularized space charged particle detector |
CN103698800B (en) * | 2013-11-29 | 2016-08-17 | 兰州空间技术物理研究所 | A kind of modular space charged particle detector |
CN104567946A (en) * | 2015-01-22 | 2015-04-29 | 清华大学 | Micro-channel plate detector and photon, electron and ion imaging detector |
CN106610501A (en) * | 2015-10-26 | 2017-05-03 | 中国科学院国家空间科学中心 | Compact push-broom geospace neutral atom observation device |
CN106610501B (en) * | 2015-10-26 | 2019-01-25 | 中国科学院国家空间科学中心 | A kind of terrestrial space neutral atom observation device of compact push-broom type |
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C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C19 | Lapse of patent right due to non-payment of the annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |