CN2414532Y

CN2414532Y - Miniature laser module

Info

Publication number: CN2414532Y
Application number: CN 00205174
Authority: CN
Inventors: 陈胜和
Original assignee: Individual
Current assignee: Individual
Priority date: 2000-02-16
Filing date: 2000-02-16
Publication date: 2001-01-10
Anticipated expiration: 2010-02-16

Abstract

The utility model relates to a miniature laser module, which comprises a metal seat, a circuit board, a copper pole and a flat cover plate. The utility model is characterized in that an opening on the front end of the metal seat is provided with a guide slot for inserting the circuit board; the circuit board is provided with a laser diode under which is provided with a hole, the internal surface of which is provided with a copper foil for arranging the copper pole; the opposite position to the laser diode is provided with a light diode; both sides of the circuit board are provided with a plurality of through holes for jointing the flat cover plate; the radiation of a working heat source of the laser diode can be completed by not only the copper foil on the circuit board, but also the copper foil on the copper pole and the hole with the copper foil.

Description

A kind of miniature laser module

The utility model relates to a kind of miniature laser module, refers to a kind of miniature laser modular structure that can make the excellent in heat dissipation effect of Laser Diodes when work especially.

At present, existing laser modular structure (as shown in Figure 1), it is made up of normalized Laser Diodes 60, diode metal pedestal 65, eyeglass crown cap 70, eyeglass 75 and drive circuit board 80.Because of it uses normalized Laser Diodes 60, it to be installed on the diode metal pedestal 65, lock the eyeglass crown cap 70 that includes eyeglass 75 again, and be welded on the drive circuit board 80, make the limited circle that is of overall structure volume, and can not microminiaturization and being applied in the less or mechanism than book of volume of book shapeization, and its manufacturing cost height, when taking a lot of work.

Or a SMD laser modular structure that adopts the IC packing technique to make is arranged, it is complicated on processing procedure, and acceptance rate is difficult for improving.

Other has a ultra-small semiconductor laser devices, as the Taiwan notification number: 356312, it is combined into by laser emitter, sleeve pipe, spring, lens, wherein:

The laser emitter is made of base body, luminosity detector, wafer, protective cap, this base body is to be one discoid, the face of base body is provided with wafer and luminosity detector, base body is provided with the outward extending lead foot of plural number, can be installed with protective cap on the face of base body, the center of protective cap inside is provided with an eyeglass, in the protective cap with base body through processing mutual bonding composition laser emitter, but this laser emitter fit cannula tip;

Sleeve pipe, this sleeve pipe are the hollow tubes for arbitrary shape, and its front end does not have glue hole more at least, and this glue hole can be made a glue and use;

Adjust spring, this adjustment spring can be sleeved on the outer rim of protective cap on the base body;

Lens, these lens can place the front end of adjusting spring;

The base body of combining the above-mentioned member laser emitter of group can be bonded in its sleeve pipe one end processing on its base body via bonding; it is identical with its base body external profile diameter size to it is characterized by this casing diameter size; and it adjusts the outer rim that spring can be sleeved on protective cap on the pedestal; lens are placed the front end of adjusting spring; adjust with the elastic force displacement lens of adjusting spring; after must focussing distance via being adjusted to; some glue hole by the sleeve pipe front end utilizes some glue mode that its lens point glue bond is fixed in the front end of sleeve pipe again, and becomes the ultra-small semiconductor laser devices.

The manufacturing cost height of the type device, and when taking a lot of work, simultaneously, this Laser Diodes can produce macro-energy when operating current is big, causes the Laser Diodes characteristic rotten, and can not use.

The purpose of this utility model provide a kind of make Laser Diodes in the excellent in heat dissipation effect in when work, be easy to produce, and can significantly reduce worker the time and reduce cost and can be installed on the miniature laser module that volume is less and thin type mechanism uses.

For achieving the above object, the utility model is taked following design: a kind of miniature laser module, a circuit substrate is arranged, and it is characterized in that: which is provided with at least one Laser Diodes, be positioned at each Laser Diodes below, have an inner face to contain the hole of Copper Foil; Be provided with at least one copper post, it is engaged in the hole respectively; Be provided with a cover plate, it covers on the circuit substrate, and its inner face is with respect to Laser Diodes;

By this, the work thermal source that makes Laser Diodes also can go out via the Copper Foil dissipation in copper post, the hole except the heat radiation of Copper Foil on circuit substrate.

On the relative position of the Laser Diodes of circuit substrate, can be provided with a near-infrafed photodiodes; and the both sides at circuit substrate can be respectively equipped with through hole; engage for a flat cover plate; this cover plate can be a flat plastic cement shell; the inner face of this flat cover plate is to put Laser Diodes and near-infrafed photodiodes relatively, with as protection Laser Diodes and near-infrafed photodiodes.

Be provided with one and be the hollow metal seat, most guide grooves that the base board of not powering on the position of metal pedestal front openings is chimeric; Metal pedestal can be tubular or be thin type.

The utility model is described in further detail below in conjunction with accompanying drawing.

Fig. 1 is the exploded view of existing laser modular structure

Fig. 2 is an exploded view of the present utility model

Fig. 3 is a constitutional diagram of the present utility model

Fig. 4 is another embodiment constitutional diagram of the utility model

See also Fig. 2, shown in Figure 3, a kind of miniature laser module, it comprises member units such as a metal pedestal 1, a circuit substrate 2 and a flat cover plate 3; Wherein:

Metal pedestal 1 slightly is tubular, and all discs in its outside are provided with screw thread 11, and are provided with two symmetrical guide grooves 12 on metal pedestal 1 front openings, and power supply base board 2 is thereon chimeric.

Circuit substrate 2 is provided with a Laser Diodes 21, the relative position of Laser Diodes 21 is provided with a near-infrafed photodiodes 22, this near-infrafed photodiodes 22 is light beams of accepting from the ejaculation of Laser Diodes 11 rears, be used for detecting the power of light beam, assisting a ruler in governing a country an automated power balancing circuitry, promptly can reach the self balancing purpose of power.Certainly, also can not use near-infrafed photodiodes 22, only need assist a ruler in governing a country the circuit of a constant current source, can reach purpose with current drives, and be respectively equipped with most through holes 23 in the both sides of circuit substrate 2, be embedded in for a flat cover plate 3, and under Laser Diodes 11, then be provided with the hole 24 that an inner face contains Copper Foil, be installed with on it for a bronze medal post 4, the thermal source of this Laser Diodes 21 when work the Copper Foil heat radiation, also can be gone out via the Copper Foil dissipation in copper post 4, the hole 24 on seeing through circuit substrate 2.

Flat cover plate 3; slightly be a ㄇ shape; its both sides root edge does not have most projections 31 respectively; to engage with the through hole 23 of circuit substrate 2; and the inner face that makes this flat cover plate 3 is with respect to Laser Diodes 21, near-infrafed photodiodes 22; make this flat cover plate 3 can reflect light beam, and make this near-infrafed photodiodes 22 can be received from the light beam that send at Laser Diodes 21 rears effectively, and reach protection laser and near-infrafed photodiodes crystal grain and electrode cable thereof from Laser Diodes 21 rear dissipations.

See also Fig. 4, metal pedestal 1 of the present utility model also can be thin type.

In sum, see through the improvement design of microminiaturization structure of the present utility model, do one relatively with existing laser module set structure, have following advantage:

(1), since the work thermal source of this Laser Diodes on seeing through circuit substrate, the Copper Foil heat radiation, also can Go out via the Copper Foil dissipation in copper post, the hole, so, the rotten facts of Laser Diodes can not take place.

(2), mechanism that it is installed on small volume and thin type is used, and needn't use the standard bag of T0-18 Dress is to reach the purpose that significantly reduces cost.

(3), on processing procedure, be easy to produce, and can significantly reduce worker the time and cost.

Claims

1, a kind of miniature laser module has a circuit substrate, it is characterized in that: which is provided with at least one Laser Diodes, be positioned at each Laser Diodes below, have an inner face to contain the hole of Copper Foil; Be provided with at least one copper post, it is engaged in the hole respectively; Be provided with a cover plate, it covers on the circuit substrate, and its inner face is with respect to Laser Diodes.

2, miniature laser module according to claim 1, it is characterized in that: the both sides at circuit substrate can be respectively equipped with through hole.

3, miniature laser module according to claim 1 is characterized in that: cover plate can be a flat plastic cement shell.

4, miniature laser module according to claim 1 is characterized in that: can be provided with a near-infrafed photodiodes on the relative position of the Laser Diodes of circuit substrate.

5, miniature laser module according to claim 1 is characterized in that: be provided with one and be the hollow metal seat, most guide grooves that the base board of not powering on the position of metal pedestal front openings is chimeric.

6, miniature laser module according to claim 5, it is characterized in that: metal pedestal can be tubular.

7, miniature laser module according to claim 5, it is characterized in that: metal pedestal can be thin type.