CN2388903Y - High-efficiency refrigerating semiconductor cooling liner - Google Patents
High-efficiency refrigerating semiconductor cooling liner Download PDFInfo
- Publication number
- CN2388903Y CN2388903Y CN 99242575 CN99242575U CN2388903Y CN 2388903 Y CN2388903 Y CN 2388903Y CN 99242575 CN99242575 CN 99242575 CN 99242575 U CN99242575 U CN 99242575U CN 2388903 Y CN2388903 Y CN 2388903Y
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- China
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- cooling chamber
- water
- cold
- cup
- refrigeration
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- Expired - Fee Related
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- Devices That Are Associated With Refrigeration Equipment (AREA)
Abstract
The utility model relates to a high-efficiency refrigerating semiconductor cooling liner, comprising a cooling chamber, a refrigeration transmission component, a semiconductor refrigeration component and a radiator. The refrigeration transmission component is installed on the chamber wall of the cooling chamber. A water inlet and a water outlet are arranged on the chamber wall of the cooling chamber. A diversion plate which separates the cooling chamber into two or more different regions where water temperatures are different is arranged in the cooling chamber. Passages are arranged between adjacent regions. The water inlet and the water outlet are respectively communicated with the region whose temperature is the highest and the region whose temperature is the lowest. The utility model makes the speed of heat exchange quick and the refrigerating capacity of the cooling liner is considerably improved.
Description
The utility model belongs to the cold courage of a kind of refrigeration, and what be specifically related to is the cold courage of a kind of semiconductor refrigerating water dispenser.
The cold courage of semiconductor refrigerating water dispenser in the market, its cooling chamber is an integral body, it all is to place water simply that used refrigeration passes cold, do not consider the flow path of water in cooling chamber that will be cooled, make the normal-temperature water that just enters cooling chamber with in cooling chamber the cooling water through refrigeration mix, cause the temperature difference between cold of water and refrigeration biography few, thereby reduced exchange rate, make refrigerating capacity few, be generally below 0.7 liter/hour.
The purpose of this utility model is at the above problem, provides the high semiconductor of a kind of refrigerating efficiency cold courage.
The purpose of this utility model is achieved in that the utility model comprises cooling chamber, refrigeration transmission parts, semiconductor refrigerating element and radiator, the refrigeration transmission parts is installed on the cooling chamber locular wall, on the cooling chamber locular wall, offer inlet opening and apopore, in cooling chamber, be provided with the branch water plate that cooling chamber is divided into the different zone of two or more water temperatures, leave passage between adjacent area, inlet opening and apopore communicate with the zone that temperature is the highest and temperature is minimum respectively.
Technique effect of the present utility model is: owing to be provided with branch water plate in cooling chamber, the water of different temperatures is kept apart to a certain extent, the firm like this normal-temperature water that enters in the cooling chamber can not all be mixed with the cooling water that has freezed, the water of deriving from apopore is the minimum water of temperature, rather than mixing water, the low water of temperature after rolling, the water of staying in the cooling chamber is the high water of temperature, the temperature difference between water and refrigeration transmission parts is big like this, rate of heat exchange is fast, and the refrigerating capacity of cold courage has obtained improving greatly.
The utility model is described in further detail below in conjunction with drawings and Examples.
Fig. 1 is the assembly structure schematic diagram of the utility model embodiment side-looking.
Fig. 2 is the assembly structure schematic diagram that the utility model embodiment overlooks.
As depicted in figs. 1 and 2, embodiment of the present utility model comprises cooling chamber, as the cold cup 1 of the biography of refrigeration transmission parts, semiconductor refrigerating element 2 and radiator 3, the locular wall of cooling chamber is by inner casing 4, shell 5 and middle heat-insulation layer 6 constitute, on the cooling chamber locular wall, offer and pass cold cup installing hole, inlet opening 7, the mudhole of using when apopore 8 and cleaning 9, in passing cold cup installing hole, four positioning boss 10 are arranged, on the cold cup 1 of biography, four locating slots 11 are arranged, passing cold cup 1 is fixed in the cold cup of the biography installing hole by locating slot 11 and positioning boss 10, make the cold cup 1 of biography can not radially rotate and in cooling chamber, move vertically, the cold cup 1 of biography is not rocked in installing hole when mounted, pass between cold cup 1 and installing hole inwall silica gel circle 12 is housed, doing sealing uses, passing the cold cup cup end is close to the huyashi-chuuka (cold chinese-style noodles) of semiconductor refrigerating element 2, and the hot side of semiconductor refrigerating element 2 is close to radiator 3, fan 13 is installed on the radiator 3, be used for strengthening the heat radiation of radiator 3, radiator 3 is fixed on the cooling chamber locular wall by screw, the cold cup 1 of biography can not outwards be moved vertically, also make the huyashi-chuuka (cold chinese-style noodles) and the radiator 3 that pass cold cup 1 bottom and semiconductor refrigerating element 2 tightr, be beneficial to the conduction of heat with the applying of semiconductor refrigerating element 2 hot sides.In aforementioned cooling chamber, be provided with branch water plate 14, cooling chamber be divided into two, divide the water plate 14 horizontal inserting in two locating slots 11 that pass cold cup 1 horizontal direction, around it with cooling chamber inwall fluid-tight engagement, just and pass 1 glass in cold cup at the bottom of between leave a passage; Inlet opening 7 is positioned on the top of cooling chamber, apopore 8 is positioned at the side of cooling chamber, is connected to guiding gutter 15 with supersonic welding on the cooling chamber inwall, and the lower end of guiding gutter 15 is positioned at the cooling chamber bottom, its upper end picks out water hole 8, makes water flow to apopore 8 from the cooling chamber bottom.
The cold courage of present embodiment is divided into two cooling chamber by minute water plate 14, top is the high-temperature region, the bottom is a low-temperature space, minute water plate 14 and transmit the minimum part of cup 1 temperature promptly cup leave passage between the end, the water that will cool off from the inlet opening 7 can not be at once when flowing into cooling chambers and chilled water all mix, the water that will cool off will enter low-temperature space, must be through undue water plate 14 and the passage that forms between at the bottom of passing 1 glass in cold cup, like this temperature high water by passing the minimum position of cold cup 1 temperature, temperature difference maximum between the two, rate of heat exchange is fast, thereby improve the refrigerating capacity of cold courage, and apopore 8 links to each other with the cooling chamber bottom by guiding gutter 15, what at first go out during cold courage water outlet is the low water of temperature, rather than mixing water, the low water of temperature after rolling, the water of staying in the cooling chamber is the high water of temperature, water is big with the temperature difference of cold glass 1 of biography like this, rate of heat exchange is fast, and the refrigerating capacity of cold courage can be brought up to more than 0.85 liter/hour.
It is also passable not establish guiding gutter 15 in the above-described embodiments, but apopore 8 should be changed into the cooling chamber bottom, is positioned at low-temperature space.
Cooling chamber of the present utility model also can be designed to be separated into the different zone of a plurality of water temperatures by a minute water plate, leave passage between adjacent area, inlet opening and apopore communicate with the zone that temperature is the highest and temperature is minimum respectively, so it is described that the design of branch water plate is not limited to top embodiment, the refrigeration transmission parts also can adopt refrigeration transmission block or refrigeration transmission sheet etc.
Claims (3)
1. cold courage of highly effective refrigeration semiconductor, comprise cooling chamber, refrigeration transmission parts, semiconductor refrigerating element (2) and radiator (3), the refrigeration transmission parts is installed on the cooling chamber locular wall, on the cooling chamber locular wall, offer inlet opening (7) and apopore (8), it is characterized in that: in cooling chamber, be provided with the branch water plate (14) that cooling chamber is divided into the different zone of two or more water temperatures, leave passage between adjacent area, inlet opening (7) and apopore (8) communicate with the zone that temperature is the highest and temperature is minimum respectively.
2. the cold courage of highly effective refrigeration semiconductor according to claim 1, it is characterized in that: described refrigeration transmission parts is for passing cold cup (1), two locating slots (11) that horizontal direction is arranged on the wall of cup that passes cold cup (1), described minute horizontal the inserting in the locating slot (11) of water plate (14), around it with cooling chamber inwall fluid-tight engagement, only and pass cold cup (1) cup and leave a passage between end.
3. the cold courage of highly effective refrigeration semiconductor according to claim 2 is characterized in that: guiding gutter (15) also is installed on the cooling chamber inwall, and the lower end of guiding gutter (15) is positioned at the cooling chamber bottom, and its upper end picks out water hole (8).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 99242575 CN2388903Y (en) | 1999-08-27 | 1999-08-27 | High-efficiency refrigerating semiconductor cooling liner |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 99242575 CN2388903Y (en) | 1999-08-27 | 1999-08-27 | High-efficiency refrigerating semiconductor cooling liner |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN2388903Y true CN2388903Y (en) | 2000-07-26 |
Family
ID=34029152
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 99242575 Expired - Fee Related CN2388903Y (en) | 1999-08-27 | 1999-08-27 | High-efficiency refrigerating semiconductor cooling liner |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN2388903Y (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107787196A (en) * | 2015-07-03 | 2018-03-09 | 雀巢产品技术援助有限公司 | Fluid foaming machine |
-
1999
- 1999-08-27 CN CN 99242575 patent/CN2388903Y/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107787196A (en) * | 2015-07-03 | 2018-03-09 | 雀巢产品技术援助有限公司 | Fluid foaming machine |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| ASS | Succession or assignment of patent right |
Owner name: LONGNIAN ELECTRONICS ( SHENZHEN ) CO., LTD. Free format text: FORMER OWNER: CORRECT XIONG ELECTRONIC ( SHENZHEN ) CO., LTD. Effective date: 20061110 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| C56 | Change in the name or address of the patentee |
Owner name: CORRECT XIONG ELECTRONIC ( SHENZHEN ) CO., LTD. Free format text: FORMER NAME OR ADDRESS: ZHENGXIONG ELECTRONIC CO., LTD., SHENZHEN |
|
| CP03 | Change of name, title or address |
Address after: 518053 \u3001 1 factory buildings, D Industrial Zone, east of overseas Chinese, Shenzhen, Guangdong Patentee after: ZHENGXIONG ELECTRONIC (SHENZHEN) Co.,Ltd. Address before: 518053 \u3001 1 factory buildings, D Industrial Zone, east of overseas Chinese, Shenzhen, Guangdong Patentee before: ZHENGXIONG ELECTRONIC Co.,Ltd. SHENZHEN |
|
| TR01 | Transfer of patent right |
Effective date of registration: 20061110 Address after: 518102 Guangdong Province, Shenzhen city Baoan District West Village Township Lequn Xingye Road Patentee after: Laurina Electronic (Shenzhen) Co.,Ltd. Address before: 518053 1 factory buildings, D Industrial Zone, east of overseas Chinese, Shenzhen, Guangdong Patentee before: ZHENGXIONG ELECTRONIC (SHENZHEN) Co.,Ltd. |
|
| C19 | Lapse of patent right due to non-payment of the annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |