CN2388524Y - Semiconductor warm air-conditioning device - Google Patents

Semiconductor warm air-conditioning device Download PDF

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Publication number
CN2388524Y
CN2388524Y CN 98246854 CN98246854U CN2388524Y CN 2388524 Y CN2388524 Y CN 2388524Y CN 98246854 CN98246854 CN 98246854 CN 98246854 U CN98246854 U CN 98246854U CN 2388524 Y CN2388524 Y CN 2388524Y
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CN
China
Prior art keywords
heating
utility
model
heating liquid
air
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN 98246854
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Chinese (zh)
Inventor
陈和昭
陈雄国
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Individual
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Individual
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Publication date
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Priority to CN 98246854 priority Critical patent/CN2388524Y/en
Application granted granted Critical
Publication of CN2388524Y publication Critical patent/CN2388524Y/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Abstract

The utility model relates to a semiconductor warm air-conditioning device, which comprises a heating liquid tank, a pressure device, a heating device, a heat radiator, heating liquid and an air exhaust fan. The utility model is characterized in that the liquid tank, the pressure device, the heating device and the heat radiator are coupled into a closed loop in turn through conduit pipes, heating liquid flows in the closed loop, and hot air is exhausted from the air exhaust fan; heating liquid is a kind of aqueous solution, and the maximum heating temperature is below the boiling point of heating liquid. The utility model adopts electric semiconductor material as heat source. The utility model has the advantages of high efficiency, electricity saving, no environmental pollution, rapid temperature raising, etc. Owing to simple structure and small complete machine size, installation is also very convenient. Since the utility model does not adopt the manner of high-heat baking, oxygen and moisture content in air is not affected.

Description

A kind of semiconductor warm air adjusting device
The utility model relates to a kind of warm air adjusting device.
Existing warm air adjusting device has following a few class: a class is the cooling and heating air conditioner that utilizes fluorine Lyons to make, and is made of indoor, off-premises station, and volume is big, and inconvenience is installed.Because there is destruction in fluorine Lyons to atmospheric environment, world environmental protection organization is forbidding its use, and this class device will progressively be eliminated.Another kind of device is that the employing coal is a fuel, and heating boiler produces steam, and the heat that is come out when utilizing heat steam by radiator improves indoor temperature.Because this class device is fuel with the coal, must cause environmental pollution, hold up thousands of chimneys in the big city to airborne release waste gas, heavy damage environment, have influence on the people's normal life.Also having a kind of is to utilize quartz ampoule or resistance wire energising heating, and air is carried out high-temperature baking, and this unit efficiency is low, and power consumption is big, and will cause oxygen content and water content decline in the air, and the people is felt under the weather.
The purpose of this utility model is to disclose a kind of novel warm air adjusting device.
The purpose of this utility model is achieved in that this device makes pyrotoxin with the semi-conductor electricity hot material, and whole device comprises heating liquid case, pressue device, heater, radiator, heating fluid and exhaust fan.It is characterized in that: fluid box, pressue device, heater, radiator connect to a closed loop successively by conduit, and heating fluid flows in this closed loop, and hot-air is discharged by exhaust fan; Heating fluid is a kind of aqueous solution, and the heating maximum temperature is under its boiling point.
Operation principle of the present utility model is such: heating fluid flows out from the heating liquid case, enters pressue device, enters heater after pressurized, and fluid temperature is raise, and enters the conduit of radiator again, flows in conduit.Heating liquid is in the radiator duct flow process, and heat is shed by the fin of radiator, the circumference air, and by exhaust fan hot gas is discharged outside the machine, indoor temperature is raise.Heating liquid is flowed through behind the radiator, and the temperature step-down flows back to the heating liquid case again, finishes a circulation.So continuous circulation constantly adds hot-air, reaches the temperature that improves whole space.
The utility model is compared with other warm air device, and following outstanding advantage is arranged:
1, owing to adopt the semi-conductor electricity hot material to make pyrotoxin, the efficient height economizes on electricity, and environment is not polluted.
2, temperature raises fast.
3, simple in structure, machine volume is little, and it is very convenient to install.
4, owing to be not to adopt high heat, airborne oxygen content and water content are not impacted the mode that air toasts.
Fig. 1 is example structure figure;
Illustrate:
1, heating liquid case, 2, pressue device, 3, heater, 3 (1), the semi-conductor electricity hot material, 4, radiator, 5, exhaust fan, 6, heating fluid, 7, hot-air.
Example structure is simple, is not described further.Pressue device among Fig. 1 (2), radiator (4) all can adopt the existing universal product.

Claims (2)

1, a kind of semiconductor warm air adjusting device, comprise heating liquid case, pressue device, heater, radiator, heating fluid and exhaust fan, it is characterized in that: described fluid box, pressue device, heater, radiator connect to a closed loop successively by conduit; Exhaust fan is installed in the radiator next door.
2, a kind of semiconductor warm air adjusting device according to claim 1, it is characterized in that: used heating fluid is a kind of aqueous solution, the heating maximum temperature is under its boiling point.
CN 98246854 1998-11-18 1998-11-18 Semiconductor warm air-conditioning device Expired - Fee Related CN2388524Y (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN 98246854 CN2388524Y (en) 1998-11-18 1998-11-18 Semiconductor warm air-conditioning device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN 98246854 CN2388524Y (en) 1998-11-18 1998-11-18 Semiconductor warm air-conditioning device

Publications (1)

Publication Number Publication Date
CN2388524Y true CN2388524Y (en) 2000-07-19

Family

ID=33992175

Family Applications (1)

Application Number Title Priority Date Filing Date
CN 98246854 Expired - Fee Related CN2388524Y (en) 1998-11-18 1998-11-18 Semiconductor warm air-conditioning device

Country Status (1)

Country Link
CN (1) CN2388524Y (en)

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Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
C19 Lapse of patent right due to non-payment of the annual fee
CF01 Termination of patent right due to non-payment of annual fee