CN2289318Y

CN2289318Y - Coaxial enclosed semiconductor laser subassembly

Info

Publication number: CN2289318Y
Application number: CN 95229575
Authority: CN
Inventors: 王勇
Original assignee: Shenzhen Photon Technology Co ltd
Current assignee: Shenzhen Photon Technology Co., Ltd.
Priority date: 1995-12-20
Filing date: 1995-12-20
Publication date: 1998-08-26
Anticipated expiration: 2005-12-20

Abstract

The utility model relates to a coaxial enclosed semiconductor laser subassembly, comprising a laser subassembly 1 enclosed by TO-46, a laser coaxial bracket 2 which is tightly matched with the laser subassembly, a self-focusing lens 3, a single-mode optical fiber 4, an optical fiber bracket 5, a self-focusing lens bracket and an optical fiber system bracket 6, wherein, the laser subassembly 1, the self-focusing lens 3 and the single mode optical fiber 4 are on the same coaxial line and respectively positioned on the left part, the middle part and the right part of the coaxial enclosed semiconductor laser subassembly; the end part of the single-mode optical fiber 4 is grinded into an inclined plane which forms an included angle with an axial line from six degrees to twelve degrees by using a silicon carbide paper and than is penetrated in a small hole of the middle part of the optical fiber bracket 5 which is processed accurately; the self-focusing lens 3 and the optical fiber bracket 5 are fixed in the inner walls of the self-focusing lens and the optical fiber system bracket 6.

Description

The semiconductor laser elements of coaxial packaging

The utility model relates to the photoelectron technology field, relates in particular to a kind of semiconductor laser elements of coaxial packaging.

Semiconductor laser is to utilize GRIN Lens to realize the optical coupling of semiconductor laser and monomode fiber, and its coupling efficiency can artificially be controlled on a large scale, and the coupling range of tolerable variance is wide.The operation principle of its optical system is by shown in Figure 1.The light that the laser on the left side sends has certain emissivity, after the GRIN Lens of centre is assembled light beam, the core diameter on coupling input the right is in the monomode fiber of 6-9 μ m, its coupling efficiency can be adjusted by object distance, the image distance of GRIN Lens system, and its high coupling efficiency can reach more than 40%.Domestic semiconductor laser generally adopts dual in-line package technology at present, and this encapsulation technology is directly made tapered lens on monomode fiber, be coupled with laser alignment again.Technique for fixing then adopts the laser welding of non-coaxial configuration or scolder welding to fix, this dual in-line package technical matters more complicated, and cost is also higher.

The purpose of this utility model is to avoid above-mentioned the deficiencies in the prior art part and provides a kind of technology simple, reliability height, the semiconductor laser elements that cost is low.

The purpose of this utility model can reach by following measure: make a kind of coaxial packaging semiconductor laser, comprise laser assembly, GRIN Lens, monomode fiber, laser coaxial support, structure of fiber_optic and GRIN Lens, the fibre system support of TO-46 encapsulation; Laser assembly, GRIN Lens, the monomode fiber three coaxial line of TO-46 encapsulation, lay respectively at left part, middle part and the right part of coaxial packaging semiconductor laser elements, distance between them is determined with the imaging relations formula of GRIN Lens according to the power output size requirements of assembly; TO-46 encapsulated laser assembly linked to each other with close joining of laser coaxial support, and monomode fiber penetrates the aperture in the middle of accurately machined structure of fiber_optic; GRIN Lens and structure of fiber_optic are fixed on the inwall of GRIN Lens, fibre system support; The coaxial connection between coaxial stents and GRIN Lens, the fibre system.

The drawing of accompanying drawing is described as follows;

Fig. 1 is the optical system schematic diagram of laser diode module.

Fig. 2 is the structure chart of coaxial packaging semiconductor laser elements.

Fig. 3 is a structure chart of making coaxial packaging semiconductor laser elements special fixture.

Fig. 4 be coaxial lotus root close when encapsulation special fixture and semiconductor laser elements between the position relation

Schematic diagram.

Below in conjunction with accompanying drawing and most preferred embodiment shown in the drawings the utility model device is described in further detail.

As shown in Figure 2, the coaxial packaging semiconductor laser elements comprises laser assembly 1, GRIN Lens 3, monomode fiber 4, the columnar laser coaxial support 2 of TO-46 encapsulation, cylindrical, central axis has the structure of fiber_optic 5 of a meticulous aperture, and columniform GRIN Lens, fibre system support 6; Laser assembly 1, GRIN Lens 3, monomode fiber 4 three's coaxial lines of TO-46 encapsulation, lay respectively at left part, middle part and the right part of coaxial packaging semiconductor laser, distance between them is determined with the imaging relations formula of GRIN Lens according to the power output size requirements of assembly; TO-46 encapsulated laser assembly 1 linked to each other with 2 close joining of laser coaxial support, and monomode fiber 4 penetrates the aperture in the middle of fine finishining, machining accuracy are 1 to 4 micron fiber support 5; The high-temp glue that GRIN Lens 3 and structure of fiber_optic 5 usefulness are 100 to 250 ℃ sticks on the inwall of self-focusing lens, fibre system support 6; Coaxial stents 2 and GRIN Lens, fibre system support 6 both are coaxial to link to each other with making with the laser welder welding.

The inclined-plane (41) that becomes 6 to 12 degree angles with its axis is ground, is polished in the end of monomode fiber 4 with silicon carbide paper.In case the output of not-go-end face light reflection causing optical fiber is non-linear.

It is more convenient, more accurate for the coaxial packaging semiconductor laser elements is located when carrying out coaxial packaging, the utility model has also designed a kind of special fixture 8 (Fig. 3) of making the coaxial packaging semiconductor laser elements, special fixture 8 is made up of left-half 81 and right half part 82, and two parts 81 of anchor clamps and 82 are firmly clipped together by two screws 83; The inwall of clamp body the latter half is formed a circular cavity, be used for clamping GRIN Lens, fibre system support 6 among Fig. 2, the top of clamp body is four fan-shaped posts 84 that are evenly distributed on the circumference, and the center of every post has a car that the silk hole of negative thread is arranged, and screw rod 85 Kong Xuan is therewith joined; Regulating above-mentioned four screw rods 85 firmly holds out against laser coaxial support 2 in the position of optical fiber Output optical power for maximum; The two-part joint in the anchor clamps cuboid base left and right sides is the meshing structure 86 of stairstepping.

Now the technical process to the utility model coaxial packaging semiconductor laser elements simply is described below: at first will be assembled in semiconductor laser in TO-46 shell and pack on the laser coaxial support 2, monomode fiber 4 is penetrated in accurately machined structure of fiber_optic 5, and make it become the inclined-plane that constitutes 6 to 12 degree angles with axis with the end that silicon carbide paper grinds monomode fiber 4, the luminous power that need export according to laser assembly requires GRIN Lens 3 again, the structure of fiber_optic 5 distance on request GRIN Lens of packing into, in the fibre system support 6, then this support is fixed on the special fixture 8, again it is fixed to coupling micropositioner X, on the adjusting plane of Y direction, semiconductor laser coaxial stents 2 is fixed to the Z direction of coupling micropositioner.Regulate relative position between the two, make monomode fiber 4 Output optical power to maximum.Utilize centrosymmetric four screw rods 85 on the special fixture 8, with laser diode coaxial stents 2 and GRIN Lens, fibre system support 6 secured in alignment in the optimum position (shown in Figure 4).At last special fixture 8 is moved apart coupling table, weld four solder joints 7 with laser welder on the circumference symmetrically and evenly contacting of 6 on laser diode coaxial stents 2 and GRIN Lens, fibre system support, finish the welding back and decontrol special fixture 8, promptly finished the coaxial packaging technology (the popular name bullet-nose encapsulation of whistle again) of laser diode assembly.The profile of the laser diode assembly of complete coaxial packaging as shown in Figure 2.Coaxial coupling package specific anchor clamps 8 concern as shown in Figure 4 with the position of laser diode module.

The advantage of the utility model product is: coaxial centrosymmetric structure is guaranteed the stress equilibrium of assembly, Thereby improved widely the reliability of product; Because manufacturing process is simple, manufacturing cost is also obvious again Reduce.

Claims

1, a kind of coaxial packaging semiconductor laser elements, the laser assembly (1), GRIN Lens (3), the monomode fiber (4) that comprise the TO-46 encapsulation, it is characterized in that: it also comprises columnar laser coaxial support (2), cylindrical, central axis has the structure of fiber_optic (5) of a meticulous aperture, and columniform GRIN Lens, fibre system support (6); Laser assembly (1), GRIN Lens (3), monomode fiber (4) three's coaxial line of TO-46 encapsulation, lay respectively at left part, middle part and the right part of coaxial packaging semiconductor laser elements, distance between them is determined with the imaging relations formula of GRIN Lens according to the power output size requirements of assembly; TO-46 encapsulated laser assembly (1) linked to each other with close joining of laser coaxial support (2), and monomode fiber (4) penetrates the aperture in the middle of fine finishining, machining accuracy are 1 to 4 micron fiber support (5); GRIN Lens (3) and structure of fiber_optic (5) are fixed on the inwall of self-focusing lens, fibre system support (6); The coaxial connection between coaxial stents (2) and GRIN Lens, the fibre system support (6).

2, coaxial packaging semiconductor laser elements according to claim 1 is characterized in that: the inclined-plane (41) that becomes 6 to 12 degree angles with its axis is ground, is polished in the end of described monomode fiber (4).