CN2283276Y - Central processing unit chip heat sink pedestal - Google Patents
Central processing unit chip heat sink pedestal Download PDFInfo
- Publication number
- CN2283276Y CN2283276Y CN 96206984 CN96206984U CN2283276Y CN 2283276 Y CN2283276 Y CN 2283276Y CN 96206984 CN96206984 CN 96206984 CN 96206984 U CN96206984 U CN 96206984U CN 2283276 Y CN2283276 Y CN 2283276Y
- Authority
- CN
- China
- Prior art keywords
- radiator
- mounting
- lug
- cpu chip
- heat radiator
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The utility model relates to a central processing unit chip heat sink pedestal, and it relatively and respectively extends down along the both sides of a stand and forms four plates, and simultaneously it forms a lug at axial direction which extends downwards and is provided with backdigger. Every lug and the stand are integral forming and they are provided with elasticity. Five lugs form five-edge position which is provided with quickly and really stable effect. The nut locks of the screws at the four corners of the stand can adjust in level, so that the heat radiating fin can be horizontally and tightly abutted on the CPU chip to attain superior heat absorbing and heat sinking effect, and the abutting has the advantages that it is easy to assemble and the CPU chip can not be damaged easily, etc.
Description
The utility model relates to can be assembled rapidly and can flatly closely be covered on the end face of central processing unit (CPU) chip, can evenly absorb heat and the cpu chip radiator pedestal that dispels the heat.
Usually, needed member of computer such as interface card, motherboard, data card etc. need by cpu chip control running, so cpu chip very easily generates a large amount of heats than other elements in the computing machine in operating process, this heat must be through the process of suitably distributing outwardly, and the life-span of parts decreases on every side otherwise also can make except itself quite being easy to damage.
And existing radiating mode is assembled in the radiator fan of cpu chip seat end with draw heat and discharge outwardly through one usually, and this kind radiating mode is generally put the fixing seat of forming by air feed fan lock, and circlip type and gummed solidify formula, and this three has following many shortcomings when using operation:
1. gummed solidifies formula and pastes cpu chip with the heat radiation glue and be combined into one, though there is not assembling fittings, in case have only fan failure appears, the then difficult dismounting of heat radiator and cpu chip, very easily cause the destroyed problem that can't distinguish and exist the cooling fluid sclerosis in cpu chip surface, form thermal chocking on the contrary.
2. circlip type is to block cpu chip with both sides, because the insufficient pressure of clip, causes easily can't fitting tightly between heat radiator and cpu chip and causes heat absorption and heat loss through conduction effect bad.
3. the long slab that extends along the assembled base two edges lacks flexibility because of the hard plate, must after forming body, the horizontal holding of assembled base also return once more by first dismounting CPU chip during assembling together with cpu chip, not only take a lot of work, even laterally holding is combined in promotion or rotates the surface of fixing the seat end friction cpu chip that then very easily causes assembled base up and down and the surface of destroying cpu chip, when the runners of dismantling, very easily damage when assembling cpu chip.
Therefore, above-mentioned traditional structure truly has the necessity that is improved.
Therefore, fundamental purpose of the present utility model is: provide and can bring into play the good heat absorption and the cpu chip radiator pedestal of heat radiation function so that heat radiator fits tightly on the surface of CPU wafer.
Comprise according to cpu chip radiator pedestal of the present utility model: the mounting of a square box panel seat body, in mounting two opposite side one-body molded two independence and have the lug of backacter separately, mounting is axially towards dividing into a monolithic lug with backacter, by forming the taper slotted eye down up, mounting central authorities offer one can be in conjunction with the square dead slot of the square block dish of heat radiator below projection at four jiaos of mountings place.
The one plate-like heat radiator that is square can respectively have through hole from top to bottom for four jiaos in heat radiator for the locking of radiator fan seat, extends to form one down along these card lower edge central authorities and can pass square dead slot and abut against in the square block dish of CPU top;
The mat screw from the taper slotted eye of bearing by wearing the through hole of heat radiator up down and screwing togather with nut;
The combination of mat said structure makes to be matched with assembles radiator fan on the heat radiator, form a complete cpu chip radiator structure.
Aforesaid cpu chip radiator pedestal is characterized in that: make that protrude out lug with backacter and mounting down in mounting bottom one-body molded and have elasticity, the lug that side direction can be had backacter pushes away to imbed into the cpu chip root edge and forms one.
Aforesaid cpu chip radiator pedestal, its feature also are to be formed with cross rail on the surface of heat radiator.
Aforesaid cpu chip radiator pedestal, its feature be again four screw and nuts be locked on the mounting end be with screw block set backward hold in the taper slotted eye.
Therefore, the utlity model has following advantage:
The utility model be with four screws 30 cooperate bearings oppositely with heat radiator 20 relatively to lock, and collude the root edge that is hung on cpu chip 40 with five lugs 11,12 with backacter 13,14, thereby can dwindle the spacing of 20 of mounting 10 and heat radiator, and fit tightly on the surface of cpu chip 40 with the square block dish 201 that protrudes out down from heat radiator 20 belows, can reach fully the effect of heat radiation, and have assembly operation advantage easily rapidly.
Further specify architectural feature of the present utility model and purpose below in conjunction with accompanying drawing.
To brief description of drawings:
Fig. 1 is a stereographic map of the present utility model.
Fig. 2 is an exploded perspective view of the present utility model.
Fig. 3 is an assembled sectional view of the present utility model.
Fig. 4 is another assembled sectional view of the present utility model.
Fig. 5 is the backacter assembled sectional view that the utlity model has lug.
The utility model cpu chip radiator pedestal (as shown in Figure 1 and Figure 2) can find out among the figure that thus this structure mainly is made up of institutes such as mounting 10, heat radiator 20 and a plurality of screws 30;
Wherein, mounting 10 is a square box panel seat body, in 10 liang of opposite side of mounting each one-body molded two independence and bottom inside have the lug 11 (as shown in Figure 5) of backacter 12 separately, and the axial place of mounting 10 is also towards having the lug 13 (as shown in Figure 2) that a monolithic and inside bottom have down Chan 14, protrude out lug the 11, the 13rd down with Chan 12,14 in mounting 10 bottoms, one-body molded and have suitable elasticity with mounting 10, bottom side can be pushed away the root edge that imbeds into cpu chip 40 to the lug 11,13 with backacter 12,14 and form one;
Establish taper slotted eye 15 in 10 4 jiaos of places of mounting by cutting a hole down up, in order to the screw block set 31 of screw 30 and bottom thereof from oppositely wearing, mounting 10 central authorities offer square dead slot 16 make with square block dish 201 driving fits of heat radiator 20 projection downwards as shown in Figure 4, this square block dish 201 can convexedly stretch in the inside of square dead slot 16 down, and bottom that can square block dish 201 is resisted against on the surface of cpu chip 40 really;
This heat radiator 20 plate-like that is square, heat radiator 20 upper ends are formed with cross rail 21, can be for radiator fan seat 51 lockings of radiator fan 50 sides, heat radiator respectively has through hole 22 from top to bottom for 20 4 jiaos;
But four screws 30 of mat are by the through hole 22 (as shown in Figure 3) that passes down taper slotted eye 15 and heat radiator 20 up, and the top that is arranged in heat radiator 20 is locked on the mounting 10 and with screw block set 31 backward holds with nut 60 and locatees really in taper slotted eye 15.
During being used in combination of mat said structure (as shown in Figure 3), after mounting 10 is affixed on one side of cpu chip 40 with screw 30 direct lids, because of the lug 11 with example shovel 12 is one-body molded and have elasticity with mounting 10, and the another side of mounting 10 have down the lug 11 of Chan 12 can be smooth in the subtend limit of cpu chip 40, can conveniently the lug 13 that axially has backacter 14 be pushed away and imbed into the root edge of cpu chip 40 and form one, use screw block set 31 backward holds with nut 60 bolt-locks in taper slotted eye 15 in mounting 10 ends with four screws 30 up by following again, so that 10 of the bottom of heat radiator 20 and mountings are the level of state, and penetrate with square block dish 201 in the square dead slot 16 of mounting 10 and the plane directly lid be affixed on the end face of cpu chip 40, be locked on four screws 30 through nut 60, make square block dish 201 be on the surface that flatly fits in cpu chip 40 with four kinds of different orientation to lock control, and make mounting 10 and 20 of heat radiator can dwindle the space to lock with four nut elements, and but five on mat has down Chan 13,14 lug 11,12 counter colluding in the root edge of cpu chip 40, make the square block dish 201 of heating radiator 20 bottoms can fit on the surface of cpu chip 40 closely, and can conduct heat on square block dish 201 and the heat radiator 20, reach the effect of efficiently radiates heat again through the effect of heat radiator 20 top radiator fans 50.
Claims (4)
1. central processing unit (CPU) chip radiator bearing, the mounting that comprises a square box panel seat body, it is characterized in that in mounting two opposite side one-body molded two independence and have the lug of backacter separately, in mounting axially towards dividing into a lug monolithic with backacter, by forming the taper slotted eye down up, offer a square dead slot that can be incorporated into the square block dish of heat radiator below projection at four jiaos of mountings place in mounting central authorities;
The one plate-like heat radiator that is square can be for the locking of radiator fan seat,, respectively have through hole from top to bottom for four jiaos in heat radiator, extend to form one down along these card lower edge central authorities and can pass square dead slot and be resisted against the square block dish of CPU top;
The mat screw is screwed togather with nut by the through hole that wears heat radiator down up from the taper slotted eye of bearing;
The combination of mat said structure is matched with assembles radiator fan on the heat radiator, form described cpu chip radiator pedestal.
2. radiator pedestal according to claim 1 is characterized in that: to protrude out lug with backacter and mounting down one-body molded and have elasticity the mounting that is set forth in bottom, the lug that side direction can be had backacter pushes away to imbed into the cpu chip root edge and forms one.
3. radiator pedestal according to claim 1 is characterized in that forming cross rail on the surface of described heat radiator.
4. cpu chip radiator pedestal according to claim 1, it is characterized in that described by four screw and nuts be locked on the mounting end be with screw block set backward hold in the taper slotted eye.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN 96206984 CN2283276Y (en) | 1996-04-30 | 1996-04-30 | Central processing unit chip heat sink pedestal |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN 96206984 CN2283276Y (en) | 1996-04-30 | 1996-04-30 | Central processing unit chip heat sink pedestal |
Publications (1)
Publication Number | Publication Date |
---|---|
CN2283276Y true CN2283276Y (en) | 1998-06-03 |
Family
ID=33891425
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN 96206984 Expired - Fee Related CN2283276Y (en) | 1996-04-30 | 1996-04-30 | Central processing unit chip heat sink pedestal |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN2283276Y (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN100466893C (en) * | 2004-10-20 | 2009-03-04 | Lg电子株式会社 | Heat radiating apparatus |
CN101520680B (en) * | 2002-05-31 | 2011-11-23 | 韦拉里系统有限公司 | Method and device for mounting computer component |
CN101237758B (en) * | 2007-02-01 | 2012-01-04 | 保力马科技株式会社 | Thermal fin and method for positioning the same |
CN101847612B (en) * | 2009-03-26 | 2012-10-10 | 三菱电机株式会社 | Semiconductor device and manufacturing method thereof |
-
1996
- 1996-04-30 CN CN 96206984 patent/CN2283276Y/en not_active Expired - Fee Related
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101520680B (en) * | 2002-05-31 | 2011-11-23 | 韦拉里系统有限公司 | Method and device for mounting computer component |
CN100466893C (en) * | 2004-10-20 | 2009-03-04 | Lg电子株式会社 | Heat radiating apparatus |
CN101237758B (en) * | 2007-02-01 | 2012-01-04 | 保力马科技株式会社 | Thermal fin and method for positioning the same |
US8137806B2 (en) | 2007-02-01 | 2012-03-20 | Polymatech Co., Ltd. | Thermal diffusion sheet and method for positioning thermal diffusion sheet |
CN101847612B (en) * | 2009-03-26 | 2012-10-10 | 三菱电机株式会社 | Semiconductor device and manufacturing method thereof |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C19 | Lapse of patent right due to non-payment of the annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |