CN2251746Y - Radiator for ultra-thin computer central processing unit - Google Patents
Radiator for ultra-thin computer central processing unit Download PDFInfo
- Publication number
- CN2251746Y CN2251746Y CN 95217416 CN95217416U CN2251746Y CN 2251746 Y CN2251746 Y CN 2251746Y CN 95217416 CN95217416 CN 95217416 CN 95217416 U CN95217416 U CN 95217416U CN 2251746 Y CN2251746 Y CN 2251746Y
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- Prior art keywords
- radiation
- processing unit
- central processing
- heat dissipation
- base
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- Expired - Fee Related
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Abstract
The utility model relates to a radiator for an ultra-thin computer central processing unit, which is provided with a radiation base with appropriate size. The radiation base comprises a base plate portion, wherein, the surface of the base plate is preset with a plurality of vertical radiation plate sheets which are arranged in a radial way. The radiation plate sheets extend certain length towards radical direction to form concave containing space, so that a fan can be arranged in the concave space at same horizontal height. A cover sheet is arranged on the top surface of the radiation base, and therefore, the height of the CPU radiation device is decreased and the volume is reduced, so that the radiator for an ultra-thin computer central processing unit is suitable for computer system with a low interface card. The radiation wind can be blown-out in a horizontal direction from the positions among the radiation plate sheets by the horizontal built-in fan, and the radiation effect can be reinforced.
Description
The utility model relates to a kind of heat abstractor of very thin computer CPU (central processing unit), is meant that especially it can effectively reduce the entire heat dissipation height of devices, reduces its occupied space and is applicable to various system and strengthens radiating effect.
The central processing unit CPU of computer can produce high temperature when operation, so need to use heat abstractor.Present computer CPU heat abstractor mostly is provided with a heat dissipation base 10 as shown in Figure 1, fan 11 of end face combination of this heat dissipation base 10, and this heat dissipation base that stacks 10 and fan 11 all are positioned at the top of CPU12.During use, because of fan 11 rotation air-supplies, cooperate heat dissipation base 10 again, the high temperature in the time of CPU can being worked reduces.
This CPU heat abstractor disadvantage is that heat dissipation base 10 is established structure with fan 11 for folded, so its whole height H is bigger, need occupy in the computer than large space, and is not satisfactory.In addition, the interface card of some system of the computer company that has now is lower, and this higher CPU heat abstractor can't be used, and makes us puzzlement.In addition, the flabellum of the fan 11 of this structure is when down blowing wind-force, though the high temperature that produces CPU can be worked the time reduces, but blow under its wind-force, blowing high wind under this can not directly pass through, and has part bounce-back wind-force with the hot blast blowback, and radiating effect is also not really desirable.
The purpose of this utility model provides a kind of heat abstractor of very thin computer CPU (central processing unit), to solve many defectives of existing heat abstractor.
The utility model is achieved in that and includes heat dissipation base, fan, it is characterized in that: above-mentioned heat dissipation base contains bottom parts, and be provided with a plurality of heat radiation plates that radiation-like is provided with at interval that are at this backplate surface, it is the equidistant radius at center that these heat radiation plates all stop at by base plate towards the inner face that radially extends, form the accommodation space for the placement fan of an indent, and the horizontal cover plate which is provided with hole and relative vent rib is installed at the end face of heat dissipation base.Said fans is the conductive coil of portion's assembling within it, and its central shaft is installed in the center pit default on the base plate.Be preset with side channel hole that threading uses and the combination grab of CPU on the base plate of above-mentioned heat dissipation base, and on the position relative, be provided with mounting hole with the default bolt of cover plate.
Characteristics of the present utility model are to be provided with a suitably heat dissipation base of size, this heat dissipation base contains bottom parts, and be preset with a plurality of vertical heat radiation plates that radiation-like is provided with that are at this backplate surface, these heat radiation plates are all towards radially extending length-specific, form an indent spatial accommodation, fan can be installed in this in concave space with same level height, be installed in the end face of heat dissipation base again with a cover plate, thereby the height of CPU heat abstractor is reduced, reduction in bulk goes for lower interface card computer system.Horizontal built-in fans of the present utility model can blow out heat radiation wind-force between a plurality of heat radiation plates with horizontal direction, can strengthen its radiating effect.
Fig. 1 is a computer CPU construction for heat radiating device side view commonly used now.
Fig. 2 is the utility model embodiment stereographic map.
Fig. 3 is the exploded view of Fig. 2 cover plate and heat dissipation base.
Fig. 4 is the element exploded view of Fig. 2.
Fig. 5 is the assembled sectional view of Fig. 2.
Referring to Fig. 2, the utility model mainly is to place the fan 30 of these heat dissipation base 20 inside and a main element such as cover plate 40 to be constituted by a heat dissipation base 20, one.
Consult Fig. 3 more simultaneously, heat dissipation base 20 contains a bottom parts 21, is provided with the heat radiation plate 22 that a plurality of radiation-like are provided with at interval on the surface of this bottom parts 21, forms gap 23 between per two heat radiation plates 22.Simultaneously, these heat radiation plate 22 inner faces 24 towards radially extension all stop on the same circumference, also be, as being the center with bottom parts 21 mid points, all heat radiation plate 22 inner faces 24 towards radially extension all stop on the same circumference, also promptly, as being the center with bottom parts 21 mid points, the inner face of all heat radiation plates 22 all is positioned at same radius distance place.Form the spatial accommodation 50 of an indent by this, make fan 30 can be installed in 50 li in this space.
Referring to Fig. 4, in an embodiment, bottom parts 21 can be provided with a center pit 25, and for the central shaft 31 that this fan 30 is installed, and conductive coil 32 and pad 33 can be assembled in these fan 30 inside.
In addition, cover plate 40 can be made as the size of heat dissipation base bottom parts 21, is installed in the plain film mode on the end face of heat dissipation base 20.The through hole 41 of these cover plate 40 predeterminable cooperation fan sizes, and on the surface default and the relative vent rib 42 of plate 22 quantity that dispels the heat, its four angles can be provided with bolt 43, make it to cooperate the mounting hole 26 on heat dissipation base 20 relative positions, and other part is assembled into one with each.Really, above-mentioned heat dissipation base 20 is except that the mounting hole 26 that is provided with cover plate 40, and also predeterminable disjunctor grab 27 supplies in conjunction with CPU and for the side channel 28 of pulling out lead.
Referring to Fig. 5, because of fan 30 is installed in the inside spatial accommodation 50 of heat dissipation base 30, and screen, so the height W of whole C PU heat abstractor is effectively reduced with a horizontal cover plate 40, its occupied volume can be reduced, and the system that some interface card is lower can be applicable to.Another advantage is that fan 30 powers up when rotating, and heat radiation wind-force is by direction shown in the arrow, and crack 23 blows out between the plate 22 by dispelling the heat in twos, and it can not produce the resilience hot blast of bottom blowing type, and radiating effect is effectively improved.
Claims (3)
1, a kind of heat abstractor of very thin computer CPU (central processing unit), include heat dissipation base, fan, it is characterized in that: above-mentioned heat dissipation base contains bottom parts, and be provided with a plurality of heat radiation plates that radiation-like is provided with at interval that are at this backplate surface, it is the equidistant radius at center that these heat radiation plates all stop at by base plate towards the inner face that radially extends, form the accommodation space for the placement fan of an indent, and the horizontal cover plate which is provided with through hole and relative vent rib is installed at the end face of heat dissipation base.
2, the heat abstractor of very thin computer CPU (central processing unit) as claimed in claim 1 is characterized in that: said fans is the conductive coil of portion's assembling within it, and its central shaft is installed in the center pit default on the base plate.
3, the heat abstractor of very thin computer CPU (central processing unit) as claimed in claim 1, it is characterized in that: be preset with side channel hole that threading uses and the combination grab of CPU on the base plate of above-mentioned heat dissipation base, and on the position relative, be provided with mounting hole with the default bolt of cover plate.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN 95217416 CN2251746Y (en) | 1995-07-24 | 1995-07-24 | Radiator for ultra-thin computer central processing unit |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN 95217416 CN2251746Y (en) | 1995-07-24 | 1995-07-24 | Radiator for ultra-thin computer central processing unit |
Publications (1)
Publication Number | Publication Date |
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CN2251746Y true CN2251746Y (en) | 1997-04-09 |
Family
ID=33866232
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN 95217416 Expired - Fee Related CN2251746Y (en) | 1995-07-24 | 1995-07-24 | Radiator for ultra-thin computer central processing unit |
Country Status (1)
Country | Link |
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CN (1) | CN2251746Y (en) |
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102006542A (en) * | 2009-08-28 | 2011-04-06 | 清华大学 | Sound generating device |
US8457331B2 (en) | 2009-11-10 | 2013-06-04 | Beijing Funate Innovation Technology Co., Ltd. | Thermoacoustic device |
US8462965B2 (en) | 2008-12-30 | 2013-06-11 | Beijing Funate Innovation Technology Co., Ltd. | Thermoacoustic module, thermoacoustic device, and method for making the same |
US8494187B2 (en) | 2009-11-06 | 2013-07-23 | Tsinghua University | Carbon nanotube speaker |
US8537640B2 (en) | 2009-09-11 | 2013-09-17 | Tsinghua University | Active sonar system |
US8615096B2 (en) | 2009-08-07 | 2013-12-24 | Tsinghua University | Thermoacoustic device |
US8811631B2 (en) | 2009-11-16 | 2014-08-19 | Beijing Funate Innovation Technology Co., Ltd. | Thermoacoustic device |
US8905320B2 (en) | 2009-06-09 | 2014-12-09 | Tsinghua University | Room heating device capable of simultaneously producing sound waves |
CN104582452A (en) * | 2015-02-05 | 2015-04-29 | 张立 | Heat radiation module |
-
1995
- 1995-07-24 CN CN 95217416 patent/CN2251746Y/en not_active Expired - Fee Related
Cited By (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8462965B2 (en) | 2008-12-30 | 2013-06-11 | Beijing Funate Innovation Technology Co., Ltd. | Thermoacoustic module, thermoacoustic device, and method for making the same |
US8763234B2 (en) | 2008-12-30 | 2014-07-01 | Beijing Funate Innovation Technology Co., Ltd. | Method for making thermoacoustic module |
US8905320B2 (en) | 2009-06-09 | 2014-12-09 | Tsinghua University | Room heating device capable of simultaneously producing sound waves |
US8615096B2 (en) | 2009-08-07 | 2013-12-24 | Tsinghua University | Thermoacoustic device |
CN102006542A (en) * | 2009-08-28 | 2011-04-06 | 清华大学 | Sound generating device |
US8406450B2 (en) | 2009-08-28 | 2013-03-26 | Tsinghua University | Thermoacoustic device with heat dissipating structure |
CN102006542B (en) * | 2009-08-28 | 2014-03-26 | 清华大学 | Sound generating device |
US8537640B2 (en) | 2009-09-11 | 2013-09-17 | Tsinghua University | Active sonar system |
US8494187B2 (en) | 2009-11-06 | 2013-07-23 | Tsinghua University | Carbon nanotube speaker |
US8457331B2 (en) | 2009-11-10 | 2013-06-04 | Beijing Funate Innovation Technology Co., Ltd. | Thermoacoustic device |
US8811631B2 (en) | 2009-11-16 | 2014-08-19 | Beijing Funate Innovation Technology Co., Ltd. | Thermoacoustic device |
CN104582452A (en) * | 2015-02-05 | 2015-04-29 | 张立 | Heat radiation module |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C19 | Lapse of patent right due to non-payment of the annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |