CN221634259U - High-frequency power supply heat dissipation device - Google Patents
High-frequency power supply heat dissipation device Download PDFInfo
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- CN221634259U CN221634259U CN202323496238.1U CN202323496238U CN221634259U CN 221634259 U CN221634259 U CN 221634259U CN 202323496238 U CN202323496238 U CN 202323496238U CN 221634259 U CN221634259 U CN 221634259U
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- power supply
- rotating shaft
- cooling water
- frequency power
- gear
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- 230000017525 heat dissipation Effects 0.000 title claims abstract description 20
- 239000000498 cooling water Substances 0.000 claims abstract description 61
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 47
- 238000001816 cooling Methods 0.000 claims abstract description 39
- 239000004065 semiconductor Substances 0.000 claims abstract description 17
- 235000017166 Bambusa arundinacea Nutrition 0.000 claims description 9
- 235000017491 Bambusa tulda Nutrition 0.000 claims description 9
- 241001330002 Bambuseae Species 0.000 claims description 9
- 235000015334 Phyllostachys viridis Nutrition 0.000 claims description 9
- 239000011425 bamboo Substances 0.000 claims description 9
- 230000000087 stabilizing effect Effects 0.000 claims description 7
- 238000003756 stirring Methods 0.000 claims description 5
- 238000002156 mixing Methods 0.000 claims description 4
- 230000000694 effects Effects 0.000 abstract description 7
- 238000000034 method Methods 0.000 abstract description 7
- 238000010438 heat treatment Methods 0.000 description 17
- 230000006835 compression Effects 0.000 description 5
- 238000007906 compression Methods 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 3
- 238000001914 filtration Methods 0.000 description 3
- 230000006698 induction Effects 0.000 description 3
- 239000007769 metal material Substances 0.000 description 3
- 241000883990 Flabellum Species 0.000 description 2
- 235000004443 Ricinus communis Nutrition 0.000 description 2
- 238000003723 Smelting Methods 0.000 description 1
- 238000013019 agitation Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000007580 dry-mixing Methods 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052755 nonmetal Inorganic materials 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000005057 refrigeration Methods 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 238000009423 ventilation Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model relates to the technical field of high-frequency power supplies, and provides a high-frequency power supply heat dissipation device. The heated cooling water enters the water collecting cylinder through the water outlet pipe, the cooling water falls on the pushing blade to rotate the rotating shaft I, the heated cooling water flows into the cooling cylinder through the communicating pipe and is cooled through the semiconductor refrigerating sheet, so that the heated cooling water is cooled more uniformly, the rotating shaft I rotates to drive the gear I to be meshed with the gear II to rotate, the rotating shaft II drives the dry-mixed hinge to rotate so as to mix the cooled cooling water, and meanwhile, the rotating shaft II drives the fan blade to rotate so as to discharge heat energy generated in cooling the semiconductor refrigerating sheet out of the power supply box body through the plurality of vent holes, thereby solving the problems that in the prior art, the cooling water flows faster in the circulation process, the condenser only can cool the closest part of the flowing heated cooling water, and the inside of the heated cooling water cannot be sufficiently cooled, so that the heated cooling water is cooled unevenly, and the high-frequency power supply is poor in heat dissipation effect.
Description
Technical Field
The utility model relates to the technical field of high-frequency power supplies, in particular to a high-frequency power supply heat dissipation device.
Background
The high-frequency power supply is also called an electron tube frequency conversion device, and is key equipment of a high-frequency induction furnace. The high-frequency power supply and the induction heating technology have the highest heating efficiency and the fastest speed on the metal material, and the device has low energy consumption and is environment-friendly. It has been widely used in the processes of heat processing, heat treatment, heat assembly, welding, smelting, etc. of metal materials in various industries. The device can not only heat the whole workpiece, but also heat the part of the workpiece in a targeted manner; the deep diathermy of the workpiece can be realized, and only the surface and the surface layer of the workpiece can be heated in a concentrated way; the heating device can heat not only the metal material directly, but also the nonmetal material indirectly. Etc. Therefore, the induction heating technology must be used more and more widely in various industries. The high-frequency power supply can generate larger heat during working, and the high-frequency power supply can cause damage to the IGBT after working above a critical temperature for a long time, so that the working operation of the high-frequency power supply is influenced.
Through retrieval, the utility model patent with the publication number of CN214070458U discloses a high-frequency power supply radiating device, which comprises a power supply box body, a high-frequency power supply and a movable castor, wherein the movable castor is fixed below the power supply box body, a round hole is formed in the side part of the power supply box body, the high-frequency power supply is internally installed in the round hole, a spiral radiating pipe is arranged outside the high-frequency power supply, the spiral radiating pipe is provided with a water inlet and a water outlet, a water outlet pipe is fixed at the water outlet of the spiral radiating pipe, a condenser is fixed at the other end of the water outlet pipe, a radiator fan is installed at the front part of the condenser, the radiator fan is fixed on the side wall of the power supply box body, a radiating hole is formed in the power supply box body, a cooling water tank is fixed at the upper part of the cooling water inlet, a water outlet is arranged at the lower part of the cooling water tank, a connecting pipe is fixed at the side part of the cooling water tank, a compression device is fixed on a support table, the support table is fixed on the power supply box body, a water supply pipe is fixed at the lower part of the compression device, a water inlet pipe is fixed at the upper part of the compression device, and one end is fixed at the upper end of the compression device is fixed at the water inlet pipe.
However, the following problems are found in the implementation related art: the heat generated by the prior high-frequency power supply heat dissipation device is transferred to the cooling water in the spiral heat dissipation pipe, the temperature of the high-frequency power supply is reduced, the temperature of the cooling water is increased, the heated cooling water enters the condenser through the water outlet pipe, the heated cooling water in the condenser is quickly cooled and flows into the cooling water tank, the heated cooling water flows into the water storage tank through further cooling of the cooling water tank, the whole cooling circulation is completed, but the cooling water flows fast in the circulation process, the condenser can only cool the closest part of the flowing heating cooling water, and cannot sufficiently cool the inside of the heating cooling water, so that the temperature of the heating cooling water is uneven, and the problem of poor heat dissipation effect of the high-frequency power supply is caused.
There is a need for a high frequency power supply heat sink.
Disclosure of utility model
The utility model provides a high-frequency power supply heat dissipation device, which solves the problems that in the related art, cooling water flows fast in the circulating process, a condenser only can cool the nearest part of the flowing heating cooling water, and the inside of the heating cooling water cannot be sufficiently cooled, so that the heating cooling water is unevenly cooled, and the heat dissipation effect of the high-frequency power supply is poor.
The technical scheme of the utility model is as follows: the utility model provides a high frequency power heat abstractor, includes the power supply box, sets up the round hole in the power supply box side, the internally mounted of round hole has high frequency power, the inside of power supply box is equipped with a water collection section of thick bamboo, the inside of water collection section of thick bamboo is provided with the subassembly that starts, the fixed intercommunication in top of water collection section of thick bamboo has the outlet pipe, the fixed intercommunication in bottom of water collection section of thick bamboo has communicating pipe, the bottom fixed intercommunication of communicating pipe has a cooling cylinder, the inside of cooling cylinder is filled with cooling water, the inside of cooling cylinder is equipped with the delivery pipe, the bottom fixedly connected with filter of delivery pipe, the left end of cooling cylinder is provided with carries out even refrigerated stirring subassembly to cooling water.
Preferably, the starting assembly comprises a first rotating shaft, and three pushing blades are fixedly connected to the outer wall of the first rotating shaft at equal intervals in an annular mode.
Preferably, the stirring assembly comprises a first gear, the first gear is fixed on the outer wall of the first rotating shaft, a second gear is meshed with the bottom of the first gear, the second rotating shaft is fixedly connected with the inner wall of the second gear, one end of the second rotating shaft penetrates through the inner wall of the cooling cylinder and extends to the inside of the cooling cylinder, a plurality of mixing blades are fixedly connected to the outer wall of the second rotating shaft at equal intervals in an annular mode, and a semiconductor refrigerating sheet is fixedly connected to the outer wall of the cooling cylinder.
Preferably, the cooling cylinder is provided with the semiconductor refrigerating piece and carries out the radiating component of heat release with external environment heat exchange away from the one end of gear two, radiating component includes the flabellum, the flabellum is fixed in the outer wall that the gear two one end was kept away from in pivot two, a plurality of air vents have been seted up to the side of power box.
Preferably, the inner bottom wall of the power supply box body is symmetrically and fixedly connected with two bearing seats, and the cooling cylinder is fixed at the tops of the two bearing seats.
Preferably, the power supply box is close to the inside wall fixedly connected with firm board of a water collection section of thick bamboo, and the outer wall of pivot one and pivot two all rotates with the inner wall of firm board and is connected.
Preferably, the water collecting cylinder is fixed on one side of the stabilizing plate far away from the first gear.
Preferably, the semiconductor refrigeration piece is arranged in a circular shape.
The working principle and the beneficial effects of the utility model are as follows:
1. The utility model sets up the mutual cooperation of the engine assembly, stirring assembly and radiating assembly, the cooling water heated enters the water-collecting cylinder through the water outlet pipe, the cooling water falls on the pushing vane and causes the rotation of the first rotating shaft, the heating cooling water flows into the cooling cylinder through the communicating pipe and cools through the semiconductor refrigerating sheet, in order to make the heating cooling water cool more uniformly, the rotation of the first rotating shaft drives the gear to mesh with the second gear and causes the second rotating shaft to rotate, the second rotating shaft drives the dry-mixed hinge to mix the cooling water in cooling, and simultaneously the second rotating shaft drives the fan blade to rotate and discharge the heat energy generated in the cooling of the semiconductor refrigerating sheet out of the power supply box through a plurality of ventilation holes, thus solving the problems that the cooling water flows faster in the circulating process, the condenser can only cool the nearest part of the heating cooling water flowing, the inside of the heating cooling water can not be cooled sufficiently, the heating cooling water is cooled unevenly, and the high-frequency power supply radiating effect is poor.
Drawings
The utility model will be described in further detail with reference to the drawings and the detailed description.
FIG. 1 is a schematic perspective view of the present utility model;
FIG. 2 is a schematic plan view of a structure according to the present utility model;
FIG. 3 is a schematic cross-sectional view of the present utility model;
fig. 4 is an enlarged schematic view of the structure of fig. 3a according to the present utility model.
In the figure: 1, a power supply box body; 11 round holes; 12 high frequency power supply; 13, a water outlet pipe; 14 a water supply pipe; 15 a filter; 2, a water collecting cylinder; 3, starting the assembly; 31 pushing the leaf; 32 rotating shaft I; 4, stabilizing the plate; 5 an agitation assembly; 51 gear one; 52 gear two; 53 the second rotating shaft; 54 mixing lobes; 55 semiconductor refrigerating sheets; 6, a heat dissipation assembly; 61 fan blades; 62 vent holes; 7, a bearing seat; 8 communicating pipes; 9 cooling the cylinder.
Detailed Description
The technical solutions of the embodiments of the present utility model will be clearly and completely described below in conjunction with the embodiments of the present utility model, and it is apparent that the described embodiments are only some embodiments of the present utility model, not all embodiments. All other embodiments, which can be made by one of ordinary skill in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
Referring to fig. 1 to 4, the present utility model provides a technical solution for a high-frequency power supply heat dissipation device: the high-frequency power supply heat dissipation device comprises a power supply box body 1 and a round hole 11 formed in the side face of the power supply box body 1, a high-frequency power supply 12 is arranged in the round hole 11, a water collection cylinder 2 is arranged in the power supply box body 1, and the water collection cylinder 2 is fixed on one side, far away from a gear one 51, of a stable plate 4;
The inside of the water collection cylinder 2 is provided with a starting assembly 3, the starting assembly 3 comprises a first rotating shaft 32, and three pushing blades 31 are fixedly connected to the outer wall of the first rotating shaft 32 in an annular equidistant manner;
The top of the water collecting cylinder 2 is fixedly communicated with a water outlet pipe 13, the bottom of the water collecting cylinder 2 is fixedly communicated with a communicating pipe 8, the bottom end of the communicating pipe 8 is fixedly communicated with a cooling cylinder 9, the inner bottom wall of the power supply box body 1 is symmetrically and fixedly connected with two bearing seats 7, the cooling cylinder 9 is fixed at the top of the two bearing seats 7, the effect of fixing the cooling cylinder 9 is realized, cooling water is filled in the cooling cylinder 9, a water supply pipe 14 is arranged in the cooling cylinder 9, and the bottom end of the water supply pipe 14 is fixedly connected with a filter 15;
The left end of the cooling cylinder 9 is provided with an agitating component 5 for uniformly cooling water, the agitating component 5 comprises a first gear 51, the first gear 51 is fixed on the outer wall of the first rotating shaft 32, the bottom of the first gear 51 is meshed with a second gear 52, the inner wall of the second gear 52 is fixedly connected with a second rotating shaft 53, the power supply box 1 is close to the inner wall of the water collecting cylinder 2 and is fixedly connected with a stabilizing plate 4, the outer walls of the first rotating shaft 32 and the second rotating shaft 53 are both rotationally connected with the inner wall of the stabilizing plate 4, one end of the second rotating shaft 53 penetrates through the inner wall of the cooling cylinder 9 and extends to the inside of the cooling cylinder 9, a plurality of mixing blades 54 are fixedly connected to the outer wall of the second rotating shaft 53 at equal intervals, a semiconductor refrigerating sheet 55 is fixedly connected to the outer wall of the cooling cylinder 9, the semiconductor refrigerating sheet 55 is of the prior art, and the shape of the semiconductor refrigerating sheet 55 is in a circular ring shape;
The cooling cylinder 9 is provided with a semiconductor refrigerating sheet 55 and a heat radiating component 6 for releasing heat by heat exchange with the external environment at one end far away from the gear II 52, the heat radiating component 6 comprises fan blades 61, the fan blades 61 are fixed on the outer wall of the rotating shaft II 53, far away from one end of the gear II 52, and a plurality of vent holes 62 are formed in the side face of the power supply box body 1.
The working principle and the using flow of the utility model are as follows: in the use process, firstly, according to the prior art flow (one end of a water supply pipe provided with a filter is immersed in cooling water, the filtering effect is achieved on the cooling water, after a motor is started, the compression device discharges air in the water supply pipe, and the cooling water is pumped out by utilizing the atmospheric pressure difference, the cooling water enters the spiral radiating pipe through the water inlet pipe, due to the effect of thermal radiation, heat generated by a high-frequency power supply is transferred into the cooling water in the spiral radiating pipe, the temperature of the high-frequency power supply is reduced, the cooling water is increased), the heated cooling water enters the water collection cylinder 2 through the water outlet pipe 13, the cooling water falls on the pushing blade 31 to enable the first rotating shaft 32 to rotate, the heated cooling water flows into the cooling cylinder 9 through the communicating pipe 8 and is cooled through the semiconductor refrigerating plate 55, in order to enable the heating cooling water to be cooled more uniformly, the first rotating shaft 32 drives the gear 51 to be meshed with the second rotating shaft 53 to enable the second rotating shaft 53 to drive the cooling water in the cooling process if the dry mixing hinge 54 rotates, meanwhile the second rotating shaft 53 drives the fan blades 61 to rotate, the heat generated in the semiconductor plate 55 to be discharged out of the water through the air vent 62, the cooling water is cooled out of the water collection cylinder 1, the cooling water falls into the cooling water through the water supply pipe through the water inlet pipe, the filtering device is cooled down after the filtering device is arranged according to the atmospheric pressure difference, the cooling water is greatly cooled down, and the cooling water is cooled down in the water is cooled down after the cooling water is cooled down by the circulating device is started, and the cooling water is cooled down in the water is cooled down by the water circulating water according to the technology.
The foregoing description of the preferred embodiments of the utility model is not intended to be limiting, but rather is intended to cover all modifications, equivalents, alternatives, and improvements that fall within the spirit and scope of the utility model.
Claims (8)
1. The utility model provides a high frequency power heat abstractor, includes power box (1), sets up round hole (11) in power box (1) side, internally mounted of round hole (11) has high frequency power (12), a serial communication port, the inside of power box (1) is equipped with catchment section of thick bamboo (2), the inside of catchment section of thick bamboo (2) is provided with and starts subassembly (3), the fixed intercommunication in top of catchment section of thick bamboo (2) has outlet pipe (13), the fixed intercommunication in bottom of catchment section of thick bamboo (2) has communicating pipe (8), the fixed intercommunication in bottom of communicating pipe (8) has cooling cylinder (9), the inside of cooling cylinder (9) is filled with cooling water, the inside of cooling cylinder (9) is equipped with delivery pipe (14), the bottom fixedly connected with filter (15) of delivery pipe (14), the left end of cooling cylinder (9) is provided with carries out even refrigerated stirring subassembly (5) to cooling water.
2. A high-frequency power supply heat dissipation device according to claim 1, wherein the starting assembly (3) comprises a first rotating shaft (32), and three pushing blades (31) are fixedly connected to the outer wall of the first rotating shaft (32) at equal intervals in a ring shape.
3. The high-frequency power supply heat dissipation device according to claim 1, wherein the stirring assembly (5) comprises a first gear (51), the first gear (51) is fixed on the outer wall of the first rotating shaft (32), a second gear (52) is meshed with the bottom of the first gear (51), a second rotating shaft (53) is fixedly connected to the inner wall of the second gear (52), one end of the second rotating shaft (53) penetrates through the inner wall of the cooling cylinder (9) and extends to the inside of the cooling cylinder (9), a plurality of mixing blades (54) are fixedly connected to the outer wall of the second rotating shaft (53) at equal intervals in an annular mode, and a semiconductor refrigerating sheet (55) is fixedly connected to the outer wall of the cooling cylinder (9).
4. The high-frequency power supply heat dissipation device according to claim 1, wherein one end of the cooling cylinder (9) far away from the gear II (52) is provided with a heat dissipation component (6) for releasing heat by heat exchange between a semiconductor refrigerating sheet (55) and the external environment, the heat dissipation component (6) comprises fan blades (61), the fan blades (61) are fixed on the outer wall of the rotating shaft II (53) far away from one end of the gear II (52), and a plurality of vent holes (62) are formed in the side face of the power supply box body (1).
5. The high-frequency power supply heat dissipation device according to claim 1, wherein two bearing seats (7) are symmetrically and fixedly connected to the inner bottom wall of the power supply box body (1), and the cooling cylinder (9) is fixed to the tops of the two bearing seats (7).
6. The high-frequency power supply heat dissipation device according to claim 1, wherein the power supply box body (1) is fixedly connected with a stabilizing plate (4) close to the inner side wall of the water collecting barrel (2), and the outer walls of the first rotating shaft (32) and the second rotating shaft (53) are rotatably connected with the inner wall of the stabilizing plate (4).
7. A high frequency power supply heat sink according to claim 1, wherein the water collecting cylinder (2) is fixed to the side of the stabilizing plate (4) remote from the gear one (51).
8. A high-frequency power supply heat sink according to claim 3, wherein the semiconductor cooling fin (55) is arranged in a circular ring shape.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202323496238.1U CN221634259U (en) | 2023-12-21 | 2023-12-21 | High-frequency power supply heat dissipation device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202323496238.1U CN221634259U (en) | 2023-12-21 | 2023-12-21 | High-frequency power supply heat dissipation device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN221634259U true CN221634259U (en) | 2024-08-30 |
Family
ID=92496460
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202323496238.1U Active CN221634259U (en) | 2023-12-21 | 2023-12-21 | High-frequency power supply heat dissipation device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN221634259U (en) |
-
2023
- 2023-12-21 CN CN202323496238.1U patent/CN221634259U/en active Active
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| GR01 | Patent grant |