CN221632520U

CN221632520U - Chip concatenation counterpoint device

Info

Publication number: CN221632520U
Application number: CN202323347888.XU
Authority: CN
Inventors: 马帅辉; 蒋沁伶; 郭连茜; 李志华
Original assignee: Chengdu Shansi Micro Technology Co ltd
Current assignee: Chengdu Shansi Micro Technology Co ltd
Priority date: 2023-12-08
Filing date: 2023-12-08
Publication date: 2024-08-30
Anticipated expiration: 2033-12-08

Abstract

The utility model discloses a chip splicing alignment device which comprises a box body, a transparent cover plate with an inner cavity and an imaging display terminal, wherein an opening is formed in the top end of the box body, the transparent cover plate for sealing the opening is arranged at the opening, a camera with a lens vertically upwards is arranged in the box body through a bracket, a vacuum adsorption hole for adsorbing a chip is formed in the transparent cover plate, and the camera is electrically connected with the imaging display terminal. According to the utility model, the camera is used for shooting the position of the surface of the chip facing downwards, the imaging display terminal is used for displaying, and the distance between the chips is manually fine-adjusted under the guidance of the imaging display terminal, so that the subsequent chip splicing work is convenient to spread.

Description

Chip concatenation counterpoint device

Technical Field

The utility model relates to the technical field of chip packaging equipment, in particular to a chip splicing alignment device.

Background

CMOS chips of single crystal silicon wafers are typically 8 or 12 inches, and if larger products are desired, it is often necessary to splice several chips together. The problem often encountered in splicing is that there is a height difference between different chips, which often affects the image quality, so that it is necessary to customize a corresponding splicing device and determine a splicing method, thereby obtaining a product meeting the requirements.

The prior art splice of multiple chips typically uses a forward splice, i.e., surface up. The method cannot ensure the flatness of the chip surface or has great adjustment difficulty.

The prior art discloses a chip alignment device, and publication number is CN214893166U, and it adopts the camera to shoot the chip of waiting to counterpoint perpendicularly downwards, and the chip is forward concatenation, because the roughness or the adjustment degree of difficulty of a plurality of chips unable assurance surfaces are big, and the product that obtains finally does not accord with the requirement.

Disclosure of utility model

The utility model aims to solve the technical problem of providing a chip splicing alignment device, which is characterized in that the position of a surface of a camera facing downwards is imaged, and the imaging display terminal displays the image, so that the distance between chips is manually fine-adjusted under the guidance of the imaging display terminal, and the subsequent chip splicing work is conveniently unfolded.

The technical scheme for solving the technical problems is as follows: the camera comprises a box body, a transparent cover plate with an inner cavity and an imaging display terminal, wherein an opening is formed in the top end of the box body, the opening is provided with a sealing cover, the transparent cover plate is provided with a camera which is vertically upwards provided with a lens through a bracket in the box body, a vacuum adsorption hole for adsorbing a chip is formed in the transparent cover plate, and the camera is electrically connected with the imaging display terminal.

The beneficial effects of adopting above-mentioned technical scheme are:

The camera is used for shooting the position of the surface facing the downward chip, the imaging display terminal is used for displaying, the splicing gaps of the chips are accurately measured, the distance between the chips is manually adjusted under the guidance of the imaging display terminal, the subsequent chip splicing work is convenient to spread, the surfaces of the chips can be guaranteed to be in the same horizontal plane, and the height drop is not high or very small, and is in a micron level.

On the basis of the technical scheme, the utility model can be improved as follows.

Further, the camera and the support are all provided with a plurality of, and a plurality of the camera and a plurality of the support one-to-one, a plurality of the support is installed along the horizontal direction interval in the box, and a plurality of the camera is installed respectively on the support that corresponds.

The beneficial effect of adopting above-mentioned further scheme is that a plurality of cameras come to shoot the concatenation region of a plurality of chips, improves work efficiency.

Further, the device also comprises a plurality of XY mobile platforms, the XY mobile platforms are in one-to-one correspondence with the supports, the bodies of the XY mobile platforms are fixed in the bottom of the box body, and the driving ends of the XY mobile platforms can horizontally and vertically move and are fixedly connected with the corresponding supports.

The technical scheme has the advantages that the XY moving platform can adjust the positions of the camera in the X direction and the Y direction, and is convenient to align with the splicing area.

Further, a flexible light-transmitting film for protecting the chip is arranged on the transparent cover plate, and a plurality of through holes are formed in the flexible light-transmitting film.

The chip is protected by adopting the further scheme, and the chip is prevented from being damaged in the operation process.

Further, the imaging display terminal is a computer.

The further scheme has the beneficial effect that the influence data shot by the camera can be displayed with high definition.

Further, a door capable of being opened and closed is arranged on the side wall of the box body.

The beneficial effect of adopting above-mentioned further scheme is convenient for installation and maintenance equipment.

Further, the transparent cover plate is a glass cover plate.

The beneficial effect of adopting above-mentioned further scheme is with low costs, and the transmittance is good, not only plays the effect of bearing to the chip, also is convenient for the clearance between the chip is shot to the camera.

Further, the display device further comprises a screen divider, and the screen divider is electrically connected with the imaging display terminal.

The adoption of the further scheme has the beneficial effects that a plurality of splicing areas can be split-screen displayed, so that the subsequent splicing work of operators is facilitated.

Further, the vacuum generator is further included, and an air suction port of the vacuum generator is communicated with the inner cavity of the transparent cover plate.

The further scheme has the beneficial effects that the position of the chip can be better fixed, and the operation is convenient.

Further, the camera is a high-definition camera.

The beneficial effect of adopting above-mentioned further scheme is that imaging accuracy is high.

Drawings

FIG. 1 is an exploded view of the present utility model;

Fig. 2 is a front view of fig. 1.

In the drawings, the list of components represented by the various numbers is as follows:

1. A case; 2. a camera; 3. an XY moving platform; 4. a transparent cover plate; 5. an imaging display terminal; 6. a flexible light-transmitting film; 7. a screen divider; 8. a vacuum generator; 9. a bracket; 10. a chip; 11. and (3) a door.

Detailed Description

The principles and features of the present utility model are described below with reference to the drawings, the examples are illustrated for the purpose of illustrating the utility model and are not to be construed as limiting the scope of the utility model.

Example 1:

As shown in fig. 1-2, in this embodiment, a chip splicing alignment device includes a case 1, a transparent cover plate 4 with an inner cavity, and an imaging display terminal 5, an opening is disposed at the top end of the case 1, the transparent cover plate 4 for sealing the opening is mounted at the opening, a camera 2 with a vertically upward lens is mounted in the case 1 through a bracket 9, a vacuum adsorption hole for adsorbing a chip 10 is disposed on the transparent cover plate 4, and the camera 2 is electrically connected with the imaging display terminal 5.

The beneficial effects of this embodiment are: the position of the surface of the chip 10 facing downwards is photographed by the camera 2, the position is displayed by the imaging display terminal 5, the splicing gaps of the chips 10 are accurately measured, the distance between the chips 10 is manually finely adjusted under the guidance of the imaging display terminal 5, and the subsequent splicing work of the chips 10 is conveniently unfolded.

As shown in fig. 1, the case 1 has a rectangular shape, but other shapes, such as square, may be adopted.

On the basis of the above embodiment, the transparent cover plate 4 is provided with a plurality of vacuum adsorption holes for adsorbing the chip 10, and the plurality of vacuum adsorption holes are uniformly arranged on the transparent cover plate 4.

On the basis of the embodiment, lifting supporting feet can be arranged at the bottom of the box body 1, so that overall stability is improved. The lifting support foot specifically comprises a support rod and a base body, the bottom end of the support rod is connected with the base body through threads, the top end of the support rod is fixedly connected with the bottom of the box body 1, and the overall height is convenient to adjust.

Example 2

Preferably, on the basis of embodiment 1, the camera 2 and the support 9 are provided in plural, and the plural cameras 2 and the plural supports 9 are in one-to-one correspondence, the plural supports 9 are installed in the case 1 at intervals along the horizontal direction, and the plural cameras 2 are respectively installed on the corresponding supports 9.

The beneficial effects of this embodiment are: the plurality of cameras 2 respectively shoot the splicing areas of the plurality of chips 10, thereby improving the working efficiency.

The number of the cameras 2 and the holders 9 is not limited, and depends on the number of chips to be spliced according to the work requirements.

Example 3

Preferably, on the basis of embodiment 2, the device further includes an XY moving platform 3, the number of XY moving platforms 3 is plural, and the XY moving platforms are in one-to-one correspondence with plural brackets 9, the bodies of the XY moving platforms 3 are all fixed in the bottom of the case 1, and the driving ends thereof can move horizontally and vertically and are fixedly connected with the corresponding brackets 9.

The X-direction and Y-direction position of the camera can be adjusted by the XY moving platform, and the spliced area can be aligned conveniently.

The alternative scheme of the implementation is that the XYZ three-axis moving platform is directly adopted to connect the camera 2, and the height of the camera 2 does not need to be manually adjusted.

Example 4

Preferably, on the basis of embodiments 1-3, the transparent cover plate 4 is provided with a flexible light-transmitting film 6 for protecting the chip 10.

The beneficial effects of this embodiment are: the chip 10 is protected from damage during operation.

It should be noted that the flexible light-transmitting film 6 is also provided with a plurality of through holes, so as to enhance the fixing effect of the chip 10.

Example 5

Preferably, on the basis of embodiments 1 to 4, the imaging display terminal 5 is a computer.

The beneficial effects of this embodiment are: the influence data shot by the camera 2 can be displayed with high definition.

Example 6

Preferably, on the basis of embodiments 1-5, a door 11 capable of being opened and closed is arranged on the side wall of the box body 1.

The beneficial effects of this embodiment are: and the installation and maintenance of the equipment are convenient.

On the basis of the above embodiment, the door 11 of the case 1 is a side-by-side door, and further facilitates installation and maintenance of the apparatus.

Example 7

Preferably, on the basis of embodiments 1 to 6, the transparent cover plate 4 is a glass cover plate.

The beneficial effects of this embodiment are: the cost is low, the transmittance is good, the chip 10 is not only loaded, but also the camera 2 is convenient to shoot the gap between the chips 10.

Alternatively, the transparent cover plate 4 may be an acrylic plate, which has good transparency and is durable.

Example 8

Preferably, on the basis of embodiments 1-7, a screen splitter 7 is further included, and the screen splitter 7 is electrically connected to the imaging display terminal 5.

The beneficial effects of this embodiment are: the multiple splicing areas can be split-screen displayed, so that the subsequent splicing work of operators is facilitated.

Example 9

Preferably, on the basis of the embodiments 1-8, the vacuum generator 8 is further included, and an air suction port of the vacuum generator 8 is communicated with the inner cavity of the transparent cover plate 4.

The beneficial effects of this embodiment are: the position of the chip can be better fixed, and the operation is convenient.

Example 10

Preferably, on the basis of embodiments 1 to 9, the camera 2 is a high-definition camera.

The beneficial effects of this embodiment are: the imaging precision is high.

Further, a CCD camera can be adopted, the CCD camera can be detachably connected to the support 9, the CCD camera is specifically connected through a clamp, the front, back, left and right positions of the support 9 are adjusted through the XY moving platform 3, the barrel bodies of the collineation of lenses are guaranteed, the lens spacing of the CCD camera is adjusted according to the chip size, and finally the lenses of the CCD camera are used for having a spiral adjusting function, so that the focal length of each lens can be independently adjusted.

The utility model has the beneficial effects that:

Shooting the position of the surface-down chip 10 by the camera 2, displaying by the imaging display terminal 5, accurately measuring the splicing gaps of the plurality of chips 10, manually fine-adjusting the spacing between the chips 10 under the guidance of the imaging display terminal 5, and connecting the chips and the substrate by the bonding medium after the adjustment (the bonding medium has a shaped form, namely the height of the bonding medium is not changed or is very little in micron level after the curing); short manufacturing period, low cost and simple operation.

In the description of the present utility model, it should be understood that the terms "center", "length", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "inner", "outer", "peripheral side", "circumferential", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, are merely for convenience in describing the present utility model and simplifying the description, and do not indicate or imply that the system or element in question must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present utility model.

In the description of the present utility model, the meaning of "plurality" means at least two, for example, two, three, etc., unless specifically defined otherwise.

In the present utility model, unless explicitly specified and limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; either directly or indirectly, through intermediaries, or both, may be in communication with each other or in interaction with each other, unless expressly defined otherwise. The specific meaning of the above terms in the present utility model can be understood by those of ordinary skill in the art according to the specific circumstances.

In the description of the present specification, a description referring to terms "one embodiment," "some embodiments," "examples," "specific examples," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present utility model. In this specification, schematic representations of the above terms are not necessarily directed to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, the different embodiments or examples described in this specification and the features of the different embodiments or examples may be combined and combined by those skilled in the art without contradiction.

The foregoing description of the preferred embodiments of the utility model is not intended to limit the utility model to the precise form disclosed, and any such modifications, equivalents, and alternatives falling within the spirit and scope of the utility model are intended to be included within the scope of the utility model.

Claims

1. The utility model provides a chip concatenation counterpoint device which characterized in that: including box (1), have transparent cover plate (4) and imaging display terminal (5) of inner chamber, the top of box (1) is equipped with the opening, the opening part is installed and is used for the closing cap open-ended transparent cover plate (4), install camera (2) that the camera is vertical ascending through support (9) in box (1), be equipped with on transparent cover plate (4) and be used for adsorbing the vacuum adsorption hole of chip (10), camera (2) with imaging display terminal (5) electricity is connected.

2. The chip splice alignment apparatus of claim 1, wherein: the camera (2) with support (9) all are equipped with a plurality ofly, and a plurality of camera (2) with a plurality of support (9) one-to-one, a plurality of support (9) are installed along the horizontal direction interval in box (1), a plurality of camera (2) are installed respectively on corresponding support (9).

3. The chip splice alignment apparatus of claim 2, wherein: the device further comprises XY moving platforms (3), the XY moving platforms (3) are multiple in number and correspond to the supports (9) one by one, the XY moving platforms (3) are fixed in the bottom of the box body (1), and the driving ends of the XY moving platforms can move horizontally and vertically and are fixedly connected with the corresponding supports (9).

4. The chip splice alignment apparatus of claim 1, wherein: the transparent cover plate (4) is provided with a flexible light-transmitting film (6) for protecting the chip (10), and the flexible light-transmitting film (6) is provided with a plurality of through holes.

5. The chip splice alignment apparatus of claim 1, wherein: the imaging display terminal (5) is a computer.

6. The chip splice alignment apparatus of claim 1, wherein: the side wall of the box body (1) is provided with a door (11) which can be opened and closed.

7. The chip splice alignment apparatus of claim 1, wherein: the transparent cover plate (4) is a glass cover plate.

8. The chip splice alignment device of any of claims 1-7, wherein: the imaging display device further comprises a screen divider (7), and the screen divider (7) is electrically connected with the imaging display terminal (5).

9. The chip splice alignment device of any of claims 1-7, wherein: the vacuum generator (8) is further included, and an air suction port of the vacuum generator (8) is communicated with the inner cavity of the transparent cover plate (4).

10. The chip splice alignment device of any of claims 1-7, wherein: the camera (2) is a high-definition camera.