CN221463649U - Integrated LED far and near light module heat radiation structure - Google Patents
Integrated LED far and near light module heat radiation structure Download PDFInfo
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- CN221463649U CN221463649U CN202322854369.6U CN202322854369U CN221463649U CN 221463649 U CN221463649 U CN 221463649U CN 202322854369 U CN202322854369 U CN 202322854369U CN 221463649 U CN221463649 U CN 221463649U
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- radiator body
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- chip set
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- led chip
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- 230000005855 radiation Effects 0.000 title claims abstract description 17
- 230000017525 heat dissipation Effects 0.000 claims description 42
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 8
- 229910000838 Al alloy Inorganic materials 0.000 claims description 5
- 239000000741 silica gel Substances 0.000 claims description 5
- 229910002027 silica gel Inorganic materials 0.000 claims description 5
- 230000003647 oxidation Effects 0.000 claims description 3
- 238000007254 oxidation reaction Methods 0.000 claims description 3
- 239000004576 sand Substances 0.000 claims description 3
- 238000005507 spraying Methods 0.000 claims description 3
- 230000002146 bilateral effect Effects 0.000 claims 1
- 230000010354 integration Effects 0.000 abstract description 4
- 238000009434 installation Methods 0.000 description 7
- 230000000694 effects Effects 0.000 description 6
- 230000007797 corrosion Effects 0.000 description 4
- 238000005260 corrosion Methods 0.000 description 4
- 239000000956 alloy Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000005286 illumination Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
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Abstract
The utility model discloses a radiating structure of an integrated LED far and near light module, which comprises a radiator body and further comprises the following components: the low-beam LED chip set is arranged on the front surface of the radiator body; the low beam reflection cup mounting hole is arranged on the front surface of the radiator body and is used for mounting the low beam reflection cup and carrying out secondary treatment on the light source; the high beam LED chip set 4 is arranged on the side surface of the radiator body; the lens support mounting holes are formed in the side face of the radiator body and are used for mounting the lens support and the lens of far and near light. The integrated LED far and near light module radiating structure designed by the utility model takes the radiator as the base of the whole far and near light system, has higher integration level, simple structure assembly and small structure occupation space, can realize rapid heat conduction and timely radiation, and prolongs the service life of the LED; the radiator solves the problems of poor heat radiation performance, complex structure, large occupied space, inconvenient assembly and the like of the traditional radiator.
Description
Technical Field
The utility model relates to a heat radiation structure, in particular to a heat radiation structure of an integrated LED far and near light module.
Background
Most of the existing headlamps of the automobile use an LED chip set as a light source to realize the high-low beam function, and the LED is used as a new generation green light source and an environment-friendly solid illumination light source, and is widely applied to the automobile illumination industry. The light-colored light-emitting diode has the advantages of low power consumption, pure light color, full solid state, light weight, small volume, environmental protection and the like. However, LEDs have certain disadvantages in the case of many advantages as light sources. The LED is used as a photoelectric device, electric energy is converted into light energy in the working process, but the conversion efficiency is low, most of electric energy is converted into heat energy, and the temperature of the LED is increased, so that the light attenuation of the LED is serious, and the service life of the LED is influenced after long-term use. The radiator becomes an essential important component for reducing the light attenuation of the LED and prolonging the service life of the LED.
At present, some radiating fins of some radiators are provided with some branches to carry out auxiliary heat dissipation, but the arranged branches occupy large space in the assembly process, are not practical and inconvenient to assemble, and the traditional radiators have the problems of poor heat dissipation performance, complex radiating fin structures, large occupied space, inconvenient assembly, poor heat dissipation effect, influence on the service life of LEDs and the like.
Therefore, an integrated LED far and near light module heat dissipation structure is designed to solve the problems.
It should be noted that the foregoing description of the background art is only for the purpose of providing a clear and complete description of the technical solution of the present utility model and is presented for the convenience of understanding by those skilled in the art. The above-described solutions are not considered to be known to the person skilled in the art simply because they are set forth in the background of the utility model section.
Disclosure of utility model
In order to overcome the defects in the prior art, the utility model aims to provide a radiating structure of an integrated LED far and near light module.
To achieve the above and other related objects, the present utility model provides the following technical solutions: the utility model provides an integrated LED far and near light module heat radiation structure, includes the radiator body, still includes:
the low-beam LED chip set is arranged on the front surface of the radiator body;
the low beam reflection cup mounting hole is arranged on the front surface of the radiator body and is used for mounting the low beam reflection cup and carrying out secondary treatment on the light source;
the high beam LED chip set is arranged on the side face of the radiator body;
The lens support mounting holes are formed in the side face of the radiator body and used for mounting the lens support and the lens of far and near light.
In this scheme, the radiator body is the radiator promptly, with passing light LED chipset, far beam LED chipset, passing light reflection cup, lens support direct mount on the radiator body, has just regard as the base of whole far and near light system to the radiator promptly, and the integrated level is higher, and structure occupation space is little, can also realize quick heat conduction, in time dispels the heat.
Further, the radiator body is provided with a plurality of radiating fins, a radiating channel is formed between two adjacent radiating fins, and radiating columns are uniformly distributed on the radiating fins. In the scheme, the radiator body is provided with the plurality of radiating fins to form the radiating channel, and the radiating columns are arranged on the radiating fins, so that the radiating area can be increased, and the radiating efficiency is improved.
Further, two adjacent heat dissipation fins are arranged in parallel, and the thickness of each heat dissipation fin is gradually thinned from the middle end to the upper end and the lower end. In the scheme, the heat dissipation channel is widened gradually from the middle to the upper end and the lower end, so that hot air is output along the heat dissipation channel rapidly, and the heat dissipation efficiency is improved.
Further, the overall shape of the radiator body is L-shaped. In this scheme, set up the radiator body into L type, compact structure, stability is good, also is convenient for the installation of low beam LED chipset and far beam LED chipset.
Further, the low beam LED chip set and the high beam LED chip set are detachably connected to the radiator body through bolts. In this scheme, passing light LED chipset and far-reaching light LED chipset all link to each other through the fastener with the radiator body, can guarantee firm in connection, also convenient to detach and installation.
Further, two low beam reflection cup mounting holes are formed, and the two low beam LED chip sets are symmetrically arranged on two sides of the low beam LED chip set. In this scheme, set up the low beam reflection cup mounting hole of two symmetries, installation low beam reflection cup that can be more stable guarantees the holistic stability of heat radiation structure.
Further, two lens support mounting holes are formed and are respectively located on two sides of the front end above the high beam LED chip set. In this scheme, set up two lens support mounting holes, the lens support's of being convenient for installation, lens support and lens that can be more stable installation far and near light guarantee the holistic stability of heat radiation structure.
Furthermore, the contact surfaces of the low beam LED chip set and the high beam LED chip set and the radiator body are provided with high heat conduction silica gel layers. In this scheme, high heat conduction silica gel layer can make the better conduction of the heat that LED produced to the radiator body on, improves radiating efficiency.
Further, the radiator body is made of aluminum alloy. In the scheme, the aluminum alloy material is light in weight, corrosion-resistant and good in heat dissipation performance, and can enhance the heat dissipation effect.
Further, the surface of the radiator body is provided with a sand spraying layer and/or an oxidation layer. In this scheme, set up corrosion-resistant layer at the surface of radiator body, can avoid the radiator body to receive the corruption, increase radiant heat exchange volume, improved the radiating effect.
Due to the application of the technical scheme, compared with the prior art, the utility model has the following beneficial effects:
The integrated LED far and near light module radiating structure designed by the utility model takes the radiator as the base of the whole far and near light system, has higher integration level, simple structure assembly and small structure occupation space, can realize rapid heat conduction and timely radiation, and prolongs the service life of the LED; the radiator solves the problems of poor heat radiation performance, complex structure, large occupied space, inconvenient assembly and the like of the traditional radiator.
Drawings
FIG. 1 is a schematic diagram of a heat dissipating structure according to the present utility model;
FIG. 2 is a schematic diagram of a heat dissipation structure according to the present utility model;
In the above drawings, 1, a radiator body; 2. a low beam LED chipset; 3. a low beam reflector mounting hole; 4. a high beam LED chip set; 5. a lens holder mounting hole; 6. a heat radiation fin; 7. and a heat dissipation channel.
Detailed Description
Further advantages and effects of the present utility model will become apparent to those skilled in the art from the disclosure of the present utility model, which is described by the following specific examples.
It should be noted that, in the description of the present utility model, it should be noted that, directions or positional relationships indicated by terms such as "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., are directions or positional relationships based on those shown in the drawings, or directions or positional relationships in which the inventive product is conventionally put in use, are merely for convenience of describing the present utility model and for simplifying the description, and are not indicative or implying that the apparatus or element to be referred to must have a specific direction, be constructed and operated in a specific direction, and therefore should not be construed as limiting the present utility model. Furthermore, the terms "first," "second," "third," and the like are used merely to distinguish between descriptions and should not be construed as indicating or implying relative importance. The terms "horizontal," "vertical," "overhang," and the like do not denote that the component is required to be absolutely horizontal or overhang, but may be slightly inclined. As "horizontal" merely means that its direction is more horizontal than "vertical", and does not mean that the structure must be perfectly horizontal, but may be slightly inclined.
In the description of the present utility model, it should also be noted that, unless explicitly specified and limited otherwise, the terms "disposed," "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, integrally connected, mechanically connected, electrically connected, directly connected, indirectly connected through an intermediary, or communicating between two elements. The specific meaning of the above terms in the present utility model will be understood in specific cases by those of ordinary skill in the art.
In the description of the present application, it should be understood that the azimuth or positional relationships indicated by the azimuth terms such as "front, rear, upper, lower, left, right", "lateral, vertical, horizontal", and "top, bottom", etc., are generally based on the azimuth or positional relationships shown in the drawings, merely to facilitate description of the present application and simplify the description, and these azimuth terms do not indicate and imply that the apparatus or elements referred to must have a specific azimuth or be constructed and operated in a specific azimuth, and thus should not be construed as limiting the scope of protection of the present application; the orientation word "inner and outer" refers to inner and outer relative to the contour of the respective component itself.
The preferred embodiments of the present utility model will be described in detail below with reference to the accompanying drawings so that the advantages and features of the present utility model can be more easily understood by those skilled in the art, thereby making clear and defining the scope of the present utility model.
Embodiment one: referring to fig. 1 and 2, this embodiment provides a heat dissipation structure of an integrated LED far and near light module, including a heat sink body 1, further including:
The low-beam LED chip set 2 is arranged on the front surface of the radiator body 1;
The low beam reflection cup mounting hole 3 is arranged on the front surface of the radiator body 1 and is used for mounting a low beam reflection cup and carrying out secondary treatment on a light source;
The high beam LED chip set 4 is arranged on the side surface of the radiator body 1; wherein, the high beam LED chip set 4 is vertically arranged on the side surface of the radiator body 1;
The lens support mounting holes 5 are provided in the side of the radiator body 1 for mounting the lens support for high and low beams and the lens.
In this embodiment, the radiator body 1 is a radiator, and the low beam LED chip set 2, the high beam LED chip set 4, the low beam reflection cup and the lens support are directly mounted on the radiator body 1, that is, the radiator is used as a base of the whole high beam system, so that the integration level is high, the occupied space of the structure is small, and the rapid heat conduction and the timely heat dissipation can be realized.
Embodiment two: referring to fig. 2, this embodiment is a further improvement based on the first embodiment, and the specific manner is that: the radiator body 1 is provided with a plurality of radiating fins 6, a radiating channel 7 is formed between two adjacent radiating fins 6, and radiating columns are uniformly distributed on the radiating fins 6.
The heat dissipation fins 6 are disposed on the other side surface and the back surface of the heat sink body 1, the back surface is the opposite surface for mounting the low beam LED chip set 2, the other side surface is the opposite surface for mounting the high beam LED chip set 4, so as to prevent mounting interference and ensure reflection of light.
In this embodiment, the heat dissipation area can be increased and the heat dissipation efficiency can be improved by providing a plurality of heat dissipation fins 6 on the heat sink body 1 to form the heat dissipation channel 7 and providing the heat dissipation columns on the heat dissipation fins 6.
Embodiment III: referring to fig. 2, this embodiment is a further improvement based on the second embodiment, and the specific manner is as follows: the two adjacent heat radiation fins 6 are arranged in parallel, and the thickness of the heat radiation fins 6 is gradually thinned from the middle end to the upper end and the lower end.
In this embodiment, two adjacent heat dissipation fins 6 are parallel, and the thickness of the heat dissipation fins 6 is gradually thinned from the middle end to the upper and lower ends, that is, the heat dissipation channel 7 is gradually widened from the middle to the upper and lower ends, which is beneficial to the hot air flow to be rapidly output along the heat dissipation channel 7 and improves the heat dissipation efficiency.
Embodiment four: referring to fig. 1, this embodiment is a further improvement based on the first embodiment, and the specific manner is that: the overall shape of the radiator body 1 is "L".
In this embodiment, the radiator body 1 is provided in an L-shape, which is compact in structure and good in stability, and also facilitates the installation of the low beam LED chip set 2 and the high beam LED chip set 4.
Fifth embodiment: referring to fig. 1 and 2, this embodiment is a further improvement based on the first embodiment, and specifically includes: the low beam LED chip set 2 and the high beam LED chip set 4 are detachably connected to the radiator body 1 through bolts.
In this embodiment, the low beam LED chip set 2 and the high beam LED chip set 4 are connected with the radiator body 1 through fasteners, so that firm connection can be ensured, and disassembly and installation are also convenient.
Example six: referring to fig. 1, this embodiment is a further improvement based on the first embodiment, and the specific manner is that: the number of the dipped beam reflection cup mounting holes 3 is two, and the dipped beam reflection cup mounting holes are symmetrically arranged on two sides of the dipped beam LED chip set 2.
In this embodiment, two symmetrical low beam reflector cup mounting holes 3 are provided, so that the low beam reflector cup can be mounted more stably, and the overall stability of the heat dissipation structure is ensured.
Embodiment seven: referring to fig. 1, this embodiment is a further improvement based on the first embodiment, and the specific manner is that: the lens support mounting holes 5 are arranged at two sides of the upper front end of the high beam LED chip set 4.
In this embodiment, two lens support mounting holes 5 are provided, so that the lens support can be conveniently mounted, the lens support and the lens for far and near light can be more stably mounted, and the overall stability of the heat dissipation structure is ensured.
Example eight: not shown in the drawings, this embodiment is a further improvement on the basis of the first embodiment, and the specific manner is as follows: the contact surfaces of the low beam LED chip set 2 and the high beam LED chip set 4 and the radiator body 1 are provided with high heat conduction silica gel layers.
In this embodiment, the high thermal conductive silica gel layer can make the heat generated by the LED better conduct to the radiator body 1, and improve the heat dissipation efficiency.
Example nine: not shown in the drawings, this embodiment is a further improvement on the basis of the first embodiment, and the specific manner is as follows: the radiator body 1 is made of aluminum alloy.
In the embodiment, the aluminum alloy material is light in weight, corrosion-resistant, good in heat dissipation performance and capable of enhancing the heat dissipation effect.
Example ten: not shown in the drawings, this embodiment is a further improvement on the basis of the first embodiment, and the specific manner is as follows: the surface of the radiator body 1 is provided with a sand spraying layer and/or an oxidation layer.
In this embodiment, the corrosion-resistant layer is disposed on the surface of the radiator body 1, so that the radiator body 1 is prevented from being corroded, the radiant heat exchange amount is increased, and the heat dissipation effect is improved.
The integrated LED far and near light module radiating structure designed by the utility model takes the radiator as the base of the whole far and near light system, has higher integration level, simple structure assembly and small structure occupation space, can realize rapid heat conduction and timely radiation, and prolongs the service life of the LED; the radiator solves the problems of poor heat radiation performance, complex structure, large occupied space, inconvenient assembly and the like of the traditional radiator.
The above embodiments are only for illustrating the technical concept and features of the present utility model, and are intended to enable those skilled in the art to understand the content of the present utility model and to implement the same, but are not intended to limit the scope of the present utility model, and all equivalent changes or modifications made according to the spirit of the present utility model should be included in the scope of the present utility model.
Claims (10)
1. The utility model provides an integrated LED far and near light module heat radiation structure, includes radiator body (1), its characterized in that still includes:
the low-beam LED chip set (2) is arranged on the front surface of the radiator body (1);
the low beam reflection cup mounting hole (3), the low beam reflection cup mounting hole (3) is arranged on the front surface of the radiator body (1) and is used for mounting the low beam reflection cup and carrying out secondary treatment on a light source;
a high beam LED chip set (4), wherein the high beam LED chip set (4) is arranged on the side surface of the radiator body (1);
And the lens support mounting holes (5) are formed in the side face of the radiator body (1) and are used for mounting a far-near light lens support and a lens.
2. The integrated LED low-beam and high-beam module heat dissipation structure of claim 1, wherein: the radiator is characterized in that a plurality of radiating fins (6) are arranged on the radiator body (1), radiating channels (7) are formed between two adjacent radiating fins (6), and radiating columns are uniformly distributed on the radiating fins (6).
3. The integrated LED low-beam and high-beam module heat dissipation structure of claim 2, wherein: two adjacent radiating fins (6) are arranged in parallel, and the thickness of each radiating fin (6) is gradually thinned from the middle end to the upper end and the lower end.
4. The integrated LED low-beam and high-beam module heat dissipation structure of claim 1, wherein: the overall shape of the radiator body (1) is L-shaped.
5. The integrated LED low-beam and high-beam module heat dissipation structure of claim 1, wherein: the low beam LED chip set (2) and the high beam LED chip set (4) are detachably connected to the radiator body (1) through bolts.
6. The integrated LED low-beam and high-beam module heat dissipation structure of claim 1, wherein: the low beam reflection cup mounting holes (3) are formed in two sides of the low beam LED chip set (2) in a bilateral symmetry mode.
7. The integrated LED low-beam and high-beam module heat dissipation structure of claim 1, wherein: the lens support mounting holes (5) are arranged at two sides of the front end above the high beam LED chip set (4) respectively.
8. The integrated LED low-beam and high-beam module heat dissipation structure of claim 1, wherein: the contact surfaces of the low beam LED chip set (2) and the high beam LED chip set (4) and the radiator body (1) are respectively provided with a high heat conduction silica gel layer.
9. The integrated LED low-beam and high-beam module heat dissipation structure of claim 1, wherein: the radiator body (1) is made of aluminum alloy.
10. The integrated LED low-beam and high-beam module heat dissipation structure of claim 1, wherein: the surface of the radiator body (1) is provided with a sand spraying layer and/or an oxidation layer.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN202322854369.6U CN221463649U (en) | 2023-10-24 | 2023-10-24 | Integrated LED far and near light module heat radiation structure |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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CN202322854369.6U CN221463649U (en) | 2023-10-24 | 2023-10-24 | Integrated LED far and near light module heat radiation structure |
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Publication Number | Publication Date |
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CN221463649U true CN221463649U (en) | 2024-08-02 |
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN202322854369.6U Withdrawn - After Issue CN221463649U (en) | 2023-10-24 | 2023-10-24 | Integrated LED far and near light module heat radiation structure |
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Country | Link |
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CN (1) | CN221463649U (en) |
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2023
- 2023-10-24 CN CN202322854369.6U patent/CN221463649U/en not_active Withdrawn - After Issue
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