CN221421263U - Electroplating device for production and processing of semiconductors - Google Patents
Electroplating device for production and processing of semiconductors Download PDFInfo
- Publication number
- CN221421263U CN221421263U CN202323006555.0U CN202323006555U CN221421263U CN 221421263 U CN221421263 U CN 221421263U CN 202323006555 U CN202323006555 U CN 202323006555U CN 221421263 U CN221421263 U CN 221421263U
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- electroplating
- fixedly connected
- electroplating device
- semiconductor
- motor
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- 238000009713 electroplating Methods 0.000 title claims abstract description 74
- 239000004065 semiconductor Substances 0.000 title claims abstract description 47
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 16
- 239000000428 dust Substances 0.000 claims abstract description 13
- 238000005406 washing Methods 0.000 claims abstract description 12
- 238000007790 scraping Methods 0.000 claims description 9
- 239000012535 impurity Substances 0.000 abstract description 11
- 230000000694 effects Effects 0.000 abstract description 7
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 6
- 230000002349 favourable effect Effects 0.000 abstract description 5
- 238000007664 blowing Methods 0.000 abstract description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Landscapes
- Electroplating Methods And Accessories (AREA)
Abstract
The utility model relates to the technical field of semiconductor processing, in particular to a semiconductor production and processing electroplating device which comprises an electroplating device shell, wherein a water washing tank and an electroplating tank are arranged in the electroplating device shell, three fans are fixedly connected in the electroplating device shell, a dustproof component is fixedly connected to one side of the electroplating device shell, a moving component is arranged on one side of the electroplating device shell, and a clamping component is fixedly connected to one side of the moving component. The utility model has the advantages that: be provided with the third motor in the clamping subassembly and drive the semiconductor and rotate, the cooperation washing pond washs semiconductor, prevents that the dust impurity on semiconductor surface from influencing electroplating effect, is favorable to improving work efficiency to still be provided with the dust screen in one side of fan, prevent that the fan from blowing the impurity in the air on the semiconductor surface after electroplating, be favorable to improving product quality.
Description
Technical Field
The utility model relates to the technical field of semiconductor processing, in particular to a production processing electroplating device of a semiconductor.
Background
Chinese patent with publication No. CN219731099U discloses a semiconductor electroplating device, including electroplating the pond, the side surface of first fixed plate rotates and is connected with the threaded rod, the bottom fixedly connected with electric telescopic handle of movable block, the inside wall fixedly connected with stopper of mount, the inside sliding connection of stopper has the spliced pole, the left side end fixedly connected with solid fixed ring of spliced pole, the surface cover of spliced pole is equipped with the spring, the spring is laminated with solid fixed ring's side surface mutually, the first holder of bottom fixedly connected with of mount, the surface fixedly connected with second holder of spliced pole, the second holder is located the right side of stopper, and the second holder is corresponding with the position of first holder.
The device is electroplated without semiconductor cleaning, so that impurities can influence the purity of an electroplating pool, the working efficiency of the electroplating device is influenced, a dust screen is not arranged at a fan, and the fan blows larger impurities in the air to the surface of a semiconductor to influence the quality of the semiconductor after electroplating.
In this regard, the utility model provides a semiconductor production and processing electroplating device which solves the problem.
Disclosure of utility model
The object of the present utility model is to solve at least one of the technical drawbacks.
Therefore, an object of the present utility model is to provide a semiconductor manufacturing electroplating apparatus, which solves the problems mentioned in the background art and overcomes the shortcomings of the prior art.
In order to achieve the above object, an embodiment of an aspect of the present utility model provides a semiconductor manufacturing and processing electroplating apparatus, including an electroplating apparatus housing, four supporting seats are fixedly connected to the bottom of the electroplating apparatus housing, a water washing tank and an electroplating tank are disposed inside the electroplating apparatus housing, three fans are fixedly connected to the inside of the electroplating apparatus housing, a dust-proof component is fixedly connected to one side of the electroplating apparatus housing, a moving component is disposed on one side of the electroplating apparatus housing, and a clamping component is fixedly connected to one side of the moving component.
By any of the above schemes, preferably, two door panels are hinged on one side of the electroplating device shell, and an observation window is fixedly connected on one side of the electroplating device shell.
By any of the above-mentioned schemes, preferably, the dustproof assembly comprises a dustproof net and four fixing plates, one side of the dustproof net is fixedly connected with one side of the electroplating device shell, and one side of one fixing plate is fixedly connected with a first motor.
The technical effect achieved by adopting the scheme is as follows: the dust screen is used for filtering air sucked by the fan, so that larger impurities are prevented from being attached to the surface of the semiconductor.
By any of the above schemes, preferably, the output end of the first motor is fixedly connected with a first threaded rod, the outer part of the first threaded rod is rotationally connected with the inner part of the fixing plate, and the outer surface of the first threaded rod is in threaded connection with a dust scraping plate.
By any of the above schemes, preferably, a fixing rod is sleeved in the ash scraping plate, and two sides of the fixing rod are fixedly connected with one side of the fixing plate.
The technical effect achieved by adopting the scheme is as follows: the output end of the first motor drives the first threaded rod to rotate, and the ash scraping plate is matched with the fixing rod to clean.
By the above-mentioned scheme preferred, the removal subassembly includes the second motor, one side of second motor and one side fixed connection of electroplating device casing, the output fixedly connected with second threaded rod of second motor, the outside of second threaded rod is connected with electroplating device casing's inside rotation, the surface threaded connection of second threaded rod has a slider.
The technical effect achieved by adopting the scheme is as follows: the output end of the second motor drives the second threaded rod to rotate, so that the sliding block moves along the second threaded rod.
By the preferred mode of above-mentioned arbitrary scheme, clamping subassembly includes electric putter, one side fixed connection of electric putter is in one side of slider, electric putter's output fixedly connected with third motor, the output fixedly connected with electric jig of third motor.
The technical effect achieved by adopting the scheme is as follows: the output end of the electric push rod drives the electric clamp to lift, and the output end of the third motor drives the electric clamp to rotate.
Compared with the prior art, the utility model has the following advantages and beneficial effects:
Be provided with the third motor in the clamping subassembly and drive the semiconductor and rotate, the cooperation washing pond washs semiconductor, prevents that the dust impurity on semiconductor surface from influencing electroplating effect, is favorable to improving work efficiency to be provided with the dust screen in one side of fan, prevent that the fan from blowing the impurity in the air on the semiconductor surface after electroplating, be favorable to improving product quality.
Additional aspects and advantages of the utility model will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the utility model.
Drawings
The foregoing and/or additional aspects and advantages of the utility model will become apparent and may be better understood from the following description of embodiments taken in conjunction with the accompanying drawings in which:
FIG. 1 is a schematic view of a first view structure according to an embodiment of the present utility model;
FIG. 2 is a schematic view of a second view structure according to an embodiment of the present utility model;
FIG. 3 is a schematic view of a dust-proof assembly according to an embodiment of the present utility model;
Fig. 4 is a schematic partial structure according to an embodiment of the present utility model.
In the figure: 1-electroplating device shell, 101-supporting seat, 102-fan, 103-door plate, 104-observation window, 2-washing tank, 3-electroplating tank, 4-dustproof component, 401-dustproof net, 402-fixed plate, 403-first motor, 404-first threaded rod, 405-ash scraping plate, 406-fixed rod, 5-movable component, 501-second motor, 502-second threaded rod, 503-slider, 6-clamping component, 601-electric push rod, 602-third motor and 603-electric clamp.
Detailed Description
Embodiment one: as shown in fig. 1 to 4, a semiconductor manufacturing and processing electroplating device comprises an electroplating device shell 1, four supporting seats 101 are fixedly connected to the bottom of the electroplating device shell 1, a water washing tank 2 and an electroplating tank 3 are arranged in the electroplating device shell 1, a semiconductor is invaded into the water washing tank 2 by a clamping component 6, the semiconductor is enabled to rotate in the water washing tank 2 through a third motor 602 to be cleaned, three fans 102 are fixedly connected to the interior of the electroplating device shell 1, the fans 102 blow the electroplated semiconductor to be dried, a dustproof component 4 is fixedly connected to one side of the electroplating device shell 1, a moving component 5 is arranged on one side of the electroplating device shell 1, and a clamping component 6 is fixedly connected to one side of the moving component 5.
One side of the electroplating device shell 1 is hinged with two door plates 103, one side of the electroplating device shell 1 is fixedly connected with an observation window 104, and the observation window 104 is made of glass, so that the electroplating device has high transparency and chemical stability, and can be conveniently observed by operators.
The dustproof assembly 4 comprises a dustproof net 401 and four fixing plates 402, air sucked by the fan 102 is filtered through the dustproof net 401, large impurities are prevented from adhering to the surface of a semiconductor, one side of the dustproof net 401 is fixedly connected with one side of the electroplating device shell 1, and one side of one fixing plate 402 is fixedly connected with a first motor 403.
The output end of the first motor 403 is fixedly connected with a first threaded rod 404, the outer part of the first threaded rod 404 is rotationally connected with the inner part of the fixed plate 402, and the outer surface of the first threaded rod 404 is in threaded connection with a ash scraping plate 405.
The inside of the ash scraping plate 405 is sleeved with a fixing rod 406, two sides of the fixing rod 406 are fixedly connected with one side of the fixing plate 402, the output end of the first motor 403 drives the first threaded rod 404 to rotate, and the ash scraping plate 405 moves to clean the surface of the dust screen 401 in cooperation with the fixing rod 406.
The moving assembly 5 comprises a second motor 501, one side of the second motor 501 is fixedly connected with one side of the electroplating device shell 1, the output end of the second motor 501 is fixedly connected with a second threaded rod 502, the outer part of the second threaded rod 502 is rotationally connected with the inner part of the electroplating device shell 1, the outer surface of the second threaded rod 502 is in threaded connection with a sliding block 503, and the output end of the second motor 501 drives the second threaded rod 502 to rotate, so that the sliding block 503 moves along the second threaded rod 502 and further drives the clamping assembly 6 to move.
Clamping subassembly 6 includes electric putter 601, and one side fixed connection of electric putter 601 is in one side of slider 503, and electric putter 601's output drives electric clamp 603 and goes up and down, and electric putter 601's output fixedly connected with a third motor 602, through the output drive electric clamp 603 of third motor 602 and rotate, an electric clamp 603 of output fixedly connected with of third motor 602 (known technique).
Embodiment two: can set up a liftable filter in rinsing pond 2 on the basis of embodiment one, can conveniently collect the processing in this way to the impurity that semiconductor washd down, be favorable to improving work efficiency, improve resource utilization.
A production processing electroplating device of a semiconductor has the following working principle:
The operator opens door plant 103 and puts into electroplating device casing 1 with the semiconductor, clamping subassembly 6 is clamped, the second motor 501 output of moving subassembly 5 drives second threaded rod 502 and rotates, make slider 503 drive clamping subassembly 6 and remove, reach washing pond 2's top, electric putter 601's output drives electric clamp 603 and descends, semiconductor invades the output of third motor 602 in washing pond 2 and drives electric clamp 603 and rotate semiconductor, make the semiconductor wash, then electric putter 601 rises the semiconductor, moving subassembly 6 continues to drive the semiconductor and removes and reach electroplating pond 3's top, rethread electric putter 601 invades the semiconductor and electroplate in the electroplating pond 3, fan 102 weathers after electroplating is accomplished, dust screen 401 is at long-time after using, first motor 403's output drives first 404 normal running fit dead lever 406, make scraper 405 clean dust screen 401 surface.
Compared with the prior art, the utility model has the following beneficial effects compared with the prior art:
The third motor 602 is arranged in the clamping assembly 6 to drive the semiconductor to rotate, the water washing tank 2 is matched to clean the semiconductor, dust impurities on the surface of the semiconductor are prevented from affecting the electroplating effect, the working efficiency is improved, the dust screen 401 is arranged on one side of the fan 102, the fan 102 is prevented from blowing impurities in the air on the surface of the electroplated semiconductor, and the product quality is improved.
Claims (7)
1. The utility model provides a production processing electroplating device of semiconductor which characterized in that: including electroplating device casing (1), four supporting seats (101) of bottom fixedly connected with of electroplating device casing (1), the inside of electroplating device casing (1) is provided with a washing pond (2) and electroplates pond (3), the inside fixedly connected with three fan (102) of electroplating device casing (1), one side fixedly connected with dustproof subassembly (4) of electroplating device casing (1), one side of electroplating device casing (1) is provided with one and removes subassembly (5), one side fixedly connected with of removing subassembly (5) is equipped with and presss from both sides subassembly (6).
2. The apparatus for manufacturing and electroplating a semiconductor according to claim 1, wherein: two door plates (103) are hinged to one side of the electroplating device shell (1), and an observation window (104) is fixedly connected to one side of the electroplating device shell (1).
3. The apparatus for manufacturing and electroplating a semiconductor according to claim 2, wherein: the dustproof assembly (4) comprises a dustproof net (401) and four fixing plates (402), one side of the dustproof net (401) is fixedly connected with one side of the electroplating device shell (1), and one side of one fixing plate (402) is fixedly connected with a first motor (403).
4. A semiconductor manufacturing electroplating apparatus according to claim 3, wherein: the output end of the first motor (403) is fixedly connected with a first threaded rod (404), the outer part of the first threaded rod (404) is rotationally connected with the inner part of the fixed plate (402), and the outer surface of the first threaded rod (404) is in threaded connection with a dust scraping plate (405).
5. The apparatus for manufacturing and electroplating a semiconductor according to claim 4, wherein: the inside of ash scraping plate (405) has cup jointed a dead lever (406), the both sides of dead lever (406) are all with one side fixed connection of dead plate (402).
6. The apparatus for manufacturing and electroplating a semiconductor according to claim 5, wherein: the movable assembly (5) comprises a second motor (501), one side of the second motor (501) is fixedly connected with one side of the electroplating device shell (1), the output end of the second motor (501) is fixedly connected with a second threaded rod (502), the outer part of the second threaded rod (502) is rotationally connected with the inner part of the electroplating device shell (1), and the outer surface of the second threaded rod (502) is in threaded connection with a sliding block (503).
7. The apparatus for manufacturing and electroplating a semiconductor according to claim 6, wherein: clamping subassembly (6) are including electric putter (601), one side fixed connection of electric putter (601) is in one side of slider (503), the output fixedly connected with of electric putter (601) is third motor (602), the output fixedly connected with of third motor (602) is electronic anchor clamps (603).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202323006555.0U CN221421263U (en) | 2023-11-07 | 2023-11-07 | Electroplating device for production and processing of semiconductors |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202323006555.0U CN221421263U (en) | 2023-11-07 | 2023-11-07 | Electroplating device for production and processing of semiconductors |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN221421263U true CN221421263U (en) | 2024-07-26 |
Family
ID=91980214
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202323006555.0U Active CN221421263U (en) | 2023-11-07 | 2023-11-07 | Electroplating device for production and processing of semiconductors |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN221421263U (en) |
-
2023
- 2023-11-07 CN CN202323006555.0U patent/CN221421263U/en active Active
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| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20240906 Address after: Room 510-G006, Building 2, South District, Medical Device Industrial Park, No. 8 Jinfeng Road, High tech Zone, Suzhou City, Jiangsu Province 215000 Patentee after: Suzhou Zhishuo Information Technology Co.,Ltd. Country or region after: China Address before: Room 401, No. 10, Lane 1940, Xinzha Road, Jing'an District, Shanghai 200040 Patentee before: Feng Xu Country or region before: China |