PCB layout structure of half brick module power supply
Technical Field
The utility model relates to the technical field of module power supplies, in particular to a PCB layout structure of a half brick module power supply.
Background
The small-size high-power density is a trend of development of module power supply products, because the size of a fixed module power supply is limited in volume and the heat can be carried, if the heat can not be timely led out, the temperature of a power tube can be rapidly increased until the power tube is damaged, or the service life of the power supply is greatly reduced. Then the loss must be reduced or the heat must be quickly conducted away to increase the power density, and the current methods for increasing the power density of the module in the market are: 1. increasing the number of power devices reduces the loss of a single device; 2. with a potting adhesive of higher thermal conductivity. If the device is added, the larger board distribution area is occupied, the difficulty in realizing the device in a limited space is great, and the material cost is increased; the heat conductivity of the high heat conduction pouring sealant in the current market is generally between 2 and 3W/M.K, the higher the heat conductivity is, the worse the fluidity is, the higher the glue filling difficulty is, and the heat conductivity of the glue in the X-Y axis direction is lower, so that the choice of the pouring sealant has great limitation, and other more effective modes are needed for high heat export to solve.
Disclosure of utility model
In view of the above problems, a PCB layout structure of a half brick module power supply is provided, which aims to solve the problems existing in the prior art.
The specific technical scheme is as follows:
The utility model provides a PCB overall arrangement structure of half brick module power, includes the power board and set up in control circuit, main transformer, BUCK circuit, current sampling circuit and auxiliary power transformer on the power board, still include the heat dissipation auxiliary member, the main transformer runs through the power board the winding has all been exposed to the front and back of power board, set up in power components and parts in all circuits on the power board distribute in the back of power board, other components and parts in all circuits set up in the front of power board, the heat dissipation auxiliary member inlay in between the power components and parts, just the main transformer is in the exposed winding in power board both sides also with the contact of heat dissipation auxiliary member.
The PCB layout structure of the half brick module power supply is characterized by further comprising a PIN needle adapter plate, wherein the PIN needle output end on the power plate is arranged on the front surface of the power plate, the PIN needle output end on the power plate is electrically connected with the PIN needle adapter plate, and the PIN needle adapter plate is distributed with the power plate at intervals in parallel.
The beneficial effect of above-mentioned scheme: the position that originally set up the PIN needle on the power board is vacated, conveniently distributes power components and parts for the distribution of power components and parts is more reasonable, and can set up more heat dissipation auxiliary parts between power components and parts.
The PCB layout structure of the half brick module power supply is characterized in that the heat dissipation auxiliary comprises heat dissipation copper bars and heat dissipation copper sheets, the heat dissipation copper bars are inlaid between the power components and contacted with the power components, the height of the heat dissipation copper bars is the same as that of the protrusions of the power components, and the heat dissipation copper sheets are attached to the windings at the outermost sides of the two ends of the main transformer.
The beneficial effect of above-mentioned scheme: the heat dissipation copper bar contacts the power component, heat generated by the power component can be timely conducted out, the heat is conducted on an XY plane, and then the heat is conducted on a Z axis by using the pouring sealant, so that the problem of large transverse thermal resistance of the heat conduction pouring sealant is solved, and the heat dissipation effect of the power component is improved.
The PCB layout structure of the half brick module power supply also has the characteristic that the shape of the radiating copper sheet is set to be the same as the shape of the exposed winding of the main transformer.
The beneficial effect of above-mentioned scheme: the front and back surfaces of the power board are adhered with radiating copper sheets as secondary windings, the inner copper sheets of the power board are all used for winding the primary windings, and the radiating copper sheets are used as secondary windings, so that the current density in the windings is greatly reduced, the line loss is reduced, and the heating value of a power supply is reduced.
The PCB layout structure of the half brick module power supply is characterized in that the main transformer is arranged at the central position of the power board, a magnetic core is embedded into the power board in a mounting mode, the left back surface of the main transformer is a primary full-bridge MOS tube, the left front surface of the main transformer is a bus capacitor and a driving circuit of the main transformer, the right back surface of the main transformer is a secondary synchronous rectification 4 MOS tubes, and the front surface of the main transformer is an output filter capacitor.
The beneficial effect of above-mentioned scheme: the MOS tubes are all arranged on the back of the power board, so that heat generated by heating the MOS tubes can avoid affecting components on the front of the power board as much as possible, and the MOS tubes are all arranged on the back of the power board, so that heat dissipation copper bars are conveniently embedded between the MOS tubes.
The PCB layout structure of the half brick module power supply is characterized in that the BUCK circuit is distributed at the left lower part of the power board, VIN+ is arranged at the left lower corner of the power board, a BUCK switch tube is arranged at the back right above the VIN+, the front is an input capacitor, the right of the VIN+ is a BUCK inductor, a freewheeling diode is arranged at the back above the BUCK inductor, and the front is a mother capacitor.
The beneficial effect of above-mentioned scheme: the power part is arranged at the lower part of the control part, so that overlapping between the control loop and the power loop is avoided, and interference of the power part to the control circuit is avoided.
The PCB layout structure of the half brick module power supply is characterized in that the auxiliary power transformer is arranged on the right side of the BUCK circuit and comprises a magnetic core embedded into the power board and a driving circuit.
The beneficial effect of above-mentioned scheme: the power part is arranged at the lower part of the control part, so that overlapping between the control loop and the power loop is avoided, and interference of the power part to the control circuit is avoided.
The PCB layout structure of the half brick module power supply has the characteristics that the control circuit is arranged right above the power board and comprises a secondary side voltage ring, a primary side current ring, a current equalizing ring and a primary side driving and secondary side isolation driving circuit.
The beneficial effect of above-mentioned scheme: the power part is arranged at the lower part of the control part, so that overlapping between the control loop and the power loop is avoided, and interference of the power part to the control circuit is avoided.
In summary, the beneficial effects of this scheme are:
In the PCB layout structure of the half brick module power supply, all the power components are arranged on the back surface of the power board, the radiating copper strips are embedded between the power components to assist in radiating, and the radiating copper strips are used as secondary windings of the main transformer, so that the current density in the windings is reduced, and the effect of reducing heating is achieved. The PCB layout structure of the half brick module power supply provided by the utility model has the effects of reducing power loss and rapidly discharging heat.
Drawings
FIG. 1 is a schematic diagram of a circuit layout on a power board of a PCB layout structure of a half brick module power supply of the present utility model;
Fig. 2 is a schematic diagram of a side view structure of a PIN adapter plate mounted on a power board of a PCB layout structure of a half brick module power supply of the present utility model;
Fig. 3 is a schematic diagram showing the front distribution of components on a power board of a PCB layout structure of a half brick module power supply according to the present utility model;
Fig. 4 is a schematic diagram showing the back distribution of components on a power board of a PCB layout structure of a half brick module power supply according to the present utility model.
Description of the drawings: 1. a power board; 2. a PIN needle adapter plate; 3. and a heat dissipation copper sheet.
Detailed Description
The technical solutions of the present utility model will be clearly and completely described in conjunction with the embodiments of the present utility model, and it is apparent that the described embodiments are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
It should be noted that, without conflict, the embodiments of the present utility model and features of the embodiments may be combined with each other.
The utility model will be further illustrated, but is not limited, by the following examples.
Fig. 1 is a schematic diagram of circuit layout on a power board of a PCB layout structure of a half brick module power supply according to the present utility model, fig. 2 is a schematic diagram of a side view structure of a PIN adapter board mounted on a power board of a PCB layout structure of a half brick module power supply according to the present utility model, fig. 3 is a schematic diagram of front distribution of components on a power board of a PCB layout structure of a half brick module power supply according to the present utility model, and fig. 4 is a schematic diagram of back distribution of components on a power board of a PCB layout structure of a half brick module power supply according to the present utility model, as shown in fig. 1-4, in which the PCB layout structure of a half brick module power supply according to the present embodiment is provided: including power board 1 and set up control circuit, main transformer, BUCK circuit, current sampling circuit and auxiliary power transformer on power board 1, still include the heat dissipation auxiliary part, main transformer runs through power board 1, all expose the winding at power board 1 positive and negative, the power components and parts in all circuits that set up on power board 1 distribute in the back of power board 1, other components and parts in all circuits set up in the front of power board 1, the heat dissipation auxiliary part is inlayed between the power components and parts, and main transformer is in the exposed winding of power board 1 both sides also contacts with the heat dissipation auxiliary part.
In the above embodiment, the PIN switching board further includes a PIN switching board 2, the PIN output end on the power board 1 is disposed on the front surface of the power board 1, the PIN output end on the power board 1 is electrically connected with the PIN switching board 2, and the PIN switching board 2 and the power board 1 are parallel and spaced apart.
In the above embodiment, the heat dissipation auxiliary comprises a heat dissipation copper bar and a heat dissipation copper sheet 3, the heat dissipation copper bar is inlaid between each power component and contacted with the power components, the height of the heat dissipation copper bar is the same as the height of the protrusion of the power component, and the heat dissipation copper sheet 3 is attached to the windings at the outermost sides of the two ends of the main transformer.
In the above embodiment, the shape of the heat radiating copper sheet 3 is set to be the same as the shape of the exposed windings of the main transformer.
In the above embodiment, the main transformer is disposed at the central position of the power board 1, and adopts the installation mode of embedding the magnetic core into the power board 1, the left back side is a primary full-bridge MOS tube, the left front side is a bus capacitor and a driving circuit thereof, the right back side of the main transformer is a secondary synchronous rectification 4 MOS tubes, and the front side is an output filter capacitor.
In the above embodiment, the BUCK circuit is arranged at the lower left part of the power board 1, vin+ is arranged at the lower left corner of the power board 1, the back side right above vin+ is a BUCK switching tube, the front side is an input capacitor, the right side of vin+ is a BUCK inductor, the back side above the BUCK inductor is a freewheeling diode, and the front side is a mother capacitor.
In the above embodiment, the auxiliary power transformer is disposed on the right side of the BUCK circuit, and the auxiliary power transformer includes the magnetic core embedded in the power board 1 and the driving circuit.
In the above embodiment, the control circuit is disposed directly above the power board 1, and includes a secondary side voltage ring, a primary side current ring, a current equalizing ring, and primary side driving and secondary side isolation driving circuits.
The circuit layout on the power board 1 is that the power part is arranged at the lower part of the control part, the control loop and the power loop are not overlapped, the interference of the power part to the control circuit is avoided, the power loops of the primary side and the secondary side are all short, after the signal PIN needle is switched to the small board, the original position of the signal PIN needle is vacated to layout the power MOS tube, so that the space utilization rate is maximized, the heating power tubes are all arranged at the back of the power board 1, copper strips are embedded between the power components to carry out transverse auxiliary heat dissipation, the high heat conductivity of the copper strips not only can rapidly diffuse the heat of the power tubes, and the temperature rise of the power tubes is greatly reduced; the surface of the power board is directly contacted with the heat conducting glue, so that the heat conducting area of the heat generating source outwards is increased, the heat resistance is greatly reduced, the problem of large transverse heat resistance of the heat conducting glue is solved, the heat radiating copper sheet 3 is pasted on the front side and the back side of the power board 1 to serve as a secondary winding of a main transformer, the copper sheet on the inner layer of the power board 1 is fully used for winding a primary winding, and the heat radiating copper sheet 3 serves as the secondary winding to greatly reduce the current density in the winding, so that the circuit loss is reduced, and the heat productivity of a power supply is reduced.
The foregoing is merely illustrative of the preferred embodiments of the present utility model and is not intended to limit the embodiments and scope of the present utility model, and it should be appreciated by those skilled in the art that equivalent substitutions and obvious variations may be made using the teachings of the present utility model, which are intended to be included within the scope of the present utility model.