CN221326287U - System for measuring adhesion force of regional circuit of flip-chip film tape chip - Google Patents
System for measuring adhesion force of regional circuit of flip-chip film tape chip Download PDFInfo
- Publication number
- CN221326287U CN221326287U CN202322878997.8U CN202322878997U CN221326287U CN 221326287 U CN221326287 U CN 221326287U CN 202322878997 U CN202322878997 U CN 202322878997U CN 221326287 U CN221326287 U CN 221326287U
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- flip
- film tape
- chip
- chip film
- line
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- 239000000463 material Substances 0.000 claims description 10
- 239000000853 adhesive Substances 0.000 abstract description 7
- 230000001070 adhesive effect Effects 0.000 abstract description 7
- 238000012360 testing method Methods 0.000 abstract description 3
- 206010040844 Skin exfoliation Diseases 0.000 description 28
- 238000004804 winding Methods 0.000 description 6
- 230000001105 regulatory effect Effects 0.000 description 3
- 238000005259 measurement Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Abstract
The utility model relates to the technical field of flip chip film reliability test, and discloses a flip chip film tape chip area circuit adhesive force measuring system, wherein the flip chip film tape chip area circuit adhesive force measuring system comprises a flip chip film tape, a chip area is arranged on the top surface of the flip chip film tape, a circuit is paved on the chip area, and the flip chip film reliability test system further comprises a circuit stripping device for applying force for stripping the contacted circuit from the chip area and a stripping force measuring device for measuring the force applied by the circuit stripping device to the contacted circuit for stripping the contacted circuit from the chip area. The utility model can measure the line adhesion force of the chip area and control the quality of the flip-chip film based on the line adhesion force.
Description
Technical Field
The utility model relates to the technical field of flip-chip film reliability tests, in particular to a system for measuring the adhesion force of a circuit in a flip-chip film tape-coiling chip area.
Background
After the production of the tape of the flip chip film is completed, the adhesion force of the circuit is required to be checked in a covered copper circuit area on the area without the solder mask ink, the quality of the flip chip film is controlled according to the quantified adhesion force of the circuit, and the circuit adhesion force of the output end of the outer pin area and the input end of the outer pin area is controlled according to the quantified adhesion force of the circuit.
In practical application, the line adhesion of the input end of the outer lead area is generally not considered, because the line width is far greater than that of other positions, the reliability risk is extremely low, the line peeling possibility is also higher in practical application because the line of the output end of the outer lead area, the output end of the chip area and the input end of the chip area are relatively thinner, the line adhesion of the output end of the outer lead area can be detected and monitored in the industry at present, but the line adhesion of the chip area cannot be detected, and it is worth noting that the line of the chip area is generally the thinnest part of the whole product, and the risk of line peeling is also higher.
Therefore, there is an urgent need for a device capable of measuring the line adhesion of the chip area.
Disclosure of utility model
The utility model aims to provide a system for measuring the line adhesive force of a chip area of a flip-chip film tape, which can measure the line adhesive force of the chip area and control the quality of the flip-chip film based on the line adhesive force.
In order to solve the technical problems, the utility model adopts the following scheme:
in a first aspect, a system for measuring adhesion of a wire in a chip area of a flip-chip film tape includes a flip-chip film tape, a chip area is provided on a top surface of the flip-chip film tape, and a wire is laid on the chip area, and includes a wire peeling device for applying a force for peeling the contacted wire from the chip area, and a peeling force measuring device for measuring a force applied by the wire peeling device to the contacted wire for peeling the contacted wire from the chip area.
Further, the material of the part of the circuit stripping device contacted with the circuit is hard material.
Further, the peeling force measuring device comprises a plurality of force sensors which are uniformly distributed on the bottom surface of the flip chip film tape and are in contact with the bottom surface of the flip chip film tape.
Further, the flip chip type flip chip packaging device further comprises a flip chip film tape fixing platform, a flip chip film tape limiting groove consistent with the flip chip film tape in shape is formed in the top surface of the flip chip film tape fixing platform, the flip chip film tape is detachably arranged in the flip chip film tape limiting groove, and the plurality of force sensors are evenly paved on the bottom surface of the flip chip film tape limiting groove.
Further, the device further comprises a linear movement module for driving the flip-chip film winding tape to move along the length direction of the upper line of the flip-chip film winding tape, wherein the flip-chip film winding tape fixing platform is fixedly arranged on a sliding block of the linear movement module, and the length direction of the linear movement module is consistent with the length direction of the line on the flip-chip film winding tape arranged on the flip-chip film winding tape fixing platform.
Further, the device for adjusting the peeling force of the circuit peeling device applied to the contacted circuit to peel the circuit from the chip area comprises a support, a rotating shaft with the axis parallel to the horizontal plane is arranged on the support, a connecting rod is rotatably arranged on the rotating shaft, weights are detachably arranged on two parts, located on two sides of the rotating shaft, of the connecting rod, and the circuit peeling device is fixedly arranged at one end of the connecting rod.
Further, the device also comprises an observation device for observing whether the circuit is peeled off from the chip area.
The utility model has the beneficial effects that:
1. In the utility model, a flip-chip film tape is firstly arranged in a flip-chip film tape limit groove, then the part of the material on the circuit stripping device, which is made of hard material, is contacted with the top surface of the flip-chip film tape, the weight of the weight on the connecting rod is regulated until the value measured by the force sensor is set as a set value, then the linear movement module is controlled to drive the circuit to move towards the direction close to the circuit stripping device, after the circuit is contacted with the circuit stripping device, the linear movement module is continuously controlled to drive the circuit to move a specified distance along the original movement direction, and an observation device is used to observe whether the circuit is stripped from the chip area, the system provided by the utility model can measure the line adhesive force of the chip area, and can control the quality of the flip-chip film according to the line adhesive force.
2. The peeling force adjusting device comprises a bracket, a rotating shaft horizontally arranged on the bracket and a connecting rod rotatably arranged on the rotating shaft, weights are detachably arranged on two parts of the connecting rod, which are positioned on two sides of the rotating shaft, and a circuit peeling device is fixedly arranged at one end of the connecting rod, so that the force applied by the circuit peeling device to a contacted circuit to peel the circuit from a chip area can be adjusted by adjusting the weight of the weights on the connecting rod.
3. In the present utility model, an observation device is used to observe whether or not a wiring is peeled off from a chip area.
Drawings
FIG. 1 is a diagram showing the overall structure of a system for measuring the adhesion of a chip area circuit of a flip chip film tape;
FIG. 2 is a top view of a flip-chip film tape holding platform and force sensor in a flip-chip film tape chip area circuit adhesion measurement system according to the present utility model;
FIG. 3 is a front view of a flip chip film tape holding platform in a flip chip film tape chip area circuit adhesion measurement system according to the present utility model;
Fig. 4 is a top view of a flip-chip film tape in a system for measuring the adhesion of a chip area circuit of a flip-chip film tape according to the present utility model.
Reference numerals: 1-a base, 2-a linear moving module, 3-a flip chip film tape fixing platform, 4-a connecting rod, 5-a rotating shaft and 6-a rotating shaft; 7-weight fixing screws, 8-brackets, 9-weight fixing tables, 10-circuit stripping devices, 11-fixing bolts and 12-flip chip film winding; 13-force sensor, 14-flip chip film tape limit groove, 15-line.
Detailed Description
The present utility model will be described in further detail with reference to examples and drawings, but embodiments of the present utility model are not limited thereto.
In the description of the present utility model, it should be noted that, directions or positional relationships indicated by terms such as "center", "upper", "lower", "left", "right", "vertical", "longitudinal", "lateral", "horizontal", "inner", "outer", "front", "rear", "top", "bottom", etc., are directions or positional relationships based on those shown in the drawings, or are directions or positional relationships conventionally put in use of the inventive product, are merely for convenience of describing the present utility model and for simplifying the description, and are not indicative or implying that the apparatus or element to be referred to must have a specific direction, be constructed and operated in a specific direction, and therefore should not be construed as limiting the present utility model.
In the description of the present utility model, it should also be noted that, unless explicitly specified and limited otherwise, the terms "disposed," "configured," "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present utility model will be understood in specific cases by those of ordinary skill in the art.
Example 1:
As shown in fig. 1 to 4, a system for measuring the line adhesion force of a chip area of a flip-chip film tape, which comprises a flip-chip film tape 12, wherein a chip area is arranged on the top surface of the flip-chip film tape 12, and a line 15 is laid on the chip area, and the system comprises a line peeling device 10 for applying a force for peeling the contacted line 15 from the chip area, and a peeling force measuring device for measuring the force applied by the line peeling device 10 to the contacted line 15 for peeling the contacted line 15 from the chip area.
In this embodiment, the material of the portion of the wire stripping device 10 that contacts the wire 15 is a hard material.
Specifically, the circuit stripping device 10 includes a pencil, after the pencil lead of the pencil is sharpened, the tip of the pencil lead is sharpened, the sharpened end of the pencil lead contacts the circuit 15 and applies a force to the circuit 15 to strip the circuit from the chip area, and if the abrasion trace occurs on the contact portion of the pencil lead with the circuit 15, the end of the pencil lead can be sharpened again.
Specifically, the included angle between the pencil and the line 15 is 45 °.
In this embodiment, the peel force measuring device includes a plurality of force sensors 13, where the plurality of force sensors 13 are uniformly distributed on the bottom surface of the flip chip film tape 12 and contact with the bottom surface of the flip chip film tape 12.
In this embodiment, the device further includes a flip-chip film tape fixing platform 3, a flip-chip film tape limiting groove 14 with a shape consistent with that of the flip-chip film tape 12 is formed on the top surface of the flip-chip film tape fixing platform 3, the flip-chip film tape 12 is detachably mounted in the flip-chip film tape limiting groove 14, and the plurality of force sensors 13 are uniformly laid on the bottom surface of the flip-chip film tape limiting groove 14.
Specifically, the number of the force sensors 13 is 20, and the force sensors are uniformly paved on the bottom surface of the flip-chip film tape limit groove 14 according to a 4*5 matrix.
In this embodiment, the device further includes a linear moving module 2 for driving the flip-chip film tape 12 to move along the length direction of the upper line 15 thereof, the flip-chip film tape fixing platform 3 is fixedly mounted on the slider of the linear moving module 2, and the length direction of the linear moving module 2 is consistent with the length direction of the line 15 on the flip-chip film tape 12 mounted on the flip-chip film tape fixing platform 3.
In this embodiment, the device further comprises a peeling force adjusting device for adjusting the force applied by the circuit peeling device 10 to the contacted circuit 15 to peel the circuit from the chip area, the peeling force adjusting device comprises a bracket 8, a rotating shaft 5 with the axis parallel to the horizontal plane is installed on the bracket 8, a connecting rod 4 is rotatably installed on the rotating shaft 5, weights are detachably installed on two parts, located on two sides of the rotating shaft 5, of the connecting rod 4, and the circuit peeling device 10 is fixedly installed on one end of the connecting rod 4.
Specifically, still include base 1, the equal fixed end of linear movement module 2 and support 8 fixed mounting are on the loading surface of base 1, the weight passes through weight fixed screw 7 or weight fixed station 9 demountable installation on connecting rod 4, the through-hole that supplies circuit stripping device 10 to pass has been seted up on the one end of connecting rod 4, the lateral wall and the lateral wall laminating of circuit stripping device 10 of through-hole, set up fixed screw on the lateral wall of through-hole, fixed screw female screw has the fixing bolt 11 that is used for sticis circuit stripping device 10 in the through-hole.
In this embodiment, an observation device for observing whether or not the wiring 15 is peeled off from the chip area is further included.
Specifically, the observation device is a metallographic microscope.
The working principle of the embodiment is as follows:
At present, the adhesion of the circuit 15 in the chip area cannot be detected in the industry, but the circuit 15 in the chip area is generally the thinnest part of the whole product, and the risk of peeling off the circuit 15 is large, so that a device capable of measuring the adhesion of the circuit 15 in the chip area is urgently needed.
The utility model provides a system for measuring the line adhesion force of a chip area of a flip-chip film tape, which is characterized in that a flip-chip film tape 12 is firstly arranged in a flip-chip film tape limit groove 14, then a part of a material on a line peeling device 10 which is made of hard material is contacted with the top surface of the flip-chip film tape 12, the weight of a weight on a connecting rod 4 is regulated until the value measured by a force sensor 13 is set, then a linear movement module 2 is controlled to drive a line 15 to move towards the direction close to the line peeling device 10, after the line 15 is contacted with the line peeling device 10, the linear movement module 2 is controlled to drive the line 15 to move a specified distance along the original movement direction and an observation device is used for observing whether the line 15 is peeled from the chip area, the weight of the weight on the connecting rod 4 is regulated according to the peeling condition of the line 15 on the chip area, the process is executed by using another flip-chip film tape 12 in the same batch until the value measured by the force sensor 13 is obtained when the line 15 is peeled from the chip area, and the value is recorded as the line 15 adhesion force of the line 15 of the flip-chip film 12 in the batch.
In addition, in this example, a metallographic microscope was used to see whether the wiring 15 was peeled off from the chip region.
The foregoing description of the preferred embodiment of the utility model is not intended to limit the utility model in any way, but rather to cover all modifications, equivalents, improvements and alternatives falling within the spirit and principles of the utility model.
Claims (7)
1. The system for measuring the line adhesion force of the chip area of the flip-chip film tape comprises a flip-chip film tape (12), wherein a chip area is arranged on the top surface of the flip-chip film tape (12), and a line (15) is paved on the chip area.
2. The system for measuring the adhesion force of a circuit in a chip area of a flip chip film tape according to claim 1, wherein the material of the portion of the circuit peeling device (10) contacting the circuit (15) is a hard material.
3. The system for measuring the line adhesion force of the chip area of the flip chip film tape according to claim 1, wherein the peeling force measuring device comprises a plurality of force sensors (13), and the force sensors (13) are uniformly distributed on the bottom surface of the flip chip film tape (12) and are in contact with the bottom surface of the flip chip film tape (12).
4. The system for measuring the regional circuit adhesion force of the chip area of the flip chip film tape according to claim 3, further comprising a flip chip film tape fixing platform (3), wherein a flip chip film tape limit groove (14) with the same shape as the flip chip film tape (12) is formed on the top surface of the flip chip film tape fixing platform (3), the flip chip film tape (12) is detachably mounted in the flip chip film tape limit groove (14), and the plurality of force sensors (13) are uniformly paved on the bottom surface of the flip chip film tape limit groove (14).
5. The system for measuring the line adhesion force of the chip area of the flip-chip film tape according to claim 4, further comprising a linear moving module (2) for driving the flip-chip film tape (12) to move along the length direction of the line (15) on the flip-chip film tape, wherein the flip-chip film tape fixing platform (3) is fixedly installed on a sliding block of the linear moving module (2), and the length direction of the linear moving module (2) is consistent with the length direction of the line (15) on the flip-chip film tape (12) installed on the flip-chip film tape fixing platform (3).
6. The system for measuring the line adhesion force of the chip area of the flip-chip film tape according to claim 1, further comprising a peeling force adjusting device for adjusting the force applied by the line peeling device (10) to the contacted line (15) to peel the line from the chip area, wherein the peeling force adjusting device comprises a bracket (8), a rotating shaft (5) with the axis parallel to the horizontal plane is arranged on the bracket (8), a connecting rod (4) is rotatably arranged on the rotating shaft (5), weights are detachably arranged on two parts of the connecting rod (4) which are positioned on two sides of the rotating shaft (5), and the line peeling device (10) is fixedly arranged on one end of the connecting rod (4).
7. A system for measuring the adhesion of a wire to a chip area of a flip chip film tape as claimed in claim 1, further comprising a viewing device for viewing whether the wire (15) is peeled from the chip area.
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN221326287U true CN221326287U (en) | 2024-07-12 |
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| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant |