CN221307292U - Heating film, atomizing core and aerosol generating device - Google Patents
Heating film, atomizing core and aerosol generating device Download PDFInfo
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- CN221307292U CN221307292U CN202323216963.9U CN202323216963U CN221307292U CN 221307292 U CN221307292 U CN 221307292U CN 202323216963 U CN202323216963 U CN 202323216963U CN 221307292 U CN221307292 U CN 221307292U
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- flexible bonding
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- 238000010438 heat treatment Methods 0.000 title claims abstract description 151
- 239000000443 aerosol Substances 0.000 title abstract description 16
- 239000000758 substrate Substances 0.000 claims description 5
- 238000000889 atomisation Methods 0.000 abstract description 9
- 230000000694 effects Effects 0.000 abstract description 5
- 239000007788 liquid Substances 0.000 description 11
- 239000002002 slurry Substances 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000011159 matrix material Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 238000005245 sintering Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 229910001120 nichrome Inorganic materials 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 238000000222 aromatherapy Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000002537 cosmetic Substances 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 230000002262 irrigation Effects 0.000 description 1
- 238000003973 irrigation Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- SWELZOZIOHGSPA-UHFFFAOYSA-N palladium silver Chemical compound [Pd].[Ag] SWELZOZIOHGSPA-UHFFFAOYSA-N 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 239000011135 tin Substances 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
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- Resistance Heating (AREA)
Abstract
The embodiment of the application belongs to the technical field of aerosol generating devices and relates to a heating film, an atomization core and an aerosol generating device, wherein the heating film comprises two flexible bonding pads; the heating wire is positioned between the two flexible bonding pads, and two ends of the heating wire are respectively connected with the two flexible bonding pads. Because the flexible bonding pad is adopted in the application, when the heating film formed by the flexible bonding pad and the heating wire is extruded by the ejector pin of the external power supply, the heating film can deform, so that the damage of the flexible bonding pad caused by rigid contact can be avoided, and the effect of reducing the resistance of the flexible bonding pad can be achieved by increasing the contact area of the ejector pin and the flexible bonding pad.
Description
Technical Field
The application relates to the technical field of aerosol generating devices, in particular to a heating film, an atomization core and an aerosol generating device.
Background
The structure of the existing aerosol generating device comprises a main body and a suction assembly, wherein an atomization core is at least partially positioned in a containing cavity defined by the main body, an air passage is formed in the atomization core, liquid to be heated can be heated through the atomization core, aerosol is formed by the liquid to be heated, and the aerosol is circulated to an external environment through the air passage for a user to suck. The properties of the heat generating film in the atomizing core directly influence the contact area of the liquid to be heated and the atomizing core.
In the use process of the atomizing core, a thimble of an external power supply in the aerosol generating device is pressed on the heating film, and when the thimble pressure is too high or the aerosol generating device is used for a long time, the heating film can be propped up by the thimble, so that the aerosol generating device is invalid or the efficiency is reduced. Meanwhile, the heating film is heated by the heating wire to realize heating work, so that if the resistivity of the bonding pad is too high, the bonding pad can divide a part of electric quantity to generate heat, and the heating efficiency of the heating film is low. In conclusion, the heating film in the prior art has short service life and low heating efficiency.
Disclosure of utility model
The technical problems to be solved by the embodiment of the application are that the existing heating film is short in service life and low in heating efficiency.
In order to solve the technical problems, the embodiment of the application adopts the following scheme:
a heat generating film comprising:
Two flexible pads;
The heating wire is positioned between the two flexible bonding pads, and two ends of the heating wire are respectively connected with the two flexible bonding pads.
Further, the resistivity of the flexible bonding pad is lower than 0.05Ω, and the difference between the resistivity of the heating wire and the resistivity of the flexible bonding pad is greater than 0.55Ω.
Further, the resistivity of the heating wire is 0.6Ω -1.6Ω.
Further, the heating wires are continuously bent to form a plurality of sections of first sub-heating wires parallel to each other and a second sub-heating wire connected with the adjacent first sub-heating wires, and the flexible bonding pad is connected with the first sub-heating wires.
Further, the distance between adjacent first sub heating wires is 300-1000 μm.
Further, the second sub heating wire is arc-shaped, and the second sub heating wire is tangent to the first sub heating wire.
Further, the thickness of the flexible bonding pad is 100-500 μm.
Further, the thickness of the heating wire is 40-120 mu m; and/or
The width of the heating wire is 270-400 mu m.
Correspondingly, the application also provides an atomization core, which comprises a matrix and a heating film, wherein the heating film is connected to the surface of the matrix;
the heating film is the heating film.
Correspondingly, the application also provides an aerosol-generating device comprising an atomizing core as described above.
Compared with the prior art, the embodiment of the application has the following main beneficial effects:
Because the flexible bonding pad is adopted in the application, when the heating film formed by the flexible bonding pad and the heating wire is extruded by the ejector pin of the external power supply, the heating film can deform, so that the damage of the flexible bonding pad caused by rigid contact can be avoided, and the effect of reducing the resistance of the flexible bonding pad can be achieved by increasing the contact area of the ejector pin and the flexible bonding pad.
Drawings
In order to more clearly illustrate the application or the solutions of the prior art, a brief description will be given below of the drawings used in the description of the embodiments or the prior art, it being obvious that the drawings in the description below are some embodiments of the application and that other drawings can be obtained from them without the inventive effort of a person skilled in the art.
FIG. 1 is a schematic view of the structure of an atomizing core according to an embodiment of the present disclosure;
fig. 2 is a top view of the atomizing core of fig. 1.
Reference numerals:
The device comprises an atomization core 10, a flexible bonding pad 100, a heating wire 200, a first sub-heating wire 210, a second sub-heating wire 220 and a matrix 300.
Detailed Description
The following description of the embodiments of the present application will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present application, but not all embodiments. All other embodiments, which can be made by a person skilled in the art without making any inventive effort, are intended to be within the scope of the present application. Furthermore, it should be understood that the detailed description is presented herein for purposes of illustration and description only, and is not intended to limit the application.
In the present application, unless otherwise indicated, terms of orientation such as "upper" and "lower" are used generically to refer to the upper and lower parts of the device in actual use or operational state, and specifically the orientation of the drawing in the figures; while "inner" and "outer" are for the outline of the device. In addition, in the description of the present application, the term "comprising" means "including but not limited to". The terms first, second, third and the like are used merely as labels, and do not impose numerical requirements or on the order of construction.
In the present application, "and/or" describing the association relationship of the association object means that there may be three relationships, for example, a and/or B may mean: a alone, a and B together, and B alone. Wherein A, B may be singular or plural.
In the present application, "at least one" means one or more, and "a plurality" means two or more. "at least one", "at least one" or the like refer to any combination of these items, including any combination of single item(s) or plural items(s). For example, "at least one (individual) of a, b, or c," or "at least one (individual) of a, b, and c," may each represent: a, b, c, a-b (i.e., a and b), a-c, b-c, or a-b-c, wherein a, b, c may be single or multiple, respectively.
Various embodiments of the application may exist in a range of forms; it should be understood that the description in a range format is merely for convenience and brevity and should not be construed as a rigid limitation on the scope of the application; accordingly, the description of a range should be considered to have specifically disclosed all possible sub-ranges as well as single numerical values within that range. For example, it should be considered that a description of a range from 1 to 6 has specifically disclosed sub-ranges, such as from 1 to 3, from 1 to 4, from 1 to 5, from 2 to 4, from 2 to 6, from 3 to 6, etc., as well as single numbers within the range, such as 1, 2, 3, 4, 5, and 6, wherever the range applies. In addition, whenever a numerical range is referred to herein, it is meant to include any reference number (fractional or integer) within the indicated range. The Z direction in fig. 1 is the thickness direction, and the Y direction is the width direction.
Referring to fig. 1 to 2, an embodiment of the present application provides a heat generating film, including:
two flexible pads 100;
Heating wire 200, heating wire 200 is located between two flexible bonding pads 100, and both ends of heating wire 200 are connected to two flexible bonding pads 100 respectively.
Because the flexible bonding pad 100 is adopted in the application, when the heating film formed by the flexible bonding pad 100 and the heating wire 200 is extruded by the ejector pin of the external power supply, the flexible bonding pad can deform, so that the damage of the flexible bonding pad 100 caused by rigid contact can be avoided, and the effect of reducing the resistance of the flexible bonding pad can be achieved by increasing the contact area between the ejector pin and the flexible bonding pad 100.
Further, referring to fig. 1 and 2, the resistivity of the flexible pad 100 is lower than 0.05Ω, and the difference between the resistivity of the heating wire 200 and the resistivity of the flexible pad 100 is greater than 0.55Ω.
If the resistivity of the flexible pad 100 is too high, it is likely to occupy the amount of heat generated, and the heat generating efficiency of the heat generating film is worse. The larger the difference between the resistivities of the heating wire 200 and the flexible pad 100, the larger the amount of electricity the heating wire 200 occupies for heating, and the higher the heating efficiency of the heating film. Therefore, the resistivity of the flexible pad 100 is set to be lower than 0.05Ω, and the difference between the resistivity of the heating wire 200 and the resistivity of the flexible pad 100 is greater than 0.55Ω, at this time, when the heating film heats, the heating wire 200 can fully utilize the electric quantity for providing heat to generate heat, thereby improving the heating efficiency of the heating film. It is understood that the resistivity of the flexible pad 100 may be any one or a range of values of 0.05Ω, 0.04 Ω, 0.03 Ω, 0.02 Ω, 0.01 Ω.
Further, referring to fig. 1 and 2, the resistivity of the heating wire 200 is 0.6Ω to 1.6Ω. The resistivity range of the heating wire 200 in the present embodiment can avoid too high or too low a current that causes heating efficiency. The resistivity of the heating wire 200 is in the range of 0.6Ω to 1.6Ω, so that the generation of current and heat can be better controlled, the heating wire 200 can be ensured to work stably and reliably in long-time use, and the manufacturing cost of the heating wire 200 is increased.
It is understood that the resistivity of heater 200 may be any value or a range of values formed by any two values of 0.6Ω、0.65Ω、0.70Ω、0.75Ω、0.80Ω、0.85Ω、0.90Ω、0.95Ω、1.00Ω、1.05Ω、1.10Ω、1.15Ω、1.20Ω、1.25Ω、1.30Ω、1.35Ω、1.40Ω、1.45Ω、1.50Ω、1.55Ω、1.60Ω.
Further, referring to fig. 1 and 2, the heating wire 200 is continuously bent to form a plurality of parallel first sub-heating wires 210 and a second sub-heating wire 220 connected to the adjacent first sub-heating wires 210, and the flexible bonding pad 100 is connected to the first sub-heating wires 210. If the area of the heating wire 200 is too small, although the heating efficiency of the heating wire 200 is high, the area of the liquid to be heated that the heating wire 200 can actually contact is too small, resulting in low efficiency of actual aerosol generation. Therefore, in this embodiment, the heating wire 200 is continuously bent, so that the contact area between the heating wire 200 and the liquid to be heated is increased, and the heating efficiency of the heating film is further improved.
Further, referring to fig. 1 and 2, the distance between adjacent first sub-heating wires 210 is 300 μm to 1000 μm. A marked in fig. 2 is a pitch of adjacent first sub-heating wires 210. When the heating wire 200 heats, the heating work is not always realized only by the liquid to be heated contacting the heating wire 200, and in fact, the part of the liquid to be heated near the heating wire 200 can be heated under the heat emitted by the heating wire 200. Therefore, if the distance between the adjacent first sub-heating wires 210 is too small, the areas where the liquid to be heated reaches the heating requirement may overlap, resulting in energy waste. If the distance between the adjacent first sub-heating wires 210 is too long, there may be some areas between the heating areas without heat, resulting in accumulation of the liquid to be heated. In summary, the interval between the adjacent first sub-heating wires 210 in the present embodiment is 300 μm to 1000 μm, so as to improve the heating efficiency of the heating film.
It is understood that the interval between the adjacent first sub-heating wires 210 is a range formed by any one or any two of 300 μm, 350 μm, 400 μm, 450 μm, 500 μm, 550 μm, 600 μm, 650 μm, 700 μm, 750 μm, 800 μm, 850 μm, 900 μm, 950 μm, 1000 μm.
Further, referring to fig. 1 and 2, the second sub-heating wire 220 is arc-shaped, and the second sub-heating wire 220 is tangent to the first sub-heating wire 210. Compared with the second sub-heating wire 220 being linear, when the second sub-heating wire 220 is arc-shaped, the second sub-heating wire 220 can occupy a larger space, and the contact area between the heating wire 200 and the liquid to be heated can be further mentioned.
Further, referring to fig. 1 and 2, the thickness of the flexible pad 100 is 100 μm to 500 μm. Because compliant pad 100 needs to be deformed to avoid the ejector pins and the contact area between the ejector pins and compliant pad 100 needs to be increased, the thickness of compliant pad 100 needs to be greater than 100 μm, thereby providing a thickness margin for the ejector pins to compress. If the thickness of the flexible pad 100 is greater than 500 μm, the atomizing core 10 becomes excessively large in volume and increases in cost. In summary, the thickness of the flexible pad 100 according to the embodiment of the present application can provide a thickness margin for the ejector pin to deform by extrusion, and simultaneously reduce the cost of the flexible pad 100.
It is understood that the thickness of the flexible pad 100 may be any one or a range of any two values of 100 μm, 150 μm, 200 μm, 250 μm, 300 μm, 350 μm, 400 μm, 450 μm, 500 μm.
Further, referring to fig. 1 and 2, the thickness of the heating wire 200 is 40 μm to 120 μm; and/or the heating wire 200 has a width of 270 μm to 400 μm. The width of heater 200 is labeled B in fig. 2. The thickness and width of the heating wire 200 will affect the contact area with the liquid to be heated, and an excessively large value will cause cost rise, and meanwhile, production is inconvenient, and an excessively small value will cause low heating efficiency of the heating film, so that the range of the thickness and width of the heating wire 200 in this embodiment can improve the heating efficiency of the heating film and reduce the production cost of the heating film.
It is understood that the thickness of the heating wire 200 may be any one or a range of any two of 40 μm, 50 μm, 60 μm, 70 μm, 80 μm, 90 μm, 100 μm, 110 μm, 120 μm. The width of the heating wire 200 may be 270 μm, 280 μm, 290 μm, 300 μm, 310 μm, 320 μm, 330 μm, 340 μm, 350 μm, 360 μm, 370 μm, 380 μm, 390 μm, 400 μm or a range formed by any two values.
Correspondingly, the application also provides an atomization core 10, wherein the atomization core 10 comprises a base body 300 and a heating film, and the heating film is connected to the surface of the base body 300;
The heat generating film is the heat generating film in the above embodiment. Because the heating film of the embodiment is adopted in the application, when the heating film formed by the flexible bonding pad 100 and the heating wire 200 is extruded by the ejector pin of the external power supply, the heating film can deform, so that the damage of the flexible bonding pad 100 caused by rigid contact can be avoided, and the effect of reducing the resistance of the flexible bonding pad can be achieved by increasing the contact area between the ejector pin and the flexible bonding pad 100.
Further, the material of the flexible pad 100 includes, but is not limited to, silver, gold, copper, tin, etc., nichrome, stainless steel, nichrome, silver palladium, etc., and the substrate 300 includes, but is not limited to, a ceramic material.
Further, the preparation process of the heating film comprises, but is not limited to, the following steps:
Providing heating wire 200 slurry;
Printing the slurry of the heating wire 200 on the surface of the substrate 300 by adopting a silk screen printing method;
Drying and high-temperature sintering the heating wire 200 slurry to form a heating wire 200;
Providing a flexible pad 100 material;
printing the flexible bonding pad 100 slurry on the surface of the substrate 300 by a screen printing method;
The flexible pad 100 paste is baked and high temperature sintered to form the flexible pad 100.
When the slurry of the heating wire 200 is sintered at a high temperature, the degree of sintering can be determined by detecting the temperature of the heating wire 200. When the flexible bonding pad 100 is sintered at a high temperature, the sintering temperature of the flexible bonding pad 100 should be lower than that of the heating wire 200, otherwise, the flexible bonding pad 100 needs to be manufactured first and then the heating wire 200 is manufactured, so that the heating wire 200 is prevented from melting when the flexible bonding pad 100 is sintered.
Correspondingly, the application also provides an aerosol-generating device comprising an atomizing core 10 as described above. Because the atomizing core 10 of the embodiment is adopted in the application, when the heating film formed by the flexible bonding pad 100 and the heating wire 200 is extruded by the ejector pin of the external power supply, the heating film can deform, so that the damage of the flexible bonding pad 100 caused by rigid contact can be avoided, the effect of reducing the resistance of the flexible bonding pad can be achieved by increasing the contact area between the ejector pin and the flexible bonding pad 100, and in sum, the aerosol generating device has long service life and high heating efficiency.
It is understood that aerosol generating devices include, but are not limited to, aerosol generating devices, aromatherapy machines, pharmaceutical nebulizers, fire protection spray systems, cleaning devices, irrigation devices, cosmetic devices, laboratory solute extraction devices, and the like.
It is apparent that the above-described embodiments are only some embodiments of the present application, but not all embodiments, and the preferred embodiments of the present application are shown in the drawings, which do not limit the scope of the patent claims. This application may be embodied in many different forms, but rather, embodiments are provided in order to provide a thorough and complete understanding of the present disclosure. Although the application has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments described in the foregoing description, or equivalents may be substituted for elements thereof. All equivalent structures made by the content of the specification and the drawings of the application are directly or indirectly applied to other related technical fields, and are also within the scope of the application.
While embodiments of the present utility model have been shown and described, it will be understood by those of ordinary skill in the art that: many variations, modifications, combinations, substitutions and alterations of these embodiments may be made without departing from the principles and spirit of the utility model, the scope of which is defined in the claims and their equivalents.
Claims (10)
1. A heat generating film, comprising:
Two flexible pads;
The heating wire is positioned between the two flexible bonding pads, and two ends of the heating wire are respectively connected with the two flexible bonding pads.
2. The heat generating film according to claim 1, wherein the flexible pad has a resistivity lower than 0.05 Ω, and a difference between the resistivity of the heating wire and the resistivity of the flexible pad is greater than 0.55 Ω.
3. The heat generating film according to claim 2, wherein the heating wire has a resistivity of 0.6Ω to 1.6Ω.
4. The heat generating film according to claim 1, wherein the heating wires are continuously bent to form a plurality of sections of first sub-heating wires parallel to each other and a second sub-heating wire connected to the adjacent first sub-heating wires, and the flexible bonding pad is connected to the first sub-heating wires.
5. The heat generating film according to claim 4, wherein a pitch between adjacent ones of the first sub-heating wires is 300 μm to 1000 μm.
6. The heat generating film according to claim 4, wherein the second sub-heating wire is arc-shaped, and the second sub-heating wire is tangent to the first sub-heating wire.
7. The heat generating film according to claim 1, wherein the thickness of the flexible pad is 100 μm to 500 μm.
8. The heat generating film according to claim 1, wherein a thickness of the heating wire is 40 μm to 120 μm; and/or
The width of the heating wire is 270-400 mu m.
9. An atomizing core is characterized by comprising a substrate and a heating film, wherein the heating film is connected to the surface of the substrate;
the heat generating film according to any one of claims 1 to 8.
10. An aerosol-generating device, characterized in that it comprises an atomizing core according to claim 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202323216963.9U CN221307292U (en) | 2023-11-27 | 2023-11-27 | Heating film, atomizing core and aerosol generating device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202323216963.9U CN221307292U (en) | 2023-11-27 | 2023-11-27 | Heating film, atomizing core and aerosol generating device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN221307292U true CN221307292U (en) | 2024-07-12 |
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ID=91800142
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202323216963.9U Active CN221307292U (en) | 2023-11-27 | 2023-11-27 | Heating film, atomizing core and aerosol generating device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN221307292U (en) |
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2023
- 2023-11-27 CN CN202323216963.9U patent/CN221307292U/en active Active
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