CN221304640U - 3D5S non-contact positioning structure - Google Patents
3D5S non-contact positioning structureInfo
- Publication number
- CN221304640U CN221304640U CN202323024010.2U CN202323024010U CN221304640U CN 221304640 U CN221304640 U CN 221304640U CN 202323024010 U CN202323024010 U CN 202323024010U CN 221304640 U CN221304640 U CN 221304640U
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- CN
- China
- Prior art keywords
- moving mechanism
- grating
- linear slide
- slide rail
- axis moving
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Abstract
The utility model discloses a 3D5S non-contact positioning structure, which particularly relates to the field of positioning structures, and comprises a bracket and a CCD, wherein the top of one end of the bracket is supported with the CCD, one side of the CCD is provided with a shell, the bottom end inside the shell is provided with a supporting table, an X-axis moving mechanism is supported on the supporting table, the top end of the X-axis moving mechanism is supported with a Y-axis moving mechanism, one end of the Y-axis moving mechanism is connected with a rotating motor, the driving end of the rotating motor is provided with a suction head, the top of one end of the X-axis moving mechanism is bolted with a mounting plate, the top end of the mounting plate is provided with a second grating, the second grating is connected and matched with the Y-axis moving mechanism, one side of the X-axis moving mechanism is provided with a first grating, and the driving end of the rotating motor is provided with a telescopic sleeve rod. When the non-contact positioning structure is used for positioning and detecting the chip, the position of the chip can be automatically adjusted, so that accurate detection is performed, the detection precision is improved, contact is not needed, the chip is prevented from being extruded, and damage to the chip in the detection process can be avoided.
Description
Technical Field
The utility model relates to the technical field of positioning structures, in particular to a 3D5S non-contact positioning structure.
Background
The semiconductor production process comprises wafer manufacturing, wafer testing, chip packaging and post-packaging testing. The semiconductor packaging test refers to a process of processing a wafer passing through the test according to a product model and a function requirement to obtain an independent chip, wherein the packaging process is as follows: after the wafer from the wafer front process is subjected to a dicing process, the wafer is cut into small chips (Die), the cut chips are attached to the small islands of the corresponding substrate (Lead frame) frame by using glue, and bonding pads (Bond pads) of the chips are connected to corresponding pins (Lead) of the substrate by using ultrafine metal (gold, tin, copper, aluminum) wires or conductive resin to form a required circuit; and then the independent wafer is packaged and protected by a plastic shell, and after plastic packaging, a series of operations such as Post Mold Cure, trimming and forming (Trim & Form), electroplating (coating), printing and the like are further carried out. After the packaging is finished, the finished product is tested, and the finished product is usually subjected to processes such as checking in (Incoming), testing (Test), packaging (packaging) and the like, and finally is put into storage and delivered. The typical packaging process flow is: scribing, chip loading, bonding, plastic packaging, deburring, electroplating, printing, cutting ribs, molding, inspecting finished products, testing, packaging and discharging.
The utility model patent of patent publication No. CN212808352U discloses a novel 3D5S visual detection mechanism, the light source can be adjusted at any angle through the set source plate adjusting bracket, different die drawing surfaces of a product can be adjusted and polished at an angle pertinence, the definition of a shot image is not influenced, the definition of the image is improved, the misjudgment rate is reduced, and the use limitation of the product is improved.
However, in practical use, the semiconductor chip cannot be positioned when being placed on a workbench for detection, so that the accuracy of detection is reduced, and therefore, a 3D5S non-contact positioning structure is proposed.
Disclosure of utility model
In order to overcome the above-mentioned drawbacks of the prior art, the present utility model provides a 3D5S non-contact positioning structure to solve the above-mentioned problems in the prior art.
In order to achieve the above purpose, the present utility model provides the following technical solutions: the utility model provides a 3D5S non-contact location structure, including support and CCD, support one end top support has CCD, the shell is installed to CCD one side, the supporting bench is installed to the inside bottom of shell, it has X axle moving mechanism to prop up on the supporting bench, X axle moving mechanism top support has Y axle moving mechanism, Y axle moving mechanism one end is connected with the rotating electrical machines, the suction head is installed to the rotating electrical machines driving end, X axle moving mechanism one end top bolt has the mounting panel, the top is provided with the second grating on the mounting panel, the cooperation is connected with Y axle moving mechanism to the second grating, first grating is installed to X axle moving mechanism one side.
After the chip adsorbed by the suction head is subjected to drawing and photographing through the CCD, the chip is analyzed according to the position of the chip, the first flat voice coil motor in the X-axis moving mechanism can be operated, the first support plate can move under the guide of the first linear slide rail, the synchronous second grating moves along with the movement, the X-axis position of the core product is adjusted, the second grating is used for limiting, the impact with the inner wall of the shell is avoided, the second support plate moves under the guide of the second linear slide rail and the third linear slide rail through the operation of the second flat voice coil motor, the Y-axis position of the core product is adjusted, the first grating can move along with the movement when the third linear slide rail slides along with the cooperation, the impact with the inner wall of the shell is avoided, meanwhile, the theta angle of the adsorbed chip can be adjusted through the rotation of the rotating motor, the chip adsorbed by the suction head is corrected under the adjustment of X, Y positions and the theta angle, and the positioning is realized.
Preferably, the transmission end of the rotating motor is provided with a telescopic sleeve rod, a spring is sleeved on the telescopic sleeve rod, and the suction head is arranged at the end part of the telescopic sleeve rod.
Preferably, the X-axis moving mechanism includes a first flat voice coil motor provided at one side of the stage.
The first support plate is connected with the first flat plate type voice coil motor, and the first grating is arranged on one side of the first support plate.
The first linear slide rail is arranged on the supporting table and is connected with the first supporting plate.
Preferably, a third linear slide rail is installed at the top of one end of the first support plate, the third linear slide rail is perpendicular to the first linear slide rail, and the second grating is bolted on the third linear slide rail.
Preferably, the Y-axis moving mechanism includes a second flat type voice coil motor mounted on the first support plate.
And one end of the second supporting plate is connected with the driving end of the second flat voice coil motor, and one end of the second supporting plate is provided with a clamp and the rotating motor is arranged on the clamp.
The second linear slide rail is arranged on the first supporting plate, and the top end of the second linear slide rail is bolted with the second supporting plate.
Preferably, the second linear slide rail and the third linear slide rail are arranged in parallel, and the first grating and the second grating are vertically matched.
The utility model has the technical effects and advantages that:
Compared with the prior art, through carrying out X, Y axial adjustment on the core product absorbed by the suction head and matching with the rotating motor to adjust the rotating angle of the chip, the correction and the correction can be carried out on the chip, thus realizing automatic positioning, and generating contact clamping force when the chip is positioned is not needed, thereby improving the detection efficiency of the chip and avoiding damage in the detection process of the chip;
Through first grating and X axial displacement mechanism cooperation, second grating and Y axial displacement mechanism complex setting, compare with prior art, carry out spacingly through two gratings respectively to two axial movements, avoid producing mechanical impact to guarantee location structure operational stability and security.
Drawings
Fig. 1 is a schematic diagram of the overall structure of the present utility model.
Fig. 2 is a schematic diagram of a connection and matching structure of a X, Y-axis moving mechanism according to the present utility model.
Fig. 3 is a schematic structural view of the X-axis moving mechanism of the present utility model.
Fig. 4 is a schematic diagram of a connection structure between a Y-axis moving mechanism and a rotating motor according to the present utility model.
The reference numerals are: 1. a bracket; 2. a CCD; 3. a housing; 4. a rotating electric machine; 5. a suction head; 6. a spring; 7. a supporting table; 8. an X-axis moving mechanism; 801. a first flat voice coil motor; 802. a first support plate; 803. a first linear slide rail; 9. a Y-axis moving mechanism; 901. a second flat-type voice coil motor; 902. a second support plate; 903. the second linear slide rail; 10. a mounting plate; 11. a first grating.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
The 3D5S non-contact positioning structure shown in the attached figures 1-4 comprises a bracket 1 and a CCD2, wherein the CCD2 is supported at the top of one end of the bracket 1, one side of the CCD2 is provided with a shell 3, the bottom end inside the shell 3 is provided with a supporting table 7, an X-axis moving mechanism 8 is supported on the supporting table 7, the top end of the X-axis moving mechanism 8 is supported with a Y-axis moving mechanism 9, one end of the Y-axis moving mechanism 9 is connected with a rotating motor 4, a suction head 5 is mounted at the driving end of the rotating motor 4, a mounting plate 10 is bolted at the top of one end of the X-axis moving mechanism 8, a second grating is arranged at the upper top of the mounting plate 10 and is connected with the Y-axis moving mechanism 9, a first grating 11 is mounted at one side of the X-axis moving mechanism 8, a telescopic sleeve rod is mounted at the driving end of the rotating motor 4, a spring 6 is sleeved on the telescopic sleeve rod, the suction head 5 is mounted at the end of the telescopic sleeve rod, after the chip adsorbed by the suction head 5 is subjected to image taking and photographing through the CCD2, after analysis according to the position of the chip, the first support plate 802 can move under the guidance of the first linear slide 803 by the operation of the first flat voice coil motor 801 in the X-axis moving mechanism 8, the synchronous second grating moves along with the movement, so as to adjust the X-axis position of the core, limit the position of the core by the second grating, avoid the collision with the inner wall of the housing 3, and move under the guidance of the second linear slide 903 and the third linear slide by the operation of the second flat voice coil motor 901, so as to adjust the Y-axis position of the core, limit the Y-axis moving position by the movement of the first grating 11 along with the matched sliding of the third linear slide, avoid the collision with the inner wall of the housing 3, and simultaneously, rotate by the rotary motor 4, and the theta angle of the adsorbed chip is adjusted, so that the chip adsorbed by the suction head 5 is rectified under X, Y position and theta angle adjustment, and positioning is realized.
As shown in fig. 3, the X-axis moving mechanism 8 includes a first flat-plate voice coil motor 801, and the first flat-plate voice coil motor 801 is provided on the side of the stage 7.
The first support plate 802, the first support plate 802 is connected to the first flat voice coil motor 801, and the first grating 11 is mounted on one side of the first support plate 802.
The first linear slide 803, the first linear slide 803 is installed on the abutment 7, and the first linear slide 803 is connected with the first support plate 802.
Through the operation of the first flat voice coil motor 801, the first support plate 802 can be pushed and pulled, so that the first support plate 802 can move in the X-axis direction under the support of the first linear slide rail 803, and the Y-axis moving mechanism 9 supported on the first support plate 802 can be adjusted along with the position in the X-axis direction.
As shown in fig. 2, a third linear slide rail is installed at the top of one end of the first support plate 802, the third linear slide rail is perpendicular to the first linear slide rail 803, and the second grating is bolted on the third linear slide rail.
In the process that the third linear slide rail moves along with the Y-axis moving mechanism 9, the second grating can be made to move along with the movement, so that the moving position of the Y-axis moving mechanism 9 is limited.
As shown in fig. 4, the Y-axis moving mechanism 9 includes a second flat type voice coil motor 901, and the second flat type voice coil motor 901 is mounted on a first support plate 802.
And a second support plate 902, wherein one end of the second support plate 902 is connected with the driving end of the second flat voice coil motor 901, a clamp is installed at one end of the second support plate 902, and the rotary motor 4 is installed on the clamp.
The second linear slide 903, the second linear slide 903 is mounted on the first support plate 802, and the top end is bolted to the second support plate 902.
The second linear slide 903 is parallel to the third linear slide, and the first grating 11 is vertically matched with the second grating.
Through the operation of the second flat voice coil motor 901, the second support plate 902 can be moved in the Y-axis direction under the support of the second linear slide rail 903, so that the clamp-connected rotary motor 4 is adjusted along with the movement in the Y-axis direction.
The working principle of the utility model is as follows: when the 3D5S non-contact positioning structure is used for automatically positioning and using chips during detection, after the chips adsorbed by the suction heads 5 are subjected to image taking and photographing through the CCD2, after analysis is carried out according to the positions of the chips, the first flat voice coil motor 801 in the X-axis moving mechanism 8 can be operated, the first support plate 802 can move under the guide of the first linear slide rail 803, the synchronous second grating moves along with the movement, so that the X-axis position of a core product is adjusted, the second grating is limited, collision with the inner wall of the shell 3 is avoided, the second support plate 902 moves under the guide of the second linear slide rail 903 and the third linear slide rail through the operation of the second flat voice coil motor 901, the Y-axis position of the core product is adjusted, the first grating 11 can be limited along with the movement when the third linear slide rail slides along with the matching, the collision with the inner wall of the shell 3 is avoided, and meanwhile, the theta angle of the adsorbed chips can be adjusted through the rotation of the rotating motor 4, so that the suction heads 5 are adsorbed under the position X, Y and the theta angle adjustment, and the deviation correction positioning is realized.
When the non-contact positioning structure is used for positioning and detecting the chip, the position of the chip can be automatically adjusted, so that accurate detection is performed, the detection precision is improved, contact is not needed, the chip is prevented from being extruded, and damage to the chip in the detection process can be avoided.
The foregoing description of the preferred embodiments of the utility model is not intended to limit the utility model to the precise form disclosed, and any such modifications, equivalents, and alternatives falling within the spirit and principles of the utility model are intended to be included within the scope of the utility model.
Claims (6)
1.3D5S non-contact location structure, including support (1) and CCD (2), support (1) one end top support has CCD (2), its characterized in that: the CCD (2) one side is installed shell (3), prop up platform (7) in the inside bottom of shell (3), prop up bench (7) and support and have X axle moving mechanism (8), X axle moving mechanism (8) top support has Y axle moving mechanism (9), Y axle moving mechanism (9) one end is connected with rotating electrical machines (4), suction head (5) are installed to rotating electrical machines (4) driving end, X axle moving mechanism (8) one end top bolt has mounting panel (10), the top is provided with the second grating on mounting panel (10), the cooperation is connected with Y axle moving mechanism (9) to the second grating, first grating (11) are installed to X axle moving mechanism (8) one side.
2. The 3D5S non-contact positioning structure of claim 1, wherein: the telescopic sleeve rod is arranged at the transmission end of the rotating motor (4), the spring (6) is sleeved on the telescopic sleeve rod, and the suction head (5) is arranged at the end part of the telescopic sleeve rod.
3. The 3D5S non-contact positioning structure of claim 1, wherein: the X-axis moving mechanism (8) comprises a first flat voice coil motor (801), and the first flat voice coil motor (801) is arranged on one side of the support (7);
The first support plate (802), the first support plate (802) is connected with the first flat plate voice coil motor (801), and the first grating (11) is arranged on one side of the first support plate (802);
The first linear slide rail (803), first linear slide rail (803) is installed on brace (7), and first linear slide rail (803) is connected with first backup pad (802).
4. A 3D5S non-contact positioning structure as claimed in claim 3, wherein: a third linear slide rail is mounted at the top of one end of the first support plate (802), the third linear slide rail is perpendicular to the first linear slide rail (803), and the second grating is bolted to the third linear slide rail.
5. The 3D5S non-contact positioning structure of claim 1, wherein: the Y-axis moving mechanism (9) comprises a second flat voice coil motor (901), and the second flat voice coil motor (901) is arranged on the first supporting plate (802);
One end of the second supporting plate (902) is connected with the driving end of the second flat voice coil motor (901), a clamp is arranged at one end of the second supporting plate (902), and the rotating motor (4) is arranged on the clamp;
and the second linear sliding rail (903), wherein the second linear sliding rail (903) is arranged on the first supporting plate (802), and the top end of the second linear sliding rail is bolted with the second supporting plate (902).
6. The 3D5S non-contact positioning structure of claim 5, wherein: the second linear sliding rail (903) and the third linear sliding rail are arranged in parallel, and the first grating (11) is vertically matched with the second grating.
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN221304640U true CN221304640U (en) | 2024-07-09 |
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