CN221282093U

CN221282093U - Double-layer chip shell mechanism

Info

Publication number: CN221282093U
Application number: CN202322966295.5U
Authority: CN
Inventors: 邓栋; 张莉; 杨江丰; 魏书婷
Original assignee: Ningbo Kuaizao Workshop Technology Co ltd
Current assignee: Ningbo Kuaizao Workshop Technology Co ltd
Priority date: 2023-11-03
Filing date: 2023-11-03
Publication date: 2024-07-05
Anticipated expiration: 2033-11-03

Abstract

The utility model discloses a double-layer chip shell mechanism which comprises a bottom plate, wherein a lower shell is arranged at the top of the bottom plate, a chip groove is formed in the lower shell, an upper shell is arranged at the top of the lower shell, the bottom of the upper shell is fixedly connected with a reinforcing support, the top of the lower shell is fixedly connected with a buffer block, the top of the lower shell is fixedly connected with a buffer spring, and the top of the lower shell is fixedly connected with a buffer strip. This double-deck chip casing mechanism, through the inside chip groove of seting up of lower casing and the last casing that is equipped with at lower casing top, constitute bilayer structure, go up the inside buffer block that has in gap in the middle of casing and the lower casing, buffer spring and buffer strip, the reinforcing bracket of fixed connection in addition in the bottom of last casing can play the effect of protection chip, makes inside chip not fragile when suffering the striking, and the protection effect is better.

Description

Double-layer chip shell mechanism

Technical Field

The utility model belongs to the technical field of chip shells, and particularly relates to a double-layer chip shell mechanism.

Background

The chip housing mechanism is an external mechanical structure for protecting the chip, and is usually made of metal or plastic materials, so that the chip is prevented from being influenced by external environment, the chip housing mechanism is an important ring for packaging the chip, the performance, the service life and the reliability of the chip are directly influenced, and along with the development of chip technology, the chip housing mechanism is also continuously improved and innovated to meet different requirements.

The chip housing mechanism on the market still has the following problems when using:

1. The traditional chip shell mechanism usually only has one packaging shell, and has certain protective performance, but has poor protective performance, and is difficult to bear larger impact, when bearing larger impact, the shell is often damaged, even the chip is likely to be directly damaged, so that the chip is disabled, and the protective performance is poor;

2. Most of the chip shell mechanisms are not provided with a heat dissipation mechanism, heat is emitted when the chip runs for a long time, and when the heat is too large, the chip possibly reduces the performance, and the use of equipment can be influenced by the reduced performance, so that the heat dissipation performance is poor.

Disclosure of utility model

The utility model aims to provide a double-layer chip shell mechanism for solving the technical problems in the background technology.

In order to achieve the above purpose, the specific technical scheme of the utility model is as follows: the utility model provides a double-deck chip casing mechanism, includes the bottom plate, the bottom plate top is equipped with down the casing, the chip groove is seted up to the inside lower casing, it is equipped with the casing to go up the casing top down, go up casing bottom fixed connection reinforcing bracket, lower casing top fixed connection buffer block, lower casing top fixed connection buffer spring, lower casing top fixed connection buffer strip.

Preferably, the top of the lower shell is provided with a radiating fin, and the inside of the radiating fin is fixedly connected with a radiating copper pipe.

Preferably, the front surface and the back surface of the lower shell are fixedly connected with the protection plate, and the front surface of the lower shell is fixedly connected with the mounting block.

Preferably, the installation block is internally and fixedly connected with a cushion block, and the cushion block is internally and fixedly connected with a fixed block.

Preferably, the top of the fixed block is fixedly connected with an extension plate, and the front surface of the extension plate is fixedly connected with a mounting plate.

Preferably, the top of the lower shell is fixedly connected with an antistatic plate, and holes are formed in the antistatic plate.

The double-layer chip shell mechanism has the following advantages:

1. According to the double-layer chip shell mechanism, a double-layer structure is formed by the chip groove formed in the lower shell and the upper shell arranged at the top of the lower shell, a buffer block, a buffer spring and a buffer strip are arranged in a gap between the upper shell and the lower shell, and a reinforcing support fixedly connected with the bottom of the upper shell is arranged at the bottom of the upper shell, so that the effect of protecting a chip can be achieved, the chip in the double-layer structure is not easy to damage when the chip is impacted, and the double-layer protection is better in protection effect by the buffer spring and the buffer block;

2. This double-deck chip casing mechanism, through the radiating fin that is equipped with at the top of casing down, radiating fin inside fixed connection's radiating copper pipe just can be at the inside radiating fin of the heat guide that the long-time operation of chip produced, and it is inside to radiating copper pipe with the heat again to guide the heat through radiating fin, and it is giving off the heat by radiating copper pipe again, the radiating effect is better.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the drawings that are needed in the embodiments will be briefly described below, it being understood that the following drawings only illustrate some examples of the present utility model and therefore should not be considered as limiting the scope, and other related drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.

FIG. 1 is a schematic diagram of the overall structure of the present utility model;

FIG. 2 is a schematic view of the internal structure of the housing according to the present utility model;

FIG. 3 is a schematic diagram of a heat dissipation mechanism according to the present utility model;

FIG. 4 is a schematic view of the upper housing structure of the present utility model;

FIG. 5 is a schematic view of a mounting plate according to the present utility model;

FIG. 6 is a schematic view of the lower housing structure of the present utility model;

the figure indicates: 1. a bottom plate; 2. a chip slot; 3. an upper housing; 4. a lower housing; 5. a protective plate; 6. a mounting plate; 7. a mounting block; 8. a buffer block; 9. a buffer spring; 10. a buffer strip; 11. a heat radiation fin; 12. a heat dissipation copper pipe; 13. an extension plate; 14. reinforcing the support; 15. a cushion block; 16. an antistatic plate; 17. a fixed block;

Detailed Description

Hereinafter, only certain exemplary embodiments are briefly described. As will be recognized by those of skill in the pertinent art, the described embodiments may be modified in numerous different ways without departing from the spirit or scope of the embodiments of the present utility model. Accordingly, the drawings and description are to be regarded as illustrative in nature and not as restrictive.

In the description of the embodiments of the present utility model, it should be understood that the terms "length," "vertical," "horizontal," "top," "bottom," and the like indicate an orientation or a positional relationship based on that shown in the drawings, and are merely for convenience in describing the embodiments of the present utility model and to simplify the description, rather than to indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the embodiments of the present utility model.

Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature. In the description of the embodiments of the present utility model, the meaning of "plurality" is two or more, unless explicitly defined otherwise.

In the embodiments of the present utility model, unless explicitly specified and limited otherwise, the terms "mounted," "connected," "secured" and the like are to be construed broadly and include, for example, either permanently connected, removably connected, or integrally formed; the device can be mechanically connected, electrically connected and communicated; can be directly connected or indirectly connected through an intermediate medium, and can be communicated with the inside of two elements or the interaction relationship of the two elements. The specific meaning of the above terms in the embodiments of the present utility model will be understood by those of ordinary skill in the art according to specific circumstances.

The following disclosure provides many different implementations, or examples, for implementing different configurations of embodiments of the utility model. In order to simplify the disclosure of embodiments of the present utility model, components and arrangements of specific examples are described below. Of course, they are merely examples and are not intended to limit embodiments of the present utility model. Furthermore, embodiments of the present utility model may repeat reference numerals and/or letters in the various examples, which are for the purpose of brevity and clarity, and which do not themselves indicate the relationship between the various embodiments and/or arrangements discussed.

For a better understanding of the objects, structures and functions of the present utility model, a dual-layer chip housing mechanism according to the present utility model will be described in further detail with reference to the accompanying drawings.

As shown in figures 1-6, the double-layer chip shell mechanism comprises a bottom plate 1, a lower shell 4 is arranged at the top of the bottom plate 1, a chip groove 2 is formed in the lower shell 4, an upper shell 3 is arranged at the top of the lower shell 4, a reinforcing support 14 is fixedly connected to the bottom of the upper shell 3, a buffer block 8 is fixedly connected to the top of the lower shell 4, a buffer spring 9 is fixedly connected to the top of the lower shell 4, a buffer strip 10 is fixedly connected to the top of the lower shell 4, a double-layer structure is formed by the chip groove 2 formed in the lower shell 4 and the upper shell 3 arranged at the top of the lower shell 4, the buffer block 8, the buffer spring 9 and the buffer strip 10 are arranged in a gap between the upper shell 3 and the lower shell 4, and the reinforcing support 14 is fixedly connected to the bottom of the upper shell 3, so that the chip can be protected, the chip in the inner part is not easy to damage when being impacted, and the double-layer protection is better in protection effect of the buffer spring 9 and the buffer block 8.

The top of the lower shell 4 is provided with the radiating fins 11, the radiating copper pipes 12 are fixedly connected inside the radiating fins 11, the radiating copper pipes 12 fixedly connected inside the radiating fins 11 are used for guiding heat generated by long-time running of the chip into the radiating fins 11, the heat is guided into the radiating copper pipes 12 again through the radiating fins 11, and the radiating copper pipes 12 are used for radiating the heat, so that the radiating effect is good.

The front and the back of the lower shell 4 are fixedly connected with the protection plate 5, the front of the lower shell 4 is fixedly connected with the installation block 7, and the protection plate 5 on the front and the back of the lower shell 4 is fixedly connected, so that the effect of protecting a chip can be achieved, and the protection effect is more excellent.

The inside fixed connection cushion 15 of installation piece 7, the inside fixed connection fixed block 17 of cushion 15 is fixed the fixed block 17 inside the installation piece 7 through cushion 15 for it is more firm when fixing the chip housing mechanism in the position of needs, be difficult for dropping, fastening effect is better.

The fixed block 17 top fixed connection extension board 13, extension board 13 openly fixed connection mounting panel 6, through extension board 13 openly fixed connection's mounting panel 6, just can be very convenient with the place that the chip housing installation needs, owing to install through mounting panel 6, also can lift off mounting panel 6 even after the casing damages, installation dismantles convenient and fast.

The top of the lower shell 4 is fixedly connected with the antistatic plate 16, holes are formed in the antistatic plate 16, and when the chip runs, the antistatic plate 16 at the top of the lower shell 4 prevents the chip from generating electrostatic reaction, influences the use, and has a good protection effect.

The working principle of the double-layer chip shell mechanism is as follows: when the double-layer chip shell structure is used, a chip is required to be placed into the chip groove 2, then the upper shell 3 is buckled on the surface of the lower shell 4 to protect the chip, when the structure is impacted, the upper shell 3 and the lower shell 4 bear impact, impact force transmitted to the inside is buffered by the buffer spring 9 and the buffer block 8, the impact force is relieved, meanwhile, the reinforcing support 14 at the bottom of the upper shell 3 can play a role in preventing the upper shell 3 from deforming due to impact, the protection effect is better, then the mounting plate 6 is fixedly connected through the front surface of the extension plate 13, the mounting plate 6 is conveniently mounted, the mounting plate 6 can be dismounted even after the shell is damaged, the mounting and dismounting are convenient and quick, heat can be dissipated in the chip working process, the heat generated by long-time running of the chip is guided into the inside of the fin 11 through the heat dissipation fins 11, the copper pipe 11 is guided into the inside the heat dissipation fins 12 again, and the heat dissipation effect is better by the heat dissipation copper pipe 11.

It will be understood that the utility model has been described in terms of several embodiments, and that various changes and equivalents may be made to these features and embodiments by those skilled in the art without departing from the spirit and scope of the utility model. In addition, many modifications may be made to adapt a particular situation or material to the teachings of the utility model without departing from the essential scope thereof. Therefore, it is intended that the utility model not be limited to the particular embodiment disclosed, but that the utility model will include all embodiments falling within the scope of the appended claims.

Claims

1. Double-deck chip housing mechanism, including bottom plate (1), its characterized in that: the utility model discloses a chip package structure, including bottom plate (1), casing (4), lower casing (4) top is equipped with down casing (4), chip groove (2) are offered to casing (4) inside down, casing (3) are equipped with at casing (4) top down, go up casing (3) bottom fixed connection reinforcing bracket (14), casing (4) top fixed connection buffer block (8) down, casing (4) top fixed connection buffer spring (9) down, casing (4) top fixed connection buffer strip (10) down.

2. The dual-layer chip housing mechanism according to claim 1, wherein: the top of the lower shell (4) is provided with radiating fins (11), and radiating copper pipes (12) are fixedly connected inside the radiating fins (11).

3. The dual-layer chip housing mechanism according to claim 1, wherein: the front surface and the back surface of the lower shell (4) are fixedly connected with a protection plate (5), and the front surface of the lower shell (4) is fixedly connected with a mounting block (7).

4. A dual-layer chip housing mechanism according to claim 3, wherein: the installation block (7) is internally fixedly connected with the cushion block (15), and the cushion block (15) is internally fixedly connected with the fixing block (17).

5. The dual-layer chip housing mechanism according to claim 4, wherein: the top of the fixed block (17) is fixedly connected with the extension plate (13), and the front surface of the extension plate (13) is fixedly connected with the mounting plate (6).

6. The dual-layer chip housing mechanism according to claim 1, wherein: the top of the lower shell (4) is fixedly connected with an antistatic plate (16), and holes are formed in the antistatic plate (16).