CN221282088U - Conveying equipment for semiconductor die bonding - Google Patents
Conveying equipment for semiconductor die bonding Download PDFInfo
- Publication number
- CN221282088U CN221282088U CN202322828079.4U CN202322828079U CN221282088U CN 221282088 U CN221282088 U CN 221282088U CN 202322828079 U CN202322828079 U CN 202322828079U CN 221282088 U CN221282088 U CN 221282088U
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- China
- Prior art keywords
- die bonding
- supporting rod
- workbench
- rotating motor
- adjusting bracket
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 17
- 238000007599 discharging Methods 0.000 claims abstract description 25
- 230000000149 penetrating effect Effects 0.000 claims description 4
- 239000000463 material Substances 0.000 claims description 3
- 239000000758 substrate Substances 0.000 abstract description 40
- 230000005540 biological transmission Effects 0.000 abstract description 2
- 230000006872 improvement Effects 0.000 description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 238000007664 blowing Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 230000007246 mechanism Effects 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000006978 adaptation Effects 0.000 description 1
- 230000001174 ascending effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000003031 feeding effect Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
Abstract
The utility model discloses a conveying device for semiconductor die bonding, which comprises a workbench and a feeding track which is arranged on the workbench and extends along the length direction of the workbench, wherein a discharging device is arranged at the front end of the device body corresponding to the feeding track, a pressure sensor is arranged at the front end of the feeding track and at the lower position corresponding to the discharging device, a clamping device is arranged at the lower station of the workbench corresponding to the fixing device, and the pressure sensor controls the rotation of a first rotating motor and a second rotating motor through a flexible substrate transmission signal which is contacted with the sensing end of the pressure sensor, so that the discharging device and the clamping device keep proper running speed, and the flexible substrate is kept in a loose feeding state.
Description
Technical Field
The utility model relates to the technical field of semiconductor die bonding equipment, in particular to conveying equipment for semiconductor die bonding.
Background
In the semiconductor packaging industry die bonding process, the equipment realizes processes of dispensing (soldering tin) die bonding and the like by singly picking up the wafer and then placing the wafer on a copper substrate in an equipment track through a full-automatic feeding mechanism, and when the copper substrate for bearing the wafer is a blocky copper substrate, the feeding mechanism can absorb and transfer the copper substrate into the feeding track in a vacuum absorption mode;
When the substrate for carrying the wafer is a coiled flexible substrate, the conveying mode of vacuum adsorption feeding is not applicable, the coiled substrate needs to be uncoiled and conveyed into the feeding track in an uncoiling mode, and in the uncoiling and conveying process, the coiled substrate needs to be kept at a proper tension and conveyed into the feeding track; however, in the existing unreeling device, the unreeling device keeps constant-speed rotation for unreeling, the length released by one revolution of a single flexible substrate when the single flexible substrate is full and the length released by one revolution of the single flexible substrate when the single flexible substrate is left half, if the conveying speeds of the unreeling device and the substrate keep constant-speed, the flexible substrate cannot keep better tension because of the change of the length of one revolution of the unreeling, and the flexible substrate cannot be conveyed into a feeding track.
Disclosure of utility model
Aiming at the technical defects in the background technology, the utility model provides a conveying device for semiconductor die bonding, which solves the technical problems and meets the actual requirements, and the specific technical scheme is as follows:
The conveying equipment for semiconductor die bonding comprises an equipment main body, wherein the equipment main body comprises a workbench and a feeding track which is arranged on the workbench and extends along the length direction of the workbench, a discharging device is arranged at the front end of the equipment main body corresponding to the feeding track, a pressure sensor is arranged at the front end of the feeding track and at the lower position corresponding to the discharging device, a die bonding device is arranged at the middle part of the workbench corresponding to the feeding track, and a clamping device is arranged at the lower station of the workbench corresponding to the die bonding device;
The clamping device comprises an upper clamping assembly and a lower clamping assembly, the upper clamping assembly comprises a first adjusting bracket and a second adjusting bracket which are arranged on two sides of the feeding track, a first supporting rod and a first pressing wheel which are arranged between the first adjusting bracket and the second adjusting bracket, and the lower clamping assembly comprises a second supporting rod and a second pressing wheel which are arranged below the upper clamping assembly.
As the improvement of above-mentioned scheme, the top of first adjustment support is equipped with the first adjusting bolt who wears to establish downwards, first adjusting bolt's bottom connection is equipped with first movable block, first adjustment support corresponds the position of first movable block is equipped with vertical first movable groove.
As the improvement of above-mentioned scheme, the top of second adjustment support is equipped with the second adjusting bolt who wears to establish downwards, the bottom connection of second adjusting bolt is equipped with the second movable block, the second adjustment support corresponds the position of second movable block is equipped with vertical second movable groove.
As an improvement of the scheme, the number of the first pressing wheels is two, and the first pressing wheels are respectively arranged at the positions, close to the two ends, of the first supporting rod and correspond to the edges of the feeding rail in the width direction.
As an improvement of the scheme, a first rotating motor is arranged on the outer side of the second adjusting bracket, the output end of the first rotating motor is connected with one end of the second supporting rod, and the second supporting rod penetrates through the first adjusting bracket and the second adjusting bracket and is aligned with the position of the first supporting rod in an up-down parallel mode.
As an improvement of the scheme, the second supporting rod is corresponding to the position right below the first supporting rod, the number of the second pressing wheels is two, the second pressing wheels are sleeved on the second supporting rod, and the positions of the first pressing wheels on the first supporting rod and the second pressing wheels on the second supporting rod are aligned vertically.
As an improvement of the scheme, the discharging device comprises a discharging disc and a second rotating motor, a C-shaped positioning block with an upward opening is arranged at the contact end of the pressure sensor, and the pressure sensor is electrically connected with the second rotating motor.
As an improvement of the scheme, the die bonding device comprises a wafer transfer assembly and a wafer disc, wherein the wafer disc is arranged on the side edge of the feeding track, and the wafer transfer assembly is arranged above the feeding track.
The utility model has the beneficial effects that: the clamping device is arranged at the rear end position of the blanking track in an up-down distribution manner through an upper clamping assembly and a lower clamping assembly, the upper clamping assembly and the lower clamping assembly clamp two sides of a flexible substrate, the lower clamping assembly is rotated through a first rotating motor to pull the flexible substrate forward for movement, the second rotating motor is used for controlling the rotation of the feeding disc to release the flexible substrate to be matched with the clamping assembly for clamping and conveying, and the pressure sensor is used for controlling the rotation of the first rotating motor and the second rotating motor through the flexible substrate transmission signal contacted with the sensing end of the pressure sensor, so that the proper running speed of the blanking device and the clamping device is kept, and the flexible substrate is kept in a loose feeding state.
Drawings
Fig. 1 is a schematic view of the main structure of the device of the present utility model.
Fig. 2 is a schematic structural diagram of a clamping device according to the present utility model.
Fig. 3 is a schematic structural diagram of a clamping device according to the present utility model.
Fig. 4 is an enlarged schematic view of the part a in fig. 1.
Wherein: the device comprises a device main body 1, a workbench 101, a feeding track 2, a first adjusting bracket 201, a first adjusting bolt 202, a first movable block 203, a first movable groove 204, a second adjusting bracket 205, a second adjusting bolt 206, a second movable block 207, a second movable groove 208, a discharging device 3, a discharging disc 301, a second rotating motor 302, a pressure sensor 4, a C-shaped positioning block 401, a die fixing device 5, a wafer transferring assembly 501, a wafer disc 502, a clamping device 6, an upper clamping assembly 7, a first supporting rod 701, a first pressing wheel 702, a lower clamping assembly 8, a second supporting rod 801, a second pressing wheel 802 and a first rotating motor 803.
Detailed Description
Embodiments of the present utility model will be described below with reference to the accompanying drawings and examples, but the embodiments of the present utility model are not limited to the following examples, and the present utility model relates to the relevant essential parts in the art, and should be regarded as known and understood by those skilled in the art.
As shown in fig. 1 to 4, a conveying device for semiconductor die bonding, the device main body 1 includes a workbench 101 and a feeding rail 2 disposed on the workbench 101 and extending along a length direction thereof, a discharging device 3 is disposed at a front end of the device main body 1 corresponding to the feeding rail 2, a pressure sensor 4 is disposed at a position of the front end of the feeding rail 2 corresponding to a lower position of the discharging device 3, a die bonding device 5 is disposed at a middle portion of the workbench 101 corresponding to the feeding rail 2, and a clamping device 6 is disposed at a position of the workbench 101 corresponding to the lower position of the die bonding device 5;
The clamping device 6 comprises an upper clamping assembly 7 and a lower clamping assembly 8, the upper clamping assembly 7 comprises a first adjusting bracket 201 and a second adjusting bracket 205 which are arranged on two sides of the feeding track 2, a first supporting rod 701 and a first pressing wheel 702 which are arranged between the first adjusting bracket 201 and the second adjusting bracket 205, and the lower clamping assembly 8 comprises a second supporting rod 801 and a second pressing wheel 802 which are arranged below the upper clamping assembly 7.
In the utility model, in terms of structure, the front end of the feeding track 2 is provided with the discharging device 3, the rear end of the feeding track 2 is provided with the clamping device 6, the discharging device 3 comprises a discharging disc 301 and a second rotating motor 302, the discharging device 3 controls the discharging disc 301 to rotate through the second rotating motor 302 to realize continuous discharging of the flexible substrate, the clamping device 6 clamps two sides of the width direction of the substrate through the upper clamping component 7 and the lower clamping component 8, and the first rotating motor 803 controls the lower clamping component 8 to rotate to drive the upper clamping component 7 to clamp the substrate to move towards the rear end of the feeding track 2;
It should be noted that, when in use, the flexible substrate is wound on the feeding tray 301, along with the continuous feeding of the feeding device 3, the length of the flexible substrate released by the feeding tray 301 rotating for one circle may be gradually shortened, and when the clamping device 6 keeps constant-speed traction, the tension of the flexible substrate between the feeding tray 301 and the clamping device 6 may be gradually tightened as the feeding length of the feeding tray 301 is shortened, so as to affect the feeding effect of the flexible substrate.
It should be noted that, structurally, the lower position that corresponds the blowing device 3 is equipped with pressure sensor 4, pressure sensor 4's contact end is equipped with the ascending C type locating piece 401 of opening, pressure sensor 4 with second rotating electrical machines 302 electricity is connected, blowing dish 301 when the blowing, loose conveying state's substrate can pass through behind pressure sensor 4's the sensing end in material loading track 2, C type locating piece 401 plays the guide effect to the material of conveying, avoids the substrate to appear deviating from pressure sensor 4's the condition appearance of sensing end when conveying.
In a specific embodiment of the present utility model, the discharging device 3 controls the discharging disc 301 to rotate through the second rotating motor 302 to discharge the coiled flexible substrate, the flexible substrate enters the feeding track 2 after passing through the pressure sensor 4 in a loose state, the clamping device 6 clamps two ends of the flexible substrate, and keeps continuous conveying of the flexible substrate through rotation of the first rotating motor 803, in continuous discharging, the length of the flexible substrate released by the flexible substrate which is caused by continuous feeding and is caused by one rotation of the discharging disc 301 is gradually shortened and then gradually tensioned, when the tensioned flexible substrate is separated from the sensing end of the pressure sensor 4, the pressure sensor 4 transmits a signal to control the second rotating motor 302 to increase the rotation speed, so that the flexible substrate is re-attached to the sensing end of the pressure sensor 4.
Further, in the above-mentioned scheme, the top of the first adjusting bracket 201 is provided with a first adjusting bolt 202 penetrating downwards, the bottom end connection of the first adjusting bolt 202 is provided with a first movable block 203, the position of the first adjusting bracket 201 corresponding to the first movable block 203 is provided with a vertical first movable slot 204, the top of the second adjusting bracket 205 is provided with a second adjusting bolt 206 penetrating downwards, the bottom end connection of the second adjusting bolt 206 is provided with a second movable block 207, the position of the second adjusting bracket 205 corresponding to the second movable block 207 is provided with a vertical second movable slot 208, the first adjusting bolt 202 is adjusted to rotate so as to adjust the height of the first movable block 203 in the first movable slot 204, and the second adjusting bolt 206 is adjusted to rotate so as to adjust the height of the second movable block 207 in the second movable slot 208.
Further, in the above-mentioned scheme, the number of the first pressing wheels 702 is two, the first pressing wheels 702 are respectively disposed at the positions of the first supporting rod 701 near two ends and correspond to the edges of the feeding rail 2 in the width direction, two ends of the first supporting rod 701 are respectively and fixedly connected with the first movable block 203 and the second movable block 207, and the height of the first pressing wheels 702 on the first supporting rod 701 can be adjusted by adjusting the heights of the first movable block 203 and the second movable block 207, so that the feeding rail is suitable for conveying flexible substrates with different thicknesses.
Further, in the above-mentioned scheme, a first rotating motor 803 is disposed on the outer side of the second adjusting bracket 205, an output end of the first rotating motor 803 is connected to one end of the second supporting rod 801, the second supporting rod 801 passes through the first adjusting bracket 201 and the second adjusting bracket 205 and is aligned with the position of the first supporting rod 701 in an up-down parallel manner, the first rotating motor 803 rotates the second supporting rod 801, the second supporting rod 801 corresponds to the position under the first supporting rod 701, the number of the second pressing wheels 802 is two, and the second pressing wheels 802 are sleeved on the second supporting rod 801, and the positions of the first pressing wheels 702 on the first supporting rod 701 and the second pressing wheels 802 on the second supporting rod 801 are aligned up-down.
Further, in the above-mentioned scheme, the die bonding apparatus 5 includes a wafer transfer assembly 501 and a wafer disc 502, the wafer disc 502 is disposed at a side of the feeding rail 2, and the wafer transfer assembly 501 is disposed above the feeding rail 2.
The foregoing is merely a preferred embodiment of the present utility model and it should be noted that modifications and adaptations to those skilled in the art may be made without departing from the principles of the present utility model, which are intended to be comprehended within the scope of the present utility model.
Claims (8)
1. The conveying equipment for semiconductor die bonding is characterized by comprising an equipment main body (1), wherein the equipment main body (1) comprises a workbench (101) and a feeding track (2) which is arranged on the workbench (101) and extends along the length direction of the workbench, a discharging device (3) is arranged at the front end of the equipment main body (1) corresponding to the feeding track (2), a pressure sensor (4) is arranged at the front end of the feeding track (2) and at the lower position corresponding to the discharging device (3), a die bonding device (5) is arranged at the middle part of the workbench (101) corresponding to the feeding track (2), and a clamping device (6) is arranged at the lower station of the workbench (101) corresponding to the die bonding device (5);
Clamping device (6) are including last clamping component (7) and lower clamping component (8), go up clamping component (7) including setting up first regulation support (201) and second regulation support (205) of material loading track (2) both sides, set up first branch (701) and first pinch roller (702) between first regulation support (201) and second regulation support (205), lower clamping component (8) are including setting up second branch (801) and second pinch roller (802) of clamping component (7) below.
2. The conveying device for semiconductor die bonding according to claim 1, wherein a first adjusting bolt (202) penetrating downwards is arranged at the top end of the first adjusting bracket (201), a first movable block (203) is connected and arranged at the bottom end of the first adjusting bolt (202), and a vertical first movable groove (204) is arranged at the position of the first adjusting bracket (201) corresponding to the first movable block (203).
3. The conveying device for semiconductor die bonding according to claim 1, wherein a second adjusting bolt (206) penetrating downwards is arranged at the top end of the second adjusting bracket (205), a second movable block (207) is connected and arranged at the bottom end of the second adjusting bolt (206), and a vertical second movable groove (208) is arranged at the position of the second adjusting bracket (205) corresponding to the second movable block (207).
4. The transfer apparatus for die bonding of semiconductors according to claim 1, wherein the number of the first pressing wheels (702) is two, and the first pressing wheels (702) are respectively arranged at positions of the first supporting rods (701) close to two ends and correspond to the edges of the feeding rail (2) in the width direction.
5. The conveying device for semiconductor die bonding according to claim 1, wherein a first rotating motor (803) is arranged on the outer side of the second adjusting bracket (205), an output end of the first rotating motor (803) is connected with one end of the second supporting rod (801), and the second supporting rod (801) penetrates through the first adjusting bracket (201) and the second adjusting bracket (205) and is aligned in parallel with the first supporting rod (701) in an up-down direction.
6. The transfer apparatus for die bonding of semiconductors according to claim 1, wherein the second supporting rod (801) corresponds to a position right below the first supporting rod (701), the number of the second pressing wheels (802) is two, the second pressing wheels are sleeved on the second supporting rod (801), and the positions of the first pressing wheels (702) on the first supporting rod (701) and the positions of the second pressing wheels (802) on the second supporting rod (801) are aligned up and down.
7. The conveying device for semiconductor die bonding according to claim 5, wherein the discharging device (3) comprises a discharging disc (301) and a second rotating motor (302), a C-shaped positioning block (401) with an upward opening is arranged at a contact end of the pressure sensor (4), and the pressure sensor (4) is electrically connected with the first rotating motor (803) and the second rotating motor (302).
8. The transfer apparatus for semiconductor die bonding according to claim 1, wherein the die bonding device (5) includes a wafer transfer member (501) and a wafer disc (502), the wafer disc (502) is disposed at a side of the loading rail (2), and the wafer transfer member (501) is disposed above the loading rail (2).
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN221282088U true CN221282088U (en) | 2024-07-05 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant |