CN221280968U - Thermal conductivity analysis device - Google Patents
Thermal conductivity analysis device Download PDFInfo
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- CN221280968U CN221280968U CN202322610225.6U CN202322610225U CN221280968U CN 221280968 U CN221280968 U CN 221280968U CN 202322610225 U CN202322610225 U CN 202322610225U CN 221280968 U CN221280968 U CN 221280968U
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- thermal conductivity
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- signal processing
- analysis device
- constant temperature
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- 238000004458 analytical method Methods 0.000 title claims abstract description 37
- 210000005056 cell body Anatomy 0.000 claims abstract description 33
- 238000012545 processing Methods 0.000 claims abstract description 33
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims abstract description 32
- 238000006243 chemical reaction Methods 0.000 claims abstract description 21
- 229910052697 platinum Inorganic materials 0.000 claims abstract description 16
- 239000010409 thin film Substances 0.000 claims abstract description 11
- 239000007789 gas Substances 0.000 claims description 20
- 239000010408 film Substances 0.000 claims description 6
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 5
- 229910052782 aluminium Inorganic materials 0.000 claims description 5
- 238000010438 heat treatment Methods 0.000 claims description 5
- 239000011261 inert gas Substances 0.000 claims description 4
- 229910001220 stainless steel Inorganic materials 0.000 claims description 4
- 239000010935 stainless steel Substances 0.000 claims description 4
- 230000008859 change Effects 0.000 abstract description 13
- 238000000034 method Methods 0.000 abstract description 10
- 230000008569 process Effects 0.000 abstract description 8
- 238000004519 manufacturing process Methods 0.000 abstract description 7
- 238000001514 detection method Methods 0.000 abstract description 5
- 230000007774 longterm Effects 0.000 abstract description 4
- 238000005259 measurement Methods 0.000 description 6
- 210000004027 cell Anatomy 0.000 description 5
- 238000010586 diagram Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000004868 gas analysis Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 241001672694 Citrus reticulata Species 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000009529 body temperature measurement Methods 0.000 description 1
- 238000005253 cladding Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
Abstract
The application relates to a thermal conductivity analysis device, comprising: the device comprises a bracket, a heat conduction pool body, a front conversion module, a constant temperature module and a signal processing module. The reference element and the measuring element in the thermal conductivity cell body are respectively a thin film platinum resistor, the thin film platinum resistor has the advantages of small volume, quick corresponding time, vibration resistance, good long-term stability, low price and the like, the structure is diversified, the processing and the assembly are easy, the elements have good consistency by adopting automatic production and detection lines, a complex dynamic pairing process can be avoided when the thermal conductivity analyzer is manufactured, the front conversion plate is used for converting the resistance change of the thin film platinum resistor into an electric signal and transmitting the electric signal to the signal processing module for analysis and treatment, and thus a measuring result is obtained.
Description
Technical Field
The application relates to the field of thermal conductivity analysis, in particular to a thermal conductivity analysis device.
Background
The thermal conductivity type gas analysis is an analysis method for analyzing the content of a component to be measured by measuring the change in thermal conductivity of a mixed gas according to the difference in thermal conductivity of various gases. Different gases have different heat conductivities, for multi-component gases, the heat conduction capacity of the mixed gas changes due to different component contents, the heat conductivity changes along with the changes of the components and the concentrations, and according to the physical characteristics, the concentration value of the measured gas can be known only by detecting the heat conductivity of the measured gas. The thermal conductivity of the gas is measured, typically by indirect measurement, which is converted into a temperature measurement of the heat sensitive element. The temperature change of the thermosensitive element has quantitative relation with the thermal conductivity of the measured gas, and the temperature change of the thermosensitive element causes the change of the resistance value of the thermosensitive element, so that the concentration of the measured gas is indirectly measured.
Typically, thermal conductivity sensors employ a hot wire sensing element. Two sensing elements are generally required, one for measurement and the other for reference, the sensing element being in the sample gas path, the resistance varying with the variation of the thermal conductivity of the sample gas, the reference element not being in contact with the sample gas. The two sensing elements are matched with the other two fixed resistors to form a double-arm bridge, the resistance change is converted into voltage change, and then the target gas concentration is calculated. The sensitive element generally adopts a glass cladding structure, the manufacturing process is complex, the consistency of the finished sensitive element is poor, and the adopted two sensitive elements need complicated dynamic pairing process before use, otherwise, the problems of drift, poor stability and the like can be caused.
Disclosure of utility model
In view of this, the application provides a thermal conductivity analysis device, which has good stability and good uniformity of production, preparation and detection lines, and can avoid complex dynamic pairing process.
According to an aspect of the present application, there is provided a thermal conductivity analysis device comprising: the device comprises a bracket, a heat conduction pool body, a front conversion module, a constant temperature module and a signal processing module.
The heat conduction pool body is placed on the support, the constant temperature module and the front conversion module are arranged in the heat conduction pool body, the front conversion module is arranged at the top of the constant temperature module, and the signal processing module is arranged at one side of the support; the thermal conductivity cell body includes: the device comprises a shell, an analysis tank and a reference tank, wherein the analysis tank and the reference tank are hermetically arranged in the shell, the analysis tank is provided with a measuring element and is suitable for being communicated with a sample gas path, the reference tank is provided with a reference element, and the measuring element and the reference element are both film platinum resistors; the front conversion plate is provided with a fixed resistor, the fixed resistor and the two thin film platinum resistors form an electric bridge, and the front conversion plate is electrically connected with the signal processing module; the constant temperature module is electrically connected with the signal processing module.
In one possible implementation, the constant temperature module accomplishes temperature control by pulse width modulation.
In one possible implementation manner, the constant temperature module comprises a flexible heating plate, and a temperature measuring element is integrally arranged on the constant temperature module.
In one possible implementation, the thermal conductivity cell body is internally sealed with an inert gas.
In one possible implementation, the signal processing module is provided with a compensation module, which is capable of inputting a fixed compensation or an analog input compensation.
In one possible implementation, the material of the housing is aluminum.
In one possible implementation manner, the front side of the support is projected into an L-shaped support, the thermal conductivity cell body is arranged on a transverse line structure of the support, and the signal processing module is arranged on a vertical line structure of the support and is arranged at one end close to the thermal conductivity cell body.
In one possible implementation manner, the support is made of stainless steel, and the thermal conductivity cell body and the signal processing module are fixedly connected with the support through bolts.
The application has the beneficial effects that: the reference element and the measuring element in the thermal conductivity cell body are respectively a thin film platinum resistor, the thin film platinum resistor has the advantages of small volume, quick corresponding time, vibration resistance, good long-term stability, low price and the like, the structure is diversified, the processing and the assembly are easy, the elements have good consistency by adopting automatic production and detection lines, a complex dynamic pairing process can be avoided when the thermal conductivity analyzer is manufactured, the front conversion plate is used for converting the resistance change of the thin film platinum resistor into an electric signal and transmitting the electric signal to the signal processing module for analysis and treatment, and thus a measuring result is obtained.
Other features and aspects of the present application will become apparent from the following detailed description of exemplary embodiments, which proceeds with reference to the accompanying drawings.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate exemplary embodiments, features and aspects of the application and together with the description, serve to explain the principles of the application.
FIG. 1 is a schematic diagram showing a thermal conductivity analysis device according to an embodiment of the present application;
Fig. 2 shows a signal transmission schematic diagram of a thermal conductivity analysis device according to an embodiment of the application.
Detailed Description
Various exemplary embodiments, features and aspects of the application will be described in detail below with reference to the drawings. In the drawings, like reference numbers indicate identical or functionally similar elements. Although various aspects of the embodiments are illustrated in the accompanying drawings, the drawings are not necessarily drawn to scale unless specifically indicated.
It should be understood, however, that the terms "center," "longitudinal," "transverse," "length," "width," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counter-clockwise," "axial," "radial," "circumferential," and the like indicate or are based on the orientation or positional relationship shown in the drawings, and are merely for convenience of describing the application or simplifying the description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore should not be construed as limiting the application.
Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature. In the description of the present application, the meaning of "a plurality" is two or more, unless explicitly defined otherwise.
The word "exemplary" is used herein to mean "serving as an example, embodiment, or illustration. Any embodiment described herein as "exemplary" is not necessarily to be construed as preferred or advantageous over other embodiments.
In addition, numerous specific details are set forth in the following description in order to provide a better illustration of the application. It will be understood by those skilled in the art that the present application may be practiced without some of these specific details. In some instances, well known methods, procedures, components, and circuits have not been described in detail so as not to obscure the present application.
As shown in fig. 1-2, the thermal conductivity analysis device includes: the device comprises a bracket 100, a thermal conductivity cell body 200, a front conversion module 300, a constant temperature module 400 and a signal processing module 500.
The thermal conductivity cell body 200 is placed on the bracket 100, the signal processing module 500 is disposed at one side of the bracket 100, the constant temperature module 400 and the front conversion module 300 are disposed in the thermal conductivity cell body 200, and the front conversion module 300 is disposed at the top of the constant temperature module 400; the thermal conductivity cell body 200 includes: the device comprises a shell, an analysis tank and a reference tank, wherein the analysis tank and the reference tank are hermetically arranged in the shell, the analysis tank is provided with a measuring element, the analysis tank is suitable for being communicated with a sample gas path, the reference tank is provided with a reference element, and the measuring element and the reference element are both film platinum resistors; the front conversion plate is provided with a fixed resistor, the fixed resistor and the two thin film platinum resistors form an electric bridge, and the front conversion plate is electrically connected with the signal processing module 500; the thermostat module 400 is electrically connected with the signal processing module 500.
The signal processing module 500 of the present application is a technology that can be implemented by the prior art. The thermal conductivity analysis device adopts the thin film aluminum resistor to replace the hot wire resistor to form the measuring bridge as the mandarin orange element, and the thin film platinum resistor has the advantages of small volume, quick response time, vibration resistance, good long-term stability, low price and the like, has diversified structures, is easy to process and assemble, adopts automatic production and detection lines to ensure that the elements have good consistency, and can avoid complex dynamic pairing processes when manufacturing the thermal conductivity analysis device.
The support 100 is made of stainless steel, and the support 100 is used as a carrier for the thermal conductivity cell body 200 and the signal processing module 500. The shell of the thermal conductivity cell body 200 is made of aluminum, an analysis cell and a reference cell are arranged on the thermal conductivity cell body, the analysis cell is used for placing a measuring element and is the same as a sample gas path, the cell body adopts a diffusion type thermal conductivity cell structure, the reference cell is used for placing the reference element, the cell body is in a closed arrangement, and inert gas can be filled in the cell body to improve the stability of the element temperature. The pre-conversion module 300 is configured with a precise fixed resistor, and forms a precise bridge with the precise elements (the reference element and the measurement element) of the thermal conductivity cell body 200, so that the resistance change of the sensitive element is converted into a circuit change, and the circuit change is provided for a subsequent circuit to be processed. The constant temperature module 400 comprises a flexible heating plate, is used for heating the thermal conductivity cell body 200, and an integrated measuring element can measure the temperature of the thermal conductivity cell body 200 in real time, and meanwhile, is also provided with a temperature safety device, so that the effect of over-temperature protection is achieved, the temperature of the thermal conductivity cell body 200 caused by the slender constant temperature circuit is prevented from being too high, the constant temperature module 400 adopts PWM (Pulse-width modulation) to precisely control the temperature, a constant temperature working environment is provided for the thermal conductivity cell body 200, the influence of external environment temperature change on measurement is reduced, and precise measurement is easier to realize. The signal processing module 500 further processes the signal transmitted by the pre-conversion module 300, amplifies, filters and converts analog signals, finally calculates the measured concentration by linearization processing on digital signals, completes the acquisition of temperature signals, realizes constant temperature control logic, provides a stable constant current source for a balance bridge by a signal processing board, and ensures that the thermal conductance type gas analysis and measurement of certain gas concentration are often interfered by background gas.
In one possible implementation, the thermostat module 400 accomplishes temperature control via pulse width modulation.
In one possible implementation, the constant temperature module 400 includes a flexible heating plate, and a temperature measuring element is integrally provided on the constant temperature module 400.
In one possible implementation, the thermal conductivity cell body 200 is provided in a sealed manner, and an inert gas is enclosed therein.
In one possible implementation, the signal processing module 500 is provided with a compensation module that is capable of inputting either fixed compensation or analog input compensation.
In one possible implementation, the material of the housing is aluminum.
In one possible implementation, the front side of the bracket 100 is projected as an "L" shaped bracket 100, the thermal conductivity cell body 200 is disposed on a lateral side of the bracket 100, and the signal processing module 500 is disposed on a vertical side of the bracket 100 and is disposed near one end of the thermal conductivity cell body 200.
In one possible implementation, the bracket 100 is made of stainless steel, and the thermal conductivity cell body 200 and the signal processing module 500 are fixedly connected to the bracket 100 by bolts.
It should be noted that, although the present application is described above as an example of a thermal conductivity analysis device, those skilled in the art will appreciate that the present application should not be limited thereto. In fact, the user can flexibly set each parameter according to personal preference and/or actual application scene, so long as the design is reasonable.
Therefore, through integrating all parts on the bracket, wherein the reference element and the measuring element in the thermal conductivity cell body are the film platinum resistor, the film platinum resistor has the advantages of small volume, quick corresponding time, vibration resistance, good long-term stability, low price and the like, the structure is diversified, the processing and the assembly are easy, the elements have good consistency by adopting automatic production and detection lines, the complex dynamic pairing process can be avoided when the thermal conductivity analyzer is manufactured, the front conversion plate is used for converting the resistance change of the film platinum resistor into an electric signal and transmitting the electric signal to the signal processing module for analysis and treatment, so that the measuring result is obtained.
The foregoing description of embodiments of the application has been presented for purposes of illustration and description, and is not intended to be exhaustive or limited to the embodiments disclosed. Many modifications and variations will be apparent to those of ordinary skill in the art without departing from the scope and spirit of the various embodiments described. The terminology used herein was chosen in order to best explain the principles of the embodiments, the practical application, or the improvement of technology in the marketplace, or to enable others of ordinary skill in the art to understand the embodiments disclosed herein.
Claims (8)
1. A thermal conductivity analysis device, comprising: the device comprises a bracket, a thermal conductivity cell body, a front conversion module, a constant temperature module and a signal processing module;
The heat conduction pool body is placed on the support, the constant temperature module and the front conversion module are arranged in the heat conduction pool body, the front conversion module is arranged at the top of the constant temperature module, and the signal processing module is arranged at one side of the support;
The thermal conductivity cell body includes: the device comprises a shell, an analysis tank and a reference tank, wherein the analysis tank and the reference tank are hermetically arranged in the shell, the analysis tank is provided with a measuring element and is suitable for being communicated with a sample gas path, the reference tank is provided with a reference element, and the measuring element and the reference element are both film platinum resistors;
The front conversion module is provided with a fixed resistor, the fixed resistor and the two thin film platinum resistors form an electric bridge, and the front conversion module is electrically connected with the signal processing module;
the constant temperature module is electrically connected with the signal processing module.
2. The thermal conductivity analysis device of claim 1, wherein said constant temperature module performs temperature control by pulse width modulation.
3. The thermal conductivity analysis device of claim 2, wherein the constant temperature module comprises a flexible heating sheet, and a temperature measuring element is integrally provided on the constant temperature module.
4. The thermal conductivity analysis device according to claim 1, wherein an inert gas is enclosed in the thermal conductivity cell body.
5. The thermal conductivity analysis device of claim 1, wherein the signal processing module is provided with a compensation module capable of inputting a fixed compensation or an analog input compensation.
6. The thermal conductivity analysis device of claim 1, wherein said housing is made of aluminum.
7. The thermal conductivity analysis device of claim 1, wherein the front side of the support is projected as an "L" shaped support, the thermal conductivity cell body is disposed on a horizontal line structure of the support, and the signal processing module is disposed on a vertical line structure of the support and is disposed at an end near the thermal conductivity cell body.
8. The thermal conductivity analysis device of claim 7, wherein the support is made of stainless steel, and the thermal conductivity cell body and the signal processing module are fixedly connected with the support through bolts.
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN221280968U true CN221280968U (en) | 2024-07-05 |
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