CN221280328U - Temperature and pressure integrated sensor and temperature and pressure detection system - Google Patents

Abstract

The application provides a temperature and pressure integrated sensor and a temperature and pressure detection system, wherein the temperature and pressure integrated sensor comprises a flexible base layer, a temperature sensing electrode layer, a flexible connecting layer, a pressure sensing electrode layer and a flexible pressure sensing material layer, the pressure sensing electrode layer is provided with a pressure sensing electrode, and the temperature sensing electrode layer is provided with a temperature sensing unit for sensing the temperature; the pressure sensing electrode layer and the temperature sensing electrode layer are respectively arranged on two opposite surfaces of the flexible connecting layer, and the flexible base layer is arranged on one surface of the temperature sensing electrode layer, which is away from the flexible connecting layer, and is fixedly connected with the flexible connecting layer; the flexible pressure sensing material layer is arranged on one surface of the pressure sensing electrode layer, which is away from the flexible connecting layer, and is fixedly connected with the flexible connecting layer, and the flexible pressure sensing material layer and the pressure sensing electrode form a pressure sensing unit for sensing the pressure. The temperature and pressure integrated sensor provided by the application has better flexibility, can be bent to adapt to detection of various curved surfaces, improves the integration level with a device to be detected, and has higher practicability.

Description

Temperature and pressure integrated sensor and temperature and pressure detection system

Technical Field

The application belongs to the technical field of sensors, and particularly relates to a temperature and pressure integrated sensor and a temperature and pressure detection system.

Background

Temperature sensors and pressure sensors are two common sensors, and often need to be matched for use in more use situations. For example, in commissioning a hot press, it may be desirable to detect both the pressure applied by the hot press and the temperature at the time of hot pressing; for example, when the battery is comprehensively detected, it is necessary to detect the temperature and the surface expansion force of the battery at the same time.

Based on this, a temperature and pressure integrated sensor integrating temperature detection and pressure detection is currently presented, which is generally based on the existing pressure sensor, a thermistor is arranged in a metal shell, and then heat conduction grease is encapsulated in the metal shell, and the metal shell is connected with a circuit through a sensitive element hole so as to realize simultaneous detection of pressure and temperature. For example, a temperature sensor is additionally arranged on the basis of the MEMS pressure chip and the ASIC conditioning chip. The scheme can collect temperature and pressure simultaneously, but has a complex structure, and the integration level between the hard shell and the device to be detected is low.

Disclosure of utility model

The application aims to provide a temperature and pressure integrated sensor and a temperature and pressure detection system, which are used for solving the technical problem of low integration level between the temperature and pressure integrated sensor and a device to be detected in the prior art.

In order to achieve the above purpose, the application adopts the following technical scheme: the temperature and pressure integrated sensor at least comprises a flexible base layer, a temperature sensing electrode layer, a flexible connecting layer, a pressure sensing electrode layer and a flexible pressure sensing material layer, wherein the pressure sensing electrode layer is at least provided with a pressure sensing electrode, and the temperature sensing electrode layer is at least provided with a temperature sensing unit for sensing the temperature; the pressure sensing electrode layer and the temperature sensing electrode layer are respectively arranged on two opposite surfaces of the flexible connecting layer, and the flexible base layer is arranged on one surface of the temperature sensing electrode layer, which is away from the flexible connecting layer, and is fixedly connected with the flexible connecting layer so that the temperature sensing unit is clamped between the flexible connecting layer and the flexible base layer; the flexible pressure sensing material layer is arranged on one surface of the pressure sensing electrode layer, which is away from the flexible connecting layer, and is fixedly connected with the flexible connecting layer, so that the pressure sensing electrode is clamped between the flexible connecting layer and the flexible pressure sensing material layer, and the flexible pressure sensing material layer and the pressure sensing electrode form a pressure sensing unit for sensing pressure.

Optionally, the temperature and pressure integrated sensor includes a first adhesive layer and a second adhesive layer, where the first adhesive layer is disposed between the flexible base layer and the flexible connection layer to fix the flexible base layer and the flexible connection layer, and the first adhesive layer avoids an area where the temperature sensing unit is disposed; the second bonding layer is arranged between the flexible pressure sensing material layer and the flexible connecting layer so that the flexible pressure sensing material layer is fixed with the flexible connecting layer, and the second bonding layer avoids the area provided with the pressure sensing electrode.

Optionally, the flexible connection layer is a one-layer structure.

Optionally, the flexible connection layer includes a first flexible connection layer, a connection glue layer, and a second flexible connection layer, where the flexible base layer is fixedly connected with the first flexible connection layer so that the temperature sensing unit is sandwiched between the flexible connection layer and the first flexible connection layer; the flexible pressure sensing material layer is fixedly connected with the second flexible connecting layer so that the pressure sensing electrode is clamped between the second flexible connecting layer and the flexible pressure sensing material layer, and the first flexible connecting layer is connected with the second flexible connecting layer through the connecting adhesive layer.

Optionally, the pressure sensing electrode layer further includes a flexible circuit board, a signal input end and a signal output end, and the pressure sensing electrode is disposed on the flexible circuit board; the pressure sensing electrode further comprises a signal input wire, a pressure sensing electrode and a signal output wire which are connected in sequence, wherein the signal input wire is connected with the signal input end, the signal output wire is connected with the signal output end, and the flexible pressure sensing material layer covers the pressure sensing electrode and forms the pressure sensing unit with the pressure sensing electrode.

Optionally, the flexible pressure-sensitive material layer covers the pressure-sensitive electrode and part of the signal input wire and part of the signal output wire; the pressure sensing electrode layer further comprises a protective layer which is connected with the flexible circuit board and covers the signal input wires and the part of the signal output wires which is not covered by the flexible pressure sensing material layer.

Optionally, the temperature sensing electrode layer includes a flexible carrier layer, a first sensing portion, a second sensing portion, a signal input portion, and a signal output portion; the flexible bearing layer is provided with two opposite surfaces, and is provided with through holes which penetrate through the two opposite surfaces of the flexible bearing layer; the first sensing part is arranged on one surface of the flexible bearing layer, one part of the second sensing part is arranged on the other surface of the flexible bearing layer, and the other part of the second sensing part penetrates through the through hole to be connected with the first sensing part so as to form the temperature sensing unit; the first sensing part and the second sensing part are made of different metal materials, one of the first sensing part and the second sensing part is connected with the signal input part, and the other is connected with the signal output part.

Optionally, the thickness of each of the first and second sensing portions is no more than 20 μm.

Optionally, the temperature sensing electrode layer is provided with a plurality of the temperature sensing units, a plurality of the signal input parts and a plurality of the signal output parts; each temperature sensing unit is respectively and electrically connected with different signal input parts, and simultaneously, each temperature sensing unit is respectively and electrically connected with different signal output parts.

Optionally, the temperature sensing electrode layer is provided with a plurality of the temperature sensing units, a plurality of the signal input parts and one of the signal output parts; each temperature sensing unit is electrically connected with different signal input parts, and simultaneously, each temperature sensing unit is electrically connected with one signal output part.

The application also provides a temperature and pressure detection system, which comprises the temperature and pressure integrated sensor, a collector and electronic equipment, wherein the electronic equipment is in communication connection with the collector, and a pressure calculation module and a temperature calculation module are stored in the electronic equipment; the collector comprises a temperature collection butt joint port and a pressure collection butt joint port; the temperature acquisition docking port is used for transmitting an electric signal to the temperature sensing unit and acquiring a changed electric signal after passing through the temperature sensing unit, and the electronic equipment acquires the changed electric signal and acquires a corresponding temperature according to the temperature calculation module; the pressure acquisition butt joint port is used for transmitting an electric signal to the pressure sensing unit and acquiring a changed electric signal after passing through the pressure sensing unit, and the electronic equipment acquires the changed electric signal and acquires a corresponding pressure according to the pressure calculation module.

The temperature and pressure integrated sensor provided by the application has the beneficial effects that: the protection of the temperature sensing unit can be realized through the flexible connecting layer and the flexible base layer, and meanwhile, the temperature sensing unit can be integrated on the flexible connecting layer; the protection to the pressure sensing unit can be realized through the flexible connecting layer and the flexible pressure sensing material layer, and meanwhile, the pressure sensing unit can be integrated on the flexible connecting layer. It can be appreciated that the temperature and pressure integrated sensor can be made to have a simpler overall structure when temperature detection and pressure detection are considered by adopting the setting mode, the flexible base layer, the flexible connecting layer and the flexible pressure sensing material layer are made to have higher flexibility, the temperature and pressure integrated sensor can be adapted to detection of various curved surfaces by bending the temperature and pressure integrated sensor, the integration level between the temperature and pressure integrated sensor and a device to be detected is further improved, and the temperature and pressure integrated sensor has higher practicability and universality. Meanwhile, the pressure sensing electrode layer and the temperature sensing electrode layer are respectively arranged on two opposite surfaces of the flexible connecting layer, and the interference of signals between the pressure sensing electrode layer and the temperature sensing electrode layer can be isolated through the flexible connecting layer, so that the pressure sensing unit and the temperature sensing unit do not need to be arranged in a staggered mode, and the pressure sensing unit and the temperature sensing unit can be respectively arranged on corresponding positions of the two opposite surfaces of the flexible connecting layer, and the pressure and the temperature of the same point to be detected of an object to be detected can be detected simultaneously; moreover, the temperature sensing unit and the pressure sensing unit do not need to be arranged on the same side of the flexible connecting layer by adopting the arrangement mode, so that more temperature sensing units and more pressure sensing units can be arranged under the same area, and the practicability of the temperature and pressure integrated sensor is further improved.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are needed in the embodiments or the description of the prior art will be briefly described below, it being obvious that the drawings in the following description are only some embodiments of the present application, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.

FIG. 1 is a schematic diagram of an explosion structure of a temperature and pressure integrated sensor according to an embodiment of the present application;

FIG. 2 is a schematic diagram of an explosion structure of another temperature and pressure integrated sensor according to an embodiment of the present application;

FIG. 3 is a partial cross-sectional view of an integrated temperature and pressure sensor provided in an embodiment of the present application;

FIG. 4 is a partial cross-sectional view of a flexible tie layer according to an embodiment of the present application;

FIG. 5 is a partial cross-sectional view of another flexible tie layer provided in accordance with an embodiment of the present application;

FIG. 6 is a schematic diagram of a structure of a pressure-sensitive electrode layer according to an embodiment of the present application;

FIG. 7 is a partial cross-sectional view of a temperature-sensing electrode layer provided by an embodiment of the present application;

FIG. 8 is a schematic diagram of a temperature-sensing electrode layer according to an embodiment of the present application;

FIG. 9 is a schematic diagram II of a temperature-sensing electrode layer according to an embodiment of the present application;

Fig. 10 is a schematic diagram of a third structure of a temperature-sensing electrode layer according to an embodiment of the present application;

FIG. 11 is a schematic diagram of a sensor according to an embodiment of the present application;

Fig. 12 is a schematic view of a usage state of a sensor according to an embodiment of the present application.

Wherein, each reference sign in the figure:

1. temperature and pressure integrated sensor; 2. a temperature and pressure detection system;

10. A flexible base layer;

20. A temperature-sensitive electrode layer; 21. a temperature sensing unit; 22. a flexible carrier layer; 23. a first sensing part; 24. a second sensing part; 25. a signal input section; 26. a signal output unit;

30. A flexible connection layer; 31. a first flexible connection layer; 32. connecting the adhesive layer; 33. a second flexible connection layer;

40. A pressure-sensitive electrode layer; 41. a pressure sensing electrode; 42. a pressure sensing unit; 43. a flexible circuit board; 44. a signal input terminal; 45. a signal output terminal; 46. a protective layer; 411. a signal input wire; 412. a pressure-sensitive electrode; 413. a signal output wire;

50. A flexible pressure sensitive material layer; 60. a first adhesive layer; 70. a second adhesive layer;

80. A collector; 81. a temperature acquisition butt joint port; 82. a pressure acquisition butt joint port; 90. an electronic device.

Detailed Description

Embodiments of the present application are described in detail below, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to like or similar elements or elements having like or similar functions throughout. The embodiments described below by referring to the drawings are illustrative and intended to explain the present application and should not be construed as limiting the application.

In the description of the present application, it should be understood that the terms "length," "width," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like indicate orientations or positional relationships based on the orientation or positional relationships shown in the drawings, merely to facilitate describing the present application and simplify the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and therefore should not be construed as limiting the present application.

Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first", "a second", etc. may explicitly or implicitly include one or more such feature. In the description of the present application, the meaning of "a plurality" is two or more, unless explicitly defined otherwise.

In the present application, unless explicitly specified and limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communicated with the inside of two elements or the interaction relationship of the two elements. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art according to the specific circumstances.

Referring to fig. 1 to 3, a temperature-pressure integrated sensor 1 is provided in a first embodiment of the present application, wherein the temperature-pressure integrated sensor 1 at least includes a flexible substrate 10, a temperature-sensing electrode layer 20, a flexible connection layer 30, a pressure-sensing electrode layer 40 and a flexible pressure-sensing material layer 50, the pressure-sensing electrode layer 40 is at least provided with a pressure-sensing electrode 41, and the temperature-sensing electrode layer 20 is at least provided with a temperature-sensing unit 21 for sensing the temperature. The pressure sensing electrode layer 40 and the temperature sensing electrode layer 20 are respectively arranged on two opposite surfaces of the flexible connecting layer 30, and the flexible base layer 10 is arranged on one surface of the temperature sensing electrode layer 20, which is away from the flexible connecting layer 30, and is fixedly connected with the flexible connecting layer 30 so that the temperature sensing unit 21 is clamped between the flexible connecting layer 30 and the flexible base layer 10; the flexible pressure sensing material layer 50 is disposed on one surface of the pressure sensing electrode layer 40 facing away from the flexible connection layer 30 and is fixedly connected with the flexible connection layer 30, so that the pressure sensing electrode 41 is sandwiched between the flexible connection layer 30 and the flexible pressure sensing material layer 50, and the flexible pressure sensing material layer 50 and the pressure sensing electrode 41 form a pressure sensing unit 42 for sensing the pressure.

According to the temperature and pressure integrated sensor 1 provided by the embodiment, the flexible base layer 10 is arranged on one surface of the temperature sensing electrode layer 20, which is away from the flexible connecting layer 30, and is fixedly connected with the flexible connecting layer 30 so that the temperature sensing unit 21 is clamped between the flexible connecting layer 30 and the flexible base layer 10, thus the protection of the temperature sensing unit 21 can be realized through the flexible connecting layer 30 and the flexible base layer 10, and meanwhile, the temperature sensing unit 21 can be integrated on the flexible connecting layer 30; the flexible pressure sensing material layer 50 is disposed on one surface of the pressure sensing electrode layer 40 facing away from the flexible connection layer 30 and is fixedly connected with the flexible connection layer 30, so that the pressure sensing electrode 41 is sandwiched between the flexible connection layer 30 and the flexible pressure sensing material layer 50, and thus the protection of the pressure sensing unit 42 can be achieved through the flexible connection layer 30 and the flexible pressure sensing material layer 50, and meanwhile, the pressure sensing unit 42 can be integrated on the flexible connection layer 30. It can be appreciated that the temperature and pressure integrated sensor 1 can be made to have a simpler overall structure while taking temperature detection and pressure detection into consideration by adopting the arrangement mode, the flexible base layer 10, the flexible connecting layer 30 and the flexible pressure sensing material layer 50 of the flexible temperature and pressure integrated sensor 1 have higher flexibility, the temperature and pressure integrated sensor 1 can be adapted to detection of various curved surfaces by bending, the integration level between the temperature and pressure integrated sensor 1 and a device to be detected is further improved, and the flexible temperature and pressure integrated sensor has higher practicability and universality. Meanwhile, the pressure sensing electrode layer 40 and the temperature sensing electrode layer 20 are respectively arranged on two opposite surfaces of the flexible connecting layer 30, and the flexible connecting layer 30 can isolate signal interference between the pressure sensing electrode layer 40 and the temperature sensing electrode layer 20, so that the pressure sensing unit 42 and the temperature sensing unit 21 do not need to be arranged in a staggered manner, and the pressure sensing unit 42 and the temperature sensing unit 21 can be respectively arranged on corresponding positions of the two opposite surfaces of the flexible connecting layer 30, and the pressure and the temperature of the same point to be detected of an object to be detected can be detected simultaneously; moreover, the temperature sensing unit 21 and the pressure sensing unit 42 do not need to be arranged on the same side of the flexible connection layer 30 by adopting the arrangement mode, so that more temperature sensing units 21 and pressure sensing units 42 can be arranged under the same area, and the practicability of the temperature and pressure integrated sensor 1 is further improved.

The number of the temperature sensing units 21 disposed on the temperature sensing electrode layer 20 is not particularly limited in the embodiment of the present utility model, and it can be understood that the number of the temperature sensing units 21 can be set according to specific usage situation requirements. One temperature sensing unit 21 may be disposed on the temperature sensing electrode layer 20, two temperature sensing units 21 may be disposed on the temperature sensing electrode layer 20, and a plurality of temperature sensing units 21 may be disposed on the temperature sensing electrode layer 20.

The number of the pressure sensing electrodes 41 disposed on the pressure sensing electrode layer 40 is not particularly limited in the embodiment of the present utility model, and it can be understood that the number of the pressure sensing electrodes 41 can be set according to specific usage situation requirements. One pressure sensing electrode 41 may be disposed on the pressure sensing electrode layer 40, two pressure sensing electrodes 41 may be disposed on the pressure sensing electrode layer 40, and a plurality of pressure sensing electrodes 41 may be disposed on the pressure sensing electrode layer 40. Since the flexible pressure-sensing material layer 50 and the pressure-sensing electrodes 41 form the pressure-sensing units 42 for sensing the magnitude of pressure, the number of the pressure-sensing units 42 on the temperature-pressure integrated sensor 1 is the same as the number of the pressure-sensing electrodes 41 covered by the flexible pressure-sensing material layer 50. As one preferred option, the flexible pressure sensing material layer 50 covers all of the pressure sensing electrodes 41 on the pressure sensing electrode layer 40.

The fixing manner between the flexible base layer 10 and the flexible connection layer 30 and the fixing manner between the flexible pressure-sensitive material layer 50 and the flexible connection layer 30 are not particularly limited in the embodiment of the present utility model. The flexible base layer 10 can be fixed on the flexible connecting layer 30 by a hot pressing mode, and the flexible base layer 10 can also be fixed on the flexible connecting layer 30 by an adhesive mode; the flexible pressure-sensitive material layer 50 may be fixed on the flexible connection layer 30 by hot pressing, and the flexible pressure-sensitive material layer 50 may be fixed on the flexible connection layer 30 by bonding.

Referring to fig. 3, as a specific embodiment, the flexible substrate 10 and the flexible pressure-sensitive material layer 50 are both fixed on the flexible connection layer 30 by bonding. Specifically, the temperature and pressure integrated sensor 1 further includes a first adhesive layer 60 and a second adhesive layer 70. The first adhesive layer 60 is disposed between the flexible base layer 10 and the flexible connection layer 30 to fix the flexible base layer 10 and the flexible connection layer 30, and the first adhesive layer 60 avoids a region where the temperature sensing unit 21 is disposed. The second adhesive layer 70 is disposed between the flexible pressure-sensitive material layer 50 and the flexible connection layer 30 to fix the flexible pressure-sensitive material layer 50 and the flexible connection layer 30, and the second adhesive layer 70 avoids the region where the pressure-sensing electrode 41 is disposed.

It can be appreciated that in the present embodiment, the flexible base layer 10 and the flexible connection layer 30 are fixed by the first adhesive layer 60, and the flexible pressure-sensitive material layer 50 and the flexible connection layer 30 are fixed by the second adhesive layer 70, so that the fixation between the flexible pressure-sensitive material layer 50 and the flexible base layer 10 and the flexible connection layer 30 is firmer, and the service life of the temperature and pressure integrated sensor 1 can be further improved. Meanwhile, the first adhesive layer 60 avoids the region where the temperature sensing unit 21 is provided, further ensuring that the first adhesive layer 60 does not affect the temperature detection; while the second adhesive layer 70 avoids the region where the pressure sensing electrode 41 is provided, so that normal operation of the pressure sensing unit 42 can be ensured.

The type of flexible base layer 10 is not particularly limited in this embodiment, and as a possible implementation, the flexible base layer 10 is a flexible PI substrate.

The type of the flexible connection layer 30 is not particularly limited in the embodiment of the present utility model, and the flexible connection layer 30 may be a one-layer structure composed of only one layer of film, or the flexible connection layer 30 may be a multi-layer structure composed of stacked layers of films.

Referring to fig. 4, as an embodiment, the flexible connection layer 30 is a layer structure. It can be appreciated that when the flexible connection layer 30 is a single film, the overall thickness of the temperature and pressure integrated sensor 1 can be reduced, so that the temperature and pressure integrated sensor 1 is thinner and lighter, and the temperature and pressure integrated sensor 1 is more flexible and thinner. As a more specific embodiment, the flexible connection layer 30 is a PI substrate.

Referring to fig. 1 and 5, as an embodiment, the flexible connection layer 30 has a multi-layer structure. Specifically, the flexible connection layer 30 includes a first flexible connection layer 31, a connection adhesive layer 32, and a second flexible connection layer 33, where the flexible base layer 10 is fixedly connected to the first flexible connection layer 31 so that the temperature sensing unit 21 is sandwiched between the flexible connection layer 30 and the first flexible connection layer 31; the flexible pressure-sensitive material layer 50 is fixedly connected with the second flexible connection layer 33 such that the pressure-sensitive electrode 41 is sandwiched between the second flexible connection layer 33 and the flexible pressure-sensitive material layer 50, and the first flexible connection layer 31 and the second flexible connection layer 33 are connected by the connection adhesive layer 32. It can be appreciated that, in the present embodiment, the temperature sensing unit 21 may be protected and integrated by the first flexible connection layer 31, the pressure sensing electrode 41 may be protected and integrated by the second flexible connection layer 33, so that the flexible base layer 10, the temperature sensing electrode layer 20 and the first flexible connection layer 31 may be separately integrated, and the pressure sensing electrode layer 40, the flexible pressure sensing material layer 50 and the second flexible connection layer 33 may also be separately integrated, and after the integration between the flexible base layer 10, the temperature sensing electrode layer 20 and the first flexible connection layer 31 and the integration between the pressure sensing electrode layer 40, the flexible pressure sensing material layer 50 and the second flexible connection layer 33 are completed, the first flexible connection layer 31 and the second flexible connection layer 33 may be fixed by the connection adhesive layer 32.

In the present utility model, the flexible pressure sensing material layer 50 and the pressure sensing electrode 41 form a pressure sensing unit 42 for sensing the magnitude of pressure. As an embodiment, the pressure sensing electrode 41 is a sensing electrode fabricated on a flexible circuit board, and the pressure sensing unit 42 is any one of a piezoresistive element, a piezoelectric element, an impedance element, or a capacitive element. The pressure sensing unit 42 is configured to change at least one electrical characteristic (e.g., a resistance value, an amount of charge, an impedance value, a capacitance value, etc.) based on an amount or magnitude of the applied force.

Referring to fig. 3 and 6, specifically, the pressure sensing electrode layer 40 further includes a flexible circuit board 43, a signal input end 44 and a signal output end 45, and the pressure sensing electrode 41 is disposed on the flexible circuit board 43. The pressure sensing electrode 41 further includes a signal input wire 411, a pressure sensing electrode 412 and a signal output wire 413 connected in sequence, the signal input wire 411 is connected with the signal input terminal 44, the signal output wire 413 is connected with the signal output terminal 45, and the flexible pressure sensing material layer 50 covers the pressure sensing electrode 412 and forms the pressure sensing unit 42 with the pressure sensing electrode 412. When the temperature and pressure integrated sensor 1 is pressed, the pressure can cause the contact area between the flexible pressure sensing material layer 50 and the pressure sensing electrode 412 to change, the contact area between the flexible pressure sensing material layer 50 and the pressure sensing electrode 412 changes, and then the electrical characteristics of the pressure sensing unit 42 change, the excitation signal is transmitted to the pressure sensing unit 42 through the signal input end 44 and the real-time signal is transmitted through the signal output end 45, and the corresponding pressure change or pressure magnitude can be calculated by acquiring the transmitted real-time signal. The method of calculating the pressure change or the pressure magnitude according to the real-time signal is a prior art method, and will not be described in detail herein.

It can be appreciated that in the embodiment of the present utility model, the flexible pressure sensing material layer 50 covers the pressure sensing electrode 412 and forms the pressure sensing unit 42 with the pressure sensing electrode 412, that is, if only the pressure detecting function is needed, the flexible pressure sensing material layer 50 only needs to cover the pressure sensing electrode 412.

Referring to fig. 2 and 6, as an embodiment, the flexible pressure-sensitive material layer 50 covers the pressure-sensitive electrode 412, the signal input wire 411 and the signal output wire 413, and the signal input wire 411 and the signal output wire 413 are protected by the flexible pressure-sensitive material layer 50 and the flexible circuit board 43.

Referring to fig. 1 and 6, as another embodiment, the flexible pressure-sensitive material layer 50 covers the pressure-sensitive electrode 412 and part of the signal input wire 411 and part of the signal output wire 413. The pressure-sensitive electrode layer 40 further includes a protective layer 46, and the protective layer 46 is connected to the flexible circuit board 43 and covers the signal input wires 411 and the signal output wires 413, which are not covered by the flexible pressure-sensitive material layer 50. In this way, a part of the signal input wire 411 and the signal output wire 413 are protected from the flexible circuit board 43 by the flexible pressure-sensitive material layer 50, and the other part is protected from the flexible circuit board 43 by the protective layer 46.

The types of the signal input terminal 44 and the signal output terminal 45 are not particularly limited in the embodiment of the present application, and the signal input terminal 44 and the signal output terminal 45 may be any type as long as they can transmit an electrical signal. As one embodiment, the signal input terminal 44 and the signal output terminal 45 are conductive terminals.

The type of the pressure sensing electrode 41 is not particularly limited in the embodiment of the present application. As a possible embodiment, the pressure sensing electrode 41 is an interdigital electrode, the pressure sensing electrode 412 is an interdigital portion, and the signal input wire 411 and the signal output wire 413 are wires respectively connected to different interdigital portions.

The type of the temperature sensing unit 21 is not particularly limited in the embodiment of the present utility model, and the temperature sensing unit 21 can be used to detect the temperature. As one preferred, the temperature sensing unit 21 is a thermocouple temperature detecting unit employing the thermocouple principle.

Referring to fig. 7 to 10, specifically, the temperature sensing electrode layer 20 includes a flexible carrier layer 22, a first sensing portion 23, a second sensing portion 24, a signal input portion 25 and a signal output portion 26. The flexible carrier layer 22 has two opposite surfaces (as shown in the a-plane and the B-plane of fig. 7), and the flexible carrier layer 22 is provided with a through hole penetrating the opposite surfaces of the flexible carrier layer 22. The first sensing part 23 is arranged on one surface of the flexible bearing layer 22; a part of the second sensing portion 24 is disposed on the other surface of the flexible carrier layer 22, and the other part of the second sensing portion 24 is connected with the first sensing portion 23 through the through hole to form the temperature sensing unit 21. Wherein the first sensing portion 23 and the second sensing portion 24 are made of different metal materials. One of the first sensing portion 23 and the second sensing portion 24 is connected to the signal input portion 25, and the other is connected to the signal output portion 26. As an example, when the first sensing portion 23 is connected to the signal input portion 25 and the second sensing portion 24 is connected to the signal output portion 26, the excitation signal is transmitted to the first sensing portion 23 through the signal input portion 25, the real-time signal is transmitted through the signal output portion 26 after passing through the first sensing portion 23 and the second sensing portion 24, and the temperature sensed by the temperature sensing unit 21 can be calculated by acquiring the transmitted real-time signal. The method of how to calculate the temperature according to the excitation signal and the real-time signal in the thermocouple principle is the existing method in the field, and will not be repeated here.

The metal materials of the first sensing portion 23 and the second sensing portion 24 are not particularly limited in the embodiment of the present utility model. As one embodiment, the material of the first sensing portion 23 is copper, and the material of the second sensing portion 24 is constantan; as another embodiment, the material of the first sensing portion 23 is nickel chromium, and the material of the second sensing portion 24 is nickel silicon; also as an embodiment, the material of the first sensing portion 23 is nickel chromium, and the material of the second sensing portion 24 is constantan.

The thickness of the first sensing portion 23 and the second sensing portion is not particularly limited, but the thickness of the first sensing portion 23 and the second sensing portion 24 should not be too thick in order to achieve the flexibility of the temperature and pressure integrated sensor 1. In the present application, it is preferable that the thickness of each of the first sensing portion 23 and the second sensing portion 24 is not more than 40 μm. Alternatively, the thickness of the first sensing portion 23 and the second sensing portion 24 is not more than 20 μm.

The number of the signal output parts 26 is not particularly limited, and the temperature sensing electrode layer 20 may be provided with a plurality of signal output parts 26, and the plurality of signal output parts 26 are respectively electrically connected with different temperature sensing units 21; the temperature sensing electrode layer 20 may be provided with only one signal output portion 26, and the plurality of temperature sensing units 21 are electrically connected to the same signal output portion 26.

Referring to fig. 8 and 9, as an embodiment, the temperature sensing electrode layer 20 is provided with a plurality of signal output portions 26, and the plurality of signal output portions 26 are electrically connected to different temperature sensing units 21. Specifically, the temperature-sensing electrode layer 20 is provided with a plurality of temperature-sensing cells 21, a plurality of signal input portions 25, and a plurality of signal output portions 26. Each temperature sensing unit 21 is electrically connected to a different signal input portion 25, and each temperature sensing unit 21 is electrically connected to a different signal output portion 26. In this way, the temperature sensing unit 21 on the temperature sensing electrode layer 20 has a unique correspondence relationship with the signal input portion 25 and the signal output portion 26 electrically connected thereto, and crosstalk between electrical signals can be preferably avoided.

Referring to fig. 8 and 10, as another embodiment, the temperature sensing electrode layer 20 is provided with a signal output portion 26, and the signal output portion 26 is electrically connected to different temperature sensing units 21. Specifically, the temperature-sensing electrode layer 20 is provided with a plurality of temperature-sensing cells 21, a plurality of signal input portions 25, and one signal output portion 26. Each temperature sensing unit 21 is electrically connected to a different signal input portion 25, and each temperature sensing unit 21 is electrically connected to a signal output portion 26. It can be understood that each temperature sensing unit 21 is electrically connected to a different signal input portion 25, so that the electrical signal input of the corresponding temperature sensing unit 21 can be realized by selecting the signal input portion 25; each temperature sensing unit 21 is electrically connected to a signal output unit 26, so that the signal input from any signal input unit 25 can obtain the output electrical signal through the signal output unit 26. By adopting the arrangement mode, the number of the signal output parts 26 can be reduced, so that the integral structure of the temperature and pressure integrated sensor 1 is simpler.

The types of the signal input portion 25 and the signal output portion 26 are not particularly limited in the embodiment of the present application, and the signal input portion 25 and the signal output portion 26 may be any ones capable of transmitting an electric signal. As one embodiment, the signal input unit 25 and the signal output unit 26 are conductive terminals.

Referring to fig. 1 to 12, a temperature and pressure detecting system 2 is provided in a second embodiment of the present application, and the temperature and pressure detecting system 2 includes a collector 80, an electronic device 90 and the temperature and pressure integrated sensor 1. The structure and the beneficial effects of the temperature and pressure integrated sensor 1 are described in the above embodiments, and are not described herein.

Specifically, the electronic device 90 is communicatively connected to the collector 80, and a pressure calculation module and a temperature calculation module are stored in the electronic device 90. The collector 80 includes a temperature collection docking port 81 and a pressure collection docking port 82. The temperature acquisition docking port 81 is used for transmitting an electrical signal to the temperature sensing unit 21, acquiring the electrical signal changed after passing through the temperature sensing unit 21, and the electronic device 90 acquires the changed electrical signal and obtains a corresponding temperature according to the temperature calculation module. The pressure acquisition docking port 82 is used for transmitting an electrical signal to the pressure sensing unit 42, acquiring the electrical signal changed after passing through the pressure sensing unit 42, and the electronic device 90 acquires the changed electrical signal and obtains the corresponding pressure according to the pressure calculation module.

The connection mode between the temperature acquisition butt joint port 81 and the temperature and pressure integrated sensor 1 and the connection mode between the pressure acquisition butt joint port 82 and the temperature and pressure integrated sensor 1 are not particularly limited in the embodiment of the utility model. The temperature acquisition butt joint port 81 and the temperature and pressure integrated sensor 1 can be fixedly connected in a glue layer bonding or welding mode, and the temperature acquisition butt joint port 81 and the temperature and pressure integrated sensor 1 can be detachably connected in a pressing plate fixing or flip cover fixing mode. The pressure acquisition butt joint port 82 and the temperature and pressure integrated sensor 1 can be fixedly connected in a glue layer bonding or welding mode, and the pressure acquisition butt joint port 82 and the temperature and pressure integrated sensor 1 can be detachably connected in a pressing plate fixing or flip cover fixing mode.

The embodiment of the utility model does not specifically limit the arrangement mode of the temperature acquisition butt joint port 81 and the pressure acquisition butt joint port 82 on the collector 80, the temperature acquisition butt joint port 81 and the pressure acquisition butt joint port 82 can be two ports which are separately arranged, and the temperature acquisition butt joint port 81 and the pressure acquisition butt joint port 82 can also be different ports which are fixed on the same shell.

The type of the electronic device 90 is not particularly limited in the embodiment of the present utility model, the electronic device 90 may be an upper computer storing a pressure calculation module and a temperature calculation module, the electronic device 90 may also be a computer storing a pressure calculation module and a temperature calculation module, and the electronic device 90 may also be a mobile phone storing a pressure calculation module and a temperature calculation module, etc.

The foregoing description of the preferred embodiments of the application is not intended to be limiting, but rather is intended to cover all modifications, equivalents, and alternatives falling within the spirit and principles of the application.

Claims (11)

1. The temperature and pressure integrated sensor is characterized by at least comprising a flexible base layer, a temperature sensing electrode layer, a flexible connecting layer, a pressure sensing electrode layer and a flexible pressure sensing material layer, wherein the pressure sensing electrode layer is at least provided with a pressure sensing electrode, and the temperature sensing electrode layer is at least provided with a temperature sensing unit for sensing the temperature;

The pressure sensing electrode layer and the temperature sensing electrode layer are respectively arranged on two opposite surfaces of the flexible connecting layer, and the flexible base layer is arranged on one surface of the temperature sensing electrode layer, which is away from the flexible connecting layer, and is fixedly connected with the flexible connecting layer so that the temperature sensing unit is clamped between the flexible connecting layer and the flexible base layer;

The flexible pressure sensing material layer is arranged on one surface of the pressure sensing electrode layer, which is away from the flexible connecting layer, and is fixedly connected with the flexible connecting layer, so that the pressure sensing electrode is clamped between the flexible connecting layer and the flexible pressure sensing material layer, and the flexible pressure sensing material layer and the pressure sensing electrode form a pressure sensing unit for sensing pressure.

2. The temperature and pressure integrated sensor according to claim 1, wherein the temperature and pressure integrated sensor comprises a first adhesive layer and a second adhesive layer, the first adhesive layer is arranged between the flexible base layer and the flexible connection layer so as to fix the flexible base layer and the flexible connection layer, and the first adhesive layer avoids a region where the temperature sensing unit is arranged; the second bonding layer is arranged between the flexible pressure sensing material layer and the flexible connecting layer so that the flexible pressure sensing material layer is fixed with the flexible connecting layer, and the second bonding layer avoids the area provided with the pressure sensing electrode.

3. The temperature and pressure integrated sensor according to claim 1, wherein the flexible connection layer is a one-layer structure.

4. The temperature and pressure integrated sensor according to claim 1, wherein the flexible connection layer comprises a first flexible connection layer, a connection adhesive layer and a second flexible connection layer, the flexible base layer is fixedly connected with the first flexible connection layer so that the temperature sensing unit is clamped between the flexible connection layer and the first flexible connection layer; the flexible pressure sensing material layer is fixedly connected with the second flexible connecting layer so that the pressure sensing electrode is clamped between the second flexible connecting layer and the flexible pressure sensing material layer, and the first flexible connecting layer is connected with the second flexible connecting layer through the connecting adhesive layer.

5. The temperature and pressure integrated sensor according to claim 1, wherein the pressure sensing electrode layer further comprises a flexible circuit board, a signal input end and a signal output end, and the pressure sensing electrode is arranged on the flexible circuit board;

The pressure sensing electrode further comprises a signal input wire, a pressure sensing electrode and a signal output wire which are connected in sequence, wherein the signal input wire is connected with the signal input end, the signal output wire is connected with the signal output end, and the flexible pressure sensing material layer covers the pressure sensing electrode and forms the pressure sensing unit with the pressure sensing electrode.

6. The temperature and pressure integrated sensor of claim 5, wherein the flexible pressure sensitive material layer covers the pressure sensitive electrode and a portion of the signal input lead and a portion of the signal output lead;

the pressure sensing electrode layer further comprises a protective layer which is connected with the flexible circuit board and covers the signal input wires and the part of the signal output wires which is not covered by the flexible pressure sensing material layer.

7. The temperature and pressure integrated sensor according to claim 1, wherein the temperature sensing electrode layer comprises a flexible carrier layer, a first sensing part, a second sensing part, a signal input part and a signal output part; the flexible bearing layer is provided with two opposite surfaces, and is provided with through holes which penetrate through the two opposite surfaces of the flexible bearing layer;

The first sensing part is arranged on one surface of the flexible bearing layer, one part of the second sensing part is arranged on the other surface of the flexible bearing layer, and the other part of the second sensing part penetrates through the through hole to be connected with the first sensing part so as to form the temperature sensing unit;

The first sensing part and the second sensing part are made of different metal materials, one of the first sensing part and the second sensing part is connected with the signal input part, and the other is connected with the signal output part.

8. The temperature and pressure integrated sensor according to claim 7, wherein the thickness of each of the first sensing portion and the second sensing portion is not more than 20 μm.

9. The temperature and pressure integrated sensor according to claim 7, wherein the temperature sensing electrode layer is provided with a plurality of the temperature sensing units, a plurality of the signal input portions, and a plurality of the signal output portions;

Each temperature sensing unit is respectively and electrically connected with different signal input parts, and simultaneously, each temperature sensing unit is respectively and electrically connected with different signal output parts.

10. The temperature and pressure integrated sensor according to claim 7, wherein the temperature sensing electrode layer is provided with a plurality of the temperature sensing units, a plurality of the signal input portions, and one of the signal output portions;

Each temperature sensing unit is electrically connected with different signal input parts, and simultaneously, each temperature sensing unit is electrically connected with one signal output part.

11. A temperature and pressure detection system comprising the temperature and pressure integrated sensor according to any one of claims 1-10, wherein the temperature and pressure detection system further comprises a collector and electronic equipment, the electronic equipment is in communication connection with the collector, and a pressure calculation module and a temperature calculation module are stored in the electronic equipment;

The collector comprises a temperature collection butt joint port and a pressure collection butt joint port; the temperature acquisition docking port is used for transmitting an electric signal to the temperature sensing unit and acquiring a changed electric signal after passing through the temperature sensing unit, and the electronic equipment acquires the changed electric signal and acquires a corresponding temperature according to the temperature calculation module;

The pressure acquisition butt joint port is used for transmitting an electric signal to the pressure sensing unit and acquiring a changed electric signal after passing through the pressure sensing unit, and the electronic equipment acquires the changed electric signal and acquires a corresponding pressure according to the pressure calculation module.