CN221274205U - Silicon wafer conveying mechanism and silicon wafer detection device - Google Patents
Silicon wafer conveying mechanism and silicon wafer detection device Download PDFInfo
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- CN221274205U CN221274205U CN202322684892.9U CN202322684892U CN221274205U CN 221274205 U CN221274205 U CN 221274205U CN 202322684892 U CN202322684892 U CN 202322684892U CN 221274205 U CN221274205 U CN 221274205U
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 85
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 85
- 239000010703 silicon Substances 0.000 title claims abstract description 85
- 238000001514 detection method Methods 0.000 title claims abstract description 80
- 230000007246 mechanism Effects 0.000 title claims abstract description 48
- 235000012431 wafers Nutrition 0.000 claims description 83
- 238000007689 inspection Methods 0.000 claims description 9
- 238000009434 installation Methods 0.000 claims description 5
- 230000008878 coupling Effects 0.000 claims description 4
- 238000010168 coupling process Methods 0.000 claims description 4
- 238000005859 coupling reaction Methods 0.000 claims description 4
- 230000000149 penetrating effect Effects 0.000 claims description 3
- 230000007723 transport mechanism Effects 0.000 claims 7
- 238000010586 diagram Methods 0.000 description 4
- 230000003068 static effect Effects 0.000 description 4
- 238000000034 method Methods 0.000 description 2
- 238000005096 rolling process Methods 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 1
- 230000001360 synchronised effect Effects 0.000 description 1
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- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The application provides a silicon wafer conveying mechanism which comprises a conveying belt bracket, a first conveying belt, a second conveying belt and a conveying belt driving mechanism. The conveyer belt actuating mechanism includes first connecting plate, second connecting plate, installing support, drive assembly, pivot, first drive drum wheel, second drive drum wheel, first steering roller and second steering roller, wherein: the first connecting plate, the second connecting plate and the rotating shaft are connected to the conveyor belt bracket. The first driving drum wheel and the second driving drum wheel are arranged on the rotating shaft, the first steering roller wheel is arranged on the first connecting plate, the second steering roller wheel is arranged on the second connecting plate, the first conveying belt bypasses the first steering roller wheel to be supported by the first driving drum wheel, and the second conveying belt bypasses the second steering roller wheel to be supported by the second driving drum wheel. The driving assembly drives the first driving drum wheel and the second driving drum wheel to rotate through the rotating shaft so as to drive the first conveying belt and the second conveying belt to convey. The driving component of the application can not cause the shaking of the conveyer belt, thereby improving the detection precision of the thickness detection device.
Description
Technical Field
The application relates to the field of silicon wafer detection, in particular to a silicon wafer conveying mechanism and a silicon wafer detection device.
Background
In the silicon wafer sorting process, thickness detection and resistivity detection of the silicon wafer are required to be implemented. Conveyor belts are commonly used in the industry to transport silicon wafers such that the wafers pass through a thickness detection device and a resistivity detection device.
The existing conveying mechanism, the conveying belt driving mechanism and the conveying belt are arranged on the same support, and the conveying belt is easy to shake when the conveying belt driving mechanism drives, so that the detection precision of the thickness detection device is affected, and the silicon wafer sorting error is caused.
Disclosure of utility model
Aiming at the problems of the traditional conveying mechanism, the application provides a silicon wafer conveying mechanism, which has the following detailed technical scheme:
The utility model provides a silicon chip conveying mechanism, includes conveyer belt support, first conveyer belt, second conveyer belt and conveyer belt actuating mechanism, wherein:
the first conveying belt and the second conveying belt are sleeved on the conveying belt bracket side by side along the first horizontal direction;
The conveyer belt actuating mechanism includes first connecting plate, second connecting plate, installing support, drive assembly, pivot, first drive drum wheel, second drive drum wheel, a plurality of first steering roller and a plurality of second steering roller, wherein:
the first connecting plate and the second connecting plate are oppositely connected to the two sides of the conveyor belt bracket;
The mounting bracket is arranged below the first connecting plate and the second connecting plate, the driving assembly is arranged on the mounting bracket, the rotating shaft is rotatably arranged on the mounting bracket along the second horizontal direction and is connected with the driving end of the driving assembly, and the second horizontal direction is perpendicular to the first horizontal direction;
The first driving drum wheel is fixedly sleeved on the rotating shaft and is close to the first conveying belt, a plurality of first steering roller wheels are arranged on the first connecting plate and distributed on two sides of the first driving drum wheel, and the first conveying belt bypasses each first steering roller wheel and is supported by the first driving drum wheel;
The second driving drum wheel is fixedly sleeved on the rotating shaft and is close to the second conveying belt, a plurality of second steering roller wheels are arranged on the second connecting plate and distributed on two sides of the second driving drum wheel, and the second conveying belt sequentially bypasses each second steering roller wheel and is supported by the second driving drum wheel;
The driving assembly drives the first driving drum wheel and the second driving drum wheel to synchronously rotate through the rotating shaft so as to drive the supported first conveying belt and the supported second conveying belt to synchronously convey.
According to the silicon wafer conveying mechanism provided by the application, the first conveying belt and the second conveying belt are arranged on the conveying belt bracket, the driving assembly is arranged on the mounting bracket, and the driving assembly drives the first conveying belt and the second conveying belt to convey through the driving drum wheel and the steering roller. Because the driving component and the conveyer belt are positioned on different brackets, the driving component can not cause the shaking of the conveyer belt when driving, thereby improving the detection precision of the thickness detection device.
In some embodiments, the mounting bracket comprises a base, a first riser, a second riser, and a third riser, wherein: the first vertical plate, the second vertical plate and the third vertical plate are sequentially arranged on the base along the second horizontal direction, wherein the second vertical plate is provided with a first through hole, and the third vertical plate is provided with a second through hole; the driving component is arranged on the first vertical plate; the first end of pivot is connected on drive assembly's drive end, and the second end of pivot cross-under is in the second cross-under hole after passing first cross-under hole, and first drive drum and second drive drum are located between second riser and the third riser.
Through setting up the installing support, provide sufficient installation space for drive assembly and pivot, ensure that the pivot supports on the installing support with the horizontality steadily, finally promoted drive assembly to the driving stability of first conveyer belt and second conveyer belt.
In some embodiments, a first rotational bearing is disposed within the first access hole, a second rotational bearing is disposed within the second access hole, and the shaft is accessed within the first rotational bearing and the second rotational bearing.
The pivot cross-under is in first rolling bearing and second rolling bearing, ensures that the pivot can smoothly rotate under drive assembly's drive, prevents to block and hang.
In some embodiments, the shaft is coupled to the drive end of the drive assembly via a coupling.
Through setting up the shaft coupling, can ensure that pivot and drive assembly's drive end synchronous revolution, further promote drive assembly's drive stability.
In some embodiments, the first conveyor belt wraps at least 1/4 of the outer circumference of the first drive drum and the second conveyor belt wraps at least 1/4 of the outer circumference of the second drive drum.
The first conveying belt at least covers 1/4 of the outer circumference of the first driving drum, so that static friction force between the first driving drum and the first conveying belt is large enough, and the first conveying belt is driven to stably convey when the first driving drum rotates, and the first conveying belt is prevented from slipping. Similarly, the second conveying belt at least covers 1/4 of the outer circumference of the second driving drum, so that the static friction force between the second driving drum and the second conveying belt is enough, and the second conveying belt is driven to stably convey when the second driving drum rotates, and the second conveying belt is prevented from slipping.
In some embodiments, the conveyor belt support comprises a first support frame, a second support frame, and a bearing support frame, wherein: the first end of the bearing bracket is supported on the first supporting frame, and a first belt wheel and a second belt wheel are arranged at the first end of the bearing bracket side by side; the second end of the bearing bracket is supported on the second supporting frame, and a third belt wheel and a fourth belt wheel are arranged at the second end of the bearing bracket side by side; two ends of the first conveyer belt are respectively sleeved on the first belt pulley and the third belt pulley; two ends of the second conveyer belt are respectively sleeved on the second belt wheel and the fourth belt wheel.
Through setting up the conveyer belt support for first conveyer belt, second conveyer belt are installed on the conveyer belt support in the transmission side by side.
In some embodiments, the support bracket includes a first pallet and a second pallet disposed side by side and extending in a first horizontal direction, with an installation gap maintained between the first pallet and the second pallet; the first belt pulley and the third belt pulley are respectively arranged at two ends of the first supporting plate, and the second belt pulley and the fourth belt pulley are respectively arranged at two ends of the second supporting plate.
The gap is kept between the first conveying belt and the second conveying belt, so that the edges of the two sides of the battery piece are supported on the first conveying belt and the second conveying belt, the lower surface of the battery piece can basically expose the first conveying belt and the second conveying belt, and the detection device on the conveying path can be conveniently used for detecting the battery piece.
The application also provides a silicon wafer detection device, which comprises a detection mechanism and any one of the silicon wafer conveying mechanisms, wherein:
the detection mechanism comprises a frame, a first thickness detection component, a second thickness detection component and a third thickness detection component, wherein a conveying channel for a silicon wafer to pass through is arranged on the frame, the first thickness detection component and the second thickness detection component are connected to the frame in a sliding manner and are positioned on a first side of the frame, and the third thickness detection component is connected to the frame and is positioned on a second side of the frame opposite to the first side;
The first conveying belt and the second conveying belt of the silicon wafer conveying mechanism penetrate through the conveying channel and are used for conveying the silicon wafer to be detected, the silicon wafer passes through the conveying channel, the first thickness detection assembly and the second thickness detection assembly are respectively used for detecting the thickness of the first side part and the second side part of the silicon wafer, and the third thickness detection assembly is used for detecting the thickness of the middle part of the silicon wafer.
Through the cooperation of silicon chip conveying mechanism and detection mechanism, silicon chip detection device has realized the thickness detection to first limit lateral part, second limit lateral part and the middle part of silicon chip.
In some embodiments, the first thickness detection assembly includes a first laser and a second laser disposed in pairs on upper and lower sides of the transport channel; the second thickness detection assembly comprises a third laser and a fourth laser which are arranged on the upper side and the lower side of the conveying channel in pairs; the third thickness detection assembly comprises fifth lasers and sixth lasers which are arranged on the upper side and the lower side of the conveying channel in pairs; when the silicon wafer to be detected passes through the conveying channel, the first laser and the second laser synchronously scan the two opposite surfaces of the first side part of the silicon wafer to be detected to detect the thickness of the first side part of the silicon wafer to be detected, the third laser and the fourth laser synchronously scan the two opposite surfaces of the second side part of the silicon wafer to be detected to detect the thickness of the second side part of the silicon wafer to be detected, and the fifth laser and the sixth laser synchronously scan the two opposite surfaces of the middle part of the silicon wafer to be detected to detect the thickness of the middle part of the silicon wafer to be detected.
Each thickness detection assembly comprises two laser sensors which are arranged in pairs, and the thickness detection of the corresponding part of the silicon wafer can be rapidly completed by synchronously scanning the two opposite surfaces of the silicon wafer through the two laser sensors, so that the thickness detection efficiency of the silicon wafer is improved.
In some embodiments, the silicon wafer detection device further comprises a resistivity detection assembly arranged on the frame, wherein the resistivity detection assembly detects the resistivity of the silicon wafer when the silicon wafer to be detected passes through the conveying channel.
By arranging the resistivity detection component, the detection of the resistivity of the silicon wafer is realized.
Drawings
FIG. 1 is a schematic diagram of a conveying mechanism according to an embodiment of the present application;
FIG. 2 is a schematic illustration of a conveyor belt rack in an embodiment of the present application with parts of the components omitted;
FIG. 3 is a schematic diagram of an assembly of a second conveyor belt with a second drive drum and a second turning roller in an embodiment of the application;
FIG. 4 is a schematic view of a belt drive mechanism according to an embodiment of the present application;
FIG. 5 is a schematic diagram of a detecting mechanism according to an embodiment of the present application under a single viewing angle;
fig. 6 is a schematic structural diagram of a detection mechanism according to an embodiment of the present application at another view angle.
Fig. 1 to 6 include:
conveyor belt holder 1:
The first support frame 11, the second support frame 12, the bearing bracket 13, the first supporting plate 131, the second supporting plate 132, the first belt pulley 14, the second belt pulley 15, the third belt pulley 16 and the fourth belt pulley 17;
a first conveyor belt 2;
a second conveyor belt 3;
Conveyor belt drive mechanism 4:
The first connecting plate 41, the second connecting plate 42, the mounting bracket 43, the driving assembly 44, the rotating shaft 45, the first driving drum 46, the second driving drum 47, the first steering roller 48, the second steering roller 49, the coupler 410, the base 431, the first upright 432, the second upright 433 and the third upright 434;
And a frame 5: a conveying passage 51;
first thickness detection component 6: a first laser 61, a second laser 62;
Second thickness detection component 7: a third laser 71, a fourth laser 72;
Third thickness detection component 8: a fifth laser 81 and a sixth laser 82.
Detailed Description
In order that the above-recited objects, features and advantages of the present application will become more readily apparent, a more particular description of the application will be rendered by reference to the appended drawings and appended detailed description.
The existing conveying mechanism, the conveying belt driving mechanism and the conveying belt are arranged on the same support, and the conveying belt is easy to shake when the conveying belt driving mechanism drives, so that the detection precision of the thickness detection device is affected, and the silicon wafer sorting error is caused.
In view of the above, the present application provides a conveying mechanism that can prevent the occurrence of shake of a conveying belt during conveying, thereby improving the detection accuracy of a thickness detection device.
As shown in fig. 1 to 3, the silicon wafer conveying mechanism in the embodiment of the application includes a conveyor belt bracket 1, a first conveyor belt 2, a second conveyor belt 3 and a conveyor belt driving mechanism 4, wherein:
the first conveyor belt 2 and the second conveyor belt 3 are sleeved on the conveyor belt bracket 1 side by side along a first horizontal direction (such as an X-axis direction in fig. 1).
The conveyor belt driving mechanism 4 includes a first connecting plate 41, a second connecting plate 42, a mounting bracket 43, a driving assembly 44, a rotating shaft 45, a first driving drum 46, a second driving drum 47, a plurality of first steering rollers 48 and a plurality of second steering rollers 49, wherein:
The first connecting plate 41 and the second connecting plate 42 are oppositely connected to both sides of the conveyor support 1.
The mounting bracket 43 is disposed below the first connection plate 41 and the second connection plate 42, the driving assembly 44 is mounted on the mounting bracket 43, and the rotating shaft 45 is rotatably disposed on the mounting bracket 43 along a second horizontal direction (e.g., a Y-axis direction in fig. 1) and connected to the driving end of the driving assembly 44, the second horizontal direction being perpendicular to the first horizontal direction.
The first driving drum 46 is fixedly sleeved on the rotating shaft 45 and is close to the first conveying belt 2, a plurality of first steering rollers 48 are arranged on the first connecting plate 41 and distributed on two sides of the first driving drum 46, and the first conveying belt 2 sequentially bypasses each first steering roller 48 and is supported by the first driving drum 46.
The second driving drum 47 is fixedly sleeved on the rotating shaft 45 and is close to the second conveying belt 3, a plurality of second steering rollers 49 are arranged on the second connecting plate 42 and distributed on two sides of the second driving drum 47, and the second conveying belt 3 sequentially bypasses each second steering roller 49 and is supported by the second driving drum 47. In the embodiment shown in fig. 3, four second steering rollers 49 are provided in total, wherein two second steering rollers 49 are located on one side of the second driving drum 47 and two other second steering rollers 49 are located on the other side of the second driving drum 47.
The driving assembly 44 drives the first driving drum 46 and the second driving drum 47 to synchronously rotate through the rotating shaft 45 so as to drive the supported first conveyor belt 2 and the supported second conveyor belt 3 to synchronously convey.
According to the silicon wafer conveying mechanism provided by the application, the first conveying belt 2 and the second conveying belt 3 are arranged on the conveying belt bracket 1, the driving assembly 44 is arranged on the mounting bracket 43, the driving assembly 44 drives the first conveying belt 2 to convey by driving the first driving drum 46 and each first steering roller 48, and drives the second conveying belt 3 to convey by driving the second driving drum 47 and each second steering roller 49.
Because the driving component and the conveyer belt are positioned on different brackets, the driving component can not cause the shaking of the conveyer belt when driving. Therefore, the conveying mechanism is adopted to convey the battery piece to the thickness detection device, so that the detection precision of the thickness detection device can be improved.
As shown in fig. 4, the mounting bracket 43 may optionally include a base 431, a first upright 432, a second upright 433, and a third upright 434, wherein: the first vertical plate 432, the second vertical plate 433 and the third vertical plate 434 are sequentially disposed on the base 431 along the second horizontal direction (e.g., the Y-axis direction in fig. 4), wherein the second vertical plate 433 is provided with a first through hole, and the third vertical plate 434 is provided with a second through hole. The drive assembly 44 is mounted on the first riser 432. The first end of the rotating shaft 45 is connected to the driving end of the driving assembly 44, the second end of the rotating shaft 45 passes through the first through hole and then is connected to the second through hole, and the first driving drum 46 and the second driving drum 47 are located between the second vertical plate 433 and the third vertical plate 434.
By arranging the mounting bracket 43, the mounting bracket 43 provides enough mounting space for the driving assembly 44 and the rotating shaft 45, ensures that the rotating shaft 45 is stably supported on the mounting bracket 43 in a horizontal state, and finally improves the driving stability of the driving assembly 44 to the first conveying belt 2 and the second conveying belt 3.
Optionally, a first rotating bearing is disposed in the first through hole, a second rotating bearing is disposed in the second through hole, and the rotating shaft 35 is connected in the first rotating bearing and the second rotating bearing in a penetrating manner. By the arrangement, the rotating shaft 45 can be ensured to smoothly rotate under the driving of the driving assembly 44, and the rotating shaft 45 is prevented from being blocked in the rotating process.
The drive assembly 44 may employ a drive motor, for example. In order to ensure that the rotating shaft 45 rotates synchronously with the driving end of the driving assembly 44 and eliminate errors possibly generated, the driving stability of the driving assembly 44 is further improved. Optionally, the shaft 45 is coupled to the drive end of the drive assembly 44 via a coupling 410.
In order to make the static friction between the first driving drum 46 and the first conveyor belt 2 large enough to ensure that the first driving drum 46 rotates to drive the first conveyor belt 2 to stably convey, preventing the first conveyor belt 2 from slipping, optionally, the first conveyor belt 2 covers at least 1/4 of the outer circumference of the first driving drum 46, namely: the portion of the first conveyor belt 2 contacting the outer circumference of the first drive drum 46 has a length of at least 1/4 of the outer circumference of the first drive drum 46.
Similarly, in order to make the static friction between the second driving drum 47 and the second conveyor belt 3 sufficiently large, the second driving drum 47 is ensured to rotate to drive the second conveyor belt 3 to stably convey, so that the second conveyor belt 3 is prevented from slipping. Alternatively, the second conveyor belt 3 covers at least 1/4 of the outer circumference of the second drive drum 47, i.e.: the portion of the second conveyor belt 3 contacting the outer circumference of the second drive drum 47 has a length of at least 1/4 of the outer circumference of the second drive drum 47.
As shown in fig. 1, optionally, the conveyor belt bracket 1 includes a first supporting frame 11, a second supporting frame 12, and a bearing bracket 13, where: the first end of the bearing bracket 13 is supported on the first support frame 11, and the first end of the bearing bracket 13 is provided with a first belt wheel 14 and a second belt wheel 15 side by side. The second end of the bearing bracket 13 is supported on the second support bracket 12, and the second end of the bearing bracket 13 is provided with a third belt wheel 16 and a fourth belt wheel 17 side by side. The two ends of the first conveyor belt 2 are respectively sleeved on the first belt pulley 14 and the third belt pulley 16. The two ends of the second conveyer belt 3 are respectively sleeved on the second belt pulley 15 and the fourth belt pulley 17.
Alternatively, the support bracket 13 includes a first pallet 131 and a second pallet 132 disposed side by side and extending in the first horizontal direction, with an installation gap maintained between the first pallet 131 and the second pallet 132. The first pulley 14 and the third pulley 16 are provided at both ends of the first pallet 131, respectively, and the second pulley 15 and the fourth pulley 17 are provided at both ends of the second pallet 132, respectively.
Through carrying out so setting up bearing support 13, can make and keep the installation clearance between first conveyer belt 2 and the second conveyer belt 3, so, the battery piece only both sides edge support is on first conveyer belt 2 and second conveyer belt 3, and battery piece lower surface then can expose first conveyer belt 2 and second conveyer belt 3 to make things convenient for thickness detection device on the delivery path to implement the thickness detection to the battery piece.
The embodiment of the application also provides a silicon wafer detection device, which comprises a detection mechanism and the silicon wafer conveying mechanism provided by any embodiment, wherein:
As shown in fig. 5 and 6, the detecting mechanism includes a frame 5, a first thickness detecting component 6, a second thickness detecting component 7 and a third thickness detecting component 8, wherein a conveying channel 51 for a silicon wafer to pass through is provided on the frame 5, the first thickness detecting component 6 and the second thickness detecting component 7 are slidably connected on the frame 5 and located on a first side of the frame 5, and the third thickness detecting component 8 is connected on the frame 5 and located on a second side opposite to the first side of the frame 5.
The first conveyor belt 2 and the second conveyor belt 3 of the silicon wafer conveying mechanism pass through the conveying channel 51 and are used for conveying the silicon wafer to be detected, so that the silicon wafer passes through the conveying channel 51. The first thickness detection component 6 and the second thickness detection component 7 are respectively used for detecting the thickness of the first side part and the second side part of the silicon wafer, and the third thickness detection component 8 is used for detecting the thickness of the middle part of the silicon wafer.
Therefore, through the cooperation of the silicon wafer conveying mechanism and the detection mechanism, the silicon wafer detection device in the embodiment of the application realizes the thickness detection of the first side part, the second side part and the middle part of the silicon wafer.
With continued reference to fig. 5 and 6, the first thickness detection assembly 6 may optionally include a first laser 61 and a second laser 62 disposed in pairs on the upper and lower sides of the conveyance path 51, and the second thickness detection assembly 7 may include a third laser 71 and a fourth laser 72 disposed in pairs on the upper and lower sides of the conveyance path 51. The third thickness detection assembly 8 includes a fifth laser 81 and a sixth laser 82 provided in pairs on the upper and lower sides of the conveyance path 51.
When the silicon wafer to be inspected passes through the conveying passage 51, the first laser 61 and the second laser 62 synchronously scan the two opposite surfaces of the first side portion of the silicon wafer to be inspected to perform thickness inspection of the first side portion of the silicon wafer to be inspected, the third laser 71 and the fourth laser 72 synchronously scan the two opposite surfaces of the second side portion of the silicon wafer to be inspected to perform thickness inspection of the second side portion of the silicon wafer to be inspected, and the fifth laser 81 and the sixth laser 82 synchronously scan the two opposite surfaces of the middle portion of the silicon wafer to be inspected to perform thickness inspection of the middle portion of the silicon wafer to be inspected.
Optionally, the silicon wafer detecting device in the embodiment of the present application further includes a resistivity detecting component disposed on the frame 5, where the resistivity detecting component detects the resistivity of the silicon wafer when the silicon wafer to be detected passes through the conveying channel. In particular, the farther the resistivity detection assembly is from the drive assembly 44, the less affected, so the resistivity detection assembly can be mounted in the middle of the frame 5; or on the side of the gantry 5 remote from the drive assembly 44 together with a laser.
The application has been described above in sufficient detail with a certain degree of particularity. It will be appreciated by those of ordinary skill in the art that the descriptions of the embodiments are merely exemplary and that all changes that come within the true spirit and scope of the application are desired to be protected. The scope of the application is indicated by the appended claims rather than by the foregoing description of the embodiments.
Claims (10)
1. The utility model provides a silicon chip conveying mechanism, its characterized in that, silicon chip conveying mechanism includes conveyer belt support, first conveyer belt, second conveyer belt and conveyer belt actuating mechanism, wherein:
the first conveying belt and the second conveying belt are sleeved on the conveying belt bracket side by side along the first horizontal direction;
The conveyer belt actuating mechanism includes first connecting plate, second connecting plate, installing support, drive assembly, pivot, first drive drum wheel, second drive drum wheel, a plurality of first steering roller and a plurality of second steering roller, wherein:
The first connecting plate and the second connecting plate are oppositely connected to two sides of the conveyor belt bracket;
The mounting bracket is arranged below the first connecting plate and the second connecting plate, the driving assembly is mounted on the mounting bracket, the rotating shaft is rotatably arranged on the mounting bracket along a second horizontal direction and is connected with the driving end of the driving assembly, and the second horizontal direction is perpendicular to the first horizontal direction;
The first driving drum wheel is fixedly sleeved on the rotating shaft and is close to the first conveying belt, a plurality of first steering roller wheels are arranged on the first connecting plate and distributed on two sides of the first driving drum wheel, and the first conveying belt bypasses the first steering roller wheels and is supported by the first driving drum wheel;
The second driving drum wheel is fixedly sleeved on the rotating shaft and is close to the second conveying belt, a plurality of second steering roller wheels are arranged on the second connecting plate and distributed on two sides of the second driving drum wheel, and the second conveying belt sequentially bypasses the second steering roller wheels and is supported by the second driving drum wheel;
The driving assembly drives the first driving drum wheel and the second driving drum wheel to synchronously rotate through the rotating shaft so as to drive the supported first conveying belt and the supported second conveying belt to synchronously convey.
2. The wafer transport mechanism of claim 1, wherein the mounting bracket comprises a base, a first riser, a second riser, and a third riser, wherein:
The first vertical plate, the second vertical plate and the third vertical plate are sequentially arranged on the base along the second horizontal direction, wherein a first through hole is formed in the second vertical plate, and a second through hole is formed in the third vertical plate;
The driving component is arranged on the first vertical plate;
The first end of the rotating shaft is connected to the driving end of the driving assembly, the second end of the rotating shaft penetrates through the first penetrating hole and then penetrates through the second penetrating hole, and the first driving drum wheel and the second driving drum wheel are located between the second vertical plate and the third vertical plate.
3. The wafer transport mechanism as set forth in claim 2 wherein:
The first through hole is internally provided with a first rotating bearing, the second through hole is internally provided with a second rotating bearing, and the rotating shaft is in through connection with the first rotating bearing and the second rotating bearing.
4. The wafer transport mechanism of claim 1 wherein the shaft is coupled to the drive end of the drive assembly via a coupling.
5. The wafer transport mechanism of claim 1 wherein said first conveyor belt covers at least 1/4 of the outer circumference of said first drive drum and said second conveyor belt covers at least 1/4 of the outer circumference of said second drive drum.
6. The wafer transport mechanism of claim 1, wherein the conveyor support comprises a first support frame, a second support frame, and a support frame, wherein:
The first end of the bearing bracket is supported on the first supporting frame, and a first belt wheel and a second belt wheel are arranged at the first end of the bearing bracket side by side;
the second end of the bearing bracket is supported on the second supporting frame, and a third belt wheel and a fourth belt wheel are arranged at the second end of the bearing bracket side by side;
Two ends of the first conveying belt are respectively sleeved on the first belt wheel and the third belt wheel;
and two ends of the second conveying belt are respectively sleeved on the second belt wheel and the fourth belt wheel.
7. The wafer transport mechanism of claim 6 wherein said support bracket includes a first pallet and a second pallet disposed side-by-side and extending in said first horizontal direction, said first pallet and said second pallet maintaining an installation gap therebetween;
The first belt wheel and the third belt wheel are respectively arranged at two ends of the first supporting plate, and the second belt wheel and the fourth belt wheel are respectively arranged at two ends of the second supporting plate.
8. A silicon wafer inspection apparatus, comprising an inspection mechanism and a silicon wafer transport mechanism according to any one of claims 1-7, wherein:
The detection mechanism comprises a frame, a first thickness detection component, a second thickness detection component and a third thickness detection component, wherein a conveying channel for a silicon wafer to pass through is arranged on the frame, the first thickness detection component and the second thickness detection component are connected to the frame in a sliding manner and are positioned on a first side of the frame, and the third thickness detection component is connected to the frame and is positioned on a second side of the frame opposite to the first side;
The first conveying belt and the second conveying belt of the silicon wafer conveying mechanism penetrate through the conveying channel and are used for conveying the silicon wafers to be detected, so that the silicon wafers pass through the conveying channel, the first thickness detection assembly and the second thickness detection assembly are respectively used for detecting the thickness of the first side part and the second side part of the silicon wafers, and the third thickness detection assembly is used for detecting the thickness of the middle part of the silicon wafers.
9. A silicon wafer inspection apparatus according to claim 8, wherein,
The first thickness detection assembly comprises a first laser and a second laser which are arranged on the upper side and the lower side of the conveying channel in pairs;
The second thickness detection assembly comprises a third laser and a fourth laser which are arranged on the upper side and the lower side of the conveying channel in pairs;
the third thickness detection assembly comprises fifth lasers and sixth lasers which are arranged on the upper side and the lower side of the conveying channel in pairs;
When the silicon wafer to be detected passes through the conveying channel, the first laser and the second laser synchronously scan two opposite surfaces of the first side part of the silicon wafer to be detected to detect the thickness of the first side part of the silicon wafer to be detected, the third laser and the fourth laser synchronously scan two opposite surfaces of the second side part of the silicon wafer to be detected to detect the thickness of the second side part of the silicon wafer to be detected, and the fifth laser and the sixth laser synchronously scan two opposite surfaces of the middle part of the silicon wafer to be detected to detect the thickness of the middle part of the silicon wafer to be detected.
10. The silicon wafer inspection apparatus according to claim 8, further comprising a resistivity inspection assembly disposed on the frame, the resistivity inspection assembly inspecting the resistivity of the silicon wafer as the silicon wafer is being inspected through the transport path.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322684892.9U CN221274205U (en) | 2023-10-08 | 2023-10-08 | Silicon wafer conveying mechanism and silicon wafer detection device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322684892.9U CN221274205U (en) | 2023-10-08 | 2023-10-08 | Silicon wafer conveying mechanism and silicon wafer detection device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN221274205U true CN221274205U (en) | 2024-07-05 |
Family
ID=91692045
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202322684892.9U Active CN221274205U (en) | 2023-10-08 | 2023-10-08 | Silicon wafer conveying mechanism and silicon wafer detection device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN221274205U (en) |
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2023
- 2023-10-08 CN CN202322684892.9U patent/CN221274205U/en active Active
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