CN221264285U - Low-impedance multilayer circuit board - Google Patents
Low-impedance multilayer circuit board Download PDFInfo
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- CN221264285U CN221264285U CN202322693013.9U CN202322693013U CN221264285U CN 221264285 U CN221264285 U CN 221264285U CN 202322693013 U CN202322693013 U CN 202322693013U CN 221264285 U CN221264285 U CN 221264285U
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- circuit board
- assembly frame
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- main body
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- 239000000428 dust Substances 0.000 claims abstract description 35
- 238000003780 insertion Methods 0.000 claims abstract description 6
- 230000037431 insertion Effects 0.000 claims abstract description 6
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 14
- 230000017525 heat dissipation Effects 0.000 claims description 11
- 229910052742 iron Inorganic materials 0.000 claims description 7
- 230000000694 effects Effects 0.000 abstract description 27
- 230000007774 longterm Effects 0.000 abstract description 9
- 238000010586 diagram Methods 0.000 description 5
- 238000009434 installation Methods 0.000 description 4
- 238000005299 abrasion Methods 0.000 description 3
- 230000002349 favourable effect Effects 0.000 description 2
- 238000006467 substitution reaction Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 235000008429 bread Nutrition 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
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- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
The utility model belongs to the field of circuit boards, in particular to a low-impedance multilayer circuit board, which aims at the problems that the accumulated dust not only affects the performance of the circuit board but also reduces the service life of the circuit board after long-term use due to the poor dustproof effect of the device on the circuit board in the prior art, and the utility model provides a scheme comprising a first assembly frame and a second assembly frame; one side of each of the first assembly frame and the second assembly frame is provided with a slot for the insertion of three circuit board main bodies, and three positioning blocks are fixedly arranged in each slot; the dustproof mechanism is arranged on the first assembly frame and the second assembly frame and used for protecting the circuit board main body from dust. When the circuit board is used, the circuit board main body is favorably dustproof, and the phenomenon that a large amount of dust accumulated on the circuit board main body after long-term use can influence the performance of the circuit board main body and reduce the service life effect of the circuit board main body is avoided.
Description
Technical Field
The utility model relates to the technical field of circuit boards, in particular to a low-impedance multilayer circuit board.
Background
The circuit board is also called a circuit board, and mainly comprises a bonding pad, a via hole, a mounting hole, a wire, components and the like, and the circuit board with FPC (flexible printed circuit) characteristics and PCB (printed circuit board) characteristics is formed according to related technological requirements, and the two circuit boards have high wiring density, light weight, thin thickness and good flexibility;
Through retrieval, the patent with the authorized bulletin number of CN211128410U provides a low-impedance multilayer circuit board, which comprises a first circuit board, a second circuit board positioned below the first circuit board and a third circuit board positioned below the second circuit board; the left and right sides of the first circuit board, the second circuit board and the third circuit board are fixedly connected with an upper connecting block, a middle connecting block and a lower connecting block respectively; a sliding rod penetrates through the upper connecting block, the middle connecting block and the lower connecting block, one end of the sliding rod is fixedly connected with the lower connecting block, and the other end of the sliding rod penetrates through the upper connecting block and is in threaded connection with a nut; the two sides of the bottoms of the first circuit board, the second circuit board and the third circuit board are fixedly connected with a fixed cylinder, and rubber blocks are arranged in the fixed cylinder; fixing columns matched with the fixing cylinders are arranged on two sides of the tops of the first circuit board, the second circuit board and the third circuit board, and the tops of the fixing columns are embedded into the fixing cylinders and connected with the rubber blocks; the circuit board can be detached for maintenance and replacement, and the heat dissipation efficiency of the circuit board can be accelerated. The following problems exist in the technical scheme:
In the using process of the circuit board, the heat dissipation of the circuit board can be improved through the arranged heat dissipation plate, and the accumulated dust can influence the performance of the circuit board and reduce the service life of the circuit board after long-term use due to the poor dustproof effect of the device on the circuit board;
In view of the above, the present document proposes a low-impedance multilayer wiring board.
Disclosure of utility model
The utility model provides a low-impedance multilayer circuit board, which solves the defects that in the prior art, the dust accumulated after long-term use can not only influence the performance of the circuit board, but also reduce the service life of the circuit board due to poor dustproof effect of the device on the circuit board.
The utility model provides the following technical scheme:
A low impedance multilayer circuit board comprising:
The circuit board comprises a first assembly frame and a second assembly frame, wherein three circuit board main bodies are arranged between the first assembly frame and the second assembly frame;
One side of each of the first assembly frame and the second assembly frame is provided with a slot for the insertion of three circuit board main bodies, three positioning blocks are fixedly arranged in each slot, positioning grooves for the insertion of the positioning blocks are formed in two sides of each circuit board main body, and rubber pads attached to the outer walls of the positioning blocks are arranged on the inner walls of each positioning groove;
The dustproof mechanism is arranged on the first assembly frame and the second assembly frame and used for protecting the circuit board main body from dust.
In one possible design, the dustproof mechanism includes two side dustproof nets, two mounting grooves for the two side dustproof nets to be inserted are formed in one side of the first assembly frame and one side of the second assembly frame, four mounting grooves are equally divided into two groups, and each group of mounting grooves corresponds to each side dustproof net respectively.
In one possible design, a chute is formed in one side of the second assembly frame, a top dust screen is slidably connected in the chute, an abutting groove for the top dust screen to be inserted is formed in one side of the first assembly frame, two symmetrical magnets are arranged on one side of the inner wall of the abutting groove, and an iron block adsorbed with the magnets is arranged on one side of the top dust screen.
In one possible design, the bottoms of the first assembly frame and the second assembly frame are provided with the same bottom plate, and the top of the bottom plate is fixedly provided with two clamping plates for clamping the first assembly frame and the second assembly frame, and the two clamping plates are fixedly installed with the first assembly frame and the second assembly frame through bolts.
In one possible design, two symmetrical anti-slip pads are fixedly arranged at the bottom of the bottom plate, mounting plates are fixedly arranged at two sides of the bottom plate, and mounting holes are formed in the two mounting plates.
In one possible design, the top of the base plate is provided with a plurality of heat dissipation holes.
When the circuit board main body is required to be mutually combined, the positioning groove formed in the circuit board main body is aligned with the positioning block on the first assembly frame, the circuit board main body is inserted into the slot until the positioning block is completely inserted into the positioning groove, meanwhile, the rubber pad arranged on the inner wall of the positioning groove is attached to the outer wall of the positioning block, so that the clamping degree can be increased, friction between the circuit board main body and the positioning block can be reduced, the abrasion degree is reduced, the next circuit board main body is repeatedly operated to be inserted into the slot, then the second assembly frame is taken out, the second assembly frame is installed on the other side of the circuit board main body, the adjacent two circuit board main bodies are separated, the assembly installation can be completed, the heat dissipation between the circuit board main bodies is favorably improved, the increase of the internal impedance of the circuit board main body caused by overhigh heat is avoided, after the circuit board main body installation is completed, the first assembly frame and the second assembly frame are clamped between the two clamping plates fixed on the bottom plate, the first assembly frame and the second assembly frame can be limited by the two clamping plates, and then the first assembly frame and the second assembly frame can be fixedly connected with the first assembly frame through the fixing bolt;
At this moment, with side dust screen slidable mounting to the mounting groove that first equipment frame and second equipment frame one side were seted up, owing to be provided with both sides dust screen, thereby can enclose circuit board main part side bread, better dustproof effect has been played, reduce the attached of dust, still can not influence the operation of circuit board main part simultaneously and use, then with top dust screen slip run through the spout, and insert into the butt inslot, magnet and iron plate adsorb mutually, be favorable to adsorbing fixedly to top dust screen, improve the fastness, and can also play spacing effect to the side dust screen, thereby be favorable to playing dirt-proof effect to the top of circuit board main part, avoid after long-term use, a large amount of dust of accumulating in the circuit board main part can not only influence the performance of circuit board main part, still can reduce the life of circuit board main part, at last, place suitable position with the device, utilize the mounting nail to run through the mounting hole on the mounting panel, the fixed mounting of the device of being convenient for, the anti-skidding pad of bottom plate bottom not only can play the anti-skidding effect, when still can improve the installation, the whole stability has been strengthened, the whole stability has been improved.
According to the low-impedance multilayer circuit board, the side surface of the circuit board main body can be enclosed by the dustproof mechanism, so that a good dustproof effect is achieved, dust adhesion is reduced, meanwhile, operation and use of the circuit board main body are not affected, then the top dustproof net is slid through the sliding groove and is inserted into the abutting groove, meanwhile, the magnet is adsorbed with the iron block, adsorption and fixation of the top dustproof net are facilitated, firmness is improved, and the side dustproof net can play a limiting role, so that the top of the circuit board main body is favorably prevented from being dustproof, a large amount of dust accumulated on the circuit board main body is prevented from affecting the performance of the circuit board main body after long-term use, and the service life effect of the circuit board main body is also reduced;
According to the low-impedance multilayer circuit board, through the arrangement of the structures such as the positioning blocks, the positioning grooves, the rubber pads and the slots, the circuit board main body can be inserted into the slots until the positioning blocks are completely inserted into the positioning grooves, meanwhile, the rubber pads arranged on the inner walls of the positioning grooves are attached to the outer walls of the positioning blocks, so that not only can the clamping degree be increased, but also the friction between the circuit board main body and the positioning blocks be reduced, the abrasion degree is reduced, the next circuit board main body is inserted into the slots repeatedly, then the second assembly frame is taken out, and is mounted on the other side of the circuit board main body, so that the adjacent two circuit board main bodies are separated, the combined mounting can be completed, the heat dissipation between the circuit board main bodies is improved, and the effect of increasing the internal impedance of the circuit board main body due to overhigh heat is avoided;
according to the utility model, the dustproof mechanism is beneficial to playing a dustproof role on the circuit board main body, so that a large amount of dust accumulated on the circuit board main body can influence the performance of the circuit board main body after long-term use, and the service life effect of the circuit board main body can be reduced.
Drawings
Fig. 1 is a schematic diagram of a front view structure of a low-impedance multilayer circuit board according to an embodiment of the present utility model;
Fig. 2 is a schematic diagram of a structure of a low-impedance multi-layer circuit board with a top dust-proof net in an open state according to an embodiment of the present utility model;
FIG. 3 is a second schematic diagram of an open state of a top dust-proof screen of a low-impedance multi-layer circuit board according to an embodiment of the present utility model;
Fig. 4 is a schematic diagram of a split structure of a bottom board of a low-impedance multilayer circuit board according to an embodiment of the present utility model;
Fig. 5 is a schematic diagram of a split structure of a circuit board body of a low-impedance multilayer circuit board according to an embodiment of the present utility model.
Reference numerals:
1. a first assembly rack; 2. a second assembly rack; 3. a circuit board main body; 4. a mounting groove; 5. a side dust screen; 6. an abutment groove; 7. a chute; 8. a top dust screen; 9. a magnet; 10. iron blocks; 11. a slot; 12. a positioning block; 13. a positioning groove; 14. a rubber pad; 15. a bottom plate; 16. a clamping plate; 17. a bolt; 18. a mounting plate; 19. a heat radiation hole; 20. an anti-slip mat.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments.
Example 1
Referring to fig. 1-5, a low-impedance multilayer circuit board is applied in the field of circuit boards, and includes:
The first assembly frame 1 and the second assembly frame 2, three circuit board main bodies 3 are arranged between the first assembly frame 1 and the second assembly frame 2;
One side of the first assembling frame 1 and one side of the second assembling frame 2 are respectively provided with a slot 11 for the insertion of the three circuit board main bodies 3, three positioning blocks 12 are fixedly arranged in each slot 11, positioning grooves 13 for the insertion of the positioning blocks 12 are respectively formed in two sides of the circuit board main bodies 3, and rubber pads 14 attached to the outer walls of the positioning blocks 12 are respectively arranged on the inner walls of each positioning groove 13;
The dustproof mechanism is arranged on the first assembly frame 1 and the second assembly frame 2 and is used for protecting the circuit board main body 3 from dust.
The technical scheme can achieve the effect that the circuit board main body 3 is inserted into the slot 11 until the positioning block 12 is completely inserted into the positioning groove 13, meanwhile, the rubber pad 14 arranged on the inner wall of the positioning groove 13 is attached to the outer wall of the positioning block 12, so that the clamping degree can be increased, friction between the circuit board main body 3 and the positioning block 12 can be reduced, the abrasion degree is reduced, the circuit board main body 3 is favorably dustproof through the dustproof mechanism, a large amount of dust accumulated on the circuit board main body 3 is prevented from affecting the performance of the circuit board main body 3 after long-term use, and the service life technical effect of the circuit board main body 3 is reduced.
Referring to fig. 1-3, the dustproof mechanism includes two side dustproof nets 5, two mounting slots 4 for inserting the two side dustproof nets 5 are formed on one sides of the first assembling frame 1 and the second assembling frame 2, the four mounting slots 4 are divided into two groups, and each group of mounting slots 4 corresponds to each side dustproof net 5.
The technical scheme can achieve the effect that the side dustproof net 5 is slidably mounted in the mounting groove 4 formed in one side of the first assembly frame 1 and one side of the second assembly frame 2, and the two side dustproof nets 5 are arranged, so that the side of the circuit board main body 3 is enclosed, a good dustproof effect is achieved, dust adhesion is reduced, and meanwhile, the operation and use technical effect of the circuit board main body 3 is not affected.
Referring to fig. 1-3, a sliding chute 7 is provided on one side of the second assembly frame 2, a top dust screen 8 is slidably connected in the sliding chute 7, an abutting groove 6 for inserting the top dust screen 8 is provided on one side of the first assembly frame 1, two symmetrical magnets 9 are provided on one side of the inner wall of the abutting groove 6, and an iron block 10 adsorbed to the magnets 9 is provided on one side of the top dust screen 8.
The technical scheme can achieve the effect that the top dust screen 8 is slid to penetrate through the sliding groove 7 and is inserted into the butt groove 6, meanwhile, the magnet 9 is adsorbed with the iron block 10, the top dust screen 8 is adsorbed and fixed, the firmness is improved, the opposite side dust screen 5 can also play a limiting role, the top of the circuit board main body 3 is further facilitated to play a dustproof role, a large amount of dust accumulated on the circuit board main body 3 is prevented from affecting the performance of the circuit board main body 3 after long-term use, and the service life technical effect of the circuit board main body 3 is reduced.
Example 2
On the basis of the first embodiment, the second embodiment further includes:
referring to fig. 4 and 5, the bottom of the first assembly frame 1 and the second assembly frame 2 is provided with a bottom plate 15, two clamping plates 16 for clamping the first assembly frame 1 and the second assembly frame 2 are fixedly arranged on the top of the bottom plate 15, and the two clamping plates 16 are fixedly arranged between the first assembly frame 1 and the second assembly frame 2 through bolts 17.
The technical scheme can achieve the effect of limiting the space between the first assembly frame 1 and the second assembly frame 2 by using the two clamping plates 16 by clamping the first assembly frame 1 and the second assembly frame 2 between the two clamping plates 16 fixed on the bottom plate 15, and then the clamping plates 16 are respectively connected and fixed with the first assembly frame 1 and the second assembly frame 2 through bolts 17, so that the fixing limit of the first assembly frame 1 and the second assembly frame 2 can be enhanced, and the technical effect of the installation stability of the circuit board main body 3 is improved.
Referring to fig. 4, two symmetrical anti-slip pads 20 are fixedly arranged at the bottom of the bottom plate 15, mounting plates 18 are fixedly arranged at two sides of the bottom plate 15, and mounting holes are formed in the two mounting plates 18.
The above-mentioned technical scheme can reach the mounting hole that utilizes the mounting nail to run through on the mounting panel 18, the fixed mounting of the device of being convenient for, and the non-slip mat 20 of bottom plate 15 bottom not only can play the skid-proof effect simultaneously, can also improve the firm effect when installing, has strengthened stability technological effect.
Referring to fig. 4, a plurality of heat dissipation holes 19 are formed on the top of the bottom plate 15.
The technical scheme can achieve the technical effects that the circuit board main body 3 can achieve a good heat dissipation effect through the plurality of heat dissipation holes 19, the heat dissipation efficiency of the circuit board main body 3 is further improved, and the using effect of the circuit board main body 3 is guaranteed.
The present utility model is not limited to the above embodiments, and any person skilled in the art can easily think about the changes or substitutions within the technical scope of the present utility model, and the changes or substitutions are intended to be covered by the scope of the present utility model; embodiments of the utility model and features of the embodiments may be combined with each other without conflict. Therefore, the protection scope of the utility model is subject to the protection scope of the claims.
Claims (6)
1. A low impedance multilayer wiring board, comprising:
The circuit board comprises a first assembly frame (1) and a second assembly frame (2), wherein three circuit board main bodies (3) are arranged between the first assembly frame (1) and the second assembly frame (2);
One side of the first assembly frame (1) and one side of the second assembly frame (2) are respectively provided with a slot (11) for inserting three circuit board main bodies (3), three positioning blocks (12) are fixedly arranged in each slot (11), positioning grooves (13) for inserting the positioning blocks (12) are respectively formed in two sides of the circuit board main bodies (3), and rubber pads (14) attached to the outer walls of the positioning blocks (12) are respectively arranged on the inner walls of each positioning groove (13);
The dustproof mechanism is arranged on the first assembly frame (1) and the second assembly frame (2) and is used for protecting the circuit board main body (3) from dust.
2. The low-impedance multilayer circuit board according to claim 1, wherein the dustproof mechanism comprises two side dustproof nets (5), two mounting grooves (4) for inserting the two side dustproof nets (5) are formed in one side of the first assembly frame (1) and one side of the second assembly frame (2), the four mounting grooves (4) are equally divided into two groups, and each group of the mounting grooves (4) corresponds to each side dustproof net (5).
3. The low-impedance multilayer circuit board according to claim 2, characterized in that a chute (7) is provided on one side of the second assembly frame (2), a top dust screen (8) is slidably connected in the chute (7), an abutting groove (6) for the insertion of the top dust screen (8) is provided on one side of the first assembly frame (1), two symmetrical magnets (9) are provided on one side of the inner wall of the abutting groove (6), and an iron block (10) adsorbed with the magnets (9) is provided on one side of the top dust screen (8).
4. The low-impedance multilayer circuit board according to claim 1, wherein the bottoms of the first assembly frame (1) and the second assembly frame (2) are provided with the same bottom plate (15), two clamping plates (16) for clamping the first assembly frame (1) and the second assembly frame (2) are fixedly arranged at the top of the bottom plate (15), and the two clamping plates (16) are fixedly arranged between the first assembly frame (1) and the second assembly frame (2) through bolts (17).
5. The low-impedance multilayer circuit board according to claim 4, wherein two symmetrical anti-slip pads (20) are fixedly arranged at the bottom of the bottom plate (15), mounting plates (18) are fixedly arranged at two sides of the bottom plate (15), and mounting holes are formed in the two mounting plates (18).
6. The low-impedance multilayer circuit board according to claim 5, wherein the top of the base plate (15) is provided with a plurality of heat dissipation holes (19).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322693013.9U CN221264285U (en) | 2023-10-09 | 2023-10-09 | Low-impedance multilayer circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322693013.9U CN221264285U (en) | 2023-10-09 | 2023-10-09 | Low-impedance multilayer circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN221264285U true CN221264285U (en) | 2024-07-02 |
Family
ID=91628847
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202322693013.9U Active CN221264285U (en) | 2023-10-09 | 2023-10-09 | Low-impedance multilayer circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN221264285U (en) |
-
2023
- 2023-10-09 CN CN202322693013.9U patent/CN221264285U/en active Active
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