CN221240535U - Radiating mechanism of plasma spray gun - Google Patents

Abstract

The application relates to the technical field of spray guns, in particular to a heat dissipation mechanism of a plasma spray gun, which comprises a spray pipe capable of spraying plasma jet. The heat radiation mechanism of the plasma spray gun comprises a heat pipe, heat radiation fins and a fan, wherein the heat is transferred to the heat radiation fins through the heat pipe to be dispersed when the spray pipe works, meanwhile, forced air convection is adopted by the design of the double fans, and heat exchange is continuously carried out with the heat radiation fins through flowing air, so that the heat on the heat pipe is rapidly dissipated, and the situation of heat accumulation is avoided.

Description

Radiating mechanism of plasma spray gun

Technical Field

The application relates to the technical field of spray guns, in particular to a heat dissipation mechanism of a plasma spray gun.

Background

The industrial process of China is rapid, the production amount of dangerous waste is increased gradually, the present harmless treatment of dangerous waste is mainly incineration and safe landfill, the traditional treatment mode has more defects, the safe landfill can produce soil and groundwater pollution, the process of preparing alternative fuel and alternative raw materials by using the dangerous waste is limited by conversion rate, product quality requirement and process pollution control requirement, a large amount of secondary dangerous waste can be produced, the plasma treatment method can convert organic matters in the dangerous waste into combustible gas, the method can be used for direct power generation and waste heat power generation after combustion, hydrogen can be produced after purification and separation, and gas chemical products can be produced by using the combustible gas;

The arc plasma treatment technology utilizes plasma jet pyrolysis and cracking high-risk wastes, the temperature of the plasma jet can reach 3000-20000 ℃, so that the highest temperature of the plasma spray gun has significance for application, in order to improve the highest temperature of the plasma spray gun, the cooperation of a heat dissipation mechanism is often needed, such as a plasma spray gun with the publication number of CN219227905U, and the cooling liquid filled in the cooling cavity can absorb heat generated by plasma and in the spraying process of the spray gun through the cooling part, so that higher temperature is avoided;

However, the spray gun adopts heat conduction oil as a heat conduction medium, so that the heat conduction oil has low heat conductivity, is easy to generate heat accumulation phenomenon, and the heat required to be dissipated comprises the heat of the heat conduction oil and the heat of the semiconductor refrigerating sheet, so that the heat dissipation efficiency is low;

to this end, we propose a new heat dissipation mechanism for plasma torch to solve the above-mentioned problems.

Disclosure of utility model

Accordingly, the present application is directed to a heat dissipation mechanism of a plasma torch, which reduces heat accumulation and improves heat dissipation efficiency.

In order to achieve the above object, the present application provides a heat dissipation mechanism of a plasma torch, comprising a nozzle capable of ejecting a plasma jet:

a heat pipe disposed around the nozzle;

The cover body is arranged at the outer side of the spray pipe, and an air channel with a rectangular section is formed at one side of the cover body, which is opposite to the condensation end of the heat pipe;

The fan is arranged on the air duct of the cover body, and the air outlet of the fan is opposite to the heat pipe;

the heat radiation fins are arranged on the outer surface of the condensing end of the heat pipe;

The water tank is arranged at the end part of the cover body;

The cooling pipe, the cooling pipe sets up in the one end of water tank, the condensation end surface setting of cooling pipe laminating heat pipe.

Preferably, the outer surface of the evaporation section of the heat pipe is arranged at the nozzle of the attaching spray pipe, and the heat pipe is annularly arranged at the central axis of the spray pipe.

Preferably, the heat dissipation fins are arranged in parallel outside the condensing end of the heat pipe, and the heat dissipation fins are arranged in parallel with the air outlet direction of the fan.

Preferably, a water pump is fixedly arranged in the water tank, and a water outlet of the water pump is opposite to the cooling pipe.

Preferably, a water outlet pipe is arranged at one side of the water pump, and the water outlet pipe is embedded and arranged in the cooling pipe.

Preferably, one side wall of the water tank is overlapped with the side wall of the air duct of the cover body, and a semiconductor refrigerating sheet is embedded into one side of the water tank facing the cover body;

And the heat end of the semiconductor refrigerating sheet is attached with a heat dissipation block, and the heat dissipation block is positioned in the air duct of the cover body.

Preferably, the semiconductor refrigeration piece is annular, and the cooling pipe and the semiconductor refrigeration piece are coaxially arranged.

Preferably, the end part of the cooling pipe is provided with a through hole, and the condensation end of the heat pipe is embedded in the through hole at the end part of the cooling pipe.

Compared with the prior art, the application has the beneficial effects that:

1. the heat radiation mechanism of the plasma spray gun comprises a heat pipe, heat radiation fins and a fan, wherein the heat is transferred to the heat radiation fins through the heat pipe to be dispersed when the spray pipe works, meanwhile, forced air convection is adopted by the design of the double fans, and heat exchange is continuously carried out with the heat radiation fins through flowing air, so that the heat on the heat pipe is rapidly dissipated, and the situation of heat accumulation is avoided.

2. And secondly, the cooling system formed by the water tank, the water pump, the water outlet pipe, the semiconductor refrigerating sheet, the cooling block and the cooling pipe is arranged in the cooling mechanism of the plasma spray gun, so that the pipe wall part of the cooling pipe is ensured to be at a lower temperature, and meanwhile, the condensing section of the heat pipe is wrapped in the cooling pipe, so that the heat radiation efficiency of the heat pipe is maintained in a higher section.

3. And secondly, the heat radiation mechanism of the plasma spray gun is provided with the semiconductor refrigerating sheet and the heat radiation block which are positioned in the fan heat radiation air channel, the temperature of the hot end of the semiconductor refrigerating sheet is dispersed into the air through the heat radiation block, and the heat radiation block positioned in the air channel can rapidly radiate heat by means of flowing air, so that the lower temperature level of the cold end of the semiconductor refrigerating sheet is maintained, and the whole system is in a high-efficiency stable cooling state.

Drawings

The accompanying drawings, which are incorporated herein and form a part of the specification, illustrate embodiments of the present disclosure and, together with the description, further serve to explain the principles of the disclosure and to enable a person skilled in the pertinent art to make and use the disclosure.

FIG. 1 is a schematic diagram of the overall structure of the present application;

fig. 2 is a schematic diagram of a heat sink fin structure according to the present application;

FIG. 3 is a schematic view of the structure of the water tank in the present application;

FIG. 4 is a schematic view of a heat pipe structure in the present application;

FIG. 5 is a schematic cross-sectional view of the water tank according to the present application;

FIG. 6 is a schematic cross-sectional view of a cooling tube according to the present application;

FIG. 7 is a schematic view of a heat dissipating block according to the present application

In the figure: nozzle 1, heat pipe 2, cover 3, fan 4, fin 5, water tank 6, water pump 601, outlet pipe 602, semiconductor refrigeration piece 603, heat dissipation piece 604, cooling tube 7.

While particular structures and devices are shown in the drawings to enable a clear implementation of embodiments of the application, this is for illustrative purposes only and is not intended to limit the application to the particular structures, devices and environments, which may be modified or adapted by those of ordinary skill in the art, as desired, and which remain within the scope of the appended claims.

Detailed Description

The following describes a heat dissipation mechanism of a plasma torch in detail with reference to the accompanying drawings and specific embodiments. While the application has been described herein in terms of the preferred and preferred embodiments, the following embodiments are intended to be more illustrative, and may be implemented in many alternative ways as will occur to those of skill in the art; and the accompanying drawings are only for the purpose of describing the embodiments more specifically and are not intended to limit the application specifically.

It should be noted that references in the specification to "one embodiment," "an example embodiment," "some embodiments," etc., indicate that the embodiment described may include a particular feature, structure, or characteristic, but every embodiment may not necessarily include the particular feature, structure, or characteristic. Further, when a particular feature, structure, or characteristic is described in connection with an embodiment, it is submitted that it is within the knowledge of one skilled in the relevant art to effect such feature, structure, or characteristic in connection with other embodiments whether or not explicitly described.

Generally, the terminology may be understood, at least in part, from the use of context. For example, the term "one or more" as used herein may be used to describe any feature, structure, or characteristic in a singular sense, or may be used to describe a combination of features, structures, or characteristics in a plural sense, depending at least in part on the context. In addition, the term "based on" may be understood as not necessarily intended to convey an exclusive set of factors, but may instead, depending at least in part on the context, allow for other factors that are not necessarily explicitly described.

It will be understood that the meanings of "on … …", "on … …" and "over … …" in this disclosure should be interpreted in the broadest sense so that "on … …" means not only "directly on" something but also includes the meaning of "on" something with intervening features or layers therebetween, and "on … …" or "over … …" means not only "on" or "over" something, but also may include its meaning of "on" or "over" something without intervening features or layers therebetween.

Furthermore, spatially relative terms such as "under …," "under …," "lower," "above …," "upper," and the like may be used herein for ease of description to describe one element or feature's relationship to another element or feature as illustrated in the figures. Spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. The device may be otherwise oriented and the spatially relative descriptors used herein may similarly be interpreted accordingly.

As shown in fig. 1, 2 and 3, an embodiment of the present application provides a heat dissipation mechanism of a plasma torch, which includes a nozzle 1 capable of ejecting a plasma jet;

A heat pipe 2, the heat pipe 2 being arranged around the nozzle 1;

The cover body 3 is arranged at the outer side of the spray pipe 1, and one side of the cover body 3, which is opposite to the condensation end of the heat pipe 2, is provided with an air channel with a rectangular section;

The fan 4 is arranged on the air duct of the cover body 3, and the air outlet of the fan 4 is opposite to the heat pipe 2;

the radiating fins 5 are arranged on the outer surface of the condensing end of the heat pipe 2;

A water tank 6, the water tank 6 being provided at an end of the cover 3;

The cooling pipe 7 is arranged at one end of the water tank 6, and the cooling pipe 7 is attached to the outer surface of the condensing end of the heat pipe 2;

The bottom of the spray pipe 1 is connected with two feeding pipes, when the spray pipe 1 works, heat of the spray pipe is mainly generated by the spray pipe, the heat pipe 2 attached to the outer side wall of the spray pipe 1 has good heat conductivity, heat can be rapidly transferred to the radiating fins 5 to be dispersed, then forced air convection is carried out by the fan 4, and heat exchange is continuously carried out between flowing air and the radiating fins 5, so that the heat on the heat pipe 2 is rapidly dispersed, and the situation of heat accumulation is avoided;

The cooling pipe 7 arranged at the condensing section of the heat pipe 2 is filled with cooling liquid in the water tank 6, the cooling pipe 7 is attached to the end part of the heat pipe 2, and in the operation process, the cooling pipe 7 exchanges heat with the heat pipe 2 to maintain the lower temperature of the condensing section of the heat pipe 2, thereby being beneficial to medium condensation in the heat pipe 2 and ensuring that the heat pipe 2 maintains good working efficiency.

As shown in fig. 4, the outer surface of the evaporation section of the heat pipe 2 is arranged on the nozzle of the bonding spray pipe 1, and the heat pipe 2 is annularly arranged on the central axis of the spray pipe 1;

The heat pipe 2 evaporation zone laminating spout setting can be fast with heat conduction to heat radiation fins 5 to heat on the quick reduction spray tube 1, and heat pipe 2 adopts annular array mode to cover spray tube 1 lateral wall, with the heat on the even distribution spray tube 1, avoids the heat to pile up.

As shown in fig. 4, the heat dissipation fins 5 are arranged in parallel outside the condensation end of the heat pipe 2, and the heat dissipation fins 5 are arranged in parallel with the air outlet direction of the fan 4;

The heat dissipation fins 5 are arranged in parallel with the wind direction of the fan 4, so that smooth flow of air flow can be guaranteed, the speed of air convection is guaranteed, heat on the heat pipe 2 is rapidly dispersed through the heat dissipation fins 5, and the heat dissipation efficiency is guaranteed by fully utilizing air.

As shown in fig. 5, a water pump 601 is fixedly arranged in the water tank 6, and a water outlet of the water pump 601 is arranged opposite to the cooling pipe 7;

The water tank 6 is filled with cooling liquid, the cooling liquid is pumped into the cooling pipe 7 through the water pump 601, the pipe diameter of the cooling pipe 7 is one time of the pipe diameter of the water outlet of the water pump 601, water flow sprayed by the water pump 601 can continuously impact the cooling pipe 7, circulation is generated, the cooling pipe 7 is conveniently maintained at a lower temperature, and the partial condensation efficiency of the condensation section of the heat pipe 2 is guaranteed.

As shown in fig. 6, a water outlet pipe 602 is installed at one side of the water pump 601, and the water outlet pipe 602 is embedded and arranged in the cooling pipe 7;

The outlet pipe 602 is embedded into the cooling pipe 7, the pipe diameter of the outlet pipe 602 is smaller than that of the cooling pipe 7, the outlet pipe 602 and the cooling pipe 7 are coaxially arranged, low-temperature cooling liquid is sprayed out of the outlet pipe 602 in the cooling liquid circulation process, and the low-temperature cooling liquid flows along the inner wall of the cooling pipe 7 in the flowing process so as to ensure that the pipe wall part of the cooling pipe 7 is at a lower temperature, and further ensure the cooling effect of the cooling pipe 7 on the heat pipe 2.

As shown in fig. 4, 5 and 6, one side wall of the water tank 6 is overlapped with the side wall of the air duct of the cover body 3, and a semiconductor refrigerating sheet 603 is embedded in one side of the water tank 6 facing the cover body 3;

the heat end of the semiconductor refrigerating sheet 603 is attached with a heat dissipation block 604, and the heat dissipation block 604 is positioned in the air channel of the cover body 3;

The semiconductor refrigerating piece 603 at one side of the water tank 6 is used for cooling the cooling liquid in the water tank 6 so as to ensure that the whole temperature of the cooling liquid is controllable, the temperature of the hot end of the semiconductor refrigerating piece 603 is dispersed into the air through the radiating block 604, and the radiating block 604 positioned in the air duct can rapidly radiate heat by means of flowing air, so that the cold end of the semiconductor refrigerating piece 603 is ensured to be at a lower temperature level;

The design of the double fans 4 is adopted, most of heat on the heat pipe 2 is dissipated through heat exchange between the heat dissipation fins 5 and air, so that the cooling pipe 7 is at a lower temperature, further, the influence of heat accumulation on the semiconductor refrigerating sheet 603 on refrigerating efficiency is avoided, the overall heat dissipation efficiency of the device is improved, and the consumption of electric power is reduced.

As shown in fig. 5, 6 and 7, the semiconductor cooling plate 603 is annular, and the cooling tube 7 is coaxially arranged with the semiconductor cooling plate 603;

The semiconductor refrigerating piece 603 is annular, so that the hot end is prevented from being contacted with the cooling pipe 7, and meanwhile, the cold end of the semiconductor refrigerating piece 603 is close to the water outlet direction of the cooling pipe 7, so that cooling liquid is facilitated to be cooled.

As shown in fig. 5 and 7, the end of the cooling tube 7 is provided with a through hole, and the condensation end of the heat pipe 2 is embedded in the through hole at the end of the cooling tube 7;

The design of clamping the cooling pipe 7 and the heat pipe 2 makes full use of the outer surface area of the condensation section of the heat pipe 2, the condensation section of the heat pipe 2 is wrapped in the cooling pipe 7, the combination is tight, the heat exchange area is large, and the heat dissipation efficiency is high;

The cooling pipe 7 is made of a material with high heat conductivity coefficient, and has good heat conduction efficiency.

According to the technical scheme provided by the application, when the spray pipe 1 works, heat is transferred to the radiating fins 5 through the heat pipe 2 to be dispersed, meanwhile, forced air convection is carried out by the fan 4, and the flowing air is continuously subjected to heat exchange with the radiating fins 5, so that the heat on the heat pipe 2 is rapidly dispersed, and the situation of heat accumulation is avoided;

The water tank 6 is filled with cooling liquid, the cooling liquid is pumped into the cooling pipe 7 through the water pump 601, low-temperature cooling liquid is sprayed out of the water outlet pipe 602 in the cooling liquid circulation process, and the low-temperature cooling liquid flows along the inner wall of the cooling pipe 7 in the flowing process so as to ensure that the pipe wall part of the cooling pipe 7 is at a lower temperature;

The condensation section of the heat pipe 2 is wrapped in the cooling pipe 7, so that the cooling effect of the cooling pipe 7 on the heat pipe 2 is guaranteed, meanwhile, the semiconductor refrigerating piece 603 on one side of the water tank 6 continuously cools the cooling liquid in the water tank 6 when in operation, the temperature of the hot end of the semiconductor refrigerating piece 603 is dispersed into the air through the heat dissipation block 604, and the heat dissipation block 604 positioned in the air flue can rapidly dissipate heat by means of flowing air, so that the lower temperature level of the cold end of the semiconductor refrigerating piece 603 is maintained.

The application is intended to cover any alternatives, modifications, equivalents, and variations that fall within the spirit and scope of the application. In the following description of preferred embodiments of the application, specific details are set forth in order to provide a thorough understanding of the application, and the application will be fully understood to those skilled in the art without such details. In other instances, well-known methods, procedures, flows, components, circuits, and the like have not been described in detail so as not to unnecessarily obscure aspects of the present application.

Those of ordinary skill in the art will appreciate that all or a portion of the steps in implementing the methods of the embodiments described above may be implemented by a program that instructs associated hardware, and the program may be stored on a computer readable storage medium, such as: ROM/RAM, magnetic disks, optical disks, etc.

The foregoing is merely a preferred embodiment of the present application and it should be noted that modifications and adaptations to those skilled in the art may be made without departing from the principles of the present application, which are intended to be comprehended within the scope of the present application.

Claims (8)

1. A heat dissipation mechanism of a plasma torch, comprising a nozzle (1) capable of ejecting a plasma jet, characterized in that:

A heat pipe (2), wherein the heat pipe (2) is arranged around the spray pipe (1);

The cover body (3), the said cover body (3) is installed in the outside of spray tube (1), the said cover body (3) is faced to one side of condensation end of the heat pipe (2) and offered the air channel with rectangular section;

The fan (4) is arranged on the air duct of the cover body (3), and an air outlet of the fan (4) is opposite to the heat pipe (2);

The heat radiation fins (5) are arranged on the outer surface of the condensing end of the heat pipe (2);

The water tank (6) is arranged at the end part of the cover body (3);

The cooling pipe (7), cooling pipe (7) set up in the one end of water tank (6), cooling pipe (7) laminating condensation end surface setting of heat pipe (2).

2. A heat dissipation mechanism for a plasma torch as defined in claim 1, wherein: the outer surface of the evaporation section of the heat pipe (2) is arranged at the nozzle of the attaching spray pipe (1), and the heat pipe (2) is annularly arranged at the central axis of the spray pipe (1).

3. A heat dissipation mechanism for a plasma torch as defined in claim 1, wherein: the heat radiation fins (5) are arranged in parallel on the outer side of the condensing end of the heat pipe (2), and the heat radiation fins (5) are arranged in parallel with the air outlet direction of the fan (4).

4. A heat dissipation mechanism for a plasma torch as defined in claim 1, wherein: the inside of the water tank (6) is fixedly provided with a water pump (601), and a water outlet of the water pump (601) is opposite to the cooling pipe (7).

5. The heat dissipation mechanism of a plasma torch according to claim 4, wherein: a water outlet pipe (602) is arranged on one side of the water pump (601), and the water outlet pipe (602) is embedded and arranged in the cooling pipe (7).

6. The heat dissipation mechanism of a plasma torch according to claim 4, wherein: a side wall of the water tank (6) is overlapped with the side wall of the air duct of the cover body (3), and a semiconductor refrigerating sheet (603) is embedded into one side of the water tank (6) facing the cover body (3);

And a heat dissipation block (604) is attached to the hot end of the semiconductor refrigerating sheet (603), and the heat dissipation block (604) is positioned in the air duct of the cover body (3).

7. The heat dissipation mechanism of a plasma torch according to claim 6, wherein: the semiconductor refrigerating piece (603) is annular, and the cooling pipe (7) and the semiconductor refrigerating piece (603) are coaxially arranged.

8. The heat dissipation mechanism of a plasma torch according to claim 7, wherein: the end part of the cooling pipe (7) is provided with a through hole, and the condensation end of the heat pipe (2) is embedded into the through hole at the end part of the cooling pipe (7).