CN221197349U - LED lamp decoration heat radiation structure - Google Patents
LED lamp decoration heat radiation structure Download PDFInfo
- Publication number
- CN221197349U CN221197349U CN202322972347.XU CN202322972347U CN221197349U CN 221197349 U CN221197349 U CN 221197349U CN 202322972347 U CN202322972347 U CN 202322972347U CN 221197349 U CN221197349 U CN 221197349U
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- China
- Prior art keywords
- heat dissipation
- led lamp
- base
- lamp body
- fixedly connected
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- 238000005034 decoration Methods 0.000 title claims abstract description 10
- 230000005855 radiation Effects 0.000 title claims description 9
- 230000017525 heat dissipation Effects 0.000 claims abstract description 51
- 239000007788 liquid Substances 0.000 claims abstract description 14
- 239000000758 substrate Substances 0.000 claims abstract description 9
- 239000011521 glass Substances 0.000 claims abstract description 5
- 239000004065 semiconductor Substances 0.000 abstract description 7
- 239000000110 cooling liquid Substances 0.000 abstract description 2
- 230000002035 prolonged effect Effects 0.000 abstract description 2
- 239000000463 material Substances 0.000 description 3
- 239000011550 stock solution Substances 0.000 description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 239000000084 colloidal system Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000002826 coolant Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 238000009423 ventilation Methods 0.000 description 1
Landscapes
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
Abstract
The utility model discloses an LED lamp decoration heat dissipation structure, which comprises an LED lamp body, wherein glass is arranged on the outer side of the LED lamp body, a support frame is connected with the side edge of the LED lamp body through threads, bolts are arranged on the support frame, the number of the bolts is two, and the two bolts are axially symmetrically distributed on the side edge of the support frame; and the heat dissipation device is fixedly connected to the top of the base. According to the LED lamp, the heat radiating device and the fan are arranged, the fan is started, wind formed by rotation of the fan blows to the liquid storage tube, and because the cooling liquid is arranged in the liquid storage tube, part of wind is emitted inside the heat radiating hollow tube after the wind blown to the liquid storage tube is cooled, part of wind can cool the luminous tube, and the other part of wind is blown to the base along the heat radiating fins, so that the temperature inside the base is emitted from the heat radiating holes along the heat radiating substrate, and the temperature of the semiconductor wafer is reduced, so that the service life of the LED lamp is prolonged.
Description
Technical Field
The utility model relates to the technical field of lamps, in particular to a heat dissipation structure of an LED lamp.
Background
The LED lamp is an electroluminescent semiconductor material chip, is solidified on the bracket by silver colloid or white colloid, then is connected with the chip and the circuit board by silver wires or gold wires, and the periphery of the LED lamp is sealed by epoxy resin to protect the internal core wires, and finally is provided with the shell, so that the LED lamp has good anti-seismic performance.
The LED is a solid semiconductor device capable of converting electric energy into visible light, the electric energy can be directly converted into light, the heart of the LED is a semiconductor wafer, the heat-resistant effect of the semiconductor wafer is very poor, so that a good heat dissipation structure is required when the LED lamp is manufactured, the service life of the LED lamp is ensured, the heat dissipation structure of the LED lamp on the market at present generally controls junction temperature through a heat conducting medium and a radiator, the lower the luminous flux is, the poorer the service effect of the LED lamp is, the junction temperature cannot be controlled at a lower temperature by the heat conducting medium and the radiator, and the service life of the LED lamp is greatly reduced, so that the heat dissipation device is required to be additionally arranged for heat dissipation.
Disclosure of utility model
The utility model discloses a radiating structure of an LED lamp decoration, which aims to solve the problems in the background technology.
In order to solve the technical problems, the utility model adopts a technical scheme that: an LED lamp decoration heat radiation structure, an LED lamp decoration heat radiation structure includes
The LED lamp comprises an LED lamp body, wherein glass is arranged on the outer side of the LED lamp body, a support frame is connected with the side edge of the LED lamp body through threads, bolts are arranged on the support frame, the number of the bolts is two, and the two bolts are axially symmetrically distributed on the side edge of the support frame;
and the heat dissipation device is fixedly connected to the top of the base.
Preferably, the back of the LED lamp body is provided with a plurality of radiating holes, the radiating holes are distributed on the back of the LED lamp body in a linear array, the back of the LED lamp body is provided with a plurality of radiating fins, and the radiating fins are distributed on the side edges of the radiating holes.
Preferably, the bottom of the inner side of the LED lamp body is provided with a heat dissipation substrate, the top of the heat dissipation substrate is provided with two bases, and the two bases are axisymmetrically distributed at the top of the heat dissipation substrate.
Preferably, the top of base is provided with the protection casing, and the top fixedly connected with bracing piece of base, the top fixedly connected with base of bracing piece, the top of base are provided with a plurality of luminotrons, and a plurality of luminotrons are the annular and distribute at the top of base.
Preferably, the top of base is provided with the heat dissipation hollow tube, and the surface of heat dissipation hollow tube is provided with a plurality of bleeder vents, and the top of heat dissipation hollow tube is provided with the heat dissipation apron, and the bottom of heat dissipation apron is provided with the fan.
Preferably, the heat dissipating device comprises a vertical rod fixedly connected to the top of the base, the vertical rod is arranged inside the heat dissipating hollow tube, the top of the vertical rod is fixedly connected with a heat dissipating fin, a plurality of liquid storage tubes are arranged at the top of the heat dissipating fin, and the liquid storage tubes are annularly distributed at the top of the heat dissipating fin.
The beneficial effects of the utility model are as follows: through the setting of heat abstractor and fan, open the fan, the fan rotates the wind that forms and blows to the stock solution pipe, because of the inside coolant liquid that is provided with of stock solution pipe, so blow to the inside giving off of heat dissipation cavity pipe after the air cooling of stock solution pipe, partial wind can cool off the luminotron, and another part wind blows to the base along radiating fin, makes the inside temperature of base distribute away along radiating basal plate follow the louvre, and the semiconductor wafer temperature that makes reduces to the life of LED lamp is prolonged.
Drawings
The utility model is further described below with reference to the accompanying drawings:
FIG. 1 is an overall schematic of the present utility model;
FIG. 2 is a schematic back view of the present utility model;
FIG. 3 is a general anatomic schematic of the present utility model;
fig. 4 is an anatomic view of a heat dissipating hollow tube of the present utility model.
In the figure: 1. an LED lamp body; 2. glass; 3. a protective cover; 4. a heat sink; 41. a vertical rod; 42. a heat radiation fin; 43. a liquid storage tube; 5. a heat sink; 6. a heat radiation hole; 7. a support frame; 8. a bolt; 9. a heat-dissipating substrate; 10. a base; 11. a support rod; 12. a base; 13. a luminous tube; 14. a heat dissipation hollow tube; 15. ventilation holes; 16. a heat-dissipating cover plate; 17. a fan.
Detailed Description
In order to more clearly illustrate the general inventive concept, reference will be made in the following detailed description, by way of example, to the accompanying drawings.
It should be noted that in the following description, numerous specific details are set forth in order to provide a thorough understanding of the present utility model, but that the present utility model may be practiced otherwise than as described herein, and therefore the scope of the present utility model is not limited by the specific embodiments disclosed below.
In addition, in the description of the present utility model, it should be understood that the terms "center", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "axial", "radial", "circumferential", etc. indicate orientations or positional relationships based on the drawings, are merely for convenience in describing the present utility model and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present utility model.
In the present utility model, unless explicitly specified and limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally formed; can be directly connected or indirectly connected through an intermediate medium, and can be communicated with the inside of two elements or the interaction relationship of the two elements. However, it is noted that a direct connection indicates that two bodies connected together do not form a connection relationship by an excessive structure, but are connected to form a whole by a connection structure. The specific meaning of the above terms in the present utility model can be understood by those of ordinary skill in the art according to the specific circumstances.
In the present utility model, unless expressly stated or limited otherwise, a first feature "up" or "down" a second feature may be the first and second features in direct contact, or the first and second features in indirect contact via an intervening medium. In the description of the present specification, a description referring to terms "one embodiment," "some embodiments," "examples," "specific examples," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present utility model. In this specification, schematic representations of the above terms are not necessarily directed to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
Referring to fig. 1 to 4, the present utility model provides a technical solution: an LED lamp decoration heat radiation structure, an LED lamp decoration heat radiation structure includes
The LED lamp body 1, the outside of the LED lamp body 1 is provided with glass 2, the side edge of the LED lamp body 1 is in threaded connection with a support frame 7, bolts 8 are arranged on the support frame 7, the number of the bolts 8 is two, and the two bolts 8 are axisymmetrically distributed on the side edge of the support frame 7;
And the heat dissipation device 4 is fixedly connected to the top of the base 12.
The back of the LED lamp body 1 is provided with a plurality of radiating holes 6, the radiating holes 6 are distributed on the back of the LED lamp body 1 in a linear array, the back of the LED lamp body 1 is provided with a plurality of radiating fins 5, and the radiating fins 5 are distributed on the side edges of the radiating holes 6.
The LED lamp body 1 is provided with heat dissipation base plate 9 in inboard bottom, and heat dissipation base plate 9's top is provided with base 10, and the quantity of base 10 has two, and two bases 10 are axisymmetric distribution at heat dissipation base plate 9's top.
The top of base 10 is provided with protection casing 3, and the top fixedly connected with bracing piece 11 of base 10, the top fixedly connected with base 12 of bracing piece 11, and the top of base 12 is provided with a plurality of luminotrons 13, and a plurality of luminotrons 13 are the annular and distribute at the top of base 12.
The top of base 12 is provided with heat dissipation hollow tube 14, and the surface of heat dissipation hollow tube 14 is provided with a plurality of bleeder vents 15, and the top of heat dissipation hollow tube 14 is provided with heat dissipation apron 16, and the bottom of heat dissipation apron 16 is provided with fan 17.
The heat dissipating device 4 comprises a vertical rod 41 fixedly connected to the top of the base 12, the vertical rod 41 is arranged inside the heat dissipating hollow tube 14, the top of the vertical rod 41 is fixedly connected with a heat dissipating fin 42, a plurality of liquid storage tubes 43 are arranged at the top of the heat dissipating fin 42, and the plurality of liquid storage tubes 43 are distributed on the top of the heat dissipating fin 42 in a ring shape.
When the LED lamp is used, the fan 17 is started, wind formed by rotation of the fan 17 blows to the liquid storage tube 43, and because the cooling liquid is arranged in the liquid storage tube 43, part of the wind is emitted in the heat dissipation hollow tube 14 after the wind blown to the liquid storage tube 43 is cooled, the light emitting tube 13 is cooled through the air holes 15, and the other part of the wind is blown to the base 12 along the heat dissipation fins 42, so that the temperature in the base 12 is emitted from the heat dissipation holes 6 along the heat dissipation substrate 9, and the temperature of the semiconductor wafer is reduced, thereby prolonging the service life of the LED lamp.
Those of ordinary skill in the art will appreciate that: the discussion of any of the embodiments above is merely exemplary and is not intended to suggest that the scope of the utility model (including the claims) is limited to these examples; the technical features of the above embodiments or in the different embodiments may also be combined within the idea of the utility model, the steps may be implemented in any order and there are many other variations of the different aspects of the utility model as described above, which are not provided in detail for the sake of brevity.
The present utility model is intended to embrace all such alternatives, modifications and variances which fall within the broad scope of the appended claims. Therefore, any omission, modification, equivalent replacement, improvement, etc. of the present utility model should be included in the scope of the present utility model.
Claims (6)
1. The utility model provides a LED lamp decoration heat radiation structure which characterized in that: the LED lamp decoration heat dissipation structure comprises
The LED lamp comprises an LED lamp body (1), wherein glass (2) is arranged on the outer side of the LED lamp body (1), a support frame (7) is connected with the side edge of the LED lamp body (1) in a threaded mode, bolts (8) are arranged on the support frame (7), the number of the bolts (8) is two, and the two bolts (8) are axially symmetrically distributed on the side edge of the support frame (7);
and the heat dissipation device (4) is fixedly connected to the top of the base (12).
2. The LED light fixture heat dissipation structure of claim 1, wherein: the back of LED lamp body (1) is provided with a plurality of louvres (6), and a plurality of louvres (6) are the back at LED lamp body (1) of linear array distribution, and the back of LED lamp body (1) is provided with a plurality of fin (5), and a plurality of fin (5) distribute in the side of louvre (6).
3. The LED light fixture heat dissipation structure of claim 1, wherein: the LED lamp is characterized in that a heat dissipation substrate (9) is arranged at the bottom of the inner side of the LED lamp body (1), bases (10) are arranged at the top of the heat dissipation substrate (9), two bases (10) are arranged in number, and the two bases (10) are axially symmetrically distributed at the top of the heat dissipation substrate (9).
4. A LED light fixture heat dissipation structure as defined in claim 3, wherein: the top of base (10) is provided with protection casing (3), and the top fixedly connected with bracing piece (11) of base (10), the top fixedly connected with base (12) of bracing piece (11), the top of base (12) is provided with a plurality of luminotrons (13), and a plurality of luminotrons (13) are the top of annular distribution at base (12).
5. The LED lamp fixture heat dissipation structure of claim 4, wherein: the top of base (12) is provided with heat dissipation hollow tube (14), and the surface of heat dissipation hollow tube (14) is provided with a plurality of bleeder vents (15), and the top of heat dissipation hollow tube (14) is provided with heat dissipation apron (16), and the bottom of heat dissipation apron (16) is provided with fan (17).
6. The LED light fixture heat dissipation structure of claim 1, wherein: the heat dissipation device (4) comprises a vertical rod (41) fixedly connected to the top of the base (12), the vertical rod (41) is arranged inside the heat dissipation hollow tube (14), the top of the vertical rod (41) is fixedly connected with a heat dissipation fin (42), a plurality of liquid storage tubes (43) are arranged at the top of the heat dissipation fin (42), and the liquid storage tubes (43) are annularly distributed at the top of the heat dissipation fin (42).
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202322972347.XU CN221197349U (en) | 2023-11-03 | 2023-11-03 | LED lamp decoration heat radiation structure |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202322972347.XU CN221197349U (en) | 2023-11-03 | 2023-11-03 | LED lamp decoration heat radiation structure |
Publications (1)
Publication Number | Publication Date |
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CN221197349U true CN221197349U (en) | 2024-06-21 |
Family
ID=91492763
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN202322972347.XU Active CN221197349U (en) | 2023-11-03 | 2023-11-03 | LED lamp decoration heat radiation structure |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN221197349U (en) |
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2023
- 2023-11-03 CN CN202322972347.XU patent/CN221197349U/en active Active
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